US20120167384A1 - Method of Making a Low Profile Flip Chip Power Module - Google Patents
Method of Making a Low Profile Flip Chip Power Module Download PDFInfo
- Publication number
- US20120167384A1 US20120167384A1 US13/417,603 US201213417603A US2012167384A1 US 20120167384 A1 US20120167384 A1 US 20120167384A1 US 201213417603 A US201213417603 A US 201213417603A US 2012167384 A1 US2012167384 A1 US 2012167384A1
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- printed circuit
- front surface
- circuit
- power module
- cover board
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- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A power module is proposed to package an electronic system having flip chip power MOSFET devices. The power module includes a front surface cover board and a multi-layer printed circuit laminate bonded thereto. Notably, the front surface of the printed circuit laminate includes recessed pockets each having printed circuit traces atop its floor. Inside the recessed pockets are power MOSFET and other circuit components bonded to the printed circuit traces. As the circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Additionally, some circuit components can be provided with a front-side bonding layer that is also bonded to the front surface cover board to realize a double-side bonding to the interior of the power module. Methods for making the low profile power module are also described.
Description
- This application is a divisional application of a pending U.S. patent application entitled “Low Profile Flip Chip Power Module and Method of Making” by Ming Sun with filing date of Feb. 23, 2007 and application Ser. No. 11/678,061 whose content is hereby incorporated by reference for all purposes.
- This invention relates generally to the field of electronic packaging. More specifically, the present invention is directed to the packaging of power semiconductor modules.
- A general trend of modern day electronic product, as demanded by the market place, is product miniaturization with vastly increasing functionality. With no exception, the same trend also applies to the segment of power electronics. Hence, even in the area of power electronics, there has been an ongoing need of product miniaturization concurrent with the other requirements of heat dissipation and electromagnetic interference/radio frequency interference (EMI/RFI) shielding prominent in power electronics.
- A low profile power module is proposed to package an electronic system that includes power Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) devices. The power module includes an electrically conductive front surface cover board and a multi-layer printed circuit laminate physically and electrically bonded to the back of the front surface cover board. The multi-layer printed circuit laminate has numerous bonded printed circuit layers for forming a multi-layer electrical interconnection. Notably, the front surface of the printed circuit laminate includes a number of recessed pockets each having numerous printed circuit traces atop its floor. Located inside the recessed pockets are numerous flip-chip power MOSFET devices and other circuit components that are conductively bonded to the printed circuit traces atop the recessed pocket floors. As the various circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity.
- Additionally, some of the various circuit components can be provided with a front-side bonding layer that is then conductively bonded to the front surface cover board to realize a corresponding double-side bonding to the interior of the power module. In a more specific embodiment, the power MOSFET flip chips have their source-contacts and gate-contacts located on their back-side and their drain-contacts located on their front-side as referenced to the orientation of the power module. To facilitate heat dissipation from these double-side bonded circuit components, the front surface cover board is further made heat conductive as a heat sink. As the front surface cover board is flat, an external heat sink can be easily attached to the front surface cover board so as to facilitate heat removal from the power module.
- One method of making the power module includes:
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- A) Forming the multi-layer printed circuit laminate having the bonded printed circuit layers, the front-surface recessed pockets and the circuit components located inside and flip-chip bonded to the printed circuit traces inside recessed pockets.
- B) Providing an electrically conductive front surface cover board.
- C) Physically and electrically bonding the front surface of the multi-layer printed circuit laminate to the front surface cover board. As a variation, some of the circuit components can additionally be made front-side bondable hence conductively bonded to the front surface cover board in this step.
- One method of forming the multi-layer printed circuit laminate further includes:
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- A1) Forming the numerous bonded printed circuit layers.
- A2) Along the front surface of the numerous bonded printed circuit layers, creating the recessed pockets by selectively removing a corresponding number of material pockets from a corresponding number of layers of printed circuit layers.
- A3) Placing the various circuit components inside the recessed pockets.
- A4) Conductively bonding the various circuit components, via their back-side component bonding pads, to the recessed pockets.
