US20120205710A1 - Led module - Google Patents
Led module Download PDFInfo
- Publication number
- US20120205710A1 US20120205710A1 US13/397,110 US201213397110A US2012205710A1 US 20120205710 A1 US20120205710 A1 US 20120205710A1 US 201213397110 A US201213397110 A US 201213397110A US 2012205710 A1 US2012205710 A1 US 2012205710A1
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- led module
- substrate
- encapsulating resin
- clad member
- metal wiring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Definitions
- the present disclosure relates to a LED module having a light emitting diode (hereinafter referred to as a “LED”) arranged therein.
- a LED light emitting diode
- the LED module X shown in FIG. 10 includes a substrate 91 , metal electrodes 92 and 93 arranged in the substrate 91 , a LED chip 94 electrically connected to the metal electrodes 92 and 93 , a wire 95 and an encapsulating resin 96 covering these components.
- the substrate 91 is made of, e.g., a glass epoxy resin.
- the metal electrodes 92 and 93 are spaced apart from each other at the opposite marginal edges of the substrate 91 .
- Each of the metal electrodes 92 and 93 covers a region extending from the front surface of the substrate 91 to the rear surface across the side surface.
- the LED chip 94 is mounted on the portion of the metal electrode 92 covering the front surface of the substrate 91 .
- One end of the wire 95 is fixed to the portion of the metal electrode 93 covering the front surface of the substrate 91 .
- the other end of the wire 95 is connected to the LED chip 94 .
- the LED module X when in use, is embedded to, e.g., a circuit board 97 built in an illuminating device. As shown in FIG. 10 , the portions of the metal electrodes 92 and 93 covering the rear surface of the substrate 91 are connected to wiring lines 98 provided in the circuit board 97 .
- the encapsulating resin 96 is provided to protect the LED chip 94 and the wire 95 and is formed of an epoxy resin transparent to the light emitted from the LED chip 94 .
- the encapsulating resin 96 is formed to cover the portions of the metal electrodes 92 and 93 positioned on the front surface of the substrate 91 .
- Gold-plated layers are often formed on the surfaces of the metal electrodes 92 and 93 in order to increase the conductivity.
- the epoxy resin and the gold are not easily bonded to each other, possibly posing a problem set forth below.
- a heating process is performed when installing the LED module X on the circuit board 97 . At this time, the encapsulating resin 96 is thermally deformed.
- the encapsulating resin 96 and the metal electrodes 92 and 93 may be exfoliated, since the epoxy resin and the gold-plated layer are not strongly bonded together. If such situation occurs, there is a possibility that the LED chips 94 are not turned on.
- the present disclosure provides some embodiments of a highly reliable LED module conceived in view of the afore-mentioned circumstances.
- a LED module includes a substrate, a LED chip, a metal wiring, an encapsulating resin and a clad member.
- the LED chip is supported on the substrate.
- the metal wiring is installed on the substrate and has a mounting portion on which the LED chip is mounted.
- the encapsulating resin covers the LED chip and the metal wiring.
- the clad member covers the metal wiring to expose the mounting portion. With this configuration, the encapsulating resin is arranged to cover the clad member.
- the clad member has an opening formed to permit installation of the LED chip when seen in a thickness direction of the substrate.
- the mounting portion has a rectangular shape when seen in the thickness direction of the substrate, and the opening has a circular shape when seen in the thickness direction of the substrate.
- the clad member partially covers the mounting portion.
- the metal wiring includes a wire bonding portion spaced apart from the mounting portion, and a wire configured to interconnect the LED chip and the wire bonding portion.
- the clad member is arranged to cover the metal wiring to expose the wire bonding portion.
- the clad member has a recess dented to approach the mounting portion in an extension direction of the wire.
- the recess is positioned to overlap with the wire bonding portion when seen in the thickness direction of the substrate.
- the metal wiring includes a first metal electrode containing the mounting portion and a second metal electrode containing the wire bonding portion.
- the first metal electrode covers a first edge of the substrate in a first direction.
- the second metal electrode covers a second edge of the substrate opposite the first edge.
- the encapsulating resin is shorter than the substrate.
- the substrate includes a pair of concave portions located at opposite ends of the substrate, the pair of concave portions including depressed toward one another.
- the metal wiring is arranged to cover the pair of the concave portions, and the encapsulating resin is formed to expose the pair of the concave portions.
- a first end of the clad member and a first end of the encapsulating resin are at the same position in the first direction.
- a first end of the clad member extends toward a first end of the substrate further than a first end of the encapsulating resin in the first direction.
- a second end of the clad member and a second end of the encapsulating resin are at the same position in the first direction.
- a second end of the clad member extends further toward a second end of the substrate than a second end of the encapsulating resin in the first direction.
- the encapsulating resin is formed to cover entire width of the substrate in a second direction orthogonal to the first direction.
- the opposite ends of the clad member and the opposite ends of the substrate are at the same position in the second direction.
- the substrate is formed longer than the encapsulating resin in the first direction.
- a first side surface of the encapsulating resin inclines toward a second side surface in the first direction.
- the first side surface of the encapsulating resin includes an inclined surface inclined 6 degrees or more with respect to the thickness direction of the substrate.
- the first side surface of the encapsulating resin has a curved surface.
- the second side surface of the encapsulating resin inclines toward the first side surface in the first direction.
- the second side surface of the encapsulating resin includes an inclined surface inclined 6 degrees or more with respect to the thickness direction of the substrate.
- the second side surface of the encapsulating resin includes a curved surface.
- the clad member is made of a material with which the adhesion strength between the clad member and the metal wiring and the adhesion strength between the clad member and the encapsulating resin become greater than the adhesion strength between the metal wiring and the encapsulating resin.
- the metal wiring has a gold-plated layer.
- the clad member is made of a resin.
- the clad member has a white color.
- the clad member has a thickness of 1 ⁇ m to 10 ⁇ m.
- FIG. 1 is a plan view showing a LED module according to a first embodiment of the present disclosure.
- FIG. 2 is a section view taken along line II-II in FIG. 1 .
- FIG. 3 is a plan view of the LED module shown in FIG. 1 , with an encapsulating resin omitted for clarity.
- FIG. 4 is a plan view showing a LED module according to a second embodiment of the present disclosure, with an encapsulating resin omitted for clarity.
- FIG. 5 is a section view showing a LED module according to a third embodiment of the present disclosure.
- FIG. 6 is a section view showing a LED module according to a fourth embodiment of the present disclosure.
- FIG. 7 is a section view showing a LED module according to a fifth embodiment of the present disclosure.
- FIG. 8 is a plan view showing a LED module according to a sixth embodiment of the present disclosure, with an encapsulating resin omitted for clarity.
- FIG. 9 is a plan view showing a LED module according to a seventh embodiment of the present disclosure, with an encapsulating resin omitted for clarity.
- FIG. 10 is a section view illustrating one example of conventional LED modules.
- FIGS. 1 through 3 show a LED module according to a first embodiment of the present disclosure.
- the LED module A 1 shown in FIGS. 1 through 3 includes a substrate 1 , a metal wiring 2 , a LED chip 3 , an encapsulating resin 4 , a wire 5 and a clad member 6 .
- the encapsulating resin 4 is omitted to illustrate the interior of the LED module A 1 .
- the x, y and z directions indicated in FIGS. 1 through 3 are orthogonal to one another.
- the z direction is the thickness direction of the substrate 1 .
- the upper surface of the substrate 1 in the z direction in FIG. 2 will be referred to as a front surface, the lower surface as rear surface and the opposite end surfaces in the x direction as side surfaces.
- the substrate 1 is made of, e.g., a glass epoxy resin. When seen in the z direction as in FIG. 3 , the substrate 1 has an elongated rectangular shape extending in the x direction. A pair of concave portions la depressed in the x direction is formed in opposite end portions of the substrate 1 in the x-direction.
- the substrate 1 is manufactured, for example, by cutting a substrate material. In the manufacturing process, a plurality of through-holes is formed in the substrate material. The concave portions 1 a are formed by cutting the through-holes.
- the metal wiring 2 includes a metal electrode 21 and a metal electrode 22 .
- the metal electrode 21 and the metal electrode 22 are spaced apart from each other in the x-direction and arranged at opposite edges of the substrate 1 .
- Each of the metal electrodes 21 and 22 covers a region extending from the front surface of the substrate 1 to the rear surface across the side surface. In the present embodiment, the metal electrodes 21 and 22 cover only the concave portions la of the side surfaces of the substrate 1 .
- the regions of the metal electrode 21 and the metal electrode 22 positioned on the front surface of the substrate 1 are used in mounting the LED module A 1 to a desired circuit board as described earlier.
- the metal electrode 21 includes a region covering the left end portion of the substrate 1 over the full width in the y direction.
- the metal electrode 21 further includes a narrow band portion 211 protruding from the region toward the x-direction, which is the right direction in FIG. 3 .
- a mounting portion 212 connected to the right end of the narrow band portion 211 in the x-direction is also included in the metal electrode 21 .
- the mounting portion 212 has a square shape when seen in the z direction.
- the length of one side of the mounting portion 212 is larger than the length of one side of the LED chip 3 but is smaller than the y-direction width of the substrate 1 .
- the narrow band portion 211 is formed such that the y-direction width thereof becomes smaller than the length of one side of the mounting portion 212 .
- the metal electrode 22 includes a region covering the right end portion of the substrate 1 over the full width in the y direction and a narrow band portion 221 protruding from the region toward the x-direction, which is the left side in FIG. 3 .
- the y-direction width of the narrow band portion 221 is smaller than the length of one side of the mounting portion 212 .
- the right end in FIG. 3 of the wire 5 is connected to the narrow band portion 221 .
- the section of the narrow band portion 221 not covered with the clad member 6 corresponds to a wire bonding section referred to in the present disclosure.
- the metal wiring 2 is formed of a plurality of metal layers laminated one above another. Among the metal layers, the outermost metal layer is formed of gold.
- the metal wiring 2 can be formed by subjecting the afore-mentioned substrate material to a plating treatment and etching away unnecessary portions. At this time, a structure in which the metal wiring 2 covers the concave portions la can be easily realized by performing the plating treatment to cover the inner circumferential surfaces of the through-holes formed in the substrate material.
- the LED chip 3 is, e.g., a pn-type semiconductor device, and is configured to emit visible light or infrared light.
- the LED chip 3 has an n-side electrode formed on the lower surface thereof in FIG. 2 .
- the n-side electrode is electrically connected to the mounting portion 212 through a silver paste which is not shown.
- the LED chip 3 has a p-side electrode formed on the upper surface thereof in FIG. 2 .
- the p-side electrode is electrically connected to the narrow band portion 221 through the wire 5 .
- the encapsulating resin 4 is provided to protect the LED chip 3 and the wire 5 , and is formed of, e.g., an epoxy resin transparent to the light emitted from the LED chip 3 .
- the x-direction length of the encapsulating resin 4 is smaller than the x-direction length of the substrate 1 .
- the y-direction length of the encapsulating resin 4 is equal to the y-direction length of the substrate 1 .
- the encapsulating resin 4 has an x-direction left end 4 a positioned at the right side of the left concave portion 1 a of the substrate 1 and an x-direction right end 4 b positioned at the left side of the right concave portion 1 a of the substrate 1 .
- the x-direction left side surface 41 of the encapsulating resin 4 is an inclined surface, which is positioned to the x-direction right side as it extends toward the upper side in the z direction.
- the side surface 41 is inclined 6 degrees or more with respect to the z direction.
- the x-direction right side surface 42 of the encapsulating resin 4 is an inclined surface, which is positioned at the x-direction left side as it extends toward the upper side in the z direction.
- the side surface 42 is inclined 6 degrees or more with respect to the z direction.
- the encapsulating resin 4 can be formed by a transfer molding method.
- the transfer molding method includes a step of installing the afore-mentioned substrate material in a mold and filling a molten resin into the mold and a step of pulling the mold and the substrate material apart after the resin is cured.
- the wire 5 is made of gold and is formed through the use of, e.g., a commercially available wire bonding capillary.
- the clad member 6 covers the metal wiring 2 and is covered with the encapsulating resin 4 .
- the clad member 6 is made of a material with which the adhesion strength between the clad member 6 and the metal wiring 2 and the adhesion strength between the clad member 6 and the encapsulating resin 4 become greater than the adhesion strength between the metal wiring 2 and the encapsulating resin 4 .
- the clad member 6 may be a resin film having a z-direction thickness of 1 ⁇ m to 10 ⁇ m.
- the resin film it is possible to use, e.g., a resist employed in an etching process. It may also be possible to use a solder resist employed in a soldering process.
- a white resist is used as the clad member 6 , it becomes easy for the clad member 6 to reflect the light emitted from the LED chip 3 . For that reason, the use of the white resist as the clad member 6 may provide an effect of increasing the quantity of light emitted in the z direction from the LED module A 1 .
- the clad member 6 is formed at least in a region other than a region where the LED chip 3 is die-bonded and a region where the wire 5 is bonded.
- the clad member 6 includes a first clad member 61 and a second clad member 62 spaced apart from each other in the x direction.
- the first clad member 61 is formed into an elongated rectangular shape extending in the y direction when seen in the z direction.
- the y-direction length of the first clad member 61 is smaller than the y-direction length of the substrate 1 .
- the x-direction right end portion of the first clad member 61 partially covers the narrow band portion 211 .
- the x-direction left end 61 a of the first clad member 61 lies in the same position as the x-direction left end 4 a of the encapsulating resin 4 in the x direction.
- the second clad member 62 is formed into an elongated rectangular shape extending in the y direction when seen in the z direction.
- the y-direction length of the second clad member 62 is smaller than the y-direction length of the substrate 1 .
- the x-direction left end portion of the second clad member 62 partially covers the narrow band portion 221 .
- the x-direction right end 62 a of the second clad member 62 lies in the same position as the x-direction right end 4 b of the encapsulating resin 4 in the x direction.
- the first clad member 61 is formed to cover not only the upper surface in FIG.
- the second clad member 62 is formed to cover not only the upper surface in FIG. 2 of the metal electrode 22 of the metal wiring 2 but also the front surface of the substrate 1 .
- the clad member 6 is provided between the metal wiring 2 and the encapsulating resin 4 .
- a gold layer is formed on the surface of the metal wiring 2 , it causes a problem in that the metal wiring 2 and the encapsulating resin 4 are not easily bonded to each other, while it provides superior conductivity.
- an attempt is made to solve the problem by inserting the clad member 6 between the metal wiring 2 and the encapsulating resin 4 .
- the LED module A 1 has a configuration that is easy to enhance the reliability thereof.
- the side surfaces 41 and 42 of the encapsulating resin 4 are formed of inclined surfaces. This helps to prevent the encapsulating resin 4 from being caught in a mold when pulling the mold apart from the substrate material after a resin is cured in a transfer molding method. If the encapsulating resin 4 is caught in the mold, a force is applied for a long period of time in a direction'in which the encapsulating resin 4 and the substrate 1 are pulled apart from each other. This increases the risk of causing exfoliation of the encapsulating resin 4 from the metal wiring 2 .
- the LED module A 1 is capable of preventing such problem and, therefore, has a configuration that assists in enhancing the reliability thereof.
- the y-direction length of the clad member 6 is smaller than the y-direction length of the substrate 1 .
- the y-direction length of the clad member 6 may be equal to the y-direction length of the substrate 1 .
- the clad member 6 does not protrude outward from the encapsulating resin 4 .
- the clad member 6 may protrude outward from the encapsulating resin 4 .
- FIGS. 4 through 9 show other embodiments of the present disclosure.
- the components identical with or similar to those of the foregoing embodiment will be designated by the same reference symbols as used in the foregoing embodiment. Description of these components will be omitted, if appropriate.
- FIG. 4 shows a LED module A 2 according to a second embodiment of the present disclosure.
- the LED module A 2 shown in FIG. 4 differs in shape from the clad member 6 from the LED module A 1 .
- Other configurations of the LED module A 2 remain the same as those of the LED module A 1 .
- FIG. 4 is a plan view of the LED module A 2 with the encapsulating resin 4 thereof omitted for clarity.
- the clad member 6 of the present embodiment is formed to cover almost all portions of the substrate 1 except the opposite end portions thereof when seen in the z direction.
- the clad member 6 includes an opening 63 through which the mounting portion 212 is partially exposed and a recess 64 through which the narrow band portion 221 is partially exposed.
- the clad member 6 of the LED module A 2 covers the substrate 1 over the full length in the y-direction.
- opposite ends 65 and 66 of the clad member 6 may overlap with the x-direction opposite ends (see 4 a and 4 b in FIG. 1 ) of the encapsulating resin 4 which is not shown.
- the clad member 6 may protrude outward from the encapsulating resin 4 .
- the opening 63 has a circular shape when seen in the z direction.
- the four corners of the mounting portion 212 are covered with the clad member 6 .
- the size of the opening 63 may be set to have an area great enough to permit installation of the LED chip 3 and can be changed, if appropriate.
- the recess 64 is formed so that it can be depressed from the x-direction right end 66 of the clad member 6 toward the x-direction left side.
- the recess 64 may expose the narrow band portion 221 over an area only required in bonding the wire 5 to the narrow band portion 221 .
- the shape of the recess 64 can be changed, if appropriate.
- the clad member 6 may be greater in the reflectance of the light emitted from the LED chip 3 than the substrate 1 .
- the front surface of the substrate 1 is covered with the clad member 6 .
- the clad member 6 employed in the present embodiment has a relatively high reflectance. Therefore, as compared with when the front surface of the substrate 1 is not covered with the clad member 6 , it is possible to enhance the light extraction efficiency.
- the reflectance of the clad member 6 is smaller than that of the substrate 1 , the area of the front surface of the substrate 1 covered with the clad member 6 may be made smaller as is the case in FIG. 1 , or the clad member 6 may be formed to cover only the upper surface of the metal wiring 2 as is illustrated in FIG. 9 .
- FIG. 5 shows a LED module A 3 according to a third embodiment of the present disclosure.
- the edges of the encapsulating resin 4 are formed into a round shape.
- Other configurations of the LED module A 3 remain the same as those of the LED module A 1 .
- curved surfaces 43 and 44 are provided between the side surfaces 41 and 42 and the z-direction upper surface of the encapsulating resin 4 in FIG. 5 .
- FIG. 6 shows a LED module A 4 according to a fourth embodiment of the present disclosure.
- the clad member 6 is formed to protrude from the encapsulating resin 4 .
- Other configurations of the LED module A 4 remain the same as those of the LED module A 3 .
- the left end 61 a of the first clad member 61 is positioned at the left side of the left end 4 a of the encapsulating resin 4 in the x direction. In the example shown in FIG. 6 , the left end 61 a of the first clad member 61 reaches the left end of the metal wiring 2 . Alternatively, the left end 61 a of the first clad member 61 may be positioned between the left end 4 a of the encapsulating resin 4 and the left end of the metal wiring 2 .
- the right end 62 a of the second clad member 62 is positioned at the right side of the right end 4 b in FIG. 6 of the encapsulating resin 4 in the x direction. In the example shown in FIG. 6 , the right end 62 a of the second clad member 62 reaches the right end of the metal wiring 2 . Alternatively, the right end 62 a of the second clad member 62 may be positioned between the right end 4 b of the encapsulating resin 4 and the right end of the metal wiring 2 .
- FIG. 7 shows a LED module A 5 according to a fifth embodiment of the present disclosure.
- the clad member 6 is formed to be embedded into the encapsulating resin 4 .
- Other configurations of the LED module A 5 remain the same as those of the LED module A 3 .
- the left end 61 a of the first clad member 61 is positioned at the right side of the left end 4 a of the encapsulating resin 4 in the x direction.
- the right end 62 a of the second clad member 62 is positioned at the left side of the right end 4 b of the encapsulating resin 4 in the x direction.
- FIG. 8 shows a LED module A 6 according to a sixth embodiment of the present disclosure.
- an opening 67 having a circular shape when seen in the z direction is formed in place of the recess 64 .
- Other configurations of the LED module A 6 remain the same as those of the LED module A 2 .
- the clad member 6 may cover the metal wiring 2 over a broader area, thereby further restraining exfoliation of the encapsulating resin 4 .
- FIG. 9 shows a LED module A 7 according to a seventh embodiment of the present disclosure.
- the clad member 6 is formed to cover only the upper surface of the metal wiring 2 .
- Other configurations of the LED module A 7 remain the same as those of the LED module A 1 . As stated above, this configuration is effective when the clad member 6 is smaller in reflectance than the substrate 1 .
- the LED modules according to the present disclosure are not limited to the embodiments described above.
- the specific configurations of the respective parts of the LED modules according to the present disclosure may be modified to many different designs.
- the present disclosure may be applied to an embodiment in which wire-bonding portions are provided in left and right electrodes and in which a LED chip and two wire-bonding portions are connected to each other by wire bonding.
- the present disclosure may be applied to an embodiment in which a LED chip is flip-chip connected to left and right electrodes.
- the clad member is formed in a region other than the connection portions of the LED chip and the metal wiring.
- the LED module it is possible to ameliorate the problem of the metal wiring and the encapsulating resin being hard to be bonded to each other, because the clad member is inserted between the metal wiring and the encapsulating resin.
Abstract
Description
- This application is based upon and claims the benefit of priority from Japan Patent Application Nos. 2012-008741 and 2011-30331, filed on Jan. 19, 2012 and Feb. 16, 2011, respectively, the entire contents of which are incorporated herein by reference.
- The present disclosure relates to a LED module having a light emitting diode (hereinafter referred to as a “LED”) arranged therein.
- One example of a LED module is shown in
FIG. 10 . The LED module X shown inFIG. 10 includes asubstrate 91,metal electrodes substrate 91, aLED chip 94 electrically connected to themetal electrodes wire 95 and anencapsulating resin 96 covering these components. Thesubstrate 91 is made of, e.g., a glass epoxy resin. Themetal electrodes substrate 91. Each of themetal electrodes substrate 91 to the rear surface across the side surface. TheLED chip 94 is mounted on the portion of themetal electrode 92 covering the front surface of thesubstrate 91. One end of thewire 95 is fixed to the portion of themetal electrode 93 covering the front surface of thesubstrate 91. The other end of thewire 95 is connected to theLED chip 94. The LED module X, when in use, is embedded to, e.g., acircuit board 97 built in an illuminating device. As shown inFIG. 10 , the portions of themetal electrodes substrate 91 are connected towiring lines 98 provided in thecircuit board 97. When installing the LED module X on thecircuit board 97, a process is performed in which the LED module X and thecircuit board 97 are heated in a reflow furnace with solder materials inserted between themetal electrodes wiring lines 98. - The encapsulating
resin 96 is provided to protect theLED chip 94 and thewire 95 and is formed of an epoxy resin transparent to the light emitted from theLED chip 94. Theencapsulating resin 96 is formed to cover the portions of themetal electrodes substrate 91. Gold-plated layers are often formed on the surfaces of themetal electrodes circuit board 97. At this time, theencapsulating resin 96 is thermally deformed. However, theencapsulating resin 96 and themetal electrodes LED chips 94 are not turned on. - The present disclosure provides some embodiments of a highly reliable LED module conceived in view of the afore-mentioned circumstances.
