US20160178182A1 - Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink - Google Patents

Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink Download PDF

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Publication number
US20160178182A1
US20160178182A1 US14/971,971 US201514971971A US2016178182A1 US 20160178182 A1 US20160178182 A1 US 20160178182A1 US 201514971971 A US201514971971 A US 201514971971A US 2016178182 A1 US2016178182 A1 US 2016178182A1
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US
United States
Prior art keywords
electrically conductive
conductive member
led package
led
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/971,971
Inventor
Anthony Maglica
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Mag Instrument Inc
Original Assignee
Mag Instrument Inc
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Filing date
Publication date
Application filed by Mag Instrument Inc filed Critical Mag Instrument Inc
Priority to US14/971,971 priority Critical patent/US20160178182A1/en
Assigned to MAG INSTRUMENT, INC. reassignment MAG INSTRUMENT, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAGLICA, ANTHONY
Priority to US15/015,009 priority patent/US9494285B2/en
Priority to US15/148,505 priority patent/US9453625B2/en
Priority to US15/182,396 priority patent/US9494308B1/en
Publication of US20160178182A1 publication Critical patent/US20160178182A1/en
Priority to US15/285,426 priority patent/US9671102B2/en
Priority to US15/585,321 priority patent/US10012376B2/en
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/005Electric lighting devices with self-contained electric batteries or cells the device being a pocket lamp
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022Pocket lamps
    • F21L4/027Pocket lamps the light sources being a LED
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/08Electric lighting devices with self-contained electric batteries or cells characterised by means for in situ recharging of the batteries or cells
    • F21L4/085Pocket lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/04Resilient mountings, e.g. shock absorbers 
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0414Arrangement of electric circuit elements in or on lighting devices the elements being switches specially adapted to be used with portable lighting devices
    • F21V23/0428Arrangement of electric circuit elements in or on lighting devices the elements being switches specially adapted to be used with portable lighting devices the switch being part of, or disposed on the lamp head portion thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/61Types of temperature control
    • H01M10/613Cooling or keeping cold
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/62Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/623Portable devices, e.g. mobile telephones, cameras or pacemakers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/64Heating or cooling; Temperature control characterised by the shape of the cells
    • H01M10/643Cylindrical cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/65Means for temperature control structurally associated with the cells
    • H01M10/655Solid structures for heat exchange or heat conduction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/213Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F21Y2101/02
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/04Construction or manufacture in general
    • H01M10/0481Compression means other than compression means for stacks of electrodes and separators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00Batteries for particular applications
    • H01M2220/30Batteries in portable systems, e.g. mobile phone, laptop
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/502Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/509Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the type of connection, e.g. mixed connections
    • H01M50/51Connection only in series
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/502Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/514Methods for interconnecting adjacent batteries or cells
    • H01M50/516Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • LEDs are mounted on laminated printed circuit boards. Some are mounted on special metal back or ceramic printed circuit boards in an attempt to conduct heat away from the LED.
  • the invention is generally directed to a lighting apparatus in which at least one LED is mounted to the top surface of a heat sink held within an outer casing that is thermally and electrically conductive, the LED having a first conductive member which is thermally and electrically directly connected to the heatsink without the use of a printed circuit board and a second electrically conductive member which is electrically isolated from the heatsink by an electrical insulating material held within the heatsink.
  • the second electrically conductive member of the LED can be soldered to a terminal held within the electrical insulating material while the first electrically conductive member of the LED can also be soldered to the heat sink and the resulting heat sink assembly can be press fit into a tube or barrel (such as an aluminum flashlight barrel) or inserted into the tube or barrel and then removably retained by a mechanical means such as a nut threaded to the tube or barrel.
  • the heatsink can be integrally formed with the tube or barrel.
  • FIGS. 1A-D show a heatsink and insulating core installed in a metal tube or flashlight barrel having the following identified elements:
  • FIG. 1B is a cross sectional view which is shown exploded in FIG. 1D while FIGS. 1A and 1C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 1B .
  • FIGS. 2A-D show a variation on FIGS. 1A-D in which the heatsink and insulating core are installed in a metal tube or flashlight barrel having the following identified elements:
  • FIG. 2B is a cross sectional view which is shown exploded in FIG. 2D while FIGS. 2A and 2C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 2B .
  • FIGS. 3A-D show a one-piece heatsink similar to that shown in FIGS. 2A-D having the following identified elements:
  • FIG. 3B is a cross sectional view which is shown exploded in FIG. 3D while FIGS. 3A and 3C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 3B .
  • FIGS. 4A-D show a variation on the heatsink and insulating core in FIGS. 1A-D .
  • there is a printed circuit board between the LED and the other end of the assembly having the following identified elements:
  • FIG. 4B is a cross sectional view which is shown exploded in FIG. 4D while FIGS. 4A and 4C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 4B .
  • FIGS. 5A-D show a variation of the assembly shown in FIGS. 4A-D having the following identified elements:
  • FIG. 5B is a cross sectional view which is shown exploded in FIG. 5D while FIGS. 5A and 5C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 5B .
  • FIGS. 6A-D show a heatsink similar to that in FIGS. 3A-D but containing a printed circuit board having the following identified elements:
  • FIG. 6B is a cross sectional view which is shown exploded in FIG. 6D while FIGS. 6A and 6C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 6B .
  • FIGS. 7A-D show a circular array of LEDs mounted on a common heatsink. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 7A-D have the following identified elements:
  • FIG. 7B is a cross sectional view which is shown exploded in FIG. 7D while FIGS. 7A and 7C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 7B .
  • FIGS. 8A-D show a circular array of LEDs mounted to a common heatsink with printed circuit boards in the insulating member. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 8A-D have the following identified elements:
  • FIG. 8B is a cross sectional view which is shown exploded in FIG. 8D while FIGS. 8A and 8C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 8B .
  • FIGS. 9A-C show a linear array of LEDs on a common heatsink. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 9A-C have the following identified elements:
  • FIG. 9B is a cross sectional view of a single LED and FIGS. 9A and 9C are, respectively, top and bottom views of a linear array of four LEDs.
