US20150241092A1 - Active heat flow control with thermoelectric layers - Google Patents
Active heat flow control with thermoelectric layers Download PDFInfo
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- US20150241092A1 US20150241092A1 US14/189,823 US201414189823A US2015241092A1 US 20150241092 A1 US20150241092 A1 US 20150241092A1 US 201414189823 A US201414189823 A US 201414189823A US 2015241092 A1 US2015241092 A1 US 2015241092A1
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- Prior art keywords
- heat flow
- thermoelectric
- temperature
- thermoelectric module
- flow direction
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
Definitions
- This disclosure is directed to heat flow control.
- TIM Thermal Interface Material
- air gap can have different impacts on thermal performance at skin as well as junction.
- Various temperature limit levels can depend on the hardware nearby, the point of contact with the user, etc.
- the temperature thresholds may be skin ( 45 C), memory ( 85 C), and CPU ( 105 - 120 C). Hot spots can also change with use.
- the processor and memory while a user is gaming, the camera module when a user is recording a video, the transmitter when a user is making a call, etc.
- thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa.
- a thermoelectric device creates voltage when there is a different temperature on each side. Conversely, when a voltage is applied to it, it creates a temperature difference. At the atomic scale, an applied temperature gradient causes charge carriers in the material to diffuse from the hot side to the cold side.
- a Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
- Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler.
- This disclosure is directed to active heat flow control in a mobile system.
- an exemplary embodiment is directed to a method for controlling heat flow in a mobile system, the method comprising: determining a temperature value for each of at least one temperature sensors; determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations; mapping each delta value to a thermoelectric module; calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
- thermoelectric module for determining a temperature value for each of at least one temperature sensors, a comparing module for determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations, a mapping module for mapping each delta value to a thermoelectric module, and a heat flow direction module for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and a processor for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
- Still another exemplary embodiment is directed to a heat flow control apparatus, the apparatus comprising: a memory, the memory comprising: means for determining a temperature value for each of at least one temperature sensors, means for determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations, means for mapping each delta value to a thermoelectric module, means for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and means for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
- FIG. 1 illustrates an exemplary mobile station with hardware that may be used in an operating environment that can control heat flow.
- FIG. 2 illustrates exemplary hardware that can control heat flow in a mobile system, according to one aspect of the disclosure.
- FIG. 3 illustrates an operational flow of a method to control heat flow in a mobile system, according to one aspect of the disclosure.
- FIG. 4A illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.
- FIG. 4B illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.
- FIG. 4C illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.
- FIG. 4D illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure.
- FIG. 5 illustrates an exemplary resistor-capacitor (RC) circuit diagram for active heat flow, according to one aspect of the disclosure.
- FIG. 6 illustrates various thermoelectric array shapes, according to one aspect of the disclosure.
- FIG. 1 is a block diagram illustrating various components of an exemplary mobile station 100 .
- the various features and functions illustrated in the box diagram of FIG. 1 are connected together using a common bus which is meant to represent that these various features and functions are operatively coupled together.
- a common bus which is meant to represent that these various features and functions are operatively coupled together.
- Those skilled in the art will recognize that other connections, mechanisms, features, functions, or the like, may be provided and adapted as necessary to operatively couple and configure an actual portable wireless device.
- one or more of the features or functions illustrated in the example of FIG. 1 may be further subdivided or two or more of the features or functions illustrated in FIG. 1 may be combined.
- the mobile station 100 may include one or more wide area network (WAN) transceiver(s) 104 that may be connected to one or more antennas 102 .
- the WAN transceiver 104 comprises suitable devices, hardware, and/or software for communicating with and/or detecting signals to/from WAN-WAPs, and/or directly with other wireless devices within a network.
- the WAN transceiver 104 may comprise a CDMA communication system suitable for communicating with a CDMA network of wireless base stations; however in other aspects, the wireless communication system may comprise another type of cellular telephony network, such as, for example, TDMA or GSM. Additionally, any other type of wide area wireless networking technologies may be used, for example, WiMAX (802.16), etc.
- the mobile station 100 may also include one or more local area network (LAN) transceivers 106 that may be connected to one or more antennas 102 .
- the LAN transceiver 106 comprises suitable devices, hardware, and/or software for communicating with and/or detecting signals to/from LAN-WAPs, and/or directly with other wireless devices within a network.
- the LAN transceiver 106 may comprise a WLAN (802.11x) communication system suitable for communicating with one or more wireless access points; however in other aspects, the LAN transceiver 106 comprise another type of local area network, personal area network, (e.g., Bluetooth). Additionally, any other type of wireless networking technologies may be used, for example, Ultra Wide Band, ZigBee, wireless USB etc.
- wireless access point may be used to refer to LAN-WAPs and/or WAN-WAPs.
- WAP wireless access point
- embodiments may include a mobile station 100 that can exploit signals from a plurality of LAN-WAPs, a plurality of WAN-WAPs, or any combination of the two.