- An alternative method of forming the multi-layer printed circuit laminate further includes:
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- A1) Providing a number, according to the layer requirement of the multi-layer printed circuit laminate, of printed circuit layers.
- A2) For each printed circuit layer, determining and pre-cutting out a specific number of windows each of a specific geometry such that, upon later lamination, the number of printed circuit layers would form the desired recessed pockets.
- A3) Stacking and laminating the number of printed circuit layers hence simultaneously forming the desired recessed pockets.
- A4) Creating, if necessary as specified by the multi-layer printed circuit laminate, additional circuit forming features such as printed through holes and solder masks on each of the now laminated printed circuit layers.
- A5) Placing the various circuit components inside the recessed pockets.
- A6) Conductively bonding the various circuit components, via their back-side component bonding pads, to the recessed pockets.
- These aspects of the present invention and their numerous embodiments are further made apparent, in the remainder of the present description, to those of ordinary skill in the art.
- In order to more fully describe numerous embodiments of the present invention, reference is made to the accompanying drawings. However, these drawings are not to be considered limitations in the scope of the invention, but are merely illustrative.
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FIG. 1 is a cross sectional illustration of the low profile power module of the present invention; -
FIG. 2A-FIG . 2J illustrate the steps under one embodiment to make the low profile power module under the present invention; and -
FIG. 3A-FIG . 3J illustrate the steps under an alternative embodiment to make the low profile power module under the present invention. - The description above and below plus the drawings contained herein merely focus on one or more currently preferred embodiments of the present invention and also describe some exemplary optional features and/or alternative embodiments. The description and drawings are presented for the purpose of illustration and, as such, are not limitations of the present invention. Thus, those of ordinary skill in the art would readily recognize variations, modifications, and alternatives. Such variations, modifications and alternatives should be understood to be also within the scope of the present invention.
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FIG. 1 is a cross sectional illustration of a lowprofile power module 10 of the present invention. The lowprofile power module 10 is proposed to package an electronic system that includes, for simplicity of illustration, one or more power Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) 64, one or more Integrated Circuit (IC) 60 and one or morepassive component 62. While not specifically illustrated, the active circuitry of thepower MOSFET 64 is flip-chip, with its source and gate contacts on its back side as referenced to the orientation of the lowprofile power module 10. Thus, the source and gate contacts of thepower MOSFET 64 get electrically connected to back-side solder bumps 24 through a pad opening 66. Similarly, the packaging of theIC 60 is also of the flip chip type. It is remarked that thepower MOSFET drain 68 further has a front-sidecomponent bonding layer 27, located on its front side as referenced to the orientation of the lowprofile power module 10. - Globally, the low
profile power module 10 includes an electrically conductive frontsurface cover board 12 and a multi-layer printedcircuit laminate 14 physically and electrically bonded to the frontsurface cover board 12. The multi-layer printedcircuit laminate 14 has numerous laminated and bonded traditional printed circuit layers (PCB layer one 14 a, PCB layer two 14 b, PCB layer three 14 c and PCB layer four 14 d) for forming a multi-layer electrical interconnection. A few associated circuit forming constituents of the PCB layers such as plated through-hole 20 (also called “Via Hole” in the art) andsolder mask 22 are illustrated. However, to avoid unnecessary obscuring details, numerous additional circuit forming constituents such as interconnecting circuit traces interposed between thePCB layers circuit traces 26 that will be presently described. As defined here, “circuit forming constituents” is a set of pre-determined three-dimensional patterns of interconnected conductive pads, printed circuit traces, planes, conductive through holes, solder masks, ball grid arrays (BGA), land grid arrays (LGA) for forming the inter-component electrical connection of an electronic system. Notably, the front surface of the multi-layer printedcircuit laminate 14 includes a recessedpocket 25 having printed circuit traces 26 atop its floor. Thus, the various circuit