  • FIGS. 10A-C show a linear array of LEDs similar to those on FIGS. 9A and 9C but containing printed circuit boards. Four LEDs are shown here but there could be any number of LEDs.
  • FIGS. 10A-C have the following identified elements:
  • FIG. 10B is a cross sectional view of a single LED and FIGS. 10A and 10C are, respectively, top and bottom views of a linear array of four LEDs.
  • FIG. 11 is a cross sectional magnified view from FIG. 1B which shows the top of heatsink 5 without the LED in place having the following identified elements:
  • FIGS. 12A-E show a typical prior art LED assembly showing the LED soldered to a PC board and the multiple thermal junctions required to conduct heat to ambient air having the following identified elements:
  • FIG. 12B is a cross sectional view which is shown exploded in FIG. 12E while FIGS. 12A and 12C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 12B and FIG. 12D is an enlarged cutaway view of FIG. 12B .
  • FIGS. 13A-D show a widely used prior art star type, metal and ceramic backed PC board to which the LED is mounted and the multiple thermal junctions required to conduct heat to ambient air having the following identified elements:
  • FIG. 13B is a cross sectional view which is shown exploded in FIG. 13D while FIGS. 13A and 13C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 13B .
  • FIG. 14 is a block diagram of a typical heatsink mounted LED with positive polarity heatsink.
  • FIG. 15 is a block diagram of a typical heatsink mounted LED with negative polarity heatsink.
  • FIG. 16 is a block diagram of a typical heatsink mounted LED with a positive polarity heatsink that incorporates a PC board with LED drive electronics.
  • FIG. 17 is a block diagram of a typical heatsink mounted LED with a negative polarity heatsink that incorporates a PC board with LED drive electronics.
  • FIG. 18 is a comparison of the performance of four different heatsinking methods or systems.
  • FIG. 2 curve is for the present invention and demonstrates superior performance with minimal drop off in lumens output over time.
  • FIGS. 19A-B illustrate a process for manufacturing a heat sink assembly in accordance with the present invention in which solder S 1 and S 2 is used to solder pads of an LED 5 to a top surface of a heat sink 2 to form a heat sink assembly 200 .
  • FIGS. 19 C-D illustrate a press fit step of inserting heat sink assembly 200 into a tube or barrel 1 .
  • FIGS. 20A and 20B show variations on FIGS. 19C-D in which the heatsink and insulating core are installed in a metal tube or flashlight barrel having the following identified elements:
  • the present invention utilizes a thermally and electrically conductive metal outer member, a heatsink.
  • the interior of the heatsink, or core is an electrical insulating material that positions and electrically isolates a second electrically conductive member that extends out the end opposite from the LED to provide an electrical connection point.
  • the top surface of this assembly provides a mounting surface for the LED.
  • the anode or cathode side of the LED, and in some cases a dedicated thermal pad, is bonded to the top surface of the heatsink by soldering or some other thermally and electrically conductive method or material.
  • the electrically opposite side of the LED package is bonded to the isolated second member. Power from an appropriate electrical circuit is applied to the heatsink and the isolated terminal to turn on the LED.
  • FIGS. 1A through 11 depict variations on the design described above.
  • the heatsink can be different shapes depending on the application.
  • a heatsink can also support multiple LEDs in a variety of configurations; a circular array and a linear array are only two of many possibilities.
  • Electronics with a suitable interconnect method can also be suspended in the insulating core. It is also possible in all cases to provide electrically insulating material that positions and electrically isolates two electrically conductive members that extend out the end opposite from the LED to provide electrical connection points. In these cases the cathode and anode LED pads are bonded to corresponding isolated pads and the LED thermal pad is bonded to the invention's heatsink surface.
  • the improved heatsink method depicted in FIGS. 1A through 11 does not utilize a PC board for mounting the LED; instead, the LED is mounted directly to the metal surface of the heatsink. This method produces much improved heat transfer and a cooler operating, higher lumens LED, compared to PC board mounted LED designs.
  • the present invention provides a direct efficient path to conduct heat away from an LED to ambient air outside of a flashlight or any other lighting device such as a headlamp, lantern or spotlight, as well as all types of area lighting that utilize high powered LEDs as a light source.
  • Other heatsinking methods produce thermal paths that are interrupted by a large number of thermal junctions, some of which have poor thermal conductivity or high thermal resistance. Examples of prior art heatsinking methods are illustrated in FIGS. 12A through 13D .
  • Unique to the present invention is the ability to solder the terminal and heatsink directly to the electrical and thermal pads of the LED. No thermal grease or adhesives are required.
  • the equivalent heatsinking and electrical contact pads are on a PC board which results in more, less efficient, thermal junctions and longer, smaller cross section, thermal paths to ambient air.
  • the use of thermal grease and adhesives in these less efficient designs helps heat transfer to some degree but not to the level of attaching the LED directly to the heatsink.
  • the result of the much improved heat transfer possible with the invention is that the LED operates much cooler and therefore much more efficiently.
  • Higher lumens are possible with no increase in power over conventional systems. It is also possible to maintain lumens at the same level as other less efficient systems but consume far less power. This is especially important in battery powered lighting systems as on-time is extended without reducing lumens.
  • the superior performance of the present invention is demonstrated by the lumens output 60 seconds after applying a constant 4 amps of current to the LED. The invention was better than other systems as follows:
  • FIGS. 2A-D produced 19 percent more lumens than the system in FIGS. 13A-D (typical star, metal backed PC board mounted LED);
  • FIGS. 2A-D produced 93 percent more lumens than the system in FIGS. 12A-D (multi-layer conventional PC board with extra copper traces and vias to attempt to conduct heat away from the LED).
  • the efficiency of the present invention can be increased or optimized, with the aid of the present disclosure, by increasing or maximizing the surface area exposure between the heatsink and the thermally and electrically conductive outer casing while also designing the heatsink to have a sufficient mass to effectively and efficiently conduct heat between the heatsink and the outer casing.