- According to one aspect of the present disclosure, there is provided a LED module. The LED module includes a substrate, a LED chip, a metal wiring, an encapsulating resin and a clad member. The LED chip is supported on the substrate. The metal wiring is installed on the substrate and has a mounting portion on which the LED chip is mounted. The encapsulating resin covers the LED chip and the metal wiring. The clad member covers the metal wiring to expose the mounting portion. With this configuration, the encapsulating resin is arranged to cover the clad member.
- In one embodiment, the clad member has an opening formed to permit installation of the LED chip when seen in a thickness direction of the substrate.
- For example, the mounting portion has a rectangular shape when seen in the thickness direction of the substrate, and the opening has a circular shape when seen in the thickness direction of the substrate.
- In another embodiment, the clad member partially covers the mounting portion.
- In another embodiment, the metal wiring includes a wire bonding portion spaced apart from the mounting portion, and a wire configured to interconnect the LED chip and the wire bonding portion. The clad member is arranged to cover the metal wiring to expose the wire bonding portion.
- In another embodiment, the clad member has a recess dented to approach the mounting portion in an extension direction of the wire. The recess is positioned to overlap with the wire bonding portion when seen in the thickness direction of the substrate.
- In another embodiment, the metal wiring includes a first metal electrode containing the mounting portion and a second metal electrode containing the wire bonding portion. The first metal electrode covers a first edge of the substrate in a first direction. The second metal electrode covers a second edge of the substrate opposite the first edge. The encapsulating resin is shorter than the substrate.
- In another embodiment, the substrate includes a pair of concave portions located at opposite ends of the substrate, the pair of concave portions including depressed toward one another. The metal wiring is arranged to cover the pair of the concave portions, and the encapsulating resin is formed to expose the pair of the concave portions.
- In another embodiment, a first end of the clad member and a first end of the encapsulating resin are at the same position in the first direction.
- In another embodiment, a first end of the clad member extends toward a first end of the substrate further than a first end of the encapsulating resin in the first direction.
- In another embodiment, a second end of the clad member and a second end of the encapsulating resin are at the same position in the first direction.
- In another embodiment, a second end of the clad member extends further toward a second end of the substrate than a second end of the encapsulating resin in the first direction.
- In another embodiment, the encapsulating resin is formed to cover entire width of the substrate in a second direction orthogonal to the first direction. The opposite ends of the clad member and the opposite ends of the substrate are at the same position in the second direction.
- In another embodiment of the present disclosure, the substrate is formed longer than the encapsulating resin in the first direction. A first side surface of the encapsulating resin inclines toward a second side surface in the first direction.
- For example, the first side surface of the encapsulating resin includes an inclined surface inclined 6 degrees or more with respect to the thickness direction of the substrate.
- In an additional embodiment, the first side surface of the encapsulating resin has a curved surface.
- The second side surface of the encapsulating resin inclines toward the first side surface in the first direction.
- For example, the second side surface of the encapsulating resin includes an inclined surface inclined 6 degrees or more with respect to the thickness direction of the substrate.
- In an additional embodiment, the second side surface of the encapsulating resin includes a curved surface.
- In yet another embodiment of the present disclosure, the clad member is made of a material with which the adhesion strength between the clad member and the metal wiring and the adhesion strength between the clad member and the encapsulating resin become greater than the adhesion strength between the metal wiring and the encapsulating resin.
- For example, the metal wiring has a gold-plated layer.
- For example, the clad member is made of a resin.
- For example, the clad member has a white color.
- For example, the clad member has a thickness of 1 μm to 10 μm.
- Other features and advantages of the present disclosure will become more apparent from the following detailed description of some embodiments made in conjunction with the accompanying drawings.
-
FIG. 1 is a plan view showing a LED module according to a first embodiment of the present disclosure. -
FIG. 2 is a section view taken along line II-II inFIG. 1 . -
FIG. 3 is a plan view of the LED module shown inFIG. 1 , with an encapsulating resin omitted for clarity. -
FIG. 4 is a plan view showing a LED module according to a second embodiment of the present disclosure, with an encapsulating resin omitted for clarity. -
FIG. 5 is a section view showing a LED module according to a third embodiment of the present disclosure. -
FIG. 6 is a section view showing a LED module according to a fourth embodiment of the present disclosure. -
FIG. 7 is a section view showing a LED module according to a fifth embodiment of the present disclosure. -
FIG. 8 is a plan view showing a LED module according to a sixth embodiment of the present disclosure, with an encapsulating resin omitted for clarity. -
FIG. 9 is a plan view showing a LED module according to a seventh embodiment of the present disclosure, with an encapsulating resin omitted for clarity. -
FIG. 10 is a section view illustrating one example of conventional LED modules. - Some embodiments of the present disclosure will now be described in detail with reference to the drawings.