components ofpower MOSFET 64,IC 60 andpassive component 62, being also located atop the floor of the recessedpocket 25 at locations corresponding to the printed circuit traces 26, are electrically bonded, via the back-side solder bumps 24, to the rest of the electronic system embodied with the lowprofile power module 10. Aspower MOSFET 64 is usually a vertical device, its device current flows from one major surface of the semiconductor substrate to an opposite major surface. It is also important to point out that, with proper matching of the thicknesses amongst PCB layer one 14 a, PCB layer two 14 b, back-side solder bumps 24,power MOSFET 64 and front-sidecomponent bonding layer 27, the now encasedpower MOSFET 64, between the recessedpocket 25 and the frontsurface cover board 12, has itsdrain 68 electrically bonded to the frontsurface cover board 12, further connected to the back surface of the multi-layer printedcircuit laminate 14 through plated throughhole 20. However, wherever lateral MOSFET instead of vertical MOSFET is used, this type of double-sided conductive bonding is unnecessary so it is not necessary to electrically connect the frontsurface cover board 12 to the back surface of the multi-layer printedcircuit laminate 14 through plated throughhole 20. In such case theMOSFET 64 may still thermally contact the frontsurface cover board 12 to facilitate thermal dissipation. The substrate ofIC 60 usually requires insulation fromMOSFET drain 68 therefore is preferably not in electrical contact with frontsurface cover board 12. To enable further electrical connection to an external system, the lowprofile power module 10 includes an externalball grid array 30 metallurgically attached to a number ofcorresponding bonding pads 19 and plated throughholes 20 located on a back surface of the multi-layer printedcircuit laminate 14. - For those skilled in the art, by now it should become clear that with proper choice of size and number of recessed
pocket 25 the lowprofile power module 10 can be embodied to encase a plurality of MOSFET, IC plus numerous other types of active and passive circuit components such as, but not limited to, BIPOLAR, IC, capacitors, inductors, resistors, diodes. As the various circuit components are encased inside the power module, it features a low profile, an increased mechanical robustness and EMI/RFI immunity. Of course, the frontsurface cover board 12 can be made heat conductive so as to facilitate heat dissipation from the double-side bondedpower MOSFET 64 andIC 60. As the frontsurface cover board 12 is flat, additional external heat dissipating apparatus, such as heat sink, cooling fan, re-circulating fluid cooling module, Thermal Electric Module (TEM), can be easily attached to the frontsurface cover board 12 so as to facilitate heat dissipation from the double-side bondedpower MOSFET 64. - As for its material, the front
surface cover board 12 is an electrically conductive material such as Copper, Aluminum, Ni/Au plated other metals or laminate board, Carbon made conductive materials and ions conductive materials. The front-sidecomponent bonding layer 27 is made of an electrically conductive material such as solder paste or electrically conductive epoxy filling the gap between, for example, the front surface ofpower MOSFET 64 and the frontsurface cover board 12. -
FIG. 2A-FIG . 2J illustrate the steps under one embodiment for making the lowprofile power module 10. In STEP Ia, the fourPCB layers PCB layers holes 18 are drilled through the laminate together with partial drillings to createvarious pad openings 17. Next, the via holes 18 andpad openings 17 are electroplated with a conductive material in STEP IVa to respectively become plated throughholes 20 andbonding pads 19. In STEP Va solder masks 22 are printed to guard the plated throughholes 20 and thebonding pads 19 against a later overflow of solder balls during their melt down to electrically bond with the plated throughholes 20 and thebonding pads 19. - In STEP VIa, the recessed
pocket 25 is created, along the front surface of the bonded PCB layers 14 a, 14 b, 14 c and 14 d, by selectively removing a corresponding material pocket from a corresponding number of PCB layers, in this case thePCB layer 14 a. The method of removal includes mechanical milling, partial mechanical drilling and laser cutting. Notice the completion of STEP VIa reveals the printed circuit traces 26 atop PCB layer two 14 b. - In STEP VII, called die attaching in the art of IC packaging, the various circuit components of
power MOSFET 64,IC 60 andpassive component 62 are first placed and mechanically registered inside the recessedpocket 25. Then the various circuit components are conductively bonded, via their back-side solder bumps 24, to the printed circuit traces 26. As is well known in the art, a temperature above 200 degree C., depending upon the type of solder or epoxy used, is needed to form permanent die bonds. - In STEP VIII, the front
surface cover board 12 is placed atop the multi-layer printedcircuit laminate 14 with the various circuit components already conductively bonded to the floor of the recessedpocket 25. The front surface of the multi-layer printedcircuit laminate 14, together with the front-sidecomponent bonding layer 27 ofpower MOSFET 64, are then physically and electrically bonded to the frontsurface cover board 12. - In STEP IX the partially completed low profile power module is first flipped upside down. A number of
solder balls 21 are then placed upon theircorresponding bonding pads 19 and plated throughholes 20 of the multi-layer printedcircuit laminate 14. - In STEP X the number of
solder balls 21 are metallurgically bonded to theircorresponding bonding pads 19 and plated throughholes 20 to form the externalball grid array 30 for further electrical connection of the now completed lowprofile power module 10 to an external system. Notice the now completed lowprofile power module 10 is flipped back to its original orientation. - As a simplified overview of the present invention, the above STEPS Ia to X can be partitioned into a first portion (STEPS Ia to VII) and a second portion (VIII to X). The first portion forms the multi-layer printed
circuit laminate 14 with the various circuit components ofpower MOSFET 64,IC 60 andpassive component 62 conductively bonded to the recessedpocket 25. The second portion physically and electrically bonds the front surface of the multi-layer printedcircuit laminate 14 together with the front-side ofpower MOSFET 64 to the electrically conductive frontsurface cover board 12. -
FIG. 3A-FIG . 3J illustrate the steps under an alternative embodiment to make the lowprofile power module 10 under the present invention. Except for STEPS Ib to VIb, the rest of the STEPS VII to X are the same as were already elucidated underFIG. 2G-FIG . 2J. In STEP Ib, the fourPCB layers - In STEP Ib, for each of the four
PCB layers pocket 25. In this case, a precut window one 15 a is made on PCB layer one 14 a and a precut window two 15 b is made on PCB layer two 14 b. Thus, in STEP IIIb, the fourPCB layers pocket 25. - In STEP IVb via
holes 18 are drilled through the laminate together with partial drillings to createvarious pad openings 17. Next, the via holes 18 andpad openings 17 are electroplated with a conductive material in STEP Vb to respectively become plated throughholes 20 andbonding pads 19. In STEP VIb solder masks 22 are printed to guard the plated throughholes 20 and thebonding pads 19 against a later overflow of solder balls during their melt down to electrically bond with the plated throughholes 20 and thebonding pads 19. - While the description above contains many specificities, these specificities should not be constructed as accordingly limiting the scope of the present invention but as merely providing illustrations of numerous presently preferred embodiments of this invention. For example, other than the illustrated
power MOSFET 64 andIC 60 modules, the present invention can be modified to package numerous other types of semiconductor modules or even miniature mechanical devices such as Miniature Electro Mechanical System (MEMS) devices. - Throughout the description and drawings, numerous exemplary embodiments were given with reference to specific configurations. It will be appreciated by those of ordinary skill in the art that the present invention can be embodied in numerous other specific forms and those of ordinary skill in the art would be able to practice such other embodiments without undue experimentation. The scope of the present invention, for the purpose of the present patent document, is hence not limited merely to the specific exemplary embodiments of the foregoing description, but rather is indicated by the following claims. Any and all modifications that come within the meaning and range of equivalents within the claims are intended to be considered as being embraced within the spirit and scope of the present invention.
Claims (5)
1. A method of making a low profile power module that encases a plurality of circuit components, the method comprising:
A) forming a multi-layer printed circuit laminate having:
(1) a plurality of bonded printed circuit layers each having a circuit forming means thereon; and,
(2) along the front surface of the multi-layer printed circuit laminate:
(2a) a plurality of recessed pockets each having the circuit forming means atop its floor; and
(2b) a plurality of circuit components, located inside the plurality of recessed pockets, each having a back-side component bonding means that is conductively bonded to the circuit forming means;
B) providing an electrically conductive front surface cover board; and
C) physically and electrically bonding the front surface of the multi-layer printed circuit laminate to a back surface of the front surface cover board.
