US20120064775A1 - Socket using contact to hold solder ball and method of making the same - Google Patents
Socket using contact to hold solder ball and method of making the same Download PDFInfo
- Publication number
- US20120064775A1 US20120064775A1 US13/231,979 US201113231979A US2012064775A1 US 20120064775 A1 US20120064775 A1 US 20120064775A1 US 201113231979 A US201113231979 A US 201113231979A US 2012064775 A1 US2012064775 A1 US 2012064775A1
- Authority
- US
- United States
- Prior art keywords
- passageways
- contacts
- socket
- contact
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
- Y10T29/49213—Metal
Definitions
- the present invention relates to a socket and method of making the same, and particularly to a SO DIMM socket with contact having a hook extending curvedly to hold solder ball.
- a typical SO DIMM (Small Outline Dual In-line Memory Module) socket be soldered to a printed circuit board is described in U.S. Pat. No. 6,575,763, issued to Choy on Jun. 10, 2003.
- the connector comprises a housing, a plurality of contacts received therein and a plurality of solder balls attached to the contacts respectively.
- the solder ball is soldered to the tail of a contact and be soldered to the printed circuit board.
- the tail of the contact expresses solderable property, i.e. the solder ball can be readily and easily attached thereto. If the solder joint is not properly formed between the tail and the solder ball, defective interconnection or so called cold-joint will encounter. Reworking process will always be needed to correct this problem.
- the solder ball tends to flow upward or wick along an external surface of the tail. Once the solder flows and wicks upwardly along the surface resulted from the capillary force, the overall characteristic of the contact terminal will be changed or negatively modified.
- an object of the present invention is to provide a socket use the contact to hold the solder ball with no fuse operation.
- a socket comprises a base, a plurality of contacts disposed in the base and a plurality of solder balls each connecting to the corresponding contact
- the base comprises a central slot for receiving a module and a plurality of passageways at two sides of the central slot to receive the contacts, respectively
- the contact comprise a body portion positioned in the base, a contact portion extending from the body portion into the central slot and a tail extending from the body portion, the solder balls are positioned by the tails of the contacts.
- FIG. 1 is an exploded, perspective view of the socket of the present invention
- FIG. 2 is an isometric view of the upper contact shown in FIG. 1 ;
- FIG. 3 is an isometric view of the lower contact shown in FIG. 1 ;
- FIG. 4 shows the upper contacts are assembled to the base and located in the original state
- FIG. 5 shows the solder balls are assembled between the base and the upper contacts
- FIG. 6 is a cross-sectional view of the socket shown in FIG. 5 along line 6 - 6 ;
- FIG. 7 shows the solder balls are holding by the upper contacts
- FIG. 8 shows the lower contacts are assembled to the base and located in the original state
- FIG. 9 shows the solder balls are assembled between the base and the lower contacts
- FIG. 10 is a cross-sectional view of the socket shown in FIG. 9 along line 10 - 10 ;
- FIG. 11 is an assembled view of socket shown in FIG. 1 ;
- FIG. 12 is a cross-sectional view of the socket shown in FIG. 11 along line 12 - 12 .
- a socket 100 in accordance to a preferred embodiment of the present invention comprises an elongate base 1 , two rows of upper contacts 4 and two rows of lower contacts 3 received in the base 1 , a metal ear 2 assembled to the base 1 and a plurality of solder balls 5 assembled to the base 1 and each hooked by the upper contact 4 or the lower contact 3 .
- the base 1 includes main body 10 and a pair of latches 11 extending from two ends of the main body 10 .
- the body 10 comprises an upper surface 101 , a bottom surface 102 opposite to the upper surface 101 , and a back surface 103 connecting the upper surface 101 and the bottom surface 102 and a front surface 104 opposite to the back surface 103 .
- the body 10 comprises a central slot 1041 recessed from the front surface 104 to the interior of the body 10 for receiving a module (not shown) therein.
- the body 10 also comprises a plurality of upper passageways 1031 penetrating from the back surface 103 to the central slot 1041 , a plurality of lower passageways 1022 penetrate from the bottom surface 102 to the slot 1041 and a plurality of recesses 1020 recessed from the bottom surface 102 to the interior of the body 10 .
- Each upper passageway 1031 and lower passageway 1022 is corresponding to a recess 1020 and is communicated with the recess 1020 .
