US20130075059A1

US20130075059A1 - Apparatus for controlling a temperature of a loading chuck and methods of operating the same

Info

Publication number: US20130075059A1
Application number: US13/591,253
Authority: US
Inventors: Jong-Koo Kil
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2011-09-22
Filing date: 2012-08-22
Publication date: 2013-03-28
Also published as: KR20130031945A

Abstract

An apparatus may include a first refrigerant tank, a second refrigerant tank, and first to fourth refrigerant lines. The first refrigerant tank may store a first refrigerant. The second refrigerant tank may store a second refrigerant. The first refrigerant line may be connected between the first refrigerant tank and a refrigerant passageway of a loading chuck to supply the first refrigerant to the refrigerant passageway. The second refrigerant line may be connected between the first refrigerant tank and the refrigerant passageway to return the first refrigerant to the first refrigerant tank. The third refrigerant line may be connected between the second refrigerant tank and the refrigerant passageway to supply the second refrigerant to the refrigerant passageway. The fourth refrigerant line may be connected between the second refrigerant tank and the refrigerant passageway to return the second refrigerant to the second refrigerant tank.

Description

CROSS-RELATED APPLICATION

This application claims priority under 35 USC §119 to Korean Patent Application No. 10-2011-0095515, filed on Sep. 22, 2011 in the Korean Intellectual Property Office (KIPO), the contents of which are herein incorporated by reference in their entirety.

BACKGROUND

The present inventive concept relates to an apparatus for controlling a temperature of a loading chuck and a method of controlling a temperature of a loading chuck. More particularly, example embodiments relate to an apparatus for controlling a temperature of a loading chuck for a semiconductor substrate and a method of controlling a temperature of a loading chuck.
In order to provide a semiconductor substrate on a loading chuck with a set temperature, a temperature of the loading chuck may be controlled. After the temperature of the loading chuck reaches a set temperature, it may be required to maintain the set temperature of the loading chuck. Thus, an apparatus for controlling the temperature of the loading chuck may be required.

SUMMARY

Some embodiments provide an apparatus for controlling the temperature of a loading chuck. The apparatus includes a first and second refrigerant tank and at least one switching valve. Thea first refrigerant tank is selectively coupled to a refrigerant passageway in thermal communication with the loading chuck. The first refrigerant tank includes a first refrigerant maintained at a first temperature. The second refrigerant tank is selectively coupled to the refrigerant passageway. The second refrigerant tank includes a second refrigerant maintained at a second temperature that is higher than the first temperature. The at least one switching valve selectively couples the first regrigerant tank or the second refrigerant tank to the refrigerant passageway responsive to selection of a set temperature for the loading chuck.
In other embodiments, the at least one switching valve is configured to selectively couple the second refrigerant tank to the refrigerant passageway responsive to selection of a first temperature of the loading chuck and to selectively couple the first refrigerant tank to the refrigerant passageway responsive to selection of a second temperature of the loading chuck, wherein the second temperature is lower than the first temperature. The first refrigerant and the second refrigerant may be a substantially same material. The first temperature may be between about −80° and about 0° C. and the second temperature may be between about 20° C. and about 80° C.
In further embodiments,the apparatus further includes at least one heater coupled between the second refrigerant tank and the refrigerant passageway that maintains the second refrigerant at the second temperature and a cooling member thermally coupled to the first refrigerant tank that maintains the first refrigerant at the first temperature. The at least one heater may include a first heat exchanger that heats the second refrigerant when the second refrigerant is returned from the refrigerant passageway to the second refrigerant tank and a second heat exchanger that heats the second refrigerant when the second refrigerant is sent to the refrigerant passageway from the second refrigerant tank.
In other embodiments, the apparatus further includes a heating member thermally coupled to the second refrigerant tank that maintains the second refrigerant at the second temperature and a cooling member thermally coupled to the first refrigerant tank that maintains the first refrigerant at the first temperature. The loading chuck may further include a heater that is thermally coupled to the loading chuck. The heater is positioned proximate the refrigerant passageway and the heater is activated to raise the loading chuck from the second temperature to the first temperature of the loading chuck.
In further embodiments, the apparatus further includes an auxiliary refrigerant tank coupled to the first refrigerant tank and the second refrigerant tank. The auxiliary refrigerant tank includes an auxiliary refrigerant to be supplied to the first or second refrigerant tanks to maintain a desired level of refrigerant in the first and second refrigerant tanks.
In yet other embodiments, a method of controlling a temperature of a loading chuck includes circulating a first refrigerant at a first temperature through a refrigerant passageway of the loading chuck to cool the loading chuck to a first selected temperature. A second refrigerant at a second temperature is circulated through the refrigerant passageway of the loading chuck while heating the loading chuck with a heater thermally coupled thereto to heat the loading chuck to a second selected temperature higher than the first selected temperature. The second temperature is greater than the first temperature and the first refrigerant is from a first refrigerant tank and the second refrigerant is from a second refrigerant tank, different from the first refrigerant tank.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. FIGS. 1 to 9 represent non-limiting, example embodiments as described herein.

