US20120222290A1 - Method and system for preparing wireless communication chips for later processing - Google Patents
Method and system for preparing wireless communication chips for later processing Download PDFInfo
- Publication number
- US20120222290A1 US20120222290A1 US13/466,969 US201213466969A US2012222290A1 US 20120222290 A1 US20120222290 A1 US 20120222290A1 US 201213466969 A US201213466969 A US 201213466969A US 2012222290 A1 US2012222290 A1 US 2012222290A1
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- US
- United States
- Prior art keywords
- wireless communication
- tabs
- antenna
- chip
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 238000000034 method Methods 0.000 title claims abstract description 68
- 238000004891 communication Methods 0.000 title claims abstract description 64
- 238000012545 processing Methods 0.000 title description 6
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- 239000011888 foil Substances 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 28
- 239000000853 adhesive Substances 0.000 description 32
- 230000001070 adhesive effect Effects 0.000 description 32
- 239000000463 material Substances 0.000 description 13
- 238000007789 sealing Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
- H01Q9/285—Planar dipole
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1097—Lamina is running length web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49751—Scrap recovering or utilizing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49751—Scrap recovering or utilizing
- Y10T29/49755—Separating one material from another
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
- Y10T29/5139—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work prior to disassembling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
- Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
- Y10T29/5139—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work prior to disassembling
- Y10T29/514—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work prior to disassembling comprising means to strip insulation from wire
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53165—Magnetic memory device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5317—Laminated device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/768—Rotatable disc tool pair or tool and carrier
- Y10T83/7868—Tool element selectively operative
Abstract
A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers is used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.
Description
- This application is a divisional of U.S. patent application Ser. No. 12/558,406, filed Sep. 11, 2009, which is a divisional of U.S. patent application Ser. No. 11/468,756, filed Aug. 30, 2006, now U.S. Pat. No. 7,650,683, which is a divisional of U.S. patent application Ser. No. 10/422,616, filed Apr. 24, 2003, now U.S. Pat. No. 7,191,507, which claims the benefit of U.S. Provisional Patent Application No. 60/375,249, filed Apr. 24, 2002, the disclosures of which are incorporated by reference herein in their entirety.
- The present disclosure relates to a method of manufacturing a wireless communication device for use in communication of information concerning an item containing the wireless communication device.
- It is often desired to track and identify items, such as packages, containers, and the like, and to communicate information concerning such items wirelessly. One method of tracking and providing information concerning packages is to attach a wireless communication device, such as a radio frequency identification (RFID) transponder or other identification device, to packages or items. The information communicated concerning the packages or items may include an expiration date, “born on” date, or date of manufacture, lot number, tracking information, or other manufacturing information, and the like. A wireless communication device may be attached to an individual package, to a container containing multiple packages, or other item as the situation merits.
- Recent advances in the miniaturization of wireless communication electronics have enabled the creation of small chips containing integrated circuits that are well suited for use in these wireless communication devices. However, these chips still need antennas to communicate to a remotely positioned interrogator. Numerous potential antennas exist that may be coupled to the chip for this purpose.
- It is expected that the demand for such devices will rapidly increase as industries realize the versatility and utility of the wireless communication devices. To meet this demand, automated manufacturing processes are needed. Further, the process contemplated should provide a wireless communication device well suited for integration with the item to be tracked and one that may have the ability to communicate at multiple frequencies if desired.
- This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
- In a first aspect, the present disclosure provides a number of embodiments designed to pick up chips from a carrier tape and position the chips on an adhesive production line for later incorporation into a wireless communication device.
- A second aspect that may be used in conjunction with the first aspect comprises a combination of positioning a conductive material on a roll, cutting the conductive material to the desired shape, and peeling the conductive material from an underlying carrier material. In one embodiment of this aspect, a single roller performs the entire cut. In a second embodiment of this aspect, three separate rollers perform different cuts, allowing the size of the tabs created to be varied as needed or desired.
- Another aspect comprises using two selectively spaced rollers to adjust the size of the tab created. In an exemplary embodiment, a testing device may assess the capacitance of the elements of the dipole with a ground layer or without a ground layer to give an estimate of the thickness and/or dielectric constant of the substrate to which the chip is being applied. Each roller may be moved independently, increasing or decreasing the size of the tab while assessing the effective capacitance until a desired value is achieved for maximum antenna performance. Upon reaching the desired values, the tabs are cut to create the antenna.