  • heatsink 2 in FIGS. 2A-D will have better results than heatsink 2 of FIGS. 1A-D
  • FIGS. 3A-D illustrate an embodiment in which the heatsink is integrally formed with the outer casing, which should result in better results than the heatsink of FIGS. 2A-D .
  • outer casing which is illustrated in the exemplary embodiments depicted in FIGS. 1-11 as a tube or barrel, need not be thermally and electrically conductive over its entire outer surface, although an outer casing which is thermally and electrically conductive over its entire outer surface may achieve better results.
  • the advantages obtained by the more efficient cooling of one or more LEDs obtained by the present invention can be used to create a flashlight mode use of increased lumens, or a flashlight mode with increased on-time, or one or more modes that alternate between such modes or combine elements of both such modes.
  • a heat sink assembly 200 is created by soldering two electrically conductive members of an LED 5 to a top surface of heatsink 2 .
  • Commercially available LEDs typically have three pads (see, e.g., FIG. 11D where second electrical connection 7 has one rectangular pad while thermal junction and first electrical connection between LED 5 and heatsink 2 have two rectangular pads) which can all be used for soldering (solder S 1 in FIG. 19A is for one pad whereas solder S 2 in FIG. 19A is for two pads).
  • heat sink assembly 200 After heat sink assembly 200 is created, it can be press fit into a tube or barrel 1 as illustrated in FIGS. 19C and 19D or it can be removably inserted into tube or barrel 1 and then held in place by a removable holding mechanism, an example of which is nut 1 B illustrated in FIGS. 20A and 20B .
  • tube or barrel 1 and heat sink 2 are made of aluminum
  • heat sink 2 is coated with a metallic plating (e.g., nickel) that helps promote the soldering process
  • a skin cut is made of the aluminum where heat sink 2 comes into contact with a top surface 1 AT of shoulder 1 A formed in tube or barrel 1 (so as to promote more efficient thermal heat transfer).

Abstract

LED efficiency in a lighting device, such as an aluminum flashlight, is increased by directly mounting the LED without use of a PCB to a heatsink that is in thermal and electrical contact with an outer casing to dissipate heat, resulting in an LED that operates much cool and therefore much more efficiently.

Description

    CROSS REFERENCE TO RELATED APPLICATIONS
  • This application is a non-provisional application which claims priority from U.S. Ser. No. 62/095,733, filed Dec. 22, 2014, with the same title, the disclosure of which is specifically incorporated by reference herein in its entirety.
  • BACKGROUND
  • LED efficiency and light output drops as the device heats up during operation. Typically, LEDs are mounted on laminated printed circuit boards. Some are mounted on special metal back or ceramic printed circuit boards in an attempt to conduct heat away from the LED.
  • SUMMARY OF THE INVENTION
  • The invention is generally directed to a lighting apparatus in which at least one LED is mounted to the top surface of a heat sink held within an outer casing that is thermally and electrically conductive, the LED having a first conductive member which is thermally and electrically directly connected to the heatsink without the use of a printed circuit board and a second electrically conductive member which is electrically isolated from the heatsink by an electrical insulating material held within the heatsink.
  • The second electrically conductive member of the LED can be soldered to a terminal held within the electrical insulating material while the first electrically conductive member of the LED can also be soldered to the heat sink and the resulting heat sink assembly can be press fit into a tube or barrel (such as an aluminum flashlight barrel) or inserted into the tube or barrel and then removably retained by a mechanical means such as a nut threaded to the tube or barrel. Alternatively, the heatsink can be integrally formed with the tube or barrel.
  • Accordingly, it is a primary object of the present invention to provide a lighting apparatus having improved efficiency by directly mounting an LED to a heatsink.
  • This and further objects and advantages will be apparent to those skilled in the art in connection with the drawings and the detailed description of the invention set forth below.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The drawings will hereinafter be described by a brief reference to the drawings and then a description of the numerical elements identified in the drawing.
  • FIGS. 1A-D show a heatsink and insulating core installed in a metal tube or flashlight barrel having the following identified elements:
      • 1. Tube or barrel
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
  • FIG. 1B is a cross sectional view which is shown exploded in FIG. 1D while FIGS. 1A and 1C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 1B.
  • FIGS. 2A-D show a variation on FIGS. 1A-D in which the heatsink and insulating core are installed in a metal tube or flashlight barrel having the following identified elements:
      • 1. Tube or barrel
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
  • FIG. 2B is a cross sectional view which is shown exploded in FIG. 2D while FIGS. 2A and 2C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 2B.
  • FIGS. 3A-D show a one-piece heatsink similar to that shown in FIGS. 2A-D having the following identified elements:
      • 1. Integral tube or barrel and heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
  • FIG. 3B is a cross sectional view which is shown exploded in FIG. 3D while FIGS. 3A and 3C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 3B.
  • FIGS. 4A-D show a variation on the heatsink and insulating core in FIGS. 1A-D. In this example, there is a printed circuit board between the LED and the other end of the assembly having the following identified elements:
      • 1. Tube or barrel
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
      • 8. Printed circuit board
      • 9. Insulator
      • 10. Contact
  • FIG. 4B is a cross sectional view which is shown exploded in FIG. 4D while FIGS. 4A and 4C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 4B.
  • FIGS. 5A-D show a variation of the assembly shown in FIGS. 4A-D having the following identified elements:
      • 1. Tube or barrel
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
      • 8. Printed circuit board
      • 9. Insulator
      • 10. Contact
  • FIG. 5B is a cross sectional view which is shown exploded in FIG. 5D while FIGS. 5A and 5C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 5B.
  • FIGS. 6A-D show a heatsink similar to that in FIGS. 3A-D but containing a printed circuit board having the following identified elements:
      • 1. Integral tube or barrel and heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
      • 8. Printed circuit board
      • 9. Insulator
      • 10. Contact
  • FIG. 6B is a cross sectional view which is shown exploded in FIG. 6D while FIGS. 6A and 6C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 6B.
  • FIGS. 7A-D show a circular array of LEDs mounted on a common heatsink. Four LEDs are shown here but there could be any number of LEDs. FIGS. 7A-D have the following identified elements:
      • 1. Tube or barrel
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
  • FIG. 7B is a cross sectional view which is shown exploded in FIG. 7D while FIGS. 7A and 7C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 7B.
  • FIGS. 8A-D show a circular array of LEDs mounted to a common heatsink with printed circuit boards in the insulating member. Four LEDs are shown here but there could be any number of LEDs. FIGS. 8A-D have the following identified elements:
      • 1. Tube or barrel
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
      • 8. Printed circuit board
      • 9. Insulator
      • 10. Contact
  • FIG. 8B is a cross sectional view which is shown exploded in FIG. 8D while FIGS. 8A and 8C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 8B.
  • FIGS. 9A-C show a linear array of LEDs on a common heatsink. Four LEDs are shown here but there could be any number of LEDs. FIGS. 9A-C have the following identified elements:
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
  • FIG. 9B is a cross sectional view of a single LED and FIGS. 9A and 9C are, respectively, top and bottom views of a linear array of four LEDs.
  • FIGS. 10A-C show a linear array of LEDs similar to those on FIGS. 9A and 9C but containing printed circuit boards. Four LEDs are shown here but there could be any number of LEDs. FIGS. 10A-C have the following identified elements:
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
      • 8. Printed circuit board
      • 9. Insulator
      • 10. Contact
  • FIG. 10B is a cross sectional view of a single LED and FIGS. 10A and 10C are, respectively, top and bottom views of a linear array of four LEDs.
  • FIG. 11 is a cross sectional magnified view from FIG. 1B which shows the top of heatsink 5 without the LED in place having the following identified elements:
      • 6. Thermal junction and first electrical connection between LED and heatsink
      • 7. Second electrical connection
  • FIGS. 12A-E show a typical prior art LED assembly showing the LED soldered to a PC board and the multiple thermal junctions required to conduct heat to ambient air having the following identified elements:
      • 101. Tube or barrel
      • 102. Heatsink
      • 103. Insulator
      • 104. Contact for applying power to printed circuit board
      • 105. LED
      • 106. Housing
      • 107. Insulator
      • 108. Contact for connecting printed circuit board 111 to PCB 109
      • 109. Multilayered printed circuit board
      • 110. Ring Contact
      • 111. Printed circuit board
  • FIG. 12B is a cross sectional view which is shown exploded in FIG. 12E while FIGS. 12A and 12C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 12B and FIG. 12D is an enlarged cutaway view of FIG. 12B.
  • FIGS. 13A-D show a widely used prior art star type, metal and ceramic backed PC board to which the LED is mounted and the multiple thermal junctions required to conduct heat to ambient air having the following identified elements:
      • 101. Tube or barrel
      • 102. Heatsink
      • 105. LED
      • 106. First power connection
      • 107. Second power connection
      • 108. Star PC board
  • FIG. 13B is a cross sectional view which is shown exploded in FIG. 13D while FIGS. 13A and 13C are, respectively, top and bottom views looking into the apparatus shown in cross section in FIG. 13B.
  • FIG. 14 is a block diagram of a typical heatsink mounted LED with positive polarity heatsink.
  • FIG. 15 is a block diagram of a typical heatsink mounted LED with negative polarity heatsink.
  • FIG. 16 is a block diagram of a typical heatsink mounted LED with a positive polarity heatsink that incorporates a PC board with LED drive electronics.
  • FIG. 17 is a block diagram of a typical heatsink mounted LED with a negative polarity heatsink that incorporates a PC board with LED drive electronics.
  • FIG. 18 is a comparison of the performance of four different heatsinking methods or systems. FIG. 2 curve is for the present invention and demonstrates superior performance with minimal drop off in lumens output over time.
      • 1. Curve labeled FIG. 1 is a graphical representation of the lumens output over time showing the drop off in performance as the LED heats and efficiency drops for the system of FIGS. 1A-D.
      • 2. Curve labeled FIG. 2 is a graphical representation of the lumens output over time showing very minimal drop off in performance as the LED heats and efficiency drops for the system of FIGS. 2A-D.
      • 3. Curve labeled FIG. 13 is a graphical representation of the lumens output over time showing the drop off in performance as the LED heats and efficiency drops for the system of FIGS. 13A-D.
      • 4. Curve labeled FIG. 12 is a graphical representation of the lumens output over time showing the drop off in performance as the LED heats and efficiency drops for the system of FIGS. 12A-E.
  • FIGS. 19A-B illustrate a process for manufacturing a heat sink assembly in accordance with the present invention in which solder S1 and S2 is used to solder pads of an LED 5 to a top surface of a heat sink 2 to form a heat sink assembly 200. FIGS. 19C-D illustrate a press fit step of inserting heat sink assembly 200 into a tube or barrel 1.