- the specific type of WAP being utilized by the mobile station 100 may depend upon the environment of operation.
- the mobile station 100 may dynamically select between the various types of WAPs in order to arrive at an accurate position solution.
- various network elements may operate in a peer-to-peer manner, whereby, for example, the mobile station 100 may be replaced with the WAP, or vice versa.
- Other peer-to-peer embodiments may include another mobile station (not shown) acting in place of one or more WAP.
- An SPS receiver 108 may also be included in the mobile station 100 .
- the SPS receiver 108 may be connected to the one or more antennas 102 for receiving satellite signals.
- a heat flow control memory 114 may be coupled to a processor 110 to control heat flow using thermoelectric layers.
- the heat flow control memory 114 can comprise a temperature data module 126 , a threshold database 124 , a comparing module 118 , a mapping module 128 , and a heat flow direction module 116 .
- the temperature data module 126 can receive data from at least on temperature sensor and determine the temperature from that data.
- the comparing module 118 can determine a delta value of the temperature and a temperature threshold, which can be provided from the threshold database 124 .
- the mapping module 128 can map the delta value to thermal module.
- the heat flow direction module 118 can then calculate a heat flow direction signal to minimize positive delta values.
- the heat flow control memory 114 can then transmit the heat flow direction signal to at least one thermoelectric module.
- the method In some embodiments, the heat flow control memory 114 can operate using real-time data.
- the processor 110 may include one or more microprocessors, microcontrollers, and/or digital signal processors that provide processing functions, as well as other calculation and control functionality.
- the processor 110 may also include heat flow control memory 114 for storing data and software instructions for executing programmed functionality within the mobile station 100 .
- the heat flow control memory 114 may be on-board the processor 110 (e.g., within the same IC package), and/or the memory 114 may be external memory to the processor 110 and functionally coupled over a data bus. The functional details associated with aspects of the disclosure will be discussed in more detail below.
- a number of software modules and data tables may reside in heat flow control memory 114 and be utilized by the processor 110 in order to manage both communications and positioning determination functionality.
- Memory 114 may include and/or otherwise receive a heat flow direction module 116 , a comparing module 118 , and a mapping module 128 .
- a heat flow direction module 116 may include and/or otherwise receive a heat flow direction module 116 , a comparing module 118 , and a mapping module 128 .
- modules shown in FIG. 1 are illustrated in the example as being contained in the heat flow control memory 114 , it is recognized that in certain implementations such procedures may be provided for or otherwise operatively arranged using other or additional mechanisms.
- all or part of the heat flow direction module 116 and/or the comparing module 118 may be provided in firmware.
- the comparing module 118 and the heat flow direction module 116 are illustrated as being separate features, it is recognized, for example, that such procedures may be combined together as one procedure or perhaps with other procedures, or otherwise further divided into a plurality of sub-procedures.
- the processor 110 may include any form of logic suitable for performing at least the techniques provided herein.
- the processor 110 may be operatively configurable based on instructions in the heat flow control memory 114 to selectively initiate one or more routines that exploit heat flow control data for use in other portions of the mobile device.
- the mobile station 100 may include a user interface 150 which provides any suitable interface systems, such as a microphone/speaker 152 , keypad 154 , and display 156 that allows user interaction with the mobile station 100 .
- the microphone/speaker 152 provides for voice communication services using the WAN transceiver 104 and/or the LAN transceiver 106 .
- the keypad 154 comprises any suitable buttons for user input.
- the display 156 comprises any suitable display, such as, for example, a backlit LCD display, and may further include a touch screen display for additional user input modes.
- the mobile station 100 may be any portable or movable device or machine that is configurable to acquire wireless signals transmitted from, and transmit wireless signals to, one or more wireless communication devices or networks.
- the mobile station 100 may include a radio device, a cellular telephone device, a computing device, a personal communication system (PCS) device, or other like movable wireless communication equipped device, appliance, or machine.
- PCS personal communication system
- “mobile station” is intended to include all devices, including wireless devices, computers, laptops, etc. which are capable of communication with a server, such as via the Internet, WLAN, or other network, and regardless of whether satellite signal reception, assistance data reception, and/or position-related processing occurs at the device, at a server, or at another device associated with the network. Any operable combination of the above is also considered a “mobile station.”
- wireless device may refer to any type of wireless communication device which may transfer information over a network and also have position determination and/or navigation functionality.
- the wireless device may be any cellular mobile terminal, personal communication system (PCS) device, personal navigation device, laptop, personal digital assistant, or any other suitable mobile device capable of receiving and processing network and/or SPS signals.
- PCS personal communication system
- an embodiment can include a heat flow control apparatus for controlling heat flow in a mobile system 200 .
- the heat flow control apparatus can include thermoelectric devices such as thermoelectric arrays 202 , 204 , 206 , with a plurality of thermoelectric modules 202 A, 202 B, 202 C, heat spreaders 208 , 210 , and a printed circuit board (PCB) 212 comprising a processor.