- As yet another aspect of the present disclosure, a wireless communication chip may be inserted into a substrate such that the chip does not protrude from the surface of the substrate. An exemplary embodiment includes punching a hole in the substrate, positioning tabs to form a dipole antenna overlapping the newly formed hole, and positioning the chip in the hole. The chip may be attached to the tabs by a low melting point solder, a conductive adhesive, welding, or a mechanical bond.
- The aspects are mutually cooperative and allow a roll-to-roll manufacturing process to be automated for the creation of the wireless communication devices.
- The foregoing aspects and many of the attendant advantages of this disclosure will become more readily appreciated as the same become better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:
-
FIG. 1 illustrates a top plan view of a wireless communication device assembled according to the present disclosure; -
FIG. 2 illustrates a side elevational view of a carrier tape loaded with wireless communication chips; -
FIG. 3 illustrates a side schematic view of a first technique to position chips on an adhesive production line; -
FIG. 4 illustrates a side schematic view of a second technique to position chips on an adhesive production line; -
FIG. 5 illustrates a more detailed view of the interface between the roller and the carrier tape ofFIG. 4 ; -
FIG. 6 illustrates a side view of a first cutting technique for creating antenna elements for wireless communication devices; -
FIG. 7 illustrates a top view of the first cutting technique ofFIG. 6 ; -
FIG. 8 illustrates a side view of a second cutting technique for creating antenna elements for wireless communication devices; -
FIG. 9 illustrates a top view of a laminate during different stages of the cutting ofFIG. 8 ; -
FIG. 10 illustrates a side view of a third cutting technique for creating antenna elements for wireless communication devices; -
FIG. 11 illustrates a top view of the third cutting technique ofFIG. 10 ; -
FIG. 12 illustrates a top view of the third cutting technique ofFIG. 10 with the rollers spread; -
FIGS. 13A and 13B illustrate top views of the tape before and after cutting in the process ofFIGS. 10-12 ; -
FIG. 14 illustrates a first cross-sectional view of a positioning technique for a chip to be used in a wireless communication device; -
FIG. 15 illustrates a top plan view of an antenna element positioned on a substrate; -
FIG. 16 illustrates a side view of the antenna element ofFIG. 15 with a chip positioned above it prior to positioning; -
FIG. 17 illustrates a side view of the antenna element ofFIG. 16 with the chip positioned; -
FIG. 18 illustrates an exemplary roller technique to attach the chips to the substrate of the wireless communication device; -
FIG. 19 illustrates a more detailed view of the chip being attached to the substrate; and -
FIG. 20 illustrates an exemplary block diagram of an entire production process using the techniques of the present disclosure. - The present disclosure provides a method of manufacturing wireless communication devices such as those used in co-pending, commonly assigned U.S. patent applications Ser. Nos. 09/678,271 and 09/678,630, now U.S. Pat. Nos. 6,501,435 and 6,975,834, entitled “Wireless Communication Device and Method” and “Mufti-Band Wireless Communication Device and Method,” respectively, both of which were filed on Oct. 3, 2000, and are incorporated herein by reference in their entireties. In particular, the present disclosure allows variations in the size of the tabs used for antenna elements in the wireless communication devices.
- Some wireless communications devices have both transmit and receive capability and can be used with the present disclosure. A typical example of such a device is described in U.S. Pat. No. 5,585,953, entitled “IR/RF Radio Transceiver and Method,” incorporated herein by reference in its entirety. Other wireless communication devices have receive capability and use the energy received to communicate back, such as described in U.S. Pat. No. 6,078,259, entitled “Radio Frequency Identification Tag,” incorporated herein by reference in its entirety. Such passive devices may likewise be used with the present disclosure. The wireless communication device in the present disclosure can be any type of device that allows reception of wireless electronic communications and is able to communicate in response thereto. Both types of wireless communication devices are sometimes referred to herein and in the art as transponders. The terms are used equivalently herein.
