US20150097196A1 - Integrated Device Including Silicon and III-Nitride Semiconductor Devices - Google Patents

Integrated Device Including Silicon and III-Nitride Semiconductor Devices Download PDF

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US20150097196A1
US20150097196A1 US14/515,233 US201414515233A US2015097196A1 US 20150097196 A1 US20150097196 A1 US 20150097196A1 US 201414515233 A US201414515233 A US 201414515233A US 2015097196 A1 US2015097196 A1 US 2015097196A1
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semiconductor
silicon
semiconductor device
integrated device
substrate
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Mike Briere
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Infineon Technologies North America Corp
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International Rectifier Corp USA
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Assigned to Infineon Technologies Americas Corp. reassignment Infineon Technologies Americas Corp. MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: INFINEON TECHNOLOGIES NORTH AMERICA CORP., INTERNATIONAL RECTIFIER CORPORATION
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    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0605—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits made of compound material, e.g. AIIIBV
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642—Isolation within the component, i.e. internal isolation
    • H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
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    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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    • H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions

Definitions

  • the present invention relates to semiconductor devices and methods for fabricating semiconductor devices.
  • Some semiconductor materials such as silicon are desirable as base material for forming IC devices for, for example, driving other devices such as power MOSFETs.
  • III-N semiconductor materials may are desirable for serving as a base material for power switching devices.
  • One example of such a material is GaN.
  • a semiconductor device includes:
  • a second semiconductor device formed over the first surface and disposed lateral to the first semiconductor device
  • the first semiconductor device is comprised of a first semiconductor material
  • the second semiconductor device is comprised of a second semiconductor material that is different from the first semiconductor material
  • the second material may have a higher band gap than the first material.
  • the first material may be silicon and the second material may be a III-N semiconductor material.
  • An example of a III-nitride material is GaN. While Si, SiC, sapphire, or even GaN can be used as a substrate, silicon is most preferred for economic reasons.
  • the first semiconductor device may include a control IC and the second semiconductor device may be a power switching device that is controlled by the control IC.
  • a device according to the present invention may further include an insulation wall disposed between the first semiconductor device and the second semiconductor device.
  • the device may further include an interlayer disposed between the second semiconductor device and the common substrate.
  • the common substrate may be comprised of silicon
  • the first material may be comprised of silicon
  • the second material may be comprised of a III-N semiconductor
  • the interlayer may be comprised of a compositionally graded III-N material (e.g. AlN)
  • the insulation wall may be comprised of silicon dioxide.
  • the first semiconductor device may be formed in ⁇ 100> silicon that is epitaxially formed over a ⁇ 100> silicon wafer.
  • the second semiconductor device is comprised of a III-N semiconductor material that is formed on a ⁇ 111> silicon body residing on a silicon dioxide body lying on the substrate.
  • a method according to the present invention may include:
  • the one semiconductor material may be comprised of silicon and the another semiconductor material may be comprised of a semiconductor material of a higher band gap than that of silicon.
  • the one semiconductor material may be comprised of silicon and the another semiconductor material may be comprised of a III-N semiconductor material, such as a semiconductor alloy from the InAlGaN system (e.g. GaN).
  • FIGS. 1-5 each shows a cross-sectional view of a portion of a wafer containing a die according to the first, second, third, fourth, and fifth embodiment of the present invention respectively.
  • FIGS. 6A-6C illustrate a process for fabricating a device according to the present invention.
  • FIGS. 7A-7D illustrate an alternative process for fabricating a device according to the present invention.
  • FIGS. 8A-8D illustrate another alternative process for fabricating a device according to the present invention.
  • a semiconductor device would include at least first semiconductor body 14 , and at least second semiconductor body 16 disposed lateral to first semiconductor body 14 .
  • first semiconductor body 14 and second semiconductor body 16 are formed over common substrate 18 .
  • first semiconductor body 14 is comprised of a first semiconductor material such as silicon
  • second semiconductor body 16 is comprised of a second semiconductor material that is different from the first semiconductor material.
  • second semiconductor material has a higher band gap than that of silicon, such a III-N semiconductor material.
  • a preferred material for forming second semiconductor body 16 is GaN.
  • GaN is preferred in that it can be used to form a power device such as a high electron mobility transistor (HEMT).
  • a die according to the present invention an be used as a basic platform for forming a semiconductor device having a control IC formed in first semiconductor body 14 , which is made preferably from silicon, and a power device, such as a HEMT, in second semiconductor body 16 .
  • substrate 18 is formed from silicon for economic reasons.
  • substrate materials such as SiC or Sapphire may be used without deviating from the scope and spirit of the present invention.
  • first semiconductor body 14 and substrate 18 are composed of the same material, for example, Si, while second semiconductor body 16 is comprised of another semiconductor material, for example, GaN.
  • interlayer 20 can be disposed between second semiconductor body 16 and substrate 20 .
  • Interlayer 20 may be required, for example, to alleviate stresses which may be caused by the dissimilarity between second semiconductor body 16 and substrate 18 .
  • interlayer 20 may be composed of a composition graded GaN body.
  • interlayer 20 may include more than one material body.
  • interlayer 20 may include first interlayer 22 , and second interlayer 24 stacked over first interlayer 22 .
  • Second semiconductor body 16 is disposed atop second interlayer 24
  • first interlayer 22 is disposed atop substrate 18 .
  • second semiconductor body 16 is composed of GaN
  • substrate 18 and first semiconductor body 14 are composed of (100) silicon.
  • the (100) silicon is particularly desired for fabricating an IC circuit.
  • first interlayer 22 is composed of SiO 2
  • second interlayer 24 is composed of (111).
  • barrier 26 is disposed between first semiconductor body 14 and second semiconductor body 16 .
  • Barrier 26 may be composed of a dielectric material such as SiO 2 or SiN, and may extend to substrate 18 , whereby it is lodged between first semiconductor body 14 and second semiconductor body 16 .
  • the fourth embodiment of the present invention is similar to the first embodiment except that it also includes a barrier 26 between first semiconductor body 14 and second semiconductor body 16 .
  • Barrier 26 is preferably composed of a dielectric such as SiO 2 or SiN and extends from the top surfaces of first semiconductor body 14 and second semiconductor body 16 to substrate 18 .
  • the fifth embodiment of the present invention is similar to the fourth embodiment except that it includes interlayer 20 disposed between second semiconductor body 16 and substrate 18 .
  • substrate 18 is preferably composed of silicon
  • second semiconductor body 16 is composed of GaN
  • interlayer 20 is composed of compositionally graded GaN.
  • a wafer comprising substrate 18 , and a semiconductor body 30 disposed over a major surface of substrate 18 is provided.
  • Substrate 18 may be composed of silicon and semiconductor body 30 may be composed of a material for forming second semiconductor bodies 16 , such as III-Nitride material, for example, GaN.
  • a material body 32 for forming interlayers 20 may also be included with the wafer.
  • portions of the wafer shown in FIG. 6A are removed to create a plurality of cavities 34 each reaching at least substrate 18 .
  • a plurality of second semiconductor bodies 16 and interlayers 20 are also formed.
  • a first semiconductor body 14 is formed in each respective cavity 34 by, for example, epitaxial growth or the like.
  • silicon is epitaxially grown over the exposed surfaces at the bottom of cavities 34 by epitaxial growth to form first semiconductor bodies 14 , as seen in FIG. 6C .
  • an alternative process for fabricating a device according to the present invention includes providing a wafer having a substrate 18 , and a semiconductor body 36 which is preferably comprised of a material for forming first semiconductor bodies 14 .
  • substrate 18 may be composed of silicon and semiconductor body 36 may also be composed of silicon.
  • semiconductor body 36 and substrate 18 a single crystal wafer of silicon may be used.
  • portions of semiconductor body 36 are removed to create cavities 38 each reaching at least substrate 18 , and to form first semiconductor bodies 14 .
  • barriers 26 are formed on the sidewalls of cavities 38 .
  • the silicon sidewalls of cavities 38 are oxidized to form barriers 26 composed of SiO 2 .
  • second semiconductor bodies 16 are formed in respective cavities 38 by epitaxial growth or the like over the exposed surface of substrate 18 at the bottom of each cavity 38 .
  • a respective interlayer 20 is formed at the bottom of each respective cavity 38 over substrate 18 .
  • interlayers 20 composed of compositionally graded GaN or the like may be formed prior to forming second semiconductor bodies 16 .
  • a wafer that includes substrate 18 having a material stack atop thereof is provided.
  • Material stack 40 includes first layer 42 , second layer 44 , and third layer 46 .
  • substrate 18 is composed of (100) silicon
  • first layer 42 is composed of SiO 2
  • second layer 44 is composed of (111) silicon
  • third layer 46 is composed of a material for forming second semiconductor bodies 16 , such a III-Nitride material, for example, GaN.
  • first semiconductor bodies 14 are formed in each cavity over the exposed surface of substrate 18 at the bottom thereof.
  • first semiconductor bodies 14 are formed with (100) silicon, which is a desirable material for forming IC's.

Abstract

A semiconductor device that includes one semiconductor device formed in one semiconductor material and a second semiconductor device formed in another semiconductor material on a common substrate, and a method of fabricating the semiconductor device.

Description

    RELATED APPLICATION
  • This application is based on and claims benefit of U.S. Provisional Application No. 60/690,389, filed on Jun. 14, 2005, entitled METHODS OF COMBINING SILICON AND III-NITRIDE MATERIAL ON A SINGLE WAFER, to which a claim of priority is hereby made and the disclosure of which is incorporated herein by reference.
    • BACKGROUND OF THE INVENTION
  • The present invention relates to semiconductor devices and methods for fabricating semiconductor devices.
  • Some semiconductor materials such as silicon are desirable as base material for forming IC devices for, for example, driving other devices such as power MOSFETs.
  • Other materials are desirable for forming switching devices. For example, III-N semiconductor materials may are desirable for serving as a base material for power switching devices. One example of such a material is GaN.
  • It is desirable to have a single die which includes one semiconductor body with optimum use for an IC application and another for power switching application so that the driver IC and the power switch may be formed in a common die.
    • SUMMARY OF THE INVENTION
  • A semiconductor device according to the present invention includes:
  • a common substrate;
  • a first semiconductor device formed over a first surface of the substrate; and
  • a second semiconductor device formed over the first surface and disposed lateral to the first semiconductor device;
  • wherein the first semiconductor device is comprised of a first semiconductor material, and the second semiconductor device is comprised of a second semiconductor material that is different from the first semiconductor material.
  • According to one aspect of the present invention the second material may have a higher band gap than the first material. Thus, for example, the first material may be silicon and the second material may be a III-N semiconductor material. An example of a III-nitride material is GaN. While Si, SiC, sapphire, or even GaN can be used as a substrate, silicon is most preferred for economic reasons.
  • According to another aspect of the present invention the first semiconductor device may include a control IC and the second semiconductor device may be a power switching device that is controlled by the control IC.
  • A device according to the present invention may further include an insulation wall disposed between the first semiconductor device and the second semiconductor device. In addition, the device may further include an interlayer disposed between the second semiconductor device and the common substrate.
  • In one preferred embodiment, the common substrate may be comprised of silicon, the first material may be comprised of silicon, the second material may be comprised of a III-N semiconductor, the interlayer may be comprised of a compositionally graded III-N material (e.g. AlN), and the insulation wall may be comprised of silicon dioxide. Preferably, the first semiconductor device may be formed in <100> silicon that is epitaxially formed over a <100> silicon wafer. Moreover, preferably, the second semiconductor device is comprised of a III-N semiconductor material that is formed on a <111> silicon body residing on a silicon dioxide body lying on the substrate.
  • A method according to the present invention may include:
  • providing a semiconductor body of one semiconductor material;
  • removing a portion of the semiconductor body to create a receiving region; and
  • forming another semiconductor body of another semiconductor material in the receiving region.
  • According to one aspect of the present invention the one semiconductor material may be comprised of silicon and the another semiconductor material may be comprised of a semiconductor material of a higher band gap than that of silicon. For example, the one semiconductor material may be comprised of silicon and the another semiconductor material may be comprised of a III-N semiconductor material, such as a semiconductor alloy from the InAlGaN system (e.g. GaN).
  • Other features and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1-5 each shows a cross-sectional view of a portion of a wafer containing a die according to the first, second, third, fourth, and fifth embodiment of the present invention respectively.
  • FIGS. 6A-6C illustrate a process for fabricating a device according to the present invention.
  • FIGS. 7A-7D illustrate an alternative process for fabricating a device according to the present invention.
  • FIGS. 8A-8D illustrate another alternative process for fabricating a device according to the present invention.
    •  DETAILED DESCRIPTION OF THE FIGURES
  • Referring to FIG. 1, there is shown a portion of a wafer 10 containing a plurality of semiconductor die 12 according to the present invention. A semiconductor device according to the present invention would include at least first semiconductor body 14, and at least second semiconductor body 16 disposed lateral to first semiconductor body 14. Preferably, first semiconductor body 14 and second semiconductor body 16 are formed over common substrate 18. According to the present invention first semiconductor body 14 is comprised of a first semiconductor material such as silicon, and second semiconductor body 16 is comprised of a second semiconductor material that is different from the first semiconductor material. For example, second semiconductor material has a higher band gap than that of silicon, such a III-N semiconductor material. A preferred material for forming second semiconductor body 16 is GaN.
  • GaN is preferred in that it can be used to form a power device such as a high electron mobility transistor (HEMT). Thus, a die according to the present invention an be used as a basic platform for forming a semiconductor device having a control IC formed in first semiconductor body 14, which is made preferably from silicon, and a power device, such as a HEMT, in second semiconductor body 16.
  • It should be noted that in the preferred embodiment substrate 18 is formed from silicon for economic reasons. However, other substrate materials such as SiC or Sapphire may be used without deviating from the scope and spirit of the present invention.
  • Referring to FIG. 2, according to the second embodiment of the present invention first semiconductor body 14 and substrate 18 are composed of the same material, for example, Si, while second semiconductor body 16 is comprised of another semiconductor material, for example, GaN. Thus, according to the second embodiment of the present invention interlayer 20 can be disposed between second semiconductor body 16 and substrate 20. Interlayer 20 may be required, for example, to alleviate stresses which may be caused by the dissimilarity between second semiconductor body 16 and substrate 18. Thus, in the preferred embodiment in which second semiconductor body 16 is composed of GaN and substrate 18 is composed of Si, interlayer 20 may be composed of a composition graded GaN body.