- the mobile system 200 can include a power source 214 .
- the mobile system 200 can also include a top case 216 and a bottom case 218 .
- thermoelectric arrays 202 , 204 , 206 can have different module locations and patterns.
- Each of the thermoelectric modules 202 A, 202 B, 202 C can receive a heat flow direction signal.
- the heat flow direction signal can transmit one of four states: off, light cooling, strong cooling, and reverse cooling.
- an embodiment can include a method for controlling heat flow in a mobile system, comprising: determining a temperature value for each of at least one temperature sensors—Block 302 ; determining a delta value of the temperature value and a temperature threshold at each of the plurality of locations—Block 304 ; mapping each delta value to a thermoelectric module (e.g., a thermoelectric cooler)—Block 306 ; calculating a heat flow direction signal to minimize positive delta values (e.g., wherein the method uses a system level model or an IC level thermal model)—Block 308 ; and transmitting the heat flow direction signal (e.g., a pulse-width modulation signal to control intensity and direction of the state of at least one of four states) to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor—Block 310 .
- a thermoelectric module e.g., a thermoelectric cooler
- a mobile device 400 comprises a PCB 402 , a battery 404 , a heat spreader 406 , a top thermoelectric array 408 with multiple thermoelectric modules 408 A-G, a bottom thermoelectric array 410 with multiple thermoelectric modules 410 A-G, a top case 412 and a bottom case 414 .
- FIG. 4A shows an example of a situation where the temperature of the top case 412 is greater than a temperature threshold while the bottom case 414 is below the temperature threshold at a given time.
- the thermoelectric modules 408 A-D of the top thermoelectric array 408 will receive a signal to execute a first state to turn on to direct heat flow to the bottom case 414 .
- the thermoelectric modules 410 A-D of the bottom thermoelectric array 410 will receive a signal to execute a second state to turn off to minimize upward heat flow.
- a mobile device 420 comprises a PCB 422 , a battery 424 , a heat spreader 426 , a top thermoelectric array 428 with multiple thermoelectric modules 428 A-G, a bottom thermoelectric array 430 with multiple thermoelectric modules 430 A-G, a top case 432 and a bottom case 434 .
- FIG. 4B shows an example of a situation where the temperature of the bottom case 434 is greater than a temperature threshold.
- the thermoelectric modules 430 A-D of the bottom thermoelectric array 410 will receive a signal to turn on to direct heat flow to the top case 432 .
- the thermoelectric modules 428 A-D of the top thermoelectric array 428 will receive a signal to turn off to minimize downward heat flow.
- a mobile device 440 comprises a PCB 442 , a battery 444 , a top heat spreader 446 , a top thermoelectric array 448 with multiple thermoelectric modules 448 A-G, a bottom thermoelectric array 450 with multiple thermoelectric modules 450 A-G, a middle heat spreader 452 , a middle thermoelectric array 454 with multiple thermoelectric modules 454 A-G, a top case 456 and a bottom case 458 .
- FIG. 4C shows an example of a situation where the temperature of the middle of the mobile device 440 is greater than a temperature threshold.
- the thermoelectric modules 448 A-E of the top thermoelectric array 448 and the thermoelectric modules 454 A-D of the middle thermoelectric array 454 will receive a signal to turn off to minimize downward heat flow.
- the thermoelectric modules 450 A-D of the bottom thermoelectric array 450 will receive a signal to turn off to minimize upward heat flow
- a mobile device 460 comprises a PCB 462 , a battery 464 , a top heat spreader 466 , a top thermoelectric array 468 with multiple thermoelectric modules 468 A-G, a bottom thermoelectric array 470 with multiple thermoelectric modules 470 A-G, a middle heat spreader 472 , a middle thermoelectric array 474 with multiple thermoelectric modules 474 A-G, a top case 476 and a bottom case 478 .
- FIG. 4D shows an example of a situation where the temperature of the top case 476 and the bottom case 478 are greater than corresponding temperature thresholds.
- the thermoelectric modules 468 B-D of the top thermoelectric array 468 and the thermoelectric module 474 B of the middle thermoelectric array 474 will receive a signal to turn off and thermoelectric modules 468 A and E-G of the top thermoelectric array 468 and the thermoelectric modules 474 A and C-G of the middle thermoelectric array 474 will receive a signal to turn on to maximize heat flow away from the top outside heat source.
- thermoelectric modules 470 B-C of the bottom thermoelectric array 470 will receive a signal to turn off and thermoelectric modules 470 A and D-G of the bottom thermoelectric array 470 will receive a signal to turn on to maximize heat flow away from the bottom outside heat source.
- a current temperature threshold for one location can be different than a current temperature threshold for another location.
- the temperature threshold for the middle of the mobile system can be lower than the temperature threshold for the top case or bottom case.