- the recesses 1020 are set to four rows corresponding to the upper passageway 1031 and the lower passageway 1022 , and are staggered in different rows.
- the metal ear 2 is assembled to the latch 11 to strengthen the latch 11 .
- the upper contacts 4 are received in the upper passageways 1031 and the lower contacts 3 are received in the lower passageways 1022 to electrically engage with the module assembled in the central slot 1041 .
- the upper contact 4 comprises a plate body portion 41 , a retention portion 44 extending forwardly from the body portion 41 , a spring portion 43 extending upwardly and forwardly from the body portion 41 , a tail 42 extending vertically and downwardly from the body portion 41 and a hook 421 extending forwardly from the tail 42 .
- body portion 41 comprises a push portion 410 at one end of the body portion 41 .
- the retention portion 44 comprises a first barb 441 .
- the spring portion 43 comprises a contact portion 431 at a free end thereof
- the lower contact 3 comprises a plate body portion 31 , a retention portion 34 extending upwardly from the body portion 31 , a spring portion 33 extending forwardly from the body portion 31 , a tail 32 extending vertically and downwardly from the body portion 31 and a hook 321 extending forwardly from the tail 32 .
- the retention portion 34 comprises a barb 341 at one end and a press portion 340 at the other end.
- the spring portion 33 comprises a contact portion 331 at a free end thereof.
- FIGS. 4-12 shows the assemble process of the socket 100 of the present invention, below is the detail description of the assemble process.
- the upper contacts 4 are inserted into the upper passageways 1031 with a certain depth from the back surface 103 of the base 1 , the push portions 410 of the upper contacts 4 are located beyond the back surface 103 ;
- the solder balls 5 are assembled into the recess 1020 corresponding to the upper contacts 4 ;
- the lower contacts 3 are inserted into the lower passageways 1022 with a certain depth from the bottom surface 102 , the press portion 340 of the lower contacts 3 are located beyond the bottom surface 102 ;
- the solder balls 5 are assembled into the recess 1020 corresponding to the lower contacts 3 ;
- the solder ball 5 contacts with the base 1 and the upper contact 4 or the lower contact 3 to make it received in the recess 1020 securely, and need not the fuse process, which reduce the cost and are easy to manufacture.
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a socket and method of making the same, and particularly to a SO DIMM socket with contact having a hook extending curvedly to hold solder ball.
- 2. Description of Related Art
- A typical SO DIMM (Small Outline Dual In-line Memory Module) socket be soldered to a printed circuit board is described in U.S. Pat. No. 6,575,763, issued to Choy on Jun. 10, 2003. The connector comprises a housing, a plurality of contacts received therein and a plurality of solder balls attached to the contacts respectively. The solder ball is soldered to the tail of a contact and be soldered to the printed circuit board.
- When conducting a soldering process, there is dilemma. At one hand, it is requested that the tail of the contact expresses solderable property, i.e. the solder ball can be readily and easily attached thereto. If the solder joint is not properly formed between the tail and the solder ball, defective interconnection or so called cold-joint will encounter. Reworking process will always be needed to correct this problem. On the other hand, because of this solderable property, the solder ball tends to flow upward or wick along an external surface of the tail. Once the solder flows and wicks upwardly along the surface resulted from the capillary force, the overall characteristic of the contact terminal will be changed or negatively modified. For example, when the contact is designed, intended normal force, deflection, etc have been carefully calculated so as to meet the field requirements. Once the solder flows and wicks upward to cover the contact, the characteristic of the contact will be altered, and the normal force and other properties will be altered accordingly.
- Hence, it is desirable to provide an improved socket to overcome the aforementioned disadvantages.
- Accordingly, an object of the present invention is to provide a socket use the contact to hold the solder ball with no fuse operation.
- According to one aspect of the present invention, a socket comprises a base, a plurality of contacts disposed in the base and a plurality of solder balls each connecting to the corresponding contact, the base comprises a central slot for receiving a module and a plurality of passageways at two sides of the central slot to receive the contacts, respectively, the contact comprise a body portion positioned in the base, a contact portion extending from the body portion into the central slot and a tail extending from the body portion, the solder balls are positioned by the tails of the contacts.
- Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is an exploded, perspective view of the socket of the present invention; -
FIG. 2 is an isometric view of the upper contact shown inFIG. 1 ; -
FIG. 3 is an isometric view of the lower contact shown inFIG. 1 ; -
FIG. 4 shows the upper contacts are assembled to the base and located in the original state; and -
FIG. 5 shows the solder balls are assembled between the base and the upper contacts; -
FIG. 6 is a cross-sectional view of the socket shown inFIG. 5 along line 6-6; -
FIG. 7 shows the solder balls are holding by the upper contacts; -
FIG. 8 shows the lower contacts are assembled to the base and located in the original state; and -
FIG. 9 shows the solder balls are assembled between the base and the lower contacts; -
FIG. 10 is a cross-sectional view of the socket shown inFIG. 9 along line 10-10; -
FIG. 11 is an assembled view of socket shown inFIG. 1 ; and -
FIG. 12 is a cross-sectional view of the socket shown inFIG. 11 along line 12-12. - Reference will now be made to the drawings to describe the present invention in detail.
- Referring to
FIG. 1 andFIG. 11 , asocket 100 in accordance to a preferred embodiment of the present invention comprises anelongate base 1, two rows ofupper contacts 4 and two rows oflower contacts 3 received in thebase 1, ametal ear 2 assembled to thebase 1 and a plurality ofsolder balls 5 assembled to thebase 1 and each hooked by theupper contact 4 or thelower contact 3. - Referring to
FIG. 1 andFIG. 4 , thebase 1 includesmain body 10 and a pair oflatches 11 extending from two ends of themain body 10. Thebody 10 comprises anupper surface 101, abottom surface 102 opposite to theupper surface 101, and aback surface 103 connecting theupper surface 101 and thebottom surface 102 and afront surface 104 opposite to theback surface 103. Thebody 10 comprises acentral slot 1041 recessed from thefront surface 104 to the interior of thebody 10 for receiving a module (not shown) therein. Thebody 10 also comprises a plurality ofupper passageways 1031 penetrating from theback surface 103 to thecentral slot 1041, a plurality oflower passageways 1022 penetrate from thebottom surface 102 to theslot 1041 and a plurality ofrecesses 1020 recessed from thebottom surface 102 to the interior of thebody 10. Eachupper passageway 1031 andlower passageway 1022 is corresponding to arecess 1020 and is communicated with therecess 1020. Therecesses 1020 are set to four rows corresponding to theupper passageway 1031 and thelower passageway 1022, and are staggered in different rows. Themetal ear 2 is assembled to thelatch 11 to strengthen thelatch 11. - Referring to
FIGS. 2-3 , theupper contacts 4 are received in theupper passageways 1031 and thelower contacts 3 are received in thelower passageways 1022 to electrically engage with the module assembled in thecentral slot 1041. Theupper contact 4 comprises aplate body portion 41, aretention portion 44 extending forwardly from thebody portion 41, aspring portion 43 extending upwardly and forwardly from thebody portion 41, atail 42 extending vertically and downwardly from thebody portion 41 and ahook 421 extending forwardly from thetail 42. Thenbody portion 41 comprises apush portion 410 at one end of thebody portion 41. Theretention portion 44 comprises afirst barb 441. Thespring portion 43 comprises acontact portion 431 at a free end thereof Thelower contact 3 comprises aplate body portion 31, aretention portion 34 extending upwardly from thebody portion 31, aspring portion 33 extending forwardly from thebody portion 31, atail 32 extending vertically and downwardly from thebody portion 31 and ahook 321 extending forwardly from thetail 32. Theretention portion 34 comprises abarb 341 at one end and apress portion 340 at the other end. Thespring portion 33 comprises acontact portion 331 at a free end thereof. -
FIGS. 4-12 shows the assemble process of thesocket 100 of the present invention, below is the detail description of the assemble process. First, theupper contacts 4 are inserted into theupper passageways 1031 with a certain depth from theback surface 103 of thebase 1, thepush portions 410 of theupper contacts 4 are located beyond theback surface 103; second, thesolder balls 5 are assembled into therecess 1020 corresponding to theupper contacts 4; third, push thepush portion 410 of theupper contacts 4 forwardly into theupper passageways 1031 to make theupper contacts 4 positioned in thebase 1 securely and thesolder balls 5 are hooked by thehook 421 of theupper contacts 4 respectively; then, thelower contacts 3 are inserted into thelower passageways 1022 with a certain depth from thebottom surface 102, thepress portion 340 of thelower contacts 3 are located beyond thebottom surface 102; next, thesolder balls 5 are assembled into therecess 1020 corresponding to thelower contacts 3; finally, press thepress portion 340 of theupper contacts 4 downwardly intolower passageways 1022 to make thelower contacts 3 positioned in thebase 1 securely and thesolder balls 5 are hooked by thehook 321 of thelower contacts 3 respectively. Thesolder balls 5 are set to four rows corresponding to theupper contacts 4 and thelower contacts 3, and thesolder balls 5 are staggered in different rows. - The
solder ball 5 contacts with thebase 1 and theupper contact 4 or thelower contact 3 to make it received in therecess 1020 securely, and need not the fuse process, which reduce the cost and are easy to manufacture. - While the preferred embodiments in accordance with the present invention has been shown and described, equivalent modifications and changes known to persons skilled in the art according to the spirit of the present invention are considered within the scope of the present invention as defined in the appended claims.