  • FIGS. 20A and 20B show variations on FIGS. 19C-D in which the heatsink and insulating core are installed in a metal tube or flashlight barrel having the following identified elements:
      • 1. Tube or barrel
      • 1A. Shoulder of tube or barrel 1
      • 1AT. Top surface of shoulder 1A
      • 18. Nut
      • 2. Heatsink
      • 3. Insulator
      • 4. Terminal to connect power to LED
      • 5. LED
    DETAILED DESCRIPTION OF INVENTION
  • The present invention utilizes a thermally and electrically conductive metal outer member, a heatsink. The interior of the heatsink, or core, is an electrical insulating material that positions and electrically isolates a second electrically conductive member that extends out the end opposite from the LED to provide an electrical connection point. The top surface of this assembly provides a mounting surface for the LED. The anode or cathode side of the LED, and in some cases a dedicated thermal pad, is bonded to the top surface of the heatsink by soldering or some other thermally and electrically conductive method or material. The electrically opposite side of the LED package is bonded to the isolated second member. Power from an appropriate electrical circuit is applied to the heatsink and the isolated terminal to turn on the LED. Heat generated by the LED is conducted through the interface with the heatsink to ambient air. The LED runs much cooler and efficiently in this system than is possible with those mounted on printed circuit boards. FIGS. 1A through 11 depict variations on the design described above. As shown, the heatsink can be different shapes depending on the application. A heatsink can also support multiple LEDs in a variety of configurations; a circular array and a linear array are only two of many possibilities. Electronics with a suitable interconnect method can also be suspended in the insulating core. It is also possible in all cases to provide electrically insulating material that positions and electrically isolates two electrically conductive members that extend out the end opposite from the LED to provide electrical connection points. In these cases the cathode and anode LED pads are bonded to corresponding isolated pads and the LED thermal pad is bonded to the invention's heatsink surface.
  • The improved heatsink method depicted in FIGS. 1A through 11 does not utilize a PC board for mounting the LED; instead, the LED is mounted directly to the metal surface of the heatsink. This method produces much improved heat transfer and a cooler operating, higher lumens LED, compared to PC board mounted LED designs.
  • The present invention provides a direct efficient path to conduct heat away from an LED to ambient air outside of a flashlight or any other lighting device such as a headlamp, lantern or spotlight, as well as all types of area lighting that utilize high powered LEDs as a light source. Other heatsinking methods produce thermal paths that are interrupted by a large number of thermal junctions, some of which have poor thermal conductivity or high thermal resistance. Examples of prior art heatsinking methods are illustrated in FIGS. 12A through 13D. Unique to the present invention is the ability to solder the terminal and heatsink directly to the electrical and thermal pads of the LED. No thermal grease or adhesives are required. In other designs the equivalent heatsinking and electrical contact pads are on a PC board which results in more, less efficient, thermal junctions and longer, smaller cross section, thermal paths to ambient air. The use of thermal grease and adhesives in these less efficient designs helps heat transfer to some degree but not to the level of attaching the LED directly to the heatsink. The result of the much improved heat transfer possible with the invention is that the LED operates much cooler and therefore much more efficiently. Higher lumens are possible with no increase in power over conventional systems. It is also possible to maintain lumens at the same level as other less efficient systems but consume far less power. This is especially important in battery powered lighting systems as on-time is extended without reducing lumens. The superior performance of the present invention is demonstrated by the lumens output 60 seconds after applying a constant 4 amps of current to the LED. The invention was better than other systems as follows:
  • The present invention (FIGS. 2A-D) produced 19 percent more lumens than the system in FIGS. 13A-D (typical star, metal backed PC board mounted LED); and
  • The present invention (FIGS. 2A-D) produced 93 percent more lumens than the system in FIGS. 12A-D (multi-layer conventional PC board with extra copper traces and vias to attempt to conduct heat away from the LED).
  • It is worth noting that the efficiency of the present invention can be increased or optimized, with the aid of the present disclosure, by increasing or maximizing the surface area exposure between the heatsink and the thermally and electrically conductive outer casing while also designing the heatsink to have a sufficient mass to effectively and efficiently conduct heat between the heatsink and the outer casing. Thus, for example, heatsink 2 in FIGS. 2A-D will have better results than heatsink 2 of FIGS. 1A-D, while FIGS. 3A-D illustrate an embodiment in which the heatsink is integrally formed with the outer casing, which should result in better results than the heatsink of FIGS. 2A-D.
  • It is also worth noting that the outer casing, which is illustrated in the exemplary embodiments depicted in FIGS. 1-11 as a tube or barrel, need not be thermally and electrically conductive over its entire outer surface, although an outer casing which is thermally and electrically conductive over its entire outer surface may achieve better results.
  • It is further worth noting that the advantages obtained by the more efficient cooling of one or more LEDs obtained by the present invention can be used to create a flashlight mode use of increased lumens, or a flashlight mode with increased on-time, or one or more modes that alternate between such modes or combine elements of both such modes.
  • The present invention lends itself to a more efficient, less costly, lighting device that can be manufactured economically through automation. In illustrative embodiments shown in FIGS. 19C-D and 20A-B, a heat sink assembly 200 is created by soldering two electrically conductive members of an LED 5 to a top surface of heatsink 2. Commercially available LEDs typically have three pads (see, e.g., FIG. 11D where second electrical connection 7 has one rectangular pad while thermal junction and first electrical connection between LED 5 and heatsink 2 have two rectangular pads) which can all be used for soldering (solder S1 in FIG. 19A is for one pad whereas solder S2 in FIG. 19A is for two pads). After heat sink assembly 200 is created, it can be press fit into a tube or barrel 1 as illustrated in FIGS. 19C and 19D or it can be removably inserted into tube or barrel 1 and then held in place by a removable holding mechanism, an example of which is nut 1B illustrated in FIGS. 20A and 20B. In the embodiments illustrated in FIGS. 20A and 20B, in an especially preferred embodiment, tube or barrel 1 and heat sink 2 are made of aluminum, heat sink 2 is coated with a metallic plating (e.g., nickel) that helps promote the soldering process, and a skin cut is made of the aluminum where heat sink 2 comes into contact with a top surface 1AT of shoulder 1A formed in tube or barrel 1 (so as to promote more efficient thermal heat transfer).
  • While the invention has been described herein with reference to certain preferred embodiments, those embodiments have been presented by way of example only, and not to limit the scope of the invention. Additional embodiments thereof will be obvious to those skilled in the art having the benefit of this detailed description.
  • Accordingly, it will be apparent to those skilled in the art that still further changes and modifications in the actual concepts described herein can readily be made without departing from the spirit and scope of the disclosed inventions.