  • Referring next to FIG. 3, according to the third embodiment of the present invention, interlayer 20 may include more than one material body. Thus, interlayer 20 may include first interlayer 22, and second interlayer 24 stacked over first interlayer 22. Second semiconductor body 16 is disposed atop second interlayer 24, and first interlayer 22 is disposed atop substrate 18. In the preferred embodiment of the present invention, second semiconductor body 16 is composed of GaN, and substrate 18 and first semiconductor body 14 are composed of (100) silicon. the (100) silicon is particularly desired for fabricating an IC circuit. However, it is desired to have (111) as a base for GaN. Thus, in the preferred embodiment first interlayer 22 is composed of SiO2, and second interlayer 24 is composed of (111). As a result, according to the preferred embodiment of the first embodiment a (100) silicon body and a GaN body can be formed on a common substrate. An interlayer 20 having more than one material body, therefore, enables the designer to optimize the crystal orientation of the materials used. Also, preferably, in the third embodiment of the present invention barrier 26 is disposed between first semiconductor body 14 and second semiconductor body 16. Barrier 26 may be composed of a dielectric material such as SiO2 or SiN, and may extend to substrate 18, whereby it is lodged between first semiconductor body 14 and second semiconductor body 16.
  • Referring next to FIG. 4, the fourth embodiment of the present invention is similar to the first embodiment except that it also includes a barrier 26 between first semiconductor body 14 and second semiconductor body 16. Barrier 26 is preferably composed of a dielectric such as SiO2 or SiN and extends from the top surfaces of first semiconductor body 14 and second semiconductor body 16 to substrate 18.
  • Referring next to FIG. 5, the fifth embodiment of the present invention is similar to the fourth embodiment except that it includes interlayer 20 disposed between second semiconductor body 16 and substrate 18. In the preferred embodiment of the present invention substrate 18 is preferably composed of silicon, second semiconductor body 16 is composed of GaN and interlayer 20 is composed of compositionally graded GaN.
  • Referring now to FIGS. 6A-6C, in a process for fabricating a device according to the present invention a wafer comprising substrate 18, and a semiconductor body 30 disposed over a major surface of substrate 18 is provided. Substrate 18 may be composed of silicon and semiconductor body 30 may be composed of a material for forming second semiconductor bodies 16, such as III-Nitride material, for example, GaN. Note that a material body 32 for forming interlayers 20 may also be included with the wafer.
  • Referring next to FIG. 613, portions of the wafer shown in FIG. 6A are removed to create a plurality of cavities 34 each reaching at least substrate 18. As a result, a plurality of second semiconductor bodies 16 and interlayers 20 are also formed. Thereafter, a first semiconductor body 14 is formed in each respective cavity 34 by, for example, epitaxial growth or the like. Thus, in the preferred embodiment silicon is epitaxially grown over the exposed surfaces at the bottom of cavities 34 by epitaxial growth to form first semiconductor bodies 14, as seen in FIG. 6C.
  • Referring next to FIGS. 7A-7D, an alternative process for fabricating a device according to the present invention includes providing a wafer having a substrate 18, and a semiconductor body 36 which is preferably comprised of a material for forming first semiconductor bodies 14. In the preferred embodiment, substrate 18 may be composed of silicon and semiconductor body 36 may also be composed of silicon. Alternatively, instead of semiconductor body 36 and substrate 18, a single crystal wafer of silicon may be used.
  • Referring next to FIG. 7B, portions of semiconductor body 36 are removed to create cavities 38 each reaching at least substrate 18, and to form first semiconductor bodies 14. Thereafter, barriers 26 are formed on the sidewalls of cavities 38. Thus, in the preferred embodiment, the silicon sidewalls of cavities 38 are oxidized to form barriers 26 composed of SiO2.
  • Referring next to FIG. 7C, according to one alternative process second semiconductor bodies 16 are formed in respective cavities 38 by epitaxial growth or the like over the exposed surface of substrate 18 at the bottom of each cavity 38.
  • Referring next to FIG. 7D, in another alternate embodiment, prior to formation of second semiconductor bodies 16 a respective interlayer 20 is formed at the bottom of each respective cavity 38 over substrate 18. Thus, for example, when GaN or another III-Nitride material is selected for forming second semiconductor bodies 16, interlayers 20 composed of compositionally graded GaN or the like may be formed prior to forming second semiconductor bodies 16.
  • Referring next to FIGS. 8A-8D, in yet another alternate process for fabricating a device according to the present invention, a wafer that includes substrate 18 having a material stack atop thereof is provided. Material stack 40 includes first layer 42, second layer 44, and third layer 46. In the preferred embodiment of the present invention, substrate 18 is composed of (100) silicon, first layer 42 is composed of SiO2, second layer 44 is composed of (111) silicon, and third layer 46 is composed of a material for forming second semiconductor bodies 16, such a III-Nitride material, for example, GaN.
  • Referring next to FIG. 8B, portions of stack 40 are removed to create cavities 48 each reaching at least an exposed surface of substrate 18, and to create second semiconductor bodies 16, and first interlayer 22 and second interlayer 24 under each second semiconductor body 16. Next, barriers 26 are formed on the sidewalls of each cavity 48 as seen in FIG. 8C. Barriers 26 may be formed of a dielectric material such as SiO2 or SiN or the like. Thereafter, a first semiconductor body 14 is formed in each cavity over the exposed surface of substrate 18 at the bottom thereof. In the preferred embodiment of the present invention, first semiconductor bodies 14 are formed with (100) silicon, which is a desirable material for forming IC's.
  • Although the present invention has been described in relation to particular embodiments thereof, many other variations and modifications and other uses will become apparent to those skilled in the art. It is preferred, therefore, that the present invention be limited not by the specific disclosure herein, but only by the appended claims.