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FIG. 1 illustrates awireless communication device 10, such as that described in the previously incorporated applications. In particular;wireless communication device 10 comprises asubstrate 20, awireless communication chip 30, and one ormore tabs 40 to serve as anantenna 60 forwireless communication device 10.Tabs -
Tabs 40 may also be constructed from a tape impregnated with metal loaded ink, as described in U.S. Pat. No. 5,566,441, entitled “Attaching an Electronic Circuit to a Substrate,” incorporated herein by reference in its entirety. In one embodiment of the present disclosure, as illustrated inFIG. 1 ,tabs foil tape - An optional ground plane (not shown) may be oppositely positioned on
substrate 20 if needed or desired.Substrate 20 may be almost any material, but is most likely a plastic or similar material. -
Wireless communication chip 30 may comprise a device from INTERMEC as used in their INTELLITAG® labels and those devices from SOS as used in theirDL 100 label, although other devices are certainly possible, especially in light of the present disclosure's suitability to both active and passivewireless communication devices 10.Wireless communication chip 30 may comprise a controller, memory, a battery, a sensor, and other conventional components, such as those described in the previously incorporated applications. -
Tabs dipole antenna 60. In this particular embodiment,tabs asymmetrical dipole antenna 60 is an antenna having afirst tab 40A or first pole, different in shape, including, but not necessarily limited to length, width, volume, and/or density, from thesecond tab 40B, or second pole. -
Tabs single tab 40 may be used as a monopole antenna given the appropriate ground plane (not shown). While the present disclosure is primarily directed to dipole antenna tab structures, it should be appreciated by those in the art that some of the techniques may be equally applicable to asingle tab 40 arrangement or an arrangement having more than twotabs - The present disclosure focuses on techniques to manufacture these
wireless communication devices 10. There are several different aspects to the manufacturing process. The first is properly positioning thewireless communication chip 30 for later processing and is discussed in the chip-positioning section below. The second is the creation of thetabs 40 that form theantenna 60, are addressed in a separate section below. The last is the merging of thechip 30 with theantenna 60 to form thewireless communication device 10, discussed in the mounting techniques section below. -
FIG. 2 illustrates anexemplary carrier tape 100 comprising anadhesive sealing layer 102 and acontainer layer 104.Container layer 104 comprises a plurality of containers orpockets 106 havingwireless communication chips 30 disposed therein.Carrier tape 100 may be made from any number of materials and is available from a number of manufacturers, such as Tek Pak. Details can be found at www.tekpak.com.Adhesive sealing layer 102 initially seals thechips 30 within thecontainers 106, protecting them from environmental vagaries. Subsequently, when desired,adhesive sealing layer 102 peels off ofcontainer layer 104, leaving the contents of thecontainers 106 exposed for further processing. - There are two specifically-contemplated techniques to remove the
chips 30 from thecarrier tape 100 for later mounting on thewireless communication device 10. Other techniques are also contemplated to enable the roll-to-roll continuous automation process of the present disclosure. - A first technique is illustrated in
FIG. 3 .Chip positioning system 110 comprises awaste roller 112, afirst roller 114, and asecond roller 116.Carrier tape 100 is fed torollers adhesive line 118.Waste roller 112 wrapsadhesive sealing layer 102 therearound, exposingchips 30 within the containers 106 (FIG. 1 ).Rollers space chips 30 appropriately onadhesive line 118. The proximity of theroller 114 toroller 116 pushes thechip 30 out of thecontainer 106 and to the sticky surface of theadhesive line 118. This removes thechip 30 from thecontainer 106 and allows theadhesive line 118 with thechips 30 to be passed downstream for further processing. - A second technique is illustrated in
FIGS. 4 and 5 . As illustrated inFIG. 4 ,chip positioning system 110A comprises awaste roller 112, atoothed roller 120 havingteeth 122 and may have an optional second roller (not shown) comparable tosecond roller 116.Carrier tape 100 is fed to theroller 120 withwaste roller 112 removing theadhesive sealing layer 102 as previously described. Now with reference toFIG. 5 , wherein a more detailed view of the interface between theteeth 122, thecontainers 106, thechips 30, and theadhesive line 118 is illustrated, it can be seen that atooth 122 pushes through thefloor 105 of thecontainer 106, pushingchip 30 upwardly to contact theadhesive line 118. Again, this removes thechip 30 from thecontainer 106 and allows theadhesive line 118 with thechips 30 to be passed downstream for further processing. - Concurrent to the positioning of the