Claims (19)

1-10. (canceled)
11: A lighting apparatus, comprising:
a light emitting diode (“LED”) package having a first and a second electrically conductive member to provide power to cause a die within the LED package to emit light;
an outer casing that is thermally and electrically conductive; and
a heatsink assembly, said heatsink assembly comprising:
an outer electrically conductive member that is thermally conductive and which is mechanically connected to the outer casing;
a core of an electrically insulating material which is held within the outer electrically conductive member; and
an inner electrically conductive member which is positioned and electrically isolated from the outer electrically conductive member by the core;
wherein the first electrically conductive member of the LED package is thermally and electrically bonded to a top surface of the outer electrically conductive member and the second electrically conductive member of the LED package is thermally and electrically bonded to the inner electrically conductive member; and
wherein the LED package is turned on when power from an electrical circuit is applied to the outer electrically conductive member and the inner electrically conductive member.
12: The lighting apparatus of claim 11 wherein the outer casing is integrally formed with the outer electrically conductive member.
13: The lighting apparatus of claim 11 wherein the heatsink assembly is held within the outer casing by an interference fit.
14: The lighting apparatus of claim 13 wherein the lighting apparatus is a flashlight and the outer casing is a flashlight barrel.
15: The lighting apparatus of claim 14 wherein flashlight barrel is made of aluminum.
16: The lighting apparatus of claim 15 wherein the lighting apparatus is manufactured by the process of:
soldering both the first electrically conductive member to the top surface of the outer electrically conductive member and the second electrically conductive member to the inner electrically conductive member; and
inserting the heat sink assembly into the flashlight barrel so that the heat sink is held by mechanical contact with the barrel.
17: The lighting apparatus of claim 16 wherein the heat sink assembly is press fit into the flashlight barrel.
18: The lighting apparatus of claim 16 wherein the heat sink assembly is removably secured within the flashlight barrel by a mechanical means.
19: The lighting apparatus of claim 18 wherein the mechanical means is a nut threaded into the flashlight barrel.
20: The lighting apparatus of claim 15 wherein the outer electrically conductive member has a circular cross section.
21: The lighting apparatus of claim 11 wherein a thermal path is created between the outer casing and the first electrically conductive member of the LED package which is only interrupted by a first thermal junction between the outer casing and the outer electrically conductive member and a second thermal junction between the outer electrically conductive member and the first electrically conductive member of the LED package.
22: The lighting apparatus of claim 12 wherein a thermal path is created between the outer casing and the first electrically conductive member of the LED package which is only interrupted by a thermal junction between the outer electrically conductive member and the first electrically conductive member of the LED package.
23: The lighting apparatus of claim 11 further comprising:
a second LED package having a third and a fourth electrically conductive member to provide power to cause a second die within the second LED package to emit light;
a third electrically conductive member which is positioned and electrically isolated from the outer electrically conductive member by the core;
wherein the third electrically conductive member of the second LED package is thermally and electrically bonded to the top surface of the outer electrically conductive member and the fourth electrically conductive member of the second LED package is thermally and electrically bonded to the fourth electrically conductive member; and
wherein the second LED package is turned on when power from the electrical circuit is applied to the heatsink and the fourth electrically conductive member.
24: A flashlight, comprising:
a flashlight barrel that is thermally and electrically conductive;
at least one light emitting diode (“LED”) package, each LED package having a first and a second electrically conductive member to provide power to cause a die within said each LED package to emit light; and
a heatsink, said heatsink comprising:
an outer electrically conductive member that is thermally conductive and which is mechanically connected to the outer casing;
a core of an electrically insulating material which is held within the outer electrically conductive member; and
at least one inner electrically conductive member which is positioned and electrically isolated from the outer electrically conductive member by the core;
wherein the first electrically conductive member of said each LED package is thermally and electrically bonded to a top surface of the outer electrically conductive member and the second electrically conductive member of said each LED package is thermally and electrically bonded to one of the at least one inner electrically conductive member;
wherein said each LED package is turned on when power from an electrical circuit is applied to the heatsink and the at least one inner electrically conductive member; and
wherein a thermal path is created between the flashlight barrel and the first electrically conductive member of said each LED package which is only interrupted by two or less thermal junctions between the flashlight barrel and the first electrically conductive member of said each LED package.
25: The flashlight of claim 24 wherein the thermal path is only interrupted by a first thermal junction between the flashlight barrel and the outer electrically conductive member and a second thermal junction between the outer electrically conductive member and the first electrically conductive member of said each LED package.
26: The lighting apparatus of claim 24 wherein the thermal path is only interrupted by one thermal junction between the outer electrically conductive member and the first electrically conductive member of said each LED package.
27: The lighting apparatus of claim 24 wherein the first electrically conductive member of said each LED package is soldered to the top surface of the outer electrically conductive member and the second electrically conductive member of said each LED package is soldered to one of the at least one inner electrically conductive member.
28: A method for creating a flashlight mode with increased lumens or with increased on-time, comprising:
soldering both a first electrically conductive member of a light emitting diode (“LED”) package to a top surface of an outer electrically conductive member of a heat sink assembly and a second electrically conductive member of the LED package to an inner electrically conductive member of the heatsink assembly; and
inserting the heat sink assembly into a flashlight barrel so that the heat sink assembly is held by mechanical contact with the barrel and a thermal path is created between the flashlight barrel and the first electrically conductive member of the LED package which is only interrupted by a first thermal junction between the flashlight barrel and the outer electrically conductive member and a second thermal junction between the outer electrically conductive member and the first electrically conductive member of said each LED package;
wherein providing power to the first and the second electrically conductive members of the LED cause a die within the LED package to emit light;
wherein the heatsink assembly has a core of an electrically insulating material which is held within the outer electrically conductive member and the inner electrically conductive member is positioned and electrically isolated from the outer electrically conductive member by the core; and
wherein the LED package is turned on when power from an electrical circuit is applied to the outer electrically conductive member and the inner electrically conductive member.