FIG. 1 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with example embodiments;

FIG. 2 is a perspective view illustrating the loading chuck and a first temperature controller of the apparatus of FIG. 1;

FIG. 3 is a perspective view illustrating a refrigerant passageway in a low temperature plate of the apparatus of FIG. 1;

FIG. 4 is a flow chart illustrating a method of controlling a temperature of a loading chuck using the apparatus of FIG. 1;

FIG. 5A is a block diagram illustrating flows of refrigerants when a chuck plate has a low temperature according to some embodiments;

FIG. 5B is a block diagram illustrating flows of refrigerants when a chuck plate is changed from a low temperature to a high temperature according to some embodiments;

FIG. 6 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with some embodiments;

FIG. 7 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with other embodiments;

FIG. 8 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with other embodiments; and

FIG. 9 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with further embodiments.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Advantages and features of the present inventive concept and methods of accomplishing the same may be understood more readily by reference to the following detailed description of preferred embodiments and the accompanying drawings. The present inventive concept may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, and the present inventive concept will only be defined by the appended claims. Like reference numerals refer to like elements throughout the specification.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It will be understood that when an element or layer is referred to as being “on”, “connected to” or “coupled to” another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on”, “directly connected to” or “directly coupled to” another element or layer, there are no intervening elements or layers present. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present inventive concept.
Spatially relative terms, such as “beneath”, “below”, “lower”, “above”, “upper”, and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Embodiments are described herein with reference to cross-section illustrations that are schematic illustrations of idealized embodiments (and intermediate structures). As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, these embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the present inventive concept.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present inventive concept belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and this specification and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Hereinafter, example embodiments will be explained in detail with reference to the accompanying drawings.
FIG. 1 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with example embodiments. FIG. 2 is a perspective view illustrating the loading chuck and a first temperature controller of the apparatus of FIG. 1. FIG. 3 is a perspective view illustrating a refrigerant passageway in a low temperature plate of the apparatus of FIG. 1.
The apparatus of these example embodiments may control the temperature of the loading chuck to maintain a set temperature of a semiconductor substrate on the loading chuck. Hereinafter, the loading chuck may be referred to as a chuck plate.
Referring to FIGS. 1 and 2, the apparatus may include a first temperature controlling member (controller) 60 and a second temperature controlling member (controller) 62. The first temperature controlling member 60 may be attached to a lower surface of the chuck plate 10. The second temperature controlling member 62 may be connected to the first temperature controlling member 60.
In example embodiments, the first temperature controlling member 60 attached to the chuck plate 10 may control the temperature of the chuck plate 10. Because the first temperature controlling member 60 may be combined with the chuck plate 10, the first temperature controlling member 60 may correspond to a part of one loading chuck unit.
The second temperature controlling member 62 may be connected to the first temperature controlling member 60 on the lower surface of the chuck plate 10. The second temperature controlling member 62 may correspond to a chiller for decreasing the temperature of the chuck plate 10.
The first temperature controlling member 60 may include a low temperature plate 12 and a high temperature plate 18, which may both be circular. In example embodiments, the low temperature plate 12 may be stacked on the high temperature plate 18. That is, the low temperature plate 12 may be positioned under the chuck plate 10 and the high temperature plate 18 may be positioned under the low temperature plate 12 as illustrated in FIG. 2. In other embodiments, the high temperature plate 18 may be stacked on the low temperature plate 12 (i.e., the high temperature plate 18 may be between the chuck plate 10 and the low temperature plate 12).
A refrigerant passageway 14 may be formed in the low temperature plate 12 as shown in FIG. 3. A refrigerant may flow through the refrigerant passageway 14 to decrease the temperature of the chuck plate 10, thereby maintaining the low temperature of the chuck plate 10. Thus, as shown in FIG. 3, in order to provide entire regions of the chuck plate 10 with a uniform temperature, the refrigerant passageway 14 may be uniformly arranged throughout the low temperature plate 12. The refrigerant passageway 14 may have an inlet 16 a and outlet 16 b formed at sides of the low temperature plate 12.
A circular heater 19 may be formed in the high temperature plate 18 as shown in FIG. 1. The heater 19 may heat the chuck plate 10 to increase the temperature of the chuck plate 10, thereby maintaining the high temperature of the chuck plate 10.