-
FIGS. 1 through 3 show a LED module according to a first embodiment of the present disclosure. The LED module A1 shown inFIGS. 1 through 3 includes asubstrate 1, a metal wiring 2, aLED chip 3, an encapsulatingresin 4, awire 5 and aclad member 6. InFIG. 3 , the encapsulatingresin 4 is omitted to illustrate the interior of the LED module A1. The x, y and z directions indicated inFIGS. 1 through 3 are orthogonal to one another. The z direction is the thickness direction of thesubstrate 1. In the following description, the upper surface of thesubstrate 1 in the z direction inFIG. 2 will be referred to as a front surface, the lower surface as rear surface and the opposite end surfaces in the x direction as side surfaces. - The
substrate 1 is made of, e.g., a glass epoxy resin. When seen in the z direction as inFIG. 3 , thesubstrate 1 has an elongated rectangular shape extending in the x direction. A pair of concave portions la depressed in the x direction is formed in opposite end portions of thesubstrate 1 in the x-direction. Thesubstrate 1 is manufactured, for example, by cutting a substrate material. In the manufacturing process, a plurality of through-holes is formed in the substrate material. The concave portions 1 a are formed by cutting the through-holes. - The metal wiring 2 includes a
metal electrode 21 and ametal electrode 22. Themetal electrode 21 and themetal electrode 22 are spaced apart from each other in the x-direction and arranged at opposite edges of thesubstrate 1. Each of themetal electrodes substrate 1 to the rear surface across the side surface. In the present embodiment, themetal electrodes substrate 1. The regions of themetal electrode 21 and themetal electrode 22 positioned on the front surface of thesubstrate 1 are used in mounting the LED module A1 to a desired circuit board as described earlier. - As shown in
FIG. 3 , themetal electrode 21 includes a region covering the left end portion of thesubstrate 1 over the full width in the y direction. Themetal electrode 21 further includes anarrow band portion 211 protruding from the region toward the x-direction, which is the right direction inFIG. 3 . In addition, a mountingportion 212 connected to the right end of thenarrow band portion 211 in the x-direction is also included in themetal electrode 21. In the example shown inFIG. 3 , the mountingportion 212 has a square shape when seen in the z direction. The length of one side of the mountingportion 212 is larger than the length of one side of theLED chip 3 but is smaller than the y-direction width of thesubstrate 1. Thenarrow band portion 211 is formed such that the y-direction width thereof becomes smaller than the length of one side of the mountingportion 212. - As illustrated in
FIG. 3 , themetal electrode 22 includes a region covering the right end portion of thesubstrate 1 over the full width in the y direction and anarrow band portion 221 protruding from the region toward the x-direction, which is the left side inFIG. 3 . In the example illustrated inFIG. 3 , the y-direction width of thenarrow band portion 221 is smaller than the length of one side of the mountingportion 212. The right end inFIG. 3 of thewire 5 is connected to thenarrow band portion 221. The section of thenarrow band portion 221 not covered with theclad member 6 corresponds to a wire bonding section referred to in the present disclosure. - While omitted in the example shown in
FIG. 2 , the metal wiring 2 is formed of a plurality of metal layers laminated one above another. Among the metal layers, the outermost metal layer is formed of gold. The metal wiring 2 can be formed by subjecting the afore-mentioned substrate material to a plating treatment and etching away unnecessary portions. At this time, a structure in which the metal wiring 2 covers the concave portions la can be easily realized by performing the plating treatment to cover the inner circumferential surfaces of the through-holes formed in the substrate material. - The
LED chip 3 is, e.g., a pn-type semiconductor device, and is configured to emit visible light or infrared light. TheLED chip 3 has an n-side electrode formed on the lower surface thereof inFIG. 2 . The n-side electrode is electrically connected to the mountingportion 212 through a silver paste which is not shown. TheLED chip 3 has a p-side electrode formed on the upper surface thereof inFIG. 2 . The p-side electrode is electrically connected to thenarrow band portion 221 through thewire 5. - The encapsulating
resin 4 is provided to protect theLED chip 3 and thewire 5, and is formed of, e.g., an epoxy resin transparent to the light emitted from theLED chip 3. The x-direction length of the encapsulatingresin 4 is smaller than the x-direction length of thesubstrate 1. The y-direction length of the encapsulatingresin 4 is equal to the y-direction length of thesubstrate 1. As shown inFIG. 1 , the encapsulatingresin 4 has an x-directionleft end 4 a positioned at the right side of the left concave portion 1 a of thesubstrate 1 and an x-directionright end 4 b positioned at the left side of the right concave portion 1 a of thesubstrate 1. As shown inFIG. 2 , the x-directionleft side surface 41 of the encapsulatingresin 4 is an inclined surface, which is positioned to the x-direction right side as it extends toward the upper side in the z direction. Theside surface 41 is inclined 6 degrees or more with respect to the z direction. The x-directionright side surface 42 of the encapsulatingresin 4 is an inclined surface, which is positioned at the x-direction left side as it extends toward the upper side in the z direction. Theside surface 42 is inclined 6 degrees or more with respect to the z direction. The encapsulatingresin 4 can be formed by a transfer molding method. The transfer molding method includes a step of installing the afore-mentioned substrate material in a mold and filling a molten resin into the mold and a step of pulling the mold and the substrate material apart after the resin is cured. - The
wire 5 is made of gold and is formed through the use of, e.g., a commercially available wire bonding capillary. - As shown in
FIG. 2 , theclad member 6 covers the metal wiring 2 and is covered with the encapsulatingresin 4. Theclad member 6 is made of a material with which the adhesion strength between theclad member 6 and the metal wiring 2 and the adhesion strength between theclad member 6 and the encapsulatingresin 4 become greater than the adhesion strength between the metal wiring 2 and the encapsulatingresin 4. For example, theclad member 6 may be a resin film having a z-direction thickness of 1 μm to 10 μm. As the resin film, it is possible to use, e.g., a resist employed in an etching process. It may also be possible to use a solder resist employed in a soldering process. If a white resist is used as theclad member 6, it becomes easy for theclad member 6 to reflect the light emitted from theLED chip 3. For that reason, the use of the white resist as theclad member 6 may provide an effect of increasing the quantity of light emitted in the z direction from the LED module A1. - In the example shown in
FIG. 3 , theclad member 6 is formed at least in a region other than a region where theLED chip 3 is die-bonded and a region where thewire 5 is bonded. Theclad member 6 includes a first cladmember 61 and a second cladmember 62 spaced apart from each other in the x direction. As shown inFIG. 3 , the first cladmember 61 is formed into an elongated rectangular shape extending in the y direction when seen in the z direction. The y-direction length of the first cladmember 61 is smaller than the y-direction length of thesubstrate 1. The x-direction right end portion of the first cladmember 61 partially covers thenarrow band portion 211. As shown inFIG. 2 , the x-directionleft end 61 a of the first cladmember 61 lies in the same position as the x-directionleft end 4 a of the encapsulatingresin 4 in the x direction. - As shown in
FIG. 3 , the second cladmember 62 is formed into an elongated rectangular shape extending in the y direction when seen in the z direction. The y-direction length of the second cladmember 62 is smaller than the y-direction length of thesubstrate 1. The x-direction left end portion of the second cladmember 62 partially covers thenarrow band portion 221. As shown inFIG. 2 , the x-directionright end 62 a of the second cladmember 62 lies in the same position as the x-directionright end 4 b of the encapsulatingresin 4 in the x direction. In addition, the first cladmember 61 is formed to cover not only the upper surface inFIG. 2 of themetal electrode 21 of the metal wiring 2 but also the front surface of thesubstrate 1. The second cladmember 62 is formed to cover not only the upper surface inFIG. 2 of themetal electrode 22 of the metal wiring 2 but also the front surface of thesubstrate 1. - Next, description will be made on the operation of the LED module A1.