- the top and bottom cases may have lower temperature thresholds so as not to injure the user.
- FIG. 5 illustrates an exemplary resistor-capacitor (RC) circuit model for active heat flow, according to one aspect of the disclosure.
- each solid arrow 502 , 504 indicates a point in an RC circuit 500 where the current temperature value is above a temperature threshold for that point.
- Each dotted arrow 506 , 508 , 510 indicates a point in the RC circuit 500 where the current temperature value is below a temperature threshold for that point.
- there is active heat flow 512 , 514 , 516 to actively remove heat from the points determine to be above their thresholds to points where the temperature is below their temperature thresholds.
- FIG. 6 illustrates various thermoelectric device shapes, according to one aspect of the disclosure.
- a mobile system 600 can have various thermoelectric array shapes.
- the mobile system 600 can have an “L” shaped thermoelectric array 602 , an oval thermoelectric array 604 , a rectangular thermoelectric array 606 , and a ring-shaped thermoelectric array 608 .
- Such different shapes can be used with various types of hardware in the mobile system.
- the ring-shaped thermoelectric array 608 can be used to surround a camera lens.
- thermoelectric module can be positioned to the outer portion of the device.
- a mobile system can comprise a thermoelectric module accessory and a mobile device.
- DSP digital signal processor
- ASIC application specific integrated circuit
- FPGA field programmable gate array
- a general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine.
- a processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
- a software module may reside in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
- An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium.
- the storage medium may be integral to the processor.
- the processor and the storage medium may reside in an ASIC.
- the ASIC may reside in an electronic object.
- the processor and the storage medium may reside as discrete components in a user terminal.
- the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium.
- Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another.
- a storage media may be any available media that can be accessed by a computer.
- such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer.
- any connection is properly termed a computer-readable medium.
- the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave
- the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium.
- Disk and disc includes CD, laser disc, optical disc, DVD, floppy disk and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
Abstract
Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
Description
- 1. Field of the Invention
- This disclosure is directed to heat flow control.
- 2. Description of the Related Art
- Most of cases, the max thermal power budget is limited by a hot spot. This can result in poor surface temperature uniformity, which in turn leads to a small thermal power budget and lowered system performance. Thermal Interface Material (TIM) and air gap can have different impacts on thermal performance at skin as well as junction. Various temperature limit levels can depend on the hardware nearby, the point of contact with the user, etc. For example, the temperature thresholds may be skin (45C), memory (85C), and CPU (105-120C). Hot spots can also change with use. For example, the processor and memory while a user is gaming, the camera module when a user is recording a video, the transmitter when a user is making a call, etc.
- The thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa. A thermoelectric device creates voltage when there is a different temperature on each side. Conversely, when a voltage is applied to it, it creates a temperature difference. At the atomic scale, an applied temperature gradient causes charge carriers in the material to diffuse from the hot side to the cold side.
- The Peltier effect can be used to create a refrigerator which is compact and has no circulating fluid or moving parts; such refrigerators are useful in applications where their advantages outweigh the disadvantage of their very low efficiency. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler.
- This disclosure is directed to active heat flow control in a mobile system.
- For example, an exemplary embodiment is directed to a method for controlling heat flow in a mobile system, the method comprising: determining a temperature value for each of at least one temperature sensors; determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations; mapping each delta value to a thermoelectric module; calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
- Another exemplary embodiment is directed to a heat flow control apparatus, the apparatus comprising: a memory, the memory comprising: a temperature data module for determining a temperature value for each of at least one temperature sensors, a comparing module for determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations, a mapping module for mapping each delta value to a thermoelectric module, and a heat flow direction module for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and a processor for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
- Still another exemplary embodiment is directed to a heat flow control apparatus, the apparatus comprising: a memory, the memory comprising: means for determining a temperature value for each of at least one temperature sensors, means for determining a delta value of the temperature value and a temperature threshold at each of the a plurality of locations, means for mapping each delta value to a thermoelectric module, means for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and means for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
- A more complete appreciation of aspects of the disclosure and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings which are presented solely for illustration and not limitation of the disclosure, and in which:
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FIG. 1 illustrates an exemplary mobile station with hardware that may be used in an operating environment that can control heat flow. -
FIG. 2 illustrates exemplary hardware that can control heat flow in a mobile system, according to one aspect of the disclosure. -
FIG. 3 illustrates an operational flow of a method to control heat flow in a mobile system, according to one aspect of the disclosure. -
FIG. 4A illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure. -
FIG. 4B illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure. -
FIG. 4C illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure. -
FIG. 4D illustrates a mobile system that includes logic configured to control heat flow, according to one aspect of the disclosure. -
FIG. 5 illustrates an exemplary resistor-capacitor (RC) circuit diagram for active heat flow, according to one aspect of the disclosure. -
FIG. 6 illustrates various thermoelectric array shapes, according to one aspect of the disclosure. - Various aspects are disclosed in the following description and related drawings. Alternate aspects may be devised without departing from the scope of the disclosure. Additionally, well-known elements of the disclosure will not be described in detail or will be omitted so as not to obscure the relevant details of the disclosure.