The second temperature controlling member 62 may be connected to the low temperature plate 12 to supply and circulate the refrigerant in the low temperature plate 12. In example embodiments, the second temperature controlling member 62 may be divided into a first part for supplying a first refrigerant having a lower temperature to the low temperature plate 12, and a second part for supplying a second refrigerant having a higher temperature to the low temperature plate 12. As used herein, the references to higher and lower refrigerant temperatures refer to the relative temperature of the first and second refrigerant.
In example embodiments, when it may be required to maintain the low temperature of the chuck plate 10 (i.e., to cool the plate 10), the second temperature controlling member 62 may supply the first refrigerant to the refrigerant passageway 14. When it may be required to change the chuck plate 10 from the low temperature to the high temperature (i.e. to heat the chuck plate 10 with the high temperature plate 19), the second temperature controlling member 62 may supply the second refrigerant to the refrigerant passageway 14. When it may be required to maintain the high temperature of the chuck plate 10, the refrigerant passageway 14 may remain filled with the second refrigerant.
In example embodiments as illustrated in FIG. 1, the second temperature controlling member 62 may include a first refrigerant tank 20, a second refrigerant tank 22, an auxiliary refrigerant tank 24, a first heat exchanger 42, a second heat exchanger 44, a first refrigerant line 30, a second refrigerant line 32, a third refrigerant line 34, a fourth refrigerant line 36, a first pump 46, a second pump 48, a third pump 52, a cooling member 50, a first switching valve 38 and a second switching valve 40.
The first refrigerant tank 20 may be filled with the first refrigerant having a first temperature. The cooling member 50 may be connected with the first refrigerant tank 20 to maintain the first temperature of the first refrigerant. In example embodiments, the first temperature of the first refrigerant may be substantially the same as the set temperature of the chuck plate 10. The first refrigerant may include a material maintained as a liquid at a temperature of about −80° C. The first temperature of the first refrigerant may be about −80° C. to about 0° C.
The first refrigerant line 30 may be connected between the first refrigerant tank 20 and the inlet 16 a of the low temperature plate 12. The first refrigerant may be supplied from the first refrigerant tank 20 to the refrigerant passageway 14 through the first refrigerant line 30.
The second refrigerant line 32 may be connected between the first refrigerant tank 20 and the outlet 16 b of the low temperature plate 12. The first refrigerant may be returned from the refrigerant passageway 14 to the first refrigerant tank 20 through the second refrigerant line 32. Thus, the first refrigerant may be circulated in the refrigerant passageway 14.
The first refrigerant in the first refrigerant tank 20 may be circulated through the refrigerant passageway 14, the first refrigerant line 30, and the second refrigerant line 32 to maintain the first temperature of the chuck plate 10.
The second refrigerant tank 22 may be filled with the second refrigerant having a second temperature higher than the first temperature. In example embodiments, the second refrigerant may include a material substantially the same as that of the first refrigerant. The second temperature of the second refrigerant may be about 20° C. to about 80° C., which may allow the second refrigerant to be maintained as a liquid.
In example embodiments, a heating member may be provided to the second refrigerant tank 22 to maintain the second temperature of the second refrigerant in the second refrigerant tank 22.
The third refrigerant line 34 may be connected between the first refrigerant line 30 and the second refrigerant tank 22. That is, the third refrigerant line 34 may be branched off from the first refrigerant line 30.
The first switching valve 38 may be installed in the branched portion between the first refrigerant line 30 and the third refrigerant line 34. The first switching valve 38 may function to selectively supply any one of the first refrigerant and the second refrigerant to the refrigerant passageway 14 in the low temperature plate 12.
When the third refrigerant line 34 may be opened by activating the first switching valve 38, the second refrigerant in the second refrigerant tank 22 may be supplied to the refrigerant passageway 14 through the third refrigerant line 34 and the first refrigerant line 30. In such a case, the first refrigerant in the first refrigerant tank 20 may not be supplied to the refrigerant passageway 14.
The fourth refrigerant line 36 may be connected between the second refrigerant line 32 and the second refrigerant tank 22. That is, the fourth refrigerant line 36 may be branched off from the second refrigerant line 32.
The second switching valve 40 may be installed in the branched portion between the second refrigerant line 32 and the fourth refrigerant line 36. The second switching valve 40 may function to selectively return the first refrigerant or the second refrigerant in the refrigerant passageway 14 to any one of the first refrigerant tank 20 and the second refrigerant tank 22.
When the fourth refrigerant line 36 may be opened by activating the second switching valve 40, the second refrigerant in the refrigerant passageway 14 may be returned to the second refrigerant tank 22 through the second refrigerant line 32 and the fourth refrigerant line 36. In such a case, the first refrigerant or the second refrigerant in the second refrigerant line 32 may not be returned to the first refrigerant tank 20.
The first heat exchanger 42 and the second pump 48 may be coupled between the fourth refrigerant line 36 and the second refrigerant line 32. The first heat exchanger 42 may rapidly heat the second refrigerant returned to the fourth refrigerant line 36 to maintain the higher temperature of the second refrigerant. The second pump 48 may circulate the second refrigerant.
The first pump 46 may be installed on the second refrigerant line 32 between the second switching valve 40 and the first refrigerant tank 20. The first pump 46 may circulate the first refrigerant.