chips 30 on theadhesive line 118,tabs 40 may be created for thewireless communication device 10. This section focuses on techniques by which thetabs 40 may be created that are again well suited for use in the roll-to-roll automated manufacturing process of the present disclosure. - A first technique for the creation of
tabs FIGS. 6 and 7 .FIG. 6 illustrates atab production system 130 comprising a pair ofrollers production line 140.Top roller 132 may comprise a die-cutting roller whilebottom roller 134 may be a driving roller to push material thoughrollers rollers production line 140 is inverted.Production line 140 may also comprise abacking layer 142, an adhesive (not shown explicitly) and aconductive foil 144, such as a copper foil, an aluminum foil, or the like. Asproduction line 140 passes throughrollers roller 132 cutsconductive foil 144 into one ormore tabs 40. In this particular embodiment, die-cuttingroller 132 cutsconductive foil 144 into twotabs Waste foil 146 is peeled frombacking layer 142 whiletabs backing layer 142 continue for further processing.Tabs 40 are then used to form antenna elements forantenna 60 on thewireless communication device 10 as explained below. - To accommodate
substrates 20 that may have varying dielectric constants and/or thicknesses (such as may occur when switching materials having different dielectric constants forming substrate 20), variations may need to be made to the dimensions oftabs optimal antenna 60performance using tabs chip 30, energy transfer should be maximized betweenchip 30 andtabs tabs tabs chip 30. - Further information on impedance-matching between wireless communication devices and antennas is described in the previously incorporated U.S. patent application Ser. Nos. 09/678,271 and 09/678,630, and co-pending U.S. patent application Ser. No. 10/125,786, entitled “Tuning Techniques for a Slot Antenna,” filed on Apr. 18, 2002, now U.S. Pat. No. 6,642,897, filed by the same assignee as that of the present application and incorporated herein by reference in its entirety.
- A first technique to address this situation is illustrated in
FIGS. 8 and 9 . In this technique, a plurality ofrollers tab production system 130A receivesproduction line 140. Afirst roller 200 makes aninitial cut 206 inconductive foil 144. Thisinitial cut 206 comprises the inner portions oftabs second roller 202 makes asecond cut 208 inconductive foil 144 that completes the creation of one oftabs tab 40A).Second cut 208 overlaps to a certain extentinitial cut 206 offirst roller 200. Athird roller 204 makes athird cut 210 inconductive foil 144 that completes the creation of the other one oftabs tab 40B). Third cut 210 overlaps to a certain extent theinitial cut 206 offirst roller 200. Note that the precise order of the cutting byrollers tab 40A, a second cut endstab 40A and beginstab 40B, and the third cut endstab 40B. Other variations are also contemplated. - The technique of
FIGS. 8 and 9 allows the sizes of thetabs rollers first roller 200. Thus, if alonger tab 40A is desired,second roller 202 is phased such that there is little overlap between thecuts shorter tab 40A is desired,second roller 202 is phased such that there is substantial overlap in thecuts tab 40B, but the phase ofthird roller 204 is modified to achieve the desired amount of overlap between thecuts sized tabs optimal antenna 60 performance as previously explained. It should be appreciated thatrollers rollers substrate 20 varies betweenwireless communication devices 10. In one embodiment, it is expected that at a 200 ft/min rate of movement ofproduction line 120 and anantenna 60 dimension of approximately 68 mm×16 mm outside dimensions, thus giving about 60antennas 60 per foot, approximately 12,000 antennas may be made per minute. - An alternate technique to provide variations in the size of
tabs FIGS. 10-13B . In this technique,production system 130B comprises afirst roller 300 and asecond roller 302, each of which is independently movable relative to one another. This technique is better suited for situations in whichsubstrate 20 on whichwireless communication device 10 is to be placed varies, as this technique allows testing on the fly to get the desired impedance forantenna 60 in conjunction withsubstrate 20.Rollers production line 140A (illustrated inFIG. 13A ) comprising abacking material 130 withtabs chip 30 disposed thereon. In contrast to the other techniques previously discussed, this technique positions, but does not specifically require,chip 30 mounted with the elements that formtabs 40. -