- The words “exemplary” and/or “example” are used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” and/or “example” is not necessarily to be construed as preferred or advantageous over other aspects. Likewise, the term “aspects of the disclosure” does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation.
- Further, many aspects are described in terms of sequences of actions to be performed by, for example, elements of a computing device. It will be recognized that various actions described herein can be performed by specific circuits (e.g., application specific integrated circuits (ASICs)), by program instructions being executed by one or more processors, or by a combination of both. Additionally, these sequence of actions described herein can be considered to be embodied entirely within any form of computer readable storage medium having stored therein a corresponding set of computer instructions that upon execution would cause an associated processor to perform the functionality described herein. Thus, the various aspects of the disclosure may be embodied in a number of different forms, all of which have been contemplated to be within the scope of the claimed subject matter. In addition, for each of the aspects described herein, the corresponding form of any such aspects may be described herein as, for example, “logic configured to” perform the described action.
-
FIG. 1 is a block diagram illustrating various components of an exemplarymobile station 100. For the sake of simplicity, the various features and functions illustrated in the box diagram ofFIG. 1 are connected together using a common bus which is meant to represent that these various features and functions are operatively coupled together. Those skilled in the art will recognize that other connections, mechanisms, features, functions, or the like, may be provided and adapted as necessary to operatively couple and configure an actual portable wireless device. Further, it is also recognized that one or more of the features or functions illustrated in the example ofFIG. 1 may be further subdivided or two or more of the features or functions illustrated inFIG. 1 may be combined. - The
mobile station 100 may include one or more wide area network (WAN) transceiver(s) 104 that may be connected to one ormore antennas 102. TheWAN transceiver 104 comprises suitable devices, hardware, and/or software for communicating with and/or detecting signals to/from WAN-WAPs, and/or directly with other wireless devices within a network. In one aspect, theWAN transceiver 104 may comprise a CDMA communication system suitable for communicating with a CDMA network of wireless base stations; however in other aspects, the wireless communication system may comprise another type of cellular telephony network, such as, for example, TDMA or GSM. Additionally, any other type of wide area wireless networking technologies may be used, for example, WiMAX (802.16), etc. Themobile station 100 may also include one or more local area network (LAN)transceivers 106 that may be connected to one ormore antennas 102. TheLAN transceiver 106 comprises suitable devices, hardware, and/or software for communicating with and/or detecting signals to/from LAN-WAPs, and/or directly with other wireless devices within a network. In one aspect, theLAN transceiver 106 may comprise a WLAN (802.11x) communication system suitable for communicating with one or more wireless access points; however in other aspects, theLAN transceiver 106 comprise another type of local area network, personal area network, (e.g., Bluetooth). Additionally, any other type of wireless networking technologies may be used, for example, Ultra Wide Band, ZigBee, wireless USB etc. - As used herein, the abbreviated term “wireless access point” (WAP) may be used to refer to LAN-WAPs and/or WAN-WAPs. Specifically, in the description presented below, when the term “WAP” is used, it should be understood that embodiments may include a
mobile station 100 that can exploit signals from a plurality of LAN-WAPs, a plurality of WAN-WAPs, or any combination of the two. The specific type of WAP being utilized by themobile station 100 may depend upon the environment of operation. Moreover, themobile station 100 may dynamically select between the various types of WAPs in order to arrive at an accurate position solution. In other embodiments, various network elements may operate in a peer-to-peer manner, whereby, for example, themobile station 100 may be replaced with the WAP, or vice versa. Other peer-to-peer embodiments may include another mobile station (not shown) acting in place of one or more WAP. AnSPS receiver 108 may also be included in themobile station 100. TheSPS receiver 108 may be connected to the one ormore antennas 102 for receiving satellite signals. - A heat
flow control memory 114 may be coupled to aprocessor 110 to control heat flow using thermoelectric layers. The heatflow control memory 114 can comprise atemperature data module 126, athreshold database 124, a comparingmodule 118, amapping module 128, and a heatflow direction module 116. In some embodiments, thetemperature data module 126 can receive data from at least on temperature sensor and determine the temperature from that data. The comparingmodule 118 can determine a delta value of the temperature and a temperature threshold, which can be provided from thethreshold database 124. Themapping module 128 can map the delta value to thermal module. The heatflow direction module 118 can then calculate a heat flow direction signal to minimize positive delta values. The heatflow control memory 114 can then transmit the heat flow direction signal to at least one thermoelectric module. The method In some embodiments, the heatflow control memory 114 can operate using real-time data. - The