In example embodiments, the second refrigerant in the second refrigerant tank 22 may be circulated through the first refrigerant line 30, the second refrigerant line 32, the third refrigerant line 34 and the fourth refrigerant line 36, so that the second refrigerant may be continuously supplied to the refrigerant passageway 14. Thus, when the chuck plate 10 may be changed from the low temperature to the high temperature, the second refrigerant may be circulated through the refrigerant passageway 14 in the low temperature plate 14. The heater 19 in the high temperature plate 18 may increase the temperature of the chuck plate 10. As a result, the temperature of the chuck plate 10 may be more rapidly increased compared to when the first refrigerant may be circulated through the refrigerant passageway 14 while the heater 19 is increasing the temperature of the chuck plate 10.
The second heat exchanger 44 for heating the second refrigerant may be installed at the third refrigerant line 34. The second heat exchanger 44 may re-heat the second refrigerant supplied from the second refrigerant tank 22.
The auxiliary refrigerant tank 24 may be connected to the first refrigerant tank 20 and the second refrigerant tank 22. The auxiliary refrigerant tank 24 may be filled with an auxiliary refrigerant having a material substantially the same as that of the first and the second refrigerants. When the first refrigerant in the first refrigerant tank 20 and/or the second refrigerant in the second refrigerant tank 22 may be exhausted, the auxiliary refrigerant in the auxiliary refrigerant tank 24 may be supplied to the first refrigerant tank 20 and/or the second refrigerant tank 22. In example embodiments, the auxiliary refrigerant in the auxiliary refrigerant tank 24 may have a room temperature.
A fifth refrigerant line 51 may be connected between the auxiliary refrigerant tank 24 and the first refrigerant tank 20. A third pump 52 and a switching valve may be installed in the fifth refrigerant line 51. A sixth refrigerant line 53 may be connected between the auxiliary refrigerant tank 24 and the second refrigerant tank 22. A switching valve may be installed in the sixth refrigerant line 53.
When the refrigerant passageway 14 is filled with a refrigerant having an lower temperature, the refrigerant may hinder heating of the loading chuck using the heater 19. Thus, a time for providing the loading chuck with a set high temperature may be too long.
In contrast, according to these example embodiments, the apparatus may include the two tanks 20 and 22 configured to receive the two refrigerants, respectively, having different temperatures. Therefore, the refrigerants may be selectively supplied to the loading chuck in accordance with the set temperature of the loading chuck. As a result, the second refrigerant may be circulated through the refrigerant passageway 14 of the loading chuck during heating of the loading chuck from the low temperature to the high temperature, so that the time for heating the loading chuck to the set high temperature may be shortened.
FIG. 4 is a flow chart illustrating a method of controlling a temperature of a loading chuck using the apparatus in FIG. 1. FIG. 5A is a block diagram illustrating flows of refrigerants when a chuck plate has a low temperature. FIG. 5B is a block diagram illustrating flows of refrigerants when a chuck plate is changed from a low temperature to a high temperature.
Referring to FIG. 4, the first refrigerant may be circulated through the refrigerant passageway 14 of the chuck plate 10 to maintain the first temperature of the loading chuck. In example embodiments, the first temperature may be no more than about 0° C., for example, about −80° C. to about 0° C.
Referring to FIG. 5A, the first refrigerant from the first refrigerant tank 20 may be supplied to the refrigerant passageway 14 of the low temperature plate 12 through the first refrigerant line 30 (See arrow A). The first refrigerant in the refrigerant passageway 14 may be returned to the first refrigerant tank 20 through the second refrigerant line 32 (See arrow A′). Thus, the first refrigerant may be circulated between the first refrigerant tank 20 and the refrigerant passageway 14. The cooling member 50 may continuously cool the first refrigerant in the first refrigerant tank 20 to maintain the first temperature of the first refrigerant.
As a result, the chuck plate 10 may have the set low temperature thereof maintained by circulating the first refrigerant through the refrigerant passageway 14 in the low temperature plate 12. In example embodiments, when the chuck plate 10 may have the low temperature, the heater 19 in the high temperature plate 18 may not be actuated.
Referring again to FIG. 4, in step ST112, the heater 19 may be actuated. Further, the second refrigerant having the second temperature higher than the first temperature may be circulated through the refrigerant passageway 14 to increase a temperature of the refrigerant in the second passageway 14 coupled to the loading chuck to the second temperature. In example embodiments, the second refrigerant may include a material substantially the same as that of the first refrigerant.
Referring to FIG. 5B, the heater 19 may heat the high temperature plate 18. The first switching valve 38 and the second switching valve 40 may be switched to connect the third refrigerant line 34 with the first refrigerant line 30 and the fourth refrigerant line 36 with the second refrigerant line 32, thereby supplying the second refrigerant to the refrigerant passageway 14 (See arrow B). The second refrigerant in the refrigerant passageway 14 may be returned to the second refrigerant tank 22 through the second refrigerant line 32 and the fourth refrigerant line 36 (See arrow B′).