- In the LED module A1 set forth above, the
clad member 6 is provided between the metal wiring 2 and the encapsulatingresin 4. As stated in the description of the example, if a gold layer is formed on the surface of the metal wiring 2, it causes a problem in that the metal wiring 2 and the encapsulatingresin 4 are not easily bonded to each other, while it provides superior conductivity. In the LED module A1, an attempt is made to solve the problem by inserting theclad member 6 between the metal wiring 2 and the encapsulatingresin 4. Thus the LED module A1 has a configuration that is easy to enhance the reliability thereof. - In the LED module A1, the side surfaces 41 and 42 of the encapsulating
resin 4 are formed of inclined surfaces. This helps to prevent the encapsulatingresin 4 from being caught in a mold when pulling the mold apart from the substrate material after a resin is cured in a transfer molding method. If the encapsulatingresin 4 is caught in the mold, a force is applied for a long period of time in a direction'in which the encapsulatingresin 4 and thesubstrate 1 are pulled apart from each other. This increases the risk of causing exfoliation of the encapsulatingresin 4 from the metal wiring 2. The LED module A1 is capable of preventing such problem and, therefore, has a configuration that assists in enhancing the reliability thereof. - In the example shown in
FIG. 3 , the y-direction length of theclad member 6 is smaller than the y-direction length of thesubstrate 1. Alternatively, the y-direction length of theclad member 6 may be equal to the y-direction length of thesubstrate 1. - In the embodiment described above, the
clad member 6 does not protrude outward from the encapsulatingresin 4. Alternatively, theclad member 6 may protrude outward from the encapsulatingresin 4. -
FIGS. 4 through 9 show other embodiments of the present disclosure. In these figures, the components identical with or similar to those of the foregoing embodiment will be designated by the same reference symbols as used in the foregoing embodiment. Description of these components will be omitted, if appropriate. -
FIG. 4 shows a LED module A2 according to a second embodiment of the present disclosure. The LED module A2 shown inFIG. 4 differs in shape from theclad member 6 from the LED module A1. Other configurations of the LED module A2 remain the same as those of the LED module A1.FIG. 4 is a plan view of the LED module A2 with the encapsulatingresin 4 thereof omitted for clarity. - As shown in
FIG. 4 , theclad member 6 of the present embodiment is formed to cover almost all portions of thesubstrate 1 except the opposite end portions thereof when seen in the z direction. Theclad member 6 includes anopening 63 through which the mountingportion 212 is partially exposed and arecess 64 through which thenarrow band portion 221 is partially exposed. - In a region other than the regions where the
opening 63 and therecess 64 are formed, theclad member 6 of the LED module A2 covers thesubstrate 1 over the full length in the y-direction. In the x-direction opposite ends 65 and 66 of theclad member 6 may overlap with the x-direction opposite ends (see 4 a and 4 b inFIG. 1 ) of the encapsulatingresin 4 which is not shown. Theclad member 6 may protrude outward from the encapsulatingresin 4. - In the example shown in
FIG. 4 , theopening 63 has a circular shape when seen in the z direction. The four corners of the mountingportion 212 are covered with theclad member 6. The size of theopening 63 may be set to have an area great enough to permit installation of theLED chip 3 and can be changed, if appropriate. - In the example shown in
FIG. 4 , therecess 64 is formed so that it can be depressed from the x-directionright end 66 of theclad member 6 toward the x-direction left side. Therecess 64 may expose thenarrow band portion 221 over an area only required in bonding thewire 5 to thenarrow band portion 221. The shape of therecess 64 can be changed, if appropriate. - The
clad member 6 may be greater in the reflectance of the light emitted from theLED chip 3 than thesubstrate 1. As shown inFIG. 4 , the front surface of thesubstrate 1 is covered with theclad member 6. Theclad member 6 employed in the present embodiment has a relatively high reflectance. Therefore, as compared with when the front surface of thesubstrate 1 is not covered with theclad member 6, it is possible to enhance the light extraction efficiency. On the contrary, if the reflectance of theclad member 6 is smaller than that of thesubstrate 1, the area of the front surface of thesubstrate 1 covered with theclad member 6 may be made smaller as is the case inFIG. 1 , or theclad member 6 may be formed to cover only the upper surface of the metal wiring 2 as is illustrated inFIG. 9 . -
FIG. 5 shows a LED module A3 according to a third embodiment of the present disclosure. In the LED module A3 shown inFIG. 5 , the edges of the encapsulatingresin 4 are formed into a round shape. Other configurations of the LED module A3 remain the same as those of the LED module A1. - In the present embodiment, curved surfaces 43 and 44 are provided between the side surfaces 41 and 42 and the z-direction upper surface of the encapsulating
resin 4 inFIG. 5 . By providing thecurved surfaces resin 4 is pulled out from the mold. -
FIG. 6 shows a LED module A4 according to a fourth embodiment of the present disclosure. In the LED module A4 shown inFIG. 6 , theclad member 6 is formed to protrude from the encapsulatingresin 4. Other configurations of the LED module A4 remain the same as those of the LED module A3. - As shown in