processor 110 may include one or more microprocessors, microcontrollers, and/or digital signal processors that provide processing functions, as well as other calculation and control functionality. Theprocessor 110 may also include heatflow control memory 114 for storing data and software instructions for executing programmed functionality within themobile station 100. The heatflow control memory 114 may be on-board the processor 110 (e.g., within the same IC package), and/or thememory 114 may be external memory to theprocessor 110 and functionally coupled over a data bus. The functional details associated with aspects of the disclosure will be discussed in more detail below. - A number of software modules and data tables may reside in heat
flow control memory 114 and be utilized by theprocessor 110 in order to manage both communications and positioning determination functionality.Memory 114 may include and/or otherwise receive a heatflow direction module 116, a comparingmodule 118, and amapping module 128. One should appreciate that the organization of the memory contents as shown inFIG. 1 is merely exemplary, and as such the functionality of the modules and/or data structures may be combined, separated, and/or be structured in different ways depending upon the implementation of themobile station 100. - While the modules shown in
FIG. 1 are illustrated in the example as being contained in the heatflow control memory 114, it is recognized that in certain implementations such procedures may be provided for or otherwise operatively arranged using other or additional mechanisms. For example, all or part of the heatflow direction module 116 and/or the comparingmodule 118 may be provided in firmware. Additionally, while in this example the comparingmodule 118 and the heatflow direction module 116 are illustrated as being separate features, it is recognized, for example, that such procedures may be combined together as one procedure or perhaps with other procedures, or otherwise further divided into a plurality of sub-procedures. - The
processor 110 may include any form of logic suitable for performing at least the techniques provided herein. For example, theprocessor 110 may be operatively configurable based on instructions in the heatflow control memory 114 to selectively initiate one or more routines that exploit heat flow control data for use in other portions of the mobile device. - The
mobile station 100 may include auser interface 150 which provides any suitable interface systems, such as a microphone/speaker 152,keypad 154, and display 156 that allows user interaction with themobile station 100. The microphone/speaker 152 provides for voice communication services using theWAN transceiver 104 and/or theLAN transceiver 106. Thekeypad 154 comprises any suitable buttons for user input. Thedisplay 156 comprises any suitable display, such as, for example, a backlit LCD display, and may further include a touch screen display for additional user input modes. - As used herein, the
mobile station 100 may be any portable or movable device or machine that is configurable to acquire wireless signals transmitted from, and transmit wireless signals to, one or more wireless communication devices or networks. By way of example but not limitation, themobile station 100 may include a radio device, a cellular telephone device, a computing device, a personal communication system (PCS) device, or other like movable wireless communication equipped device, appliance, or machine. Also, “mobile station” is intended to include all devices, including wireless devices, computers, laptops, etc. which are capable of communication with a server, such as via the Internet, WLAN, or other network, and regardless of whether satellite signal reception, assistance data reception, and/or position-related processing occurs at the device, at a server, or at another device associated with the network. Any operable combination of the above is also considered a “mobile station.” - As used herein, the term “wireless device” may refer to any type of wireless communication device which may transfer information over a network and also have position determination and/or navigation functionality. The wireless device may be any cellular mobile terminal, personal communication system (PCS) device, personal navigation device, laptop, personal digital assistant, or any other suitable mobile device capable of receiving and processing network and/or SPS signals.
- As illustrated in
FIG. 2 , an embodiment can include a heat flow control apparatus for controlling heat flow in amobile system 200. The heat flow control apparatus can include thermoelectric devices such asthermoelectric arrays thermoelectric modules heat spreaders mobile system 200 can include apower source 214. Themobile system 200 can also include atop case 216 and abottom case 218. - In some embodiments, the
thermoelectric arrays thermoelectric modules - As illustrated in
FIG. 3 , an embodiment can include a method for controlling heat flow in a mobile system, comprising: determining a temperature value for each of at least one temperature sensors—Block 302; determining a delta value of the temperature value and a temperature threshold at each of the plurality of locations—Block 304; mapping each delta value to a thermoelectric module (e.g., a thermoelectric cooler)—Block 306; calculating a heat flow direction signal to minimize positive delta values (e.g., wherein the method uses a system level model or an IC level thermal model)—Block 308; and transmitting the heat flow direction signal (e.g., a pulse-width modulation signal to control intensity and direction of the state of at least one of four states) to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor—Block 310. - As illustrated in
FIG. 4A , amobile device 400 comprises aPCB 402, abattery 404, aheat spreader 406, a topthermoelectric array 408 with multiplethermoelectric modules 408A-G, a bottomthermoelectric array 410 with multiplethermoelectric modules 410A-G, atop case 412 and abottom case 414. -
