US2457510A - Electroplating apparatus - Google Patents
Electroplating apparatus Download PDFInfo
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- US2457510A US2457510A US642921A US64292146A US2457510A US 2457510 A US2457510 A US 2457510A US 642921 A US642921 A US 642921A US 64292146 A US64292146 A US 64292146A US 2457510 A US2457510 A US 2457510A
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- Prior art keywords
- electrode
- housing
- work
- switch
- electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
Definitions
- the present invention relates to new and useful improvements in electroplating apparatus and more particularly to a machine for accurately building up to exact dimensions various types of metal surfaces, such as shafts, internal or external cylinder walls, or flat surfaces by means of an electrode mounted for movement over the work and maintained in slightly spaced relation from the work While an electroplating solution bridges the space between the work and the electrode.
- An important object of the invention is to provide a yieldable mounting for the electrode embodying spring means for holding the electrode in closely spaced relation with respect to the work and an electric switch operable to open a circuit connected to the electrode upon a building-up of the surface of the work to a predetermined thickness through a movement ofA the electrode by the building action.
- a further object of the invention is to provide a device of this character adapted for operation while immersed in the electroplating solution, or in which the solution may be applied to the contacting end of the electrode and conned between the electrode and the surface of the work during the electroplating action.
- a still further object is to provide a device of this character of simple and practical construction, which is eifcient and reliable in operation, relatively inexpensive to manufacture and otherwise well adapted for the purposes for which the same is intended.
- Figure 1 is a perspective View.
- Figure 2 is an enlarged plan view of the switch with the cover plate for the switch housing removed.
- Figure 3 is a fragmentary longitudinal sectional view of the contacting end of the electrode.
- Figure 4 is a transverse sectional view taken on a line 4 4 of Figure 2.
- Figure 5 is an enlarged bottom plan View of the rear end of the electrode with the cover plate for the electrode housing removed.
- Figure 6 is an enlarged longitudinal sectional View through the switch housing.
- Figure 7 is a fragmentary side elevational view of the contacting end of the electrode showing an applicator attached thereto for the electroplating solution
- Figures is a perspective view of the switchoperating arm. y
- the numeral 5 designates an elongated substantially flat housing of insulation material having its bottom surface formed with a longitudinally extending channel or groove 6 open at one end of thehousing and having an electrode in the form of a bar 'I slidably ⁇ mounted therein.
- the electrode 'I is projected forwardly at the frontend of the housing 5 by means of a coil spring -8 positioned against the rear end ⁇ ofthe electrode at thechannel 6, the spring forming a conductor between the electrode and a terminal 9 extending outwardly through the top of the housing- 5 and designed to be connectedin an electric circuit in a manner and for a purpose presently clear.
- the front outer end of the electrode 'l is bifurcated as shown at I0 and in which is rotatably mounted an/insulation non-conducting disk- II by means of a pin or rivet I2 and also rotatably mounted on the pin I2 at one side of the disk II is a disk I3 of conductive material and of a diameter less than the disk I I as shown to advantage in Figure 3 of the drawings.
- One edge of the electrode 'I is formed with rack teeth I4 engaging a pinion I5 secured to the lower end of a shaft I6 journaled in the housing 5 and projecting upwardly therefrom into a liquidtight switch housing I7 secured on top of the housing'E.
- An arm I8 is positioned in the switch housing and secured to the upper end of the shaft I6 for swinging the arm in one direction in accordance with a predetermined inward sliding movement of the electrode 1.
- the arm I8 is of non-conductive material and engages one side of a Aresilient switch arm I9 ⁇ of conductive material which has one end anchored in a split post 2B of nom-conductive material rising in the housing ⁇ Il.
- the free end of the switch arm I9 is provided with a breaker point 2l adapted for movement into and out of engagement with :a stationary breaker point 22, the switch arm vand the breaker point 22 having circuit wires 23 and 24 -connected thereto and extending outwardly through adjacent ends of the housing II for a purpose presently seen.
- the switch housing I I is closed by a liquid-tight cover plate 25.
- the housing is designed to be partly immersed, that is, to the housing I'I, in an electroplating solution 3 with the insulation disk I I positioned to travel against the surface of work also immersed in the solution and the housing 5 and electrode 'I are de-j signed to be moved in a xed path to travel along the surface of the work, by xing the housing 5 in a lathe, or the like, not shown.
- the insulation disk I I is held against the surface of the work by the spring 8 which projects the electrode 'I outwardly of the housing 5 therebyrreleasine the switch .arm Iza to close the breaker points 2l and 22.
- the electrode 'I is designed to be interposed in a suitable electric circuit, a diagrammatic representation of which has been shown in Fig-ure 1' with a battery I3 representing the source oi electrical energy and grounded as at 32 with -a line 33v to one side 34 0f a spring ⁇ opened solenoidac:
- switch 35 remote from the device and outside of the solution, lsaid line 33 having a control switch 3E therein.
- the other side 37 of said switch 35 is connected by a line 38A to the terminal'of the electrode l.
- the wire 23 branches from the line 33 and the wire 24 extends to one sideaof the solenoid 33 of said Iswitch 35 :and which is ground- ⁇ -ed-asat 461 to ⁇ be energized when the breaker ⁇ points ZI, 22 are closed and therebt7 operate the core dI to close said switch 35.
- the solenoid 39 will vbe energized to maintain the ⁇ s-olenoidao switch 35 closed and the electrode ⁇ I vwillbe energized. As they surface of thev work- 29, over which the. disks Il ⁇ and I3 travel, is built up, thev electrode 'If w-ill be' shoved inwardly *of the housing' 5 until a predetermined thickness of electroplati-ng isattained, whereupon, the Iarm Ils will be actuated by the raoliz'y I4 and.
- I' have illustrated a modiiied form of lthe invention which comprises a tube 26. secured to the outer end of the electrodey 1a, by a bracket 21. and attached' to. the-discharge end of the tube is a wick 2B positioned. beneath the tube and wiping against the work 29) immediately above the conductor disk I3 a and non-conductive disk I I', the tube beingy adapted to supply electro.- plating solution tothe wick for action thereon bfy the electrode to electroplate the ⁇ surface V0f the work.
- Anfelectroplating device comprising a housing .of non-conductive material and adapted to be moved in a iixed path over a piece of work lto be electroplated,r an electrode projecting out vof said housing to traveltherewith with one end in close proximity to the work, said electrode being slidably mounted in .said housing for retraction therein, work-engaging means of insulation material secured to and extending beyond saidk electrode for-causing retraction ofthe electrodeinto said housing as the thickness of the eiectroplating on the work increases, a switch carried by said housing for controlling an electrio circuit in .which the electrode isr interposed,
- 3. ⁇ -An electroplating device comprising a housing of nonconductive ⁇ material and adapted to be moved in a fixed path over a piece of work to be electroplated, anelectrode, projecting out of said housing to. travel ⁇ therewith with one endv in, close. proximity to the work,r said-electrode being: sldably, mounted in saidv housingk for retraction, therein,- work-engaging means of, insulationv material secured to and extending beyond f said electrode for causing retraction4 of" the electrede into.
- said housing as the thickness of the vto be electroplated, anhelectrode projectingv out of ⁇ said' housing to travel' therewith with one end in close proximity to the work, said Aelectrode be'- ing',K slidalolyA mounted ⁇ in said housing for retraco tionl therