US20140204517A1 - Flexible printed circuit - Google Patents
Flexible printed circuit Download PDFInfo
- Publication number
- US20140204517A1 US20140204517A1 US13/745,296 US201313745296A US2014204517A1 US 20140204517 A1 US20140204517 A1 US 20140204517A1 US 201313745296 A US201313745296 A US 201313745296A US 2014204517 A1 US2014204517 A1 US 2014204517A1
- Authority
- US
- United States
- Prior art keywords
- cutouts
- unit
- resin strips
- fpc
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims abstract description 66
- 229920005989 resin Polymers 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000005012 migration Effects 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
Description
- The present invention relates generally to a flexible printed circuit (FPC) that connects one unit of a device to another unit of the device and, more specifically, to an FPC that inhibits the migration of water along the FPC.
- Some electronic devices, such as portable computers and flip-type cell phones, are manufactured as two units, which are mechanically connected to each other with a hinge. In order for power and signals to be exchanged between the two units, an FPC may be used to electrically couple the two units.
FIG. 1 is a top perspective view of one end of an FPC 100 connected to, for example, akeyboard case 10. As illustrated inFIG. 2A , the FPC 100 may include conductive traces 102 embedded between a pair ofresin strips 104 and is bonded to abase plate 106 of thekeyboard case 10. To reduce the possibility of water or other liquid from a spill migrating into theunit 10 to which the FPC 100 is connected, the tail exit of the FPC 100 may be covered with a water-tight film 108, such as Mylar®. However, as illustrated in the cross-sectional view ofFIG. 2B , there may begaps 110 at the edge of the water-tight film 108 that can create channels along the edges of thestrips 104, increasing the possibility of intrusion of liquid into thegaps 110 and into theunit 10. Theresin strips 104, and therefore thegaps 110, may be about 0.25 millimeters (mm) thick. - Therefore, it can be seen that there is a need for a more effective method of reducing liquid migration from the tail exit of an FPC into connected devices.
- In one aspect, a flexible printed circuit (FPC) connection structure is provided. The FPC comprises a base plate and a pair of resin strips disposed on the base plate. The resin strips comprise conductive traces embedded between the FPC and configured to electrically couple a first unit of an electronic device at a tail end of the FPC with a second unit of the electronic device at an opposing end of the FPC; and edges having cutouts formed therein adjacent to the tail end.
- In another aspect, a method of manufacturing a flexible printed circuit (FPC) is provided. The method comprises providing a pair of resin strips having a tail end; embedding conductive traces between the resin strips configured to electrically couple a first unit of an electronic device at the tail end of the resin strips with a second unit of the electronic device at an opposing end of the resin strips; forming cutouts in edges of the resin strips adjacent to the tail end configured to increase the effective length of the edges; bonding the resin strips to a baseplate; and overlaying a water-tight film on the resin strips at the tail end.
- In a further aspect, an electronic device is provided. The electronic device comprises a first unit, a second unit pivotally connected to the first unit, and a flexible printed circuit (FPC) disposed to electrically couple the first unit with the second unit. The FPC comprises a base plate and a pair of resin strips between which conductive traces are embedded and extend the length of the FPC. The conductive traces are configured to electrically couple the first unit at a tail end of the FPC with the second unit at an opposing end of the resin strips, the resin strips having edges. The edges of the resin strips adjacent to the tail end have cutouts formed therein configured to increase the effective length of the edges. The FPC further comprises a water-tight film overlaying the resin strips at the tail end.
- These and other features, aspects and advantages of the present invention will become better understood with reference to the following drawings, description and claims.
-
FIG. 1 is a perspective view of a tail exit of prior art FPC on which a water-tight film has been attached; -
FIG. 2A is a top view of a prior art FPC; -
FIG. 2B is an end cut-away view taken along line A-A ofFIG. 2A ; -
FIG. 3 is a top cutaway view of an FPC of the present invention illustrating an embodiment of the edges of the resin strips at the tail end of the FPC; -
FIG. 4 is a top view of an alternative embodiment of the edges at the tail end of the FPC; -
FIG. 5 is a top view of a second alternative embodiment of the edges at the tail end of the FPC; -
FIG. 6 is a top view of a third alternative embodiment of the edges at the tail end of the FPC; -
FIG. 7 is a top view of a fourth alternative embodiment of the edges at the tail end of the FPC; -
FIG. 8 is a top view of a fifth alternative embodiment of the edges at the tail end of the FPC; -
FIG. 9 is a side cross-sectional view of a notebook computer in which an embodiment of an FPC of the present invention is installed; -
FIG. 10 is a cut-away view of a flip-type cell phone in which an embodiment of an FPC of the present invention is installed; and -
FIG. 11 is a flow chart of a method of producing an FPC of the present invention. - The following detailed description is of the best currently contemplated modes of carrying out exemplary embodiments. The description is not to be taken in a limiting sense, but is made merely for the purpose of illustrating the general principles, since the scope of the embodiments is best defined by the appended claims.
- Various inventive features are described below that can each be used independently of one another or in combination with other features.
- Broadly, exemplary embodiments provide a flexible printed circuit (FPC) that electrically couples one unit of a device to another unit of the device. More specifically, exemplary embodiments provide an FPC that may inhibit the migration of water or other liquid in the FPC.
- Referring to
FIG. 3 , according to exemplary embodiments, an FPC 300 may include abase plate 302 and pair ofresin strips 304 between which conductive traces are embedded and extend the length of theresin strips 304. The conductive traces may electrically couple a first unit of an electrical device at a tail end of the FPC with a second unit of the electrical device at the opposite end of the FPC. The conductive traces may include a variety of types of thin and flexible interconnection circuits, such as an etched cupper conductive pattern sandwiched by a pair of polyimide resin strips, or a silk screen printed conductive pattern sandwiched by a pair of polyethylene terephthalate (PET) resin strips. A water-tight film 306 such as Mylar® or other sealing material may overlay theresin strips 304 to seal theedges 304A of theresin strips 304. Nonetheless, gaps or channels between the water-tight film 306 and theresin strips 304 may remain. - Referring also to the
flow chart 1100 ofFIG. 11 , in contrast to thestraight edges 104A of the priorart resin strips 104, according to one embodiment, theresin strips 304 may be provided (step 1102) and conductive traces may be embedded between the resin strips 304 (step 1104).Small cutouts 304B may be formed in theiredges 304A near thetail exit 300A of the FPC 300 (step 1106) and theresin strips 304 may be bonded to the base plate 302 (step 1108). Thecutouts 304B may increase the effective length of theedges 304A of theresin strips 304. Consequently, the path aliquid 20 must take through the channels between theresin strips edges 304A and the water-tight film 306 is lengthened and the time it takes for theliquid 20 to travel along theedges 304A may be increased. A water-tight film may overlaid on theresin strips 304 to provide an initial sealing barrier to liquid (step 1110). - According to one embodiment, the
cutouts 304B in theedges 304A of the resin strip may be formed as notches, such as V-shaped notches 304C. According to another embodiment, thecutouts 304B in theedges 304A of the resin strips may be formed asoblong chambers 304D with narrow openings. When aliquid 22 enters the gaps, it may travel along theedges 304A and fill thechambers 304D. The pressure of theliquid 22 within thechambers 304D may then retardfurther liquid 22 flow along theedges 304A. - According to still another embodiment, the
resin strips 304 may have bothnotches 304C andchambers 304D formed in an alternating pattern in theedges 304A near thetail exit 300A of the FPC 300. In this configuration, the effects on the flow of liquid by thenotches 304C and by thechambers 304D may reinforce each other. - In one demonstration, a prior art FPC 100 having
resin strips 104 withstraight edges 104A was connected to a keyboard. The length of time it took for water to enter thegaps 110 and travel along the edge channels to reach the keyboard was about five minutes. In contrast, the length of time it took for water to reach the keyboard increased to about twenty minutes when the resin strips 304 with alternatingnotches 304C andchambers 304D were used. Any water that remains in the channels after water is removed from the outside of the FPC may eventually evaporate and not cause damage. -
FIGS. 4-8 illustrate some edge configurations that may be used with theFPC 300. It will be appreciated that the illustrated edge configurations are representative and not exhaustive and that other configurations may be used.FIG. 4 illustrates aresin strip tail 400 with a singlesquared notch 402 cut into each edge. Thenotches 402 may be about 6 millimeters (mm) wide and about 6 mm deep. -
FIG. 5 illustrates aresin strip tail 500 with multiplesquared notches 502 cut into each edge. Thenotches 502 may be about 3 mm wide, about 6 mm deep, and spaced about 3 mm apart along each edge. -
FIG. 6 illustrates aresin strip tail 600 with a set ofsquared notches 602 cut into each edge. Eachnotch 602 may haverough sides 604. Thenotches 602 may be about 1.5 mm wide, about 6 mm deep, and spaced about 1.5 mm apart along each edge. -