Production line 140A passes underfirst roller 300 andsecond roller 302 to deposit thetabs 40 and thechip 30 onto thesubstrate 20.Rollers FIGS. 10 and 11 . During the deposit oftabs substrate 20, a low signal level andlow frequency radiator 138, operating at, for example, 125 kHz, assesses the capacitance oftabs substrate 20 and with or without ground plane 306 (FIG. 10 ). This provides an estimate of the thickness and dielectric constant ofsubstrate 20.Tabs rollers optimal antenna 60 performance as previously discussed. - As illustrated by the difference between
FIGS. 11 and 12 ,rollers larger tabs tabs 40 are appropriately sized to give the desired performance toantenna 60, a cut is made andtabs substrate 20. This cut may be made with a die, a knife, a laser, or other appropriate cutting tools (none shown). It may be desirable to test capacitance by changing one and then theother tab FIG. 13B , the cut removestabs backing material 130 to createhole 121, leavingtab residuals 40′, 50′. - As previously noted, some of the above techniques may be occurring concurrently with the positioning of the
chips 30 on theadhesive line 118. The following section deals with mounting thechips 30 on thewireless communication device 10 after theantenna 60 has been positioned thereon. - One technique is illustrated in
FIG. 14 . In particular, ahole 22 is punched intosubstrate 20.Hole 22 is any type of cavity insubstrate 20 or any type of geometry such thatwireless communication chip 30 may be wholly or partially placed inside such cavity.Hole 22 may have taperedtop edges 24 that taper from awide opening 26 to anarrow mouth 28. The size ofnarrow mouth 28 may be the same or smaller in size than the width ofwireless communication chip 30, so thatwireless communication chip 30 rests inhole 22 at the point wherenarrow mouth 28 begins. -
Foil tape tape hole 22.Chip 30 is then inserted in the direction of the arrow into thehole 22.Hole 22 may be designed to allowchip 30 to sit flush withupper surface 21 ofsubstrate 20 without substantially protruding therefrom, as is illustrated inFIG. 14 . This reduces the profile ofsubstrate 20 and protectschip 30 from some inadvertent harm.Hole 22 may also be designed to allowchip 30 to sit fully belowupper surface 21 or to protrude slightly fromhole 22, depending on the design and size ofhole 22, edges 24, andmouth 28. - A number of techniques exist to attach
chip 30 totabs foil tape Chip 30 is then simply dropped onto the paste (not shown), and the solder (not shown) is melted to form connectivity betweentabs chip 30. Appropriate methods to form the solder joint comprise the use of infrared radiation to heat the joint locally, or pushingchip 30 into the paste withpins 32 ofchip 30 preheated. Preheating ofpins 32 allows the solder to remain in a liquefied state longer after initial melting so that solder may more easily, flow to more surface area oftabs pin 32 to form a stronger bond. Such preheating may be accomplished by any technique, including use of a preheating tool that emits heat such as a hot gas jet or the like. - An alternative technique for attaching
chip 30 totabs tabs chip 30, and the conductivity of the adhesive ensures electrical continuity betweentabs chip 30. Either a suitable conductive adhesive can be applied by printing to ends 44, 54 oftape chip 30 may be pushed onto a pressure sensitive conductive adhesive ontop surfaces tape - Yet another alternative is illustrated in
FIGS. 15-17 . In this embodiment, thetape 42 has one end sliced into a plurality offingers 48. Note that thefingers 48 are made from the same material as thetape 42, but includecuts 49 between thefingers 48. The fingers are then placed proximate thehole 22. A top view of thetape 42, thefingers 48, and an exemplary positioning relative to thehole 22 is illustrated inFIG. 15 . With that arrangement in place, it is now possible to mount thechip 30. -
Chip 30, and particularly pins 32 thereof, are heated above the yield point ofsubstrate 20 and positioned over substrate 20 (FIG. 16 ).Pins 32 are then forced intosubstrate 20 withfingers 48 wrapping around pins 32, as illustrated inFIG. 17 . The heat ofpins 32melts substrate 20, which then cools aroundtape 42 and pins 32, forming an effective mechanical bond. Also note that this technique could also be done on theother tab 40B (not shown) in a similar fashion. Note that bothtabs - Still another alternative would be to weld or tack pins 32 to