In example embodiments, the second refrigerant may be circulated between the second refrigerant tank 22 and the refrigerant passageway 14 through the first refrigerant line 30, the second refrigerant line 32, the third refrigerant line 34 and the fourth refrigerant line 36. The first heat exchanger 42 may rapidly heat the second refrigerant in the fourth refrigerant line 36 returned to the second refrigerant tank 22. Further, the second heat exchanger 44 may rapidly heat the second refrigerant in the third refrigerant line 34 supplied to the refrigerant passageway 14. Therefore, the second refrigerant may be rapidly heated by the first heat exchanger 42 and the second heat exchanger 44 to still have the second temperature. Further, the heating member in the second refrigerant tank 22 may continuously heat the second refrigerant in the second refrigerant tank 22 to maintain the second temperature of the second refrigerant.
Therefore, in order to change the chuck plate 10 from the low temperature to the high temperature, the second refrigerant may be supplied to the refrigerant passageway 14 to allow the temperature of the chuck plate 10 to be more rapidly increased. As a result, the chuck plate 10 may be provided with the set high temperature in a short time.
In example embodiments, the second refrigerant may serve as to shorten the time for increasing the chuck plate 10 using the heater 19. That is, the second refrigerant may not be used for directly increasing and maintaining the temperature of the chuck plate 10. Thus, the second temperature of the second refrigerant may not be necessarily equal to the set temperature of the chuck plate 10. That is, it may be merely required that the second temperature of the second refrigerant may be higher than the first temperature of the first refrigerant.
Referring again to FIG. 4, in step ST114, after maintaining the high temperature of the chuck plate 10, the second refrigerant may not be circulated. The heater 19 may be continuously activated with the refrigerant passageway 14 being filled with the second refrigerant to maintain the second temperature of the chuck plate 10.
In example embodiments, after the chuck plate 10 may be maintained at the high temperature, it may not be required to continuously circulate the second refrigerant through the refrigerant passageway 14 in the low temperature plate 12, because the high temperature of the chuck plate 10 may be maintained by the heater 19. Although the second refrigerant may not be circulated through the refrigerant passageway 14, the refrigerant passageway 14 may be filled with the second refrigerant.
In example embodiments, when the chuck plate 10 may be over-heated, the second refrigerant may be temporarily circulated through the refrigerant passageway 14 in the low temperature plate 12 to decrease the temperature of the chuck plate 10.
As mentioned above, when the chuck plate 10 may be provided with the high temperature and/or maintained at the high temperature, the first refrigerant may not be used. Thus, when the chuck plate 10 may have the high temperature, the cooling member 50 for maintaining the low temperature of the first refrigerant in the first refrigerant tank 20 may not be activated.
In contrast, in order to change the chuck plate 10 from the high temperature to the low temperature, the operation of the heater 19 may be stopped. The first refrigerant in the first refrigerant tank 20 may be circulated through the refrigerant passageway 14 in the low temperature plate 12.
According to these example embodiments, the time for changing the chuck plate from the low temperature to the high temperature may be shortened. Further, the time for changing the chuck plate from the low temperature to the high temperature may be substantially the same as a time for changing the chuck plate from the high temperature to the low temperature.
The method of these example embodiments may be effectively used when processes may be performed on the semiconductor substrate on the chuck plate at the high temperature and the low temperature. For example, in an electrical die sorting (EDS) process for testing chips of the semiconductor substrate on the chuck plate, a temperature of the EDS process may be accurately and rapidly controlled by the above-mentioned method. Particularly, because the EDS process may be performed at the low temperature and the high temperature, the EDS process may include changing the chuck plate between the low temperature and the high temperature. The time for changing the temperatures of the chuck plate may be significantly shortened using the method of these example embodiments, so that the EDS process may have a short time.
FIG. 6 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with other embodiments.
The apparatus of these example embodiments may include features substantially the same as those of the apparatus in FIG. 1 except for including only one heat exchanger. Thus, the same reference numerals may refer to the same elements and any further description with respect to such features may be omitted herein for brevity.
Referring to FIG. 6, the apparatus of these example embodiments may include only the first heat exchanger 42 on the fourth refrigerant line 36. The apparatus may not include the second heat exchanger 44 of FIG. 1.
In some embodiments, the apparatus of FIG. 6 may include the second heat exchanger on the third refrigerant line and may not include the first heat exchanger on the fourth refrigerant line.
In example embodiments using the apparatus of FIG. 6, a method of controlling a temperature of a loading chuck may be substantially the same as the method illustrated with reference to FIGS. 4, 5A and 5B except for heating and circulating the second refrigerant when the loading chuck may be changed from the low temperature to the high temperature.
When the loading chuck may be changed from the low temperature to the high temperature, the heater 19 may be activated to heat the chuck plate 10. The second refrigerant in the second refrigerant tank 22 may be supplied to the refrigerant passageway 14 through the first refrigerant line 30, the second refrigerant line 32, the third refrigerant line 34 and the fourth refrigerant line 36. The first heat exchanger 42 may rapidly heat the second refrigerant returned to the second refrigerant tank 22 from the refrigerant passageway 14 to maintain the high temperature of the second refrigerant. Further, the heating member in the second refrigerant tank 22 may heat the second refrigerant in the second refrigerant tank 22 to maintain the high temperature of the second refrigerant.