FIG. 4A shows an example of a situation where the temperature of thetop case 412 is greater than a temperature threshold while thebottom case 414 is below the temperature threshold at a given time. Thethermoelectric modules 408A-D of the topthermoelectric array 408 will receive a signal to execute a first state to turn on to direct heat flow to thebottom case 414. Thethermoelectric modules 410A-D of the bottomthermoelectric array 410 will receive a signal to execute a second state to turn off to minimize upward heat flow. - As illustrated in
FIG. 4B , amobile device 420 comprises aPCB 422, abattery 424, aheat spreader 426, a topthermoelectric array 428 with multiplethermoelectric modules 428A-G, a bottomthermoelectric array 430 with multiplethermoelectric modules 430A-G, a top case 432 and abottom case 434. -
FIG. 4B shows an example of a situation where the temperature of thebottom case 434 is greater than a temperature threshold. Thethermoelectric modules 430A-D of the bottomthermoelectric array 410 will receive a signal to turn on to direct heat flow to the top case 432. Thethermoelectric modules 428A-D of the topthermoelectric array 428 will receive a signal to turn off to minimize downward heat flow. - As illustrated in
FIG. 4C , amobile device 440 comprises aPCB 442, abattery 444, atop heat spreader 446, a top thermoelectric array 448 with multiple thermoelectric modules 448A-G, a bottom thermoelectric array 450 with multiple thermoelectric modules 450A-G, amiddle heat spreader 452, a middlethermoelectric array 454 with multiplethermoelectric modules 454A-G, atop case 456 and abottom case 458. -
FIG. 4C shows an example of a situation where the temperature of the middle of themobile device 440 is greater than a temperature threshold. The thermoelectric modules 448A-E of the top thermoelectric array 448 and thethermoelectric modules 454A-D of the middlethermoelectric array 454 will receive a signal to turn off to minimize downward heat flow. The thermoelectric modules 450A-D of the bottom thermoelectric array 450 will receive a signal to turn off to minimize upward heat flow - As illustrated in
FIG. 4D , amobile device 460 comprises aPCB 462, abattery 464, atop heat spreader 466, a top thermoelectric array 468 with multiple thermoelectric modules 468A-G, a bottom thermoelectric array 470 with multiple thermoelectric modules 470A-G, amiddle heat spreader 472, a middlethermoelectric array 474 with multiplethermoelectric modules 474A-G, atop case 476 and abottom case 478. -
FIG. 4D shows an example of a situation where the temperature of thetop case 476 and thebottom case 478 are greater than corresponding temperature thresholds. Thethermoelectric modules 468B-D of the top thermoelectric array 468 and the thermoelectric module 474B of the middlethermoelectric array 474 will receive a signal to turn off and thermoelectric modules 468A and E-G of the top thermoelectric array 468 and thethermoelectric modules 474A and C-G of the middlethermoelectric array 474 will receive a signal to turn on to maximize heat flow away from the top outside heat source. Thethermoelectric modules 470B-C of the bottom thermoelectric array 470 will receive a signal to turn off and thermoelectric modules 470A and D-G of the bottom thermoelectric array 470 will receive a signal to turn on to maximize heat flow away from the bottom outside heat source. - In some embodiments, a current temperature threshold for one location can be different than a current temperature threshold for another location. For example, the temperature threshold for the middle of the mobile system can be lower than the temperature threshold for the top case or bottom case. Conversely, the top and bottom cases may have lower temperature thresholds so as not to injure the user.
-
FIG. 5 illustrates an exemplary resistor-capacitor (RC) circuit model for active heat flow, according to one aspect of the disclosure. As shown, eachsolid arrow RC circuit 500 where the current temperature value is above a temperature threshold for that point. Each dottedarrow RC circuit 500 where the current temperature value is below a temperature threshold for that point. As shown between thesolid arrows active heat flow -
FIG. 6 illustrates various thermoelectric device shapes, according to one aspect of the disclosure. As shown, amobile system 600 can have various thermoelectric array shapes. For example, themobile system 600 can have an “L” shapedthermoelectric array 602, an ovalthermoelectric array 604, a rectangularthermoelectric array 606, and a ring-shaped thermoelectric array 608. Such different shapes can be used with various types of hardware in the mobile system. For example, the ring-shaped thermoelectric array 608 can be used to surround a camera lens. - In some embodiments, at least one thermoelectric module can be positioned to the outer portion of the device. For example, a mobile system can comprise a thermoelectric module accessory and a mobile device.
- Those of skill in the art will appreciate that information and signals may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout the above description may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.
- Further, those of skill in the art will appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the aspects disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
- The various illustrative logical blocks, modules, and circuits described in connection with the aspects disclosed herein may be implemented or performed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
- The methods, sequences and/or algorithms described in connection with the aspects disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in RAM, flash memory, ROM, EPROM, EEPROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium may be integral to the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in an electronic object. In the alternative, the processor and the storage medium may reside as discrete components in a user terminal.