tape chip 30 intosurface 21 ofsubstrate 20. A high current may be passed throughpins 32, using a low voltage pulse therethrough to form the weld. A lower voltage pulse is desirable so as to not apply a damaging voltage to chip 30. A modifiedchip 30 with a single thin foil (not shown) rather thanmultiple pins 32 may also be used for this technique. This technique may be better suited forchips 30 having an aluminum thin foil rather than a copper thin foil, since aluminum has a melting point temperature lower than copper, thereby allowing use of a current that is lower in amperes. - With all of these embodiments, a sealing layer (not shown) may also be placed onto
substrate 20 and overchip 30 to holdchip 30 firmly in its desired location. This sealing layer may be an epoxy, but may instead be a robust plastic such as polyimide, Mylar, or polypropylene. These plastics may be attached by adhesives or by thermal welding as needed or desired. - It should be noted that extra layers may be added to
wireless communication device 10 after or in place of the sealing layer. For example, a paper layer for printing or plastic layers may be added to the structure. Such sealing layer or layers may be applied ontosubstrate 20 using any type of label printing machine. - For almost any of the above styled processes, the
chip 30 may be positioned on thesubstrate 20 with rollers as illustrated inFIGS. 18 and 19 .Chip merging system 160 is illustrated schematically inFIG. 18 and comprises a first and second heat andpressure roller rollers Adhesive line 118 withchips 30 disposed thereon passes betweenrollers substrate 20, and particularly,hole 22 ofsubstrate 20, as better seen inFIG. 19 .Tabs 40 have been pre-positioned onsubstrate 20 prior to the introduction of thechip 30 thereto.Chip 30 may be secured to thetabs 40 and thesubstrate 20 by any of the means previously discussed as needed or desired. - The above-mentioned techniques are useful with a number of other manufacturing techniques. Of particular interest is the creation of
tabs hole 22 insubstrate 20 as needed or desired. - The present disclosure is well suited for “roll-to-roll” processes, making the automation of the present disclosure easy. As illustrated in
FIG. 20 , thechip 30 positioning process may be occurring concurrently with thetab 40 creation process. The tabs are then positioned on thesubstrate 20 through an appropriate means as is well understood. Finally, the two production lines merge and thechip 30 may be positioned on thesubstrate 20. Furthermore, the automation may test and mark defective parts as needed or desired. - The present disclosure may, of course, be carried out in other specific ways than those herein set forth without departing from the scope and the essential characteristics of the invention. The present embodiments are therefore to be construed in all aspects as illustrative and not restrictive and all changes coming within the meaning and equivalency range of the appended claims are intended to be embraced therein.
- While illustrative embodiments have been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A method of preparing an antenna for use on a wireless communication device, the method comprising:
passing a metal foil through a pair of rollers, wherein one of the pair of rollers is a die cut roller;
die-cutting the metal foil with the die cut roller into a pair of antenna tabs; and
passing the antenna tabs downstream for securement to a substrate.
2. The method of claim 1 , wherein said passing the antenna tabs downstream for securement to a substrate comprises passing the antenna tabs downstream to form an antenna on the wireless communication device.
3. The method of claim 1 , further comprising determining dimensions of the antenna tabs based on an electrical characteristic of the substrate.
4. The method of claim 1 , further comprising determining the dimensions of the antenna tabs based on a signal read range at a desired operating frequency.
5. The method of claim 1 , wherein said passing the antenna tabs downstream for securement to a substrate comprises:
creating fingers on the antenna tabs;
heating pins of a wireless communication chip; and
inserting the pins of the wireless communication chip into the substrate such that the fingers on the antenna tabs wrap around the pins.
6. The method of claim 1 , wherein said passing the antenna tabs downstream for securement to a substrate comprises welding pins of a wireless communication chip to the antenna tabs.
7. The method of claim 6 , wherein said welding pins of a wireless communication chip to the antenna tabs comprises welding the pins of the wireless communication chip with a low voltage, high current electrical pulse.