US14/971,971 2013-01-13 2015-12-16 Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink Abandoned US20160178182A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US14/971,971 US20160178182A1 (en) 2014-12-22 2015-12-16 Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink
US15/015,009 US9494285B2 (en) 2013-01-13 2016-02-03 Lighting devices
US15/148,505 US9453625B2 (en) 2014-12-22 2016-05-06 LED flashlight with improved heat sink and battery protection
US15/182,396 US9494308B1 (en) 2014-12-22 2016-06-14 LED flashlight with improved heatsink
US15/285,426 US9671102B2 (en) 2014-12-22 2016-10-04 LED flashlight with improved heat sink
US15/585,321 US10012376B2 (en) 2014-12-22 2017-05-03 LED flashlight with improved heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462095733P 2014-12-22 2014-12-22
US14/971,971 US20160178182A1 (en) 2014-12-22 2015-12-16 Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink

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US15/285,426 Active US9671102B2 (en) 2014-12-22 2016-10-04 LED flashlight with improved heat sink
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD938095S1 (en) * 2013-04-01 2021-12-07 Pathy Medical, Llc Lighting device
US11543093B2 (en) * 2019-04-29 2023-01-03 Black & Decker Inc. Light apparatus having air flow

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160178182A1 (en) * 2014-12-22 2016-06-23 Mag Instrument, Inc. Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink
US10260733B2 (en) 2017-07-13 2019-04-16 Armament Systems And Procedures, Inc. High power flashlight with polymer shell
DE102017126044A1 (en) * 2017-11-08 2019-05-09 HELLA GmbH & Co. KGaA Circuit arrangement of a lighting unit of a headlight for a vehicle
USD899646S1 (en) * 2019-02-08 2020-10-20 Jian Shan Utility direct charge LED flashlight
USD899647S1 (en) * 2019-02-08 2020-10-20 Jian Shan Tactical direct charge LED flashlight
USD921947S1 (en) * 2019-02-08 2021-06-08 Jian Shan Search direct charge LED flashlight
CN110260193B (en) * 2019-06-28 2021-05-14 商洛市虎之翼科技有限公司 Lighting device with heat dissipation function
US11512818B2 (en) 2020-07-10 2022-11-29 Junming Ding Multi-mode portable lighting device with novel battery charging unit
US11384930B1 (en) * 2021-03-05 2022-07-12 Mag Instrument, Inc Heat sink for lighting devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20100314655A1 (en) * 2009-03-02 2010-12-16 Thompson Joseph B Light Emitting Assemblies and Portions Thereof

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286311A (en) 1978-04-07 1981-08-25 Anthony Maglica Flashlight
US4871628A (en) * 1988-10-14 1989-10-03 Parker David H Battery terminal post protector
US6135611A (en) * 1991-06-21 2000-10-24 Mag Instrument, Inc. Miniature flashlight
US5804331A (en) * 1994-02-15 1998-09-08 Mag Instrument, Inc. Battery device
US5871272A (en) * 1997-01-28 1999-02-16 Streamlight, Incorporated Flashlight with rotatable lamp head
JP2000235808A (en) 1999-02-15 2000-08-29 Matsushita Electric Works Ltd Light source device
JP4452495B2 (en) 2001-05-26 2010-04-21 ルミネイション リミテッド ライアビリティ カンパニー High power LED module for spot lighting
US6685584B2 (en) 2001-11-30 2004-02-03 Wilson Sporting Goods Co. Dual embossed cover material for sporting goods and method of making same
US7652303B2 (en) 2001-12-10 2010-01-26 Galli Robert D LED lighting assembly
US6942365B2 (en) 2002-12-10 2005-09-13 Robert Galli LED lighting assembly
US6966677B2 (en) 2001-12-10 2005-11-22 Galli Robert D LED lighting assembly with improved heat management
US7121680B2 (en) * 2001-12-10 2006-10-17 Galli Robert D LED lighting assembly with improved heat management
US7083305B2 (en) 2001-12-10 2006-08-01 Galli Robert D LED lighting assembly with improved heat management
US7118255B2 (en) 2001-12-10 2006-10-10 Galli Robert D LED lighting assembly with improved heat exchange
US7055989B2 (en) 2001-12-10 2006-06-06 Robert Galli LED lighting assembly
US6827468B2 (en) 2001-12-10 2004-12-07 Robert D. Galli LED lighting assembly
US6974234B2 (en) 2001-12-10 2005-12-13 Galli Robert D LED lighting assembly
US6971762B2 (en) * 2002-02-01 2005-12-06 Robert Galli Dual mode switch mechanism for flashlights
US6666565B2 (en) 2002-03-29 2003-12-23 Arista Enterprises Inc. Light emitting diode (LED) flashlight
US6942358B2 (en) 2002-03-29 2005-09-13 Arista Enterprises, Inc. Light emitting diode (LED) flashlight
US6685336B1 (en) 2002-03-29 2004-02-03 Gabe Neiser Light emitting diode (LED) flashlight
US8093620B2 (en) 2002-12-10 2012-01-10 Galli Robert D LED lighting assembly with improved heat management
US7153004B2 (en) * 2002-12-10 2006-12-26 Galli Robert D Flashlight housing
US20040130894A1 (en) * 2003-01-03 2004-07-08 Galli Robert D. Lighting head assembly with reverse polarity protection
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
CA2634475C (en) 2003-07-07 2014-05-20 Brasscorp Limited Led-based inspection lamp with improved collimation optics
US7798667B2 (en) 2003-07-07 2010-09-21 Brasscorp Limited LED spotlight
US7300173B2 (en) * 2004-04-08 2007-11-27 Technology Assessment Group, Inc. Replacement illumination device for a miniature flashlight bulb
US7321161B2 (en) 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US7093954B2 (en) * 2003-12-19 2006-08-22 Streamlight, Inc. Flashlight having LED assembly and method for producing same
US8733966B2 (en) * 2004-08-20 2014-05-27 Mag Instrument, Inc. LED flashlight