2. The method of making a low profile power module of claim 1 wherein forming a multi-layer printed circuit laminate further comprising:
A1) forming the plurality of bonded printed circuit layers each having a circuit forming means thereon;
A2) along the front surface of the plurality of bonded printed circuit layers, creating the plurality of recessed pockets by selectively removing a corresponding plurality of material pockets from a corresponding number of layers of printed circuit layers;
A3) placing the plurality of circuit components inside the plurality of recessed pockets; and
A4) conductively bonding the plurality of circuit components, via their back-side component bonding means, to the circuit forming means.
3. The method of making a low profile power module of claim 1 wherein forming a multi-layer printed circuit laminate further comprising:
A1) providing a number, according to the layer requirement of the multi-layer printed circuit laminate, of printed circuit layers each having a circuit forming means thereon;
A2) for each printed circuit layer, determining and pre-cutting out a specific number of windows each of a specific geometry such that, upon later lamination, the number of printed circuit layers would form said plurality of recessed pockets;
A3) stacking and laminating the number of printed circuit layers hence simultaneously forming said plurality of recessed pockets;
A4) creating, if necessary as specified by the multi-layer printed circuit laminate, additional circuit forming means on each of the number of laminated printed circuit layers;
A5) placing the plurality of circuit components inside the plurality of recessed pockets; and
A6) conductively bonding the plurality of circuit components, via their back-side component bonding means, to the circuit forming means.
4. A method of making a low profile power module that encases a plurality of circuit components, the method comprising:
A) providing an electrically conductive front surface cover board;
B) forming a multi-layer printed circuit laminate having:
(1) a plurality of bonded printed circuit layers each having a circuit forming means thereon; and,
(2) along the front surface of the multi-layer printed circuit laminate:
(2a) a plurality of recessed pockets each having the circuit forming means atop its floor; and
(2b) a plurality of circuit components, located inside the plurality of recessed pockets, each having a front-side component bonding means that is capable of being conductively bonded to the front surface cover board and a back-side component bonding means that is conductively bonded to the circuit forming means; and
C) physically and electrically bonding both the front surface of the multi-layer printed circuit laminate and all the front-side component bonding means to the front surface cover board.
5. The method of making a low profile power module of claim 4 wherein providing an electrically conductive front surface cover board further comprises using a front surface cover board material that is heat conductive whereby facilitate heat dissipation from said plurality of circuit components.
Priority Applications (1)
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US13/417,603 US20120167384A1 (en) | 2007-02-23 | 2012-03-12 | Method of Making a Low Profile Flip Chip Power Module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/678,061 US8159828B2 (en) | 2007-02-23 | 2007-02-23 | Low profile flip chip power module and method of making |
US13/417,603 US20120167384A1 (en) | 2007-02-23 | 2012-03-12 | Method of Making a Low Profile Flip Chip Power Module |
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US11/678,061 Division US8159828B2 (en) | 2007-02-23 | 2007-02-23 | Low profile flip chip power module and method of making |
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US20120167384A1 true US20120167384A1 (en) | 2012-07-05 |
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US11/678,061 Active 2029-07-04 US8159828B2 (en) | 2007-02-23 | 2007-02-23 | Low profile flip chip power module and method of making |
US13/417,603 Abandoned US20120167384A1 (en) | 2007-02-23 | 2012-03-12 | Method of Making a Low Profile Flip Chip Power Module |
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US11/678,061 Active 2029-07-04 US8159828B2 (en) | 2007-02-23 | 2007-02-23 | Low profile flip chip power module and method of making |
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US (2) | US8159828B2 (en) |
CN (1) | CN101257011B (en) |
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Also Published As
Publication number | Publication date |
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CN101257011B (en) | 2010-06-09 |
US20080205008A1 (en) | 2008-08-28 |
TW200841445A (en) | 2008-10-16 |
CN101257011A (en) | 2008-09-03 |
US8159828B2 (en) | 2012-04-17 |
TWI420635B (en) | 2013-12-21 |
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