8. The method of claim 7 , wherein said welding the pins of the wireless communication chip with a low voltage, high current electrical pulse comprises passing the low voltage, high current electrical pulse through the pins of the wireless communication chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/466,969 US20120222290A1 (en) | 2002-04-24 | 2012-05-08 | Method and system for preparing wireless communication chips for later processing |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37524902P | 2002-04-24 | 2002-04-24 | |
US10/422,616 US7191507B2 (en) | 2002-04-24 | 2003-04-24 | Method of producing a wireless communication device |
US11/468,756 US7650683B2 (en) | 2002-04-24 | 2006-08-30 | Method of preparing an antenna |
US12/558,406 US8171624B2 (en) | 2002-04-24 | 2009-09-11 | Method and system for preparing wireless communication chips for later processing |
US13/466,969 US20120222290A1 (en) | 2002-04-24 | 2012-05-08 | Method and system for preparing wireless communication chips for later processing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/558,406 Division US8171624B2 (en) | 2002-04-24 | 2009-09-11 | Method and system for preparing wireless communication chips for later processing |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120222290A1 true US20120222290A1 (en) | 2012-09-06 |
Family
ID=29270617
Family Applications (11)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/422,616 Expired - Lifetime US7191507B2 (en) | 2002-04-24 | 2003-04-24 | Method of producing a wireless communication device |
US11/468,749 Expired - Fee Related US7730606B2 (en) | 2002-04-24 | 2006-08-30 | Manufacturing method for a wireless communication device and manufacturing apparatus |
US11/468,756 Expired - Lifetime US7650683B2 (en) | 2002-04-24 | 2006-08-30 | Method of preparing an antenna |
US11/468,726 Expired - Lifetime US7546675B2 (en) | 2002-04-24 | 2006-08-30 | Method and system for manufacturing a wireless communication device |
US11/468,731 Active 2024-05-22 US7647691B2 (en) | 2002-04-24 | 2006-08-30 | Method of producing antenna elements for a wireless communication device |
US12/558,406 Expired - Lifetime US8171624B2 (en) | 2002-04-24 | 2009-09-11 | Method and system for preparing wireless communication chips for later processing |
US12/636,136 Expired - Lifetime US8302289B2 (en) | 2002-04-24 | 2009-12-11 | Apparatus for preparing an antenna for use with a wireless communication device |
US12/642,673 Expired - Fee Related US7908738B2 (en) | 2002-04-24 | 2009-12-18 | Apparatus for manufacturing a wireless communication device |
US12/782,554 Expired - Fee Related US8136223B2 (en) | 2002-04-24 | 2010-05-18 | Apparatus for forming a wireless communication device |
US13/371,019 Abandoned US20120137506A1 (en) | 2002-04-24 | 2012-02-10 | Apparatus for forming a wireless communication device |
US13/466,969 Abandoned US20120222290A1 (en) | 2002-04-24 | 2012-05-08 | Method and system for preparing wireless communication chips for later processing |
Family Applications Before (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/422,616 Expired - Lifetime US7191507B2 (en) | 2002-04-24 | 2003-04-24 | Method of producing a wireless communication device |
US11/468,749 Expired - Fee Related US7730606B2 (en) | 2002-04-24 | 2006-08-30 | Manufacturing method for a wireless communication device and manufacturing apparatus |
US11/468,756 Expired - Lifetime US7650683B2 (en) | 2002-04-24 | 2006-08-30 | Method of preparing an antenna |
US11/468,726 Expired - Lifetime US7546675B2 (en) | 2002-04-24 | 2006-08-30 | Method and system for manufacturing a wireless communication device |
US11/468,731 Active 2024-05-22 US7647691B2 (en) | 2002-04-24 | 2006-08-30 | Method of producing antenna elements for a wireless communication device |
US12/558,406 Expired - Lifetime US8171624B2 (en) | 2002-04-24 | 2009-09-11 | Method and system for preparing wireless communication chips for later processing |
US12/636,136 Expired - Lifetime US8302289B2 (en) | 2002-04-24 | 2009-12-11 | Apparatus for preparing an antenna for use with a wireless communication device |
US12/642,673 Expired - Fee Related US7908738B2 (en) | 2002-04-24 | 2009-12-18 | Apparatus for manufacturing a wireless communication device |
US12/782,554 Expired - Fee Related US8136223B2 (en) | 2002-04-24 | 2010-05-18 | Apparatus for forming a wireless communication device |
US13/371,019 Abandoned US20120137506A1 (en) | 2002-04-24 | 2012-02-10 | Apparatus for forming a wireless communication device |
Country Status (7)
Country | Link |
---|---|
US (11) | US7191507B2 (en) |
EP (2) | EP1978473B1 (en) |
AT (2) | ATE403196T1 (en) |
AU (1) | AU2003233033A1 (en) |
CA (1) | CA2518614A1 (en) |
DE (2) | DE60333409D1 (en) |
WO (1) | WO2003092174A2 (en) |
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WO2018081522A1 (en) * | 2016-10-28 | 2018-05-03 | Avery Dennison Retail Information Services, Llc | Rfid tags designed to work on difficult substrates |
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