FIG. 7 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with further embodiments.
The apparatus of these embodiments may include features substantially the same as those of the apparatus in FIG. 1 except for not including the heat exchangers. Thus, the same reference numerals may refer to the same features and any further discussion with respect to these features may be omitted herein for brevity.
Referring to FIG. 7, the heating member in the second refrigerant tank 22 may heat the second refrigerant in the second refrigerant tank 22 to maintain the high temperature of the second refrigerant.
In example embodiments, a method of controlling a temperature of a loading chuck is the apparatus of FIG. 7 may be substantially the same as the method illustrated with reference to FIGS. 4, 5A and 5B except for heating and circulating the second refrigerant when the loading chuck may be changed from the low temperature to the high temperature.
When the loading chuck may be changed from the low temperature to the high temperature, the heater 19 may be activated to heat the chuck plate 10. The second refrigerant in the second refrigerant tank 22 may be supplied to the refrigerant passageway 14 through the first refrigerant line 30, the second refrigerant line 32, the third refrigerant line 34 and the fourth refrigerant line 36. The second refrigerant flowing through the first to the fourth refrigerant lines 30, 32, 34 and 36 may not be heated. However, the heating member in the second refrigerant tank 22 may heat the second refrigerant in the second refrigerant tank 22 to maintain the high temperature of the second refrigerant. The second refrigerant having the high temperature may flow through the first to the fourth refrigerant lines 30, 32, 34 and 36.
FIG. 8 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with other embodiments.
The apparatus of these example embodiments may include features substantially the same as those of the apparatus in FIG. 1 except for not including the heating member. Thus, the same reference numerals may refer to the same features and any further discussion with respect to these features may be omitted herein for brevity.
Referring to FIG. 8, the apparatus of these examples may not include the heating member in the second refrigerant tank 22 in FIG. 1. Further, the apparatus of these example embodiments may not include the auxiliary refrigerant tank in FIG. 1. The second refrigerant tank 22 may function as the auxiliary refrigerant tank. Particularly, when the first refrigerant in the first refrigerant tank 20 may be exhausted, the second refrigerant in the second refrigerant tank 22 may be supplied to the first refrigerant tank 20. Thus, the second refrigerant tank 22 may be connected to the first refrigerant tank 20. Because the second refrigerant tank 22 may not be provided with the heating member, the second refrigerant may have a room temperature.
In example embodiments, a method of controlling a temperature of a loading chuck using the apparatus of FIG. 8 may be substantially the same as the method illustrated with reference to FIGS. 4, 5A and 5B except for heating and circulating the second refrigerant when the loading chuck may be changed from the low temperature to the high temperature.
When the loading chuck may be changed from the low temperature to the high temperature, the heater 19 may be activated to heat the chuck plate 10. The second refrigerant in the second refrigerant tank 22 may be supplied to the refrigerant passageway 14 through the first refrigerant line 30, the second refrigerant line 32, the third refrigerant line 34 and the fourth refrigerant line 36. In example embodiments, although the second refrigerant having the room temperature may flow from the second refrigerant tank 22 to the third refrigerant line 34, the first heat exchanger 42 may rapidly heat the second refrigerant returned from the refrigerant passageway 14 to the second refrigerant tank 22. Further, the second heat exchanger 44 may rapidly heat the second refrigerant between the second refrigerant tank 22 and the refrigerant passageway 14. Therefore, the second refrigerant may be heated by the first heat exchanger 42 and the second heat exchanger 44 to continuously have the high temperature.
FIG. 9 is a block diagram illustrating an apparatus for controlling a temperature of a loading chuck in accordance with further embodiments.
The apparatus of these example embodiments may include features substantially the same as those of the apparatus in FIG. 1 except for not including the heat exchangers. Thus, the same reference numerals may refer to the same features and any further discussions with respect to the same features may be omitted herein for brevity.
Referring to FIG. 9, the apparatus of this example may have a third refrigerant line 34 a and a fourth refrigerant line 36 a. The third refrigerant line 34 a and the fourth refrigerant line 36 a may function as a heating line for heating the refrigerants.
In example embodiments, a method of controlling a temperature of a loading chuck using the apparatus of FIG. 9 may be substantially the same as the method illustrated with reference to FIGS. 4, 5A and 5B except for heating and circulating the second refrigerant when the loading chuck may be changed from the low temperature to the high temperature.
When the loading chuck may be changed from the low temperature to the high temperature, the heater 19 may be activated to heat the chuck plate 10. The second refrigerant in the second refrigerant tank 22 may be supplied to the refrigerant passageway 14 through the first refrigerant line 30, the second refrigerant line 32, the third refrigerant line 34 a and the fourth refrigerant line 36 a. In example embodiments, the second refrigerant supplied from the second refrigerant tank 22 may be heated by the third refrigerant line 34 a. Further, the second refrigerant flowing from the second refrigerant tank 22 to the refrigerant passageway 14 may be heated by the fourth refrigerant line 36 a. Therefore, the second refrigerant may be heated by the third refrigerant line 34 a and the fourth refrigerant line 36 a to continuously have the high temperature.