Claims (15)

1-22. (canceled)
23. An integrated device comprising:
a common substrate;
a first semiconductor device formed over a first surface of said substrate;
a second semiconductor device formed over said first surface and disposed lateral to said first semiconductor device;
said first semiconductor device comprising a first semiconductor material, and said second semiconductor device comprising a second semiconductor material having a higher band gap than said first semiconductor material.
24. The integrated device of claim 23, wherein said first semiconductor material comprises silicon and said second semiconductor material comprises a III-Nitride material.
25. The integrated device of claim 23, wherein said first semiconductor device comprises a control IC.
26. The integrated device of claim 23, wherein said second semiconductor device comprises a power switching device.
27. The integrated device of claim 23 further comprising an insulation wall disposed between said first semiconductor device and said second semiconductor device.
28. The integrated device of claim 23 further comprising an interlayer disposed between said second semiconductor device and said common substrate.
29. The integrated device of claim 27, wherein said insulation wall comprises of silicon dioxide.
30. The integrated device of claim 28, wherein said interlayer comprises a compositionally graded III-Nitride material.
31. The integrated device of claim 23, wherein said first semiconductor device comprises <100> silicon.
32. The integrated device of claim 23, wherein said first semiconductor device comprises <100> silicon and said common substrate comprises <100> silicon.
33. The integrated device of claim 23, wherein said second semiconductor material comprises a III-N material that is formed on <111> silicon residing on a silicon dioxide interlayer lying on said common substrate.
34. The integrated device of claim 23, wherein said second semiconductor device comprises an alloy of InAlGaN.
35. The integrated device of claim 23, wherein said second semiconductor device comprises GaN.
36. The integrated device of claim 23, wherein said second semiconductor device comprises AlGaN.
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