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099217730 | 2010-09-14 | ||
TW099217730U TWM401888U (en) | 2010-09-14 | 2010-09-14 | Electrical connector |
TW099217730U | 2010-09-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20120064775A1 true US20120064775A1 (en) | 2012-03-15 |
US8430678B2 US8430678B2 (en) | 2013-04-30 |
Family
ID=45807159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/231,979 Expired - Fee Related US8430678B2 (en) | 2010-09-14 | 2011-09-14 | Socket using contact to hold solder ball and method of making the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US8430678B2 (en) |
TW (1) | TWM401888U (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106356659B (en) * | 2016-10-10 | 2019-06-28 | 富士康(昆山)电脑接插件有限公司 | Bayonet connector |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5413970A (en) * | 1993-10-08 | 1995-05-09 | Texas Instruments Incorporated | Process for manufacturing a semiconductor package having two rows of interdigitated leads |
US6575763B1 (en) * | 2002-08-26 | 2003-06-10 | Hon Hai Precision Ind. Co., Ltd. | Dense contact tail alignment of connector |
US7195498B1 (en) * | 2005-09-28 | 2007-03-27 | Hon Hai Precision Ind. Co., Ltd. | Surface-mount connector with anti-wicking structure |
US7717728B1 (en) * | 2009-01-15 | 2010-05-18 | Advanced Connectek Inc. | Electrical Connector |
US7938664B2 (en) * | 2006-01-27 | 2011-05-10 | Fci | Connector |
US8052436B1 (en) * | 2010-10-22 | 2011-11-08 | Lotes Co., Ltd. | Electrical connector with stable retaining terminals |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6139336A (en) | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
US7462065B1 (en) | 2007-11-05 | 2008-12-09 | Hon Hai Precision Ind. Co., Ltd. | Method for terminating conductors of a cable to tail portion of contact terminals of ultra fine pitch connector |
US7540785B1 (en) | 2007-11-14 | 2009-06-02 | Hon Hai Precision Ind. Co., Ltd. | Ultra fine pitch connector and cable assembly |
-
2010
- 2010-09-14 TW TW099217730U patent/TWM401888U/en unknown
-
2011
- 2011-09-14 US US13/231,979 patent/US8430678B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5413970A (en) * | 1993-10-08 | 1995-05-09 | Texas Instruments Incorporated | Process for manufacturing a semiconductor package having two rows of interdigitated leads |
US6575763B1 (en) * | 2002-08-26 | 2003-06-10 | Hon Hai Precision Ind. Co., Ltd. | Dense contact tail alignment of connector |
US7195498B1 (en) * | 2005-09-28 | 2007-03-27 | Hon Hai Precision Ind. Co., Ltd. | Surface-mount connector with anti-wicking structure |
US7938664B2 (en) * | 2006-01-27 | 2011-05-10 | Fci | Connector |
US7717728B1 (en) * | 2009-01-15 | 2010-05-18 | Advanced Connectek Inc. | Electrical Connector |
US8052436B1 (en) * | 2010-10-22 | 2011-11-08 | Lotes Co., Ltd. | Electrical connector with stable retaining terminals |
Also Published As
Publication number | Publication date |
---|---|
US8430678B2 (en) | 2013-04-30 |
TWM401888U (en) | 2011-04-11 |
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Legal Events
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AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YEH, CHENG-CHI;REEL/FRAME:026899/0977 Effective date: 20110913 |
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Year of fee payment: 4 |
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Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20210430 |