According to some example embodiments, the apparatus may rapidly change the temperature of the loading chuck. Thus, a temperature change time of the loading chuck may be significantly reduced. As a result, a time of a process using the loading chuck may be shortened. The apparatus may be applied to equipments including the loading chuck that may be used at the high temperature and the low temperature.
As described above, example embodiments provide an apparatus for controlling a temperature of a loading chuck that may be capable of shortening a temperature change time of the loading chuck.
Example embodiments also provide a method of controlling a temperature of the above-mentioned loading chuck.
According to example embodiments, there is provided an apparatus for controlling a temperature of a loading chuck. The apparatus may include a first refrigerant tank, a second refrigerant tank, a first refrigerant line, a second refrigerant line, a third refrigerant line and a fourth refrigerant line. A refrigerant passageway may be formed in a chuck plate. A heater may be arranged under the chuck plate. The first refrigerant tank may store a first refrigerant. The second refrigerant tank may store a second refrigerant having a temperature higher than that of the first refrigerant. The first refrigerant line may be connected between the first refrigerant tank and the refrigerant passageway to supply the first refrigerant from the first refrigerant tank to the refrigerant passageway. The second refrigerant line may be connected between the first refrigerant tank and the refrigerant passageway to return the first refrigerant from the refrigerant passageway to the first refrigerant tank. The third refrigerant line may be connected between the second refrigerant tank and the refrigerant passageway to supply the second refrigerant from the second refrigerant tank to the refrigerant passageway. The fourth refrigerant line may be connected between the second refrigerant tank and the refrigerant passageway to return the second refrigerant from the refrigerant passageway to the second refrigerant tank.
In example embodiments, the third refrigerant line may correspond to a line branched off from the first refrigerant line. The fourth refrigerant line may correspond to a line branched off from the second refrigerant line.
In example embodiments, a first switching valve may be installed in a branched portion between the first refrigerant line and the third refrigerant line. A second switching valve may be installed in a branched portion between the second refrigerant line and the fourth refrigerant line.
In example embodiments, a heat exchanger for rapidly heating the second refrigerant may be arranged at least one of the third refrigerant line and the fourth refrigerant line.
In example embodiments, a heating member for heating the second refrigerant may be installed at the second refrigerant tank.
In example embodiments, the apparatus may further include an auxiliary tank connected with the first refrigerant tank and the second refrigerant tank to provide the first refrigerant tank and the second refrigerant tank with an auxiliary refrigerant.
In example embodiments, the second refrigerant tank may be connected with the first refrigerant tank. The second refrigerant tank may be used for an auxiliary tank for replenish the first refrigerant in the first refrigerant tank.
In example embodiments, the apparatus may further include a cooling member connected with the first refrigerant tank to decrease a temperature of the first refrigerant.
In example embodiments, the refrigerant passageway may be arranged over the heater.
According to example embodiments, there is provided a method of controlling a temperature of a loading chuck. In the method of controlling the temperature of the loading chuck, a first refrigerant may be circulated through a refrigerant passageway of the loading chuck to provide the loading chuck with a first temperature. The loading chuck may be directly heated and a second refrigerant may also be circulated through the refrigerant passageway to provide the loading chuck with a second temperature higher than the first temperature. The loading chuck may be continuously heated and the circulating of the second refrigerant may be stopped to maintain the second temperature of the loading chuck.
In example embodiments, the first refrigerant may be stored in a first refrigerant tank. The second refrigerant may be stored in a second refrigerant tank.
In example embodiments, the first refrigerant and the second refrigerant may include substantially the same material.
In example embodiments, continuously supplying the second refrigerant may include heating the second refrigerant to the second temperature.
In example embodiments, the second temperature may be about 20° to about 80°.
According to some example embodiments, the apparatus may rapidly change the temperature of the loading chuck. Thus, a temperature change time of the loading chuck may be remarkably reduced. As a result, a time of a process using the loading chuck may be shortened.
The foregoing is illustrative of the present inventive concept and is not to be construed as limiting thereof. Although a few embodiments of the present inventive concept have been described, those skilled in the art will readily appreciate that many modifications are possible in the embodiments without materially departing from the novel teachings and advantages of the present inventive concept. Accordingly, all such modifications are intended to be included within the scope of the present inventive concept as defined in the claims. Therefore, it is to be understood that the foregoing is illustrative of the present inventive concept and is not to be construed as limited to the specific embodiments disclosed, and that modifications to the disclosed embodiments, as well as other embodiments, are intended to be included within the scope of the appended claims. The present inventive concept is defined by the following claims, with equivalents of the claims to be included therein.