US7188978B2 (en) 2004-11-15 2007-03-13 Streamlight, Inc. Light mountable on a mounting rail
US8371729B2 (en) 2004-11-15 2013-02-12 Streamlight, Inc. Light with keying arrangement mountable on a mounting rail
US7850345B2 (en) 2005-08-17 2010-12-14 Illumination Management Solutions Inc. Optic for LEDs and other light sources
US7618155B2 (en) * 2005-11-15 2009-11-17 Jeff Jianhua Chen Flashlights utilizing unique LED light sources
KR100736891B1 (en) 2006-01-13 2007-07-10 서울반도체 주식회사 Led lamp
US7674003B2 (en) * 2006-04-20 2010-03-09 Streamlight, Inc. Flashlight having plural switches and a controller
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9212812B2 (en) 2013-02-11 2015-12-15 Cree, Inc. LED light fixture with integrated light shielding
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US7771087B2 (en) 2006-09-30 2010-08-10 Ruud Lighting, Inc. LED light fixture with uninterruptible power supply
US9222632B2 (en) 2013-01-31 2015-12-29 Cree, Inc. LED lighting fixture
US7808013B2 (en) 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
US7914169B2 (en) * 2007-10-03 2011-03-29 The Gillette Company Light-emitting product
US8376577B2 (en) 2007-11-05 2013-02-19 Xicato, Inc. Modular solid state lighting device
US9593837B2 (en) 2008-04-04 2017-03-14 Cree, Inc. Systems and methods for high output, high color quality light
WO2009143724A1 (en) * 2008-05-25 2009-12-03 Beam Matrix Limited Adjustable lighting device
US8492179B2 (en) 2008-07-11 2013-07-23 Koninklijke Philips N.V. Method of mounting a LED module to a heat sink
US9022612B2 (en) * 2008-08-07 2015-05-05 Mag Instrument, Inc. LED module
US8157407B2 (en) * 2008-08-07 2012-04-17 Xenonics Holdings, Inc. Long-range, handheld searchlight
US8760085B2 (en) 2009-01-14 2014-06-24 Mag Instrument, Inc. Multi-mode portable lighting device
US20110012535A1 (en) 2009-07-14 2011-01-20 Mag Instrument, Inc. Portable lighting devices
US9247598B2 (en) 2009-01-16 2016-01-26 Mag Instrument, Inc. Portable lighting devices
DE102009016876B4 (en) 2009-04-08 2019-09-05 Osram Gmbh Lighting unit for vehicle headlights and vehicle headlights
US8106569B2 (en) * 2009-05-12 2012-01-31 Remphos Technologies Llc LED retrofit for miniature bulbs
DE102009052930A1 (en) 2009-09-14 2011-03-24 Osram Gesellschaft mit beschränkter Haftung Lighting device and method for producing a heat sink of the lighting device and the lighting device
US8152327B2 (en) 2009-10-02 2012-04-10 Coast Cutlery Company Focusing lens system
CN102082309B (en) * 2009-11-27 2014-09-17 尹学军 Method for quickly supplementing electric energy of electric vehicle and power supply unit thereof
JP2011146187A (en) 2010-01-13 2011-07-28 Tsutomu Seisakusho:Kk Method for manufacturing continuous substrate for light emitting diode fluorescent lamp
US8395058B2 (en) * 2010-04-23 2013-03-12 Surefire, Llc Metal core circuit board with conductive pins
WO2011136236A1 (en) 2010-04-26 2011-11-03 パナソニック電工株式会社 Leadframe, wiring board, light emitting unit, and illuminating apparatus
WO2011163674A2 (en) 2010-06-25 2011-12-29 Axlen Technologies, Inc. A led package and method of making the same
CA2840052C (en) 2011-06-24 2019-09-17 Organo Bulb Inc. Led candle bulb and led candle light
US8692473B2 (en) 2011-08-23 2014-04-08 Mag Instrument, Inc. Portable lighting device
US9052066B2 (en) 2011-09-30 2015-06-09 The Artak Ter-Hovhanissian Patent Trust LED light bulb with integrated heat sink
WO2013123973A1 (en) * 2012-02-21 2013-08-29 Carl Zeiss Sms Ltd. Method and apparatus for compensating at least one defect of an optical system
US9115885B2 (en) 2012-04-12 2015-08-25 Amerlux Inc. Water tight LED assembly with connector through lens
US20140056438A1 (en) 2012-08-21 2014-02-27 Harman International Industries, Incorporated System for vehicle sound synthesis
FI20125932A (en) * 2012-09-08 2014-03-09 Lighttherm Oy Method for the manufacture of LED lighting devices and LED lighting devices
WO2014110533A2 (en) * 2013-01-13 2014-07-17 Mag Instrument, Inc. Improved lighting devices
US20160178182A1 (en) * 2014-12-22 2016-06-23 Mag Instrument, Inc. Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink
KR101343794B1 (en) * 2013-05-22 2013-12-20 이슬기 Led lighting apparatus having a multifunctional flange for heat radiating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20100314655A1 (en) * 2009-03-02 2010-12-16 Thompson Joseph B Light Emitting Assemblies and Portions Thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD938095S1 (en) * 2013-04-01 2021-12-07 Pathy Medical, Llc Lighting device
USD991542S1 (en) * 2013-04-01 2023-07-04 Pathy Medical, Llc Lighting device
US11543093B2 (en) * 2019-04-29 2023-01-03 Black & Decker Inc. Light apparatus having air flow

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US9671102B2 (en) 2017-06-06
CN107112401B (en) 2019-05-17
WO2016106053A1 (en) 2016-06-30
JP2018505537A (en) 2018-02-22
US9453625B2 (en) 2016-09-27
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US20160252221A1 (en) 2016-09-01
HRP20200833T1 (en) 2020-08-07
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DK3238278T3 (en) 2020-06-08
US20170248299A1 (en) 2017-08-31
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US20160356480A1 (en) 2016-12-08
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US9494308B1 (en) 2016-11-15
US20170023227A1 (en) 2017-01-26

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