- In one or more exemplary aspects, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media may be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, includes CD, laser disc, optical disc, DVD, floppy disk and Blu-ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
- While the foregoing disclosure shows illustrative aspects of the disclosure, it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the aspects of the disclosure described herein need not be performed in any particular order. Furthermore, although elements of the disclosure may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
Claims (20)
1. A method for controlling heat flow in a mobile system, the method comprising:
determining a temperature value for each of at least one temperature sensors;
determining a delta value of the temperature value and a temperature threshold at each of a plurality of locations;
mapping each delta value to a thermoelectric module;
calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and
transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
2. The method of claim 1 , wherein the heat flow direction signal transmits one of four states: off, light cooling, strong cooling, and reverse cooling.
3. The method of claim 2 , wherein the heat flow direction signal is a pulse-width modulation signal to control intensity and direction of the state of at least one of the four states.
4. The method of claim 2 , wherein the heat flow direction signal transmits a first state of the four states to a first of the at least one thermoelectric module and a second state of the four states to a second of the at least one thermoelectric module.
5. The method of claim 1 , wherein, at a given time, one of the temperature thresholds for each of the plurality of locations differs from another temperature threshold.
6. The method of claim 1 , wherein the method for controlling heat flow is performed using real-time data.
7. The method of claim 1 , wherein the at least one thermoelectric module is positioned to an outer portion of a thermoelectric device.
8. The method of claim 1 , wherein the at least one thermoelectric module is a thermoelectric cooler.
9. The method of claim 1 , wherein a first thermoelectric device, which comprises the at least one thermoelectric module, has at least one of a different location and a pattern than a second thermoelectric device.
10. The method of claim 1 , wherein a shape of a thermoelectric device, which comprises the at least one thermoelectric module, can be non-rectangular.
11. A heat flow control apparatus, the apparatus comprising:
a memory, the memory comprising:
a temperature data module for determining a temperature value for each of at least one temperature sensors,
a comparing module for determining a delta value of the temperature value and a temperature threshold at each of a plurality of locations,
a mapping module for mapping each delta value to a thermoelectric module, and
a heat flow direction module for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and
a processor for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
12. The apparatus of claim 11 , wherein the heat flow direction signal transmits one of four states: off, light cooling, strong cooling, and reverse cooling.
13. The apparatus of claim 12 , wherein the heat flow direction signal is a pulse-width modulation signal to control intensity and direction of the state of at least one of the four states.
14. The apparatus of claim 12 , wherein the heat flow direction signal transmits a first state of the four states to a first of the at least one thermoelectric module and a second state of the four states to a second of the at least one thermoelectric module.
15. The apparatus of claim 11 , wherein, at a given time, one of the temperature thresholds for each of the plurality of locations differs from another temperature threshold.
16. The apparatus of claim 11 , wherein the apparatus performs using real-time data.
17. The apparatus of claim 11 , wherein the at least one thermoelectric module is positioned to an outer portion of a thermoelectric device.
18. The apparatus of claim 11 , wherein the at least one thermoelectric module is a thermoelectric cooler.
19. The apparatus of claim 11 , wherein a first thermoelectric device, which is comprised of the at least one thermoelectric module, has at least one of a different location and a pattern than a second thermoelectric device.
20. A heat flow control apparatus, the apparatus comprising:
means for determining a temperature value for each of at least one temperature sensors,
means for determining a delta value of the temperature value and a temperature threshold at each of a plurality of locations,
means for mapping each delta value to a thermoelectric module,
means for calculating a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model; and
means for transmitting the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.
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US14/189,823 US20150241092A1 (en) | 2014-02-25 | 2014-02-25 | Active heat flow control with thermoelectric layers |
CN201580009844.5A CN106030449B (en) | 2014-02-25 | 2015-02-13 | Active hot-fluid control with thermoelectric layer |
KR1020167026024A KR20160124869A (en) | 2014-02-25 | 2015-02-13 | Active heat flow control with thermoelectric layers |
JP2016552923A JP2017517777A (en) | 2014-02-25 | 2015-02-13 | Active heat flow control using thermoelectric layers |
EP15713037.8A EP3111295A1 (en) | 2014-02-25 | 2015-02-13 | Active heat flow control with thermoelectric layers |
PCT/US2015/015874 WO2015130493A1 (en) | 2014-02-25 | 2015-02-13 | Active heat flow control with thermoelectric layers |
Applications Claiming Priority (1)
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US14/189,823 US20150241092A1 (en) | 2014-02-25 | 2014-02-25 | Active heat flow control with thermoelectric layers |
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US20160183414A1 (en) * | 2014-10-08 | 2016-06-23 | AzTrong Inc. | Ultrathin heat remover for portable electronic device |
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CN113237785B (en) * | 2021-07-12 | 2021-10-22 | 中国飞机强度研究所 | Heat flow control test method |
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Also Published As
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CN106030449A (en) | 2016-10-12 |
CN106030449B (en) | 2019-03-26 |
KR20160124869A (en) | 2016-10-28 |
JP2017517777A (en) | 2017-06-29 |
WO2015130493A1 (en) | 2015-09-03 |
EP3111295A1 (en) | 2017-01-04 |
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