FIG. 6 , theleft end 61 a of the first cladmember 61 is positioned at the left side of theleft end 4 a of the encapsulatingresin 4 in the x direction. In the example shown inFIG. 6 , theleft end 61 a of the first cladmember 61 reaches the left end of the metal wiring 2. Alternatively, theleft end 61 a of the first cladmember 61 may be positioned between theleft end 4 a of the encapsulatingresin 4 and the left end of the metal wiring 2. - The
right end 62 a of the second cladmember 62 is positioned at the right side of theright end 4 b inFIG. 6 of the encapsulatingresin 4 in the x direction. In the example shown inFIG. 6 , theright end 62 a of the second cladmember 62 reaches the right end of the metal wiring 2. Alternatively, theright end 62 a of the second cladmember 62 may be positioned between theright end 4 b of the encapsulatingresin 4 and the right end of the metal wiring 2. -
FIG. 7 shows a LED module A5 according to a fifth embodiment of the present disclosure. In the LED module A5 shown inFIG. 7 , theclad member 6 is formed to be embedded into the encapsulatingresin 4. Other configurations of the LED module A5 remain the same as those of the LED module A3. - As shown in
FIG. 7 , theleft end 61 a of the first cladmember 61 is positioned at the right side of theleft end 4 a of the encapsulatingresin 4 in the x direction. Theright end 62 a of the second cladmember 62 is positioned at the left side of theright end 4 b of the encapsulatingresin 4 in the x direction. -
FIG. 8 shows a LED module A6 according to a sixth embodiment of the present disclosure. In the LED module A6 shown inFIG. 8 , anopening 67 having a circular shape when seen in the z direction is formed in place of therecess 64. Other configurations of the LED module A6 remain the same as those of the LED module A2. - With this configuration, the
clad member 6 may cover the metal wiring 2 over a broader area, thereby further restraining exfoliation of the encapsulatingresin 4. -
FIG. 9 shows a LED module A7 according to a seventh embodiment of the present disclosure. In the LED module A7 shown inFIG. 9 , theclad member 6 is formed to cover only the upper surface of the metal wiring 2. Other configurations of the LED module A7 remain the same as those of the LED module A1. As stated above, this configuration is effective when theclad member 6 is smaller in reflectance than thesubstrate 1. - The LED modules according to the present disclosure are not limited to the embodiments described above. The specific configurations of the respective parts of the LED modules according to the present disclosure may be modified to many different designs.
- For example, while an example in which die-bonding and wire-bonding are performed has been described in the foregoing embodiments, the present disclosure may be applied to an embodiment in which wire-bonding portions are provided in left and right electrodes and in which a LED chip and two wire-bonding portions are connected to each other by wire bonding. Moreover, the present disclosure may be applied to an embodiment in which a LED chip is flip-chip connected to left and right electrodes. In any event, the clad member is formed in a region other than the connection portions of the LED chip and the metal wiring.
- According to the above embodiments of the present disclosure, it is possible to ameliorate the problem of the metal wiring and the encapsulating resin being hard to be bonded to each other, because the clad member is inserted between the metal wiring and the encapsulating resin. According to some embodiments of the present disclosure, when manufacturing the LED module, it is easy to pull out the encapsulating resin from the mold after the encapsulating resin is formed through the use of the mold. This helps to reduce the force exerted between the encapsulating resin and the substrate and prevent exfoliation of the encapsulating resin from the metal wiring. Accordingly, the LED module provided by the present disclosure becomes highly reliable.
- While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosures. Indeed, the novel LED modules described herein may be embodied in a variety'of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the disclosures. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosure.
Claims (24)
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US20130307014A1 (en) * | 2012-05-16 | 2013-11-21 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
WO2014182773A3 (en) * | 2013-05-10 | 2014-12-31 | Osram Sylvania Inc. | Methods of producing electronic assemblies including a subassembly film |
CN105591005A (en) * | 2014-10-20 | 2016-05-18 | 深圳市斯迈得光电子有限公司 | Bowl-free LED support structure |
US20160284678A1 (en) * | 2015-03-23 | 2016-09-29 | Rohm Co., Ltd. | Led package |
US20180123002A1 (en) * | 2012-05-09 | 2018-05-03 | Rohm Co., Ltd. | Semiconductor light-emitting device |
US20180240948A1 (en) * | 2017-02-17 | 2018-08-23 | Rohm Co., Ltd. | Semiconductor light emitting device and method of manufacturing the same |
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Also Published As
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CN102683509A (en) | 2012-09-19 |
US20170194543A1 (en) | 2017-07-06 |
US20150179898A1 (en) | 2015-06-25 |
US8994062B2 (en) | 2015-03-31 |
US20160300990A1 (en) | 2016-10-13 |
JP2012186450A (en) | 2012-09-27 |
CN102683509B (en) | 2017-04-12 |
US9379290B2 (en) | 2016-06-28 |
US20140209964A1 (en) | 2014-07-31 |
US8723215B2 (en) | 2014-05-13 |
US9640744B2 (en) | 2017-05-02 |
US10103304B2 (en) | 2018-10-16 |
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