FIG. 7 illustrates aresin strip tail 700 with a set ofoblong chambers 702 cut into each edge. Eachchamber 702 may have anarrow opening 704. Thechambers 702 may be about 3 mm wide and about 5 mm deep. Theopenings 704 may be spaced about 5 mm apart along each edge. -
FIG. 8 illustrates aresin strip tail 800 with a set ofoblong chambers 802 cut into each edge. Eachchamber 802 may have anarrow opening 804 and be separated from the adjacent chamber by anotch 806. Thechambers 802 may be about 3 mm wide and about 5 mm deep and the notches may be about 1.5 mm wide and about 6 mm deep. Theopenings 804 may be spaced about 5 mm apart along each edge. -
FIG. 9 is a side cross-sectional view of anotebook computer 900. Akeyboard unit 902 may be mechanically connected to adisplay unit 904 with ahinge 906 to enable the twounits units FPC 908 of the present invention to inhibit the migration of water or other liquid along the edges of the resin strips. -
FIG. 10 illustrates a top cut-away view of acell phone 1000. Akeyboard unit 1002 may be mechanically connected to andisplay unit 1004 with a hinge 1006 to enable the twounits units FPC 1008 of the present invention to inhibit the migration of water or other liquid along the edges of the resin strips. - It should be understood, of course, that the foregoing relate to exemplary embodiments of the invention and that modifications may be made without departing from the spirit and scope of the invention as set forth in the following claims.
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/745,296 US9374911B2 (en) | 2013-01-18 | 2013-01-18 | Flexible printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US13/745,296 US9374911B2 (en) | 2013-01-18 | 2013-01-18 | Flexible printed circuit |
Publications (2)
Publication Number | Publication Date |
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US20140204517A1 true US20140204517A1 (en) | 2014-07-24 |
US9374911B2 US9374911B2 (en) | 2016-06-21 |
Family
ID=51207500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/745,296 Active 2034-11-03 US9374911B2 (en) | 2013-01-18 | 2013-01-18 | Flexible printed circuit |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10670888B1 (en) | 2015-12-28 | 2020-06-02 | Amazon Technologies, Inc. | Head-mounted wearable device with integrated circuitry |
US10761346B1 (en) * | 2015-12-28 | 2020-09-01 | Amazon Technologies, Inc. | Head-mounted computer device with hinge |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4484039A (en) * | 1983-08-29 | 1984-11-20 | Amp Incorporated | Membrane switch having improved switch tail |
US20070089900A1 (en) * | 2005-10-26 | 2007-04-26 | Nec Electronics Corporation | Flexible board |
-
2013
- 2013-01-18 US US13/745,296 patent/US9374911B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4484039A (en) * | 1983-08-29 | 1984-11-20 | Amp Incorporated | Membrane switch having improved switch tail |
US20070089900A1 (en) * | 2005-10-26 | 2007-04-26 | Nec Electronics Corporation | Flexible board |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10670888B1 (en) | 2015-12-28 | 2020-06-02 | Amazon Technologies, Inc. | Head-mounted wearable device with integrated circuitry |
US10761346B1 (en) * | 2015-12-28 | 2020-09-01 | Amazon Technologies, Inc. | Head-mounted computer device with hinge |
Also Published As
Publication number | Publication date |
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US9374911B2 (en) | 2016-06-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: LENOVO (SINGAPORE) PTE, LTD., SINGAPORE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HOSOYA, SATOSHI;REEL/FRAME:030879/0887 Effective date: 20130118 |
|
AS | Assignment |
Owner name: LENOVO (SINGAPORE) PTE. LTD., SINGAPORE Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 030879 FRAME 0887. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT;ASSIGNOR:HOSOYA, SATOSHI;REEL/FRAME:038603/0012 Effective date: 20130118 |
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STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
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AS | Assignment |
Owner name: LENOVO PC INTERNATIONAL LIMITED, HONG KONG Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LENOVO (SINGAPORE) PTE. LTD.;REEL/FRAME:049688/0741 Effective date: 20160701 |
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MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
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