Claims

What is claimed is:

1. An apparatus for controlling the temperature of a loading chuck, the apparatus comprising:

a first refrigerant tank selectively coupled to a refrigerant passageway in thermal communication with the loading chuck, the first refrigerant tank including a first refrigerant maintained at a first temperature;

a second refrigerant tank selectively coupled to the refrigerant passageway, the second refrigerant tank including a second refrigerant maintained at a second temperature that is higher than the first temperature; and

at least one switching valve that selectively couples the first refrigerant tank or the second refrigerant tank to the refrigerant passageway responsive to selection of a set temperature for the loading chuck.

2. The apparatus of claim 1, wherein the at least one switching valve is configured to selectively couple the second refrigerant tank to the refrigerant passageway responsive to selection of a first temperature of the loading chuck and to selectively couple the first refrigerant tank to the refrigerant passageway responsive to selection of a second temperature of the loading chuck, wherein the second temperature is lower than the first temperature.

3. The apparatus of claim 2, wherein the first refrigerant and the second refrigerant comprise a substantially same material.

4. The apparatus of claim 2, further comprising:

at least one heater coupled between the second refrigerant tank and the refrigerant passageway that maintains the second refrigerant at the second temperature; and

a cooling member thermally coupled to the first refrigerant tank that maintains the first refrigerant at the first temperature.

5. The apparatus of claim 4, wherein the at least one heater comprises:

a first heat exchanger that heats the second refrigerant when the second refrigerant is returned from the refrigerant passageway to the second refrigerant tank; and

a second heat exchanger that heats the second refrigerant when the second refrigerant is sent to the refrigerant passageway from the second refrigerant tank.

6. The apparatus of claim 2, further comprising:

a heating member thermally coupled to the second refrigerant tank that maintains the second refrigerant at the second temperature; and

7. The apparatus of claim 2, wherein the loading chuck further comprises a heater that is thermally coupled to the loading chuck, wherein the heater is positioned proximate the refrigerant passageway and wherein the heater is activated to raise the loading chuck from the second temperature to the first temperature of the loading chuck.

8. The apparatus of claim 2, further comprising an auxiliary refrigerant tank coupled to the first refrigerant tank and the second refrigerant tank, the auxiliary refrigerant tank including an auxiliary refrigerant to be supplied to the first or second refrigerant tanks to maintain a desired level of refrigerant in the first and second refrigerant tanks.

9. The apparatus of claim 2, wherein the first temperature is between about −80° and about 0° C. and wherein the second temperature is between about 20° C. and about 80° C.

10. An apparatus for controlling a temperature of a loading chuck, the apparatus comprising:

a first refrigerant tank configured to receive a first refrigerant;

a second refrigerant tank configured to receive a second refrigerant having a temperature higher than a temperature of the first refrigerant;

a first refrigerant line connected between the first refrigerant tank and a refrigerant passageway of the loading chuck to supply the first refrigerant to the refrigerant passageway;

a second refrigerant line connected between the refrigerant passageway and the first refrigerant tank to return the first refrigerant to the first refrigerant tank;

a third refrigerant line connected between the second refrigerant tank and a refrigerant passageway of the loading chuck to supply the second refrigerant to the refrigerant passageway; and

a fourth refrigerant line connected between the refrigerant passageway and the second refrigerant tank to return the second refrigerant to the second refrigerant tank.

11. The apparatus of claim 10, wherein the third refrigerant line corresponds to a line branched off from the first refrigerant line, and the fourth refrigerant line corresponds to a line branched off from the second refrigerant line.

12. The apparatus of claim 11, further comprising:

a first switching valve installed in a branched portion between the first refrigerant line and the third refrigerant line; and

a second switching valve installed in a branched portion between the second refrigerant line and the fourth refrigerant line.

13. The apparatus of claim 10, further comprising:

a heat exchanger installed in at least one of the third refrigerant line and the fourth refrigerant line to rapidly heat the second refrigerant.

14. The apparatus of claim 10, further comprising:

a heating member thermally coupled to the second refrigerant tank to heat the second refrigerant.

15. The apparatus of claim 10, further comprising:

an auxiliary refrigerant tank connected with the first refrigerant tank and the second refrigerant tank and configured to receive an auxiliary refrigerant to selectively supply the auxiliary refrigerant to the first refrigerant tank and/or the second refrigerant tank.

16. The apparatus of claim 10, further comprising:

a cooling member connected to the first refrigerant tank to decrease the temperature of the first refrigerant in the first refrigerant tank.

17. The apparatus of claim 10, wherein the second refrigerant tank is connected with the first refrigerant tank to selectively supply the second refrigerant to the first refrigerant tank.

18. The apparatus of claim 10, wherein the loading chuck comprises a heater arranged under the refrigerant passageway.

19. A method of controlling a temperature of a loading chuck, the method comprising:

circulating a first refrigerant through a refrigerant passageway of the loading chuck to provide the loading chuck with a first temperature;

directly heating the loading chuck and circulating a second refrigerant having a second temperature higher than the first temperature through the refrigerant passageway to provide the loading chuck with the second temperature; and

directly heating the loading chuck with the circulation of the second refrigerant being stopped to maintain the second temperature of the loading chuck.

20. The method of claim 19, further comprising:

heating the second refrigerant while it is circulated through the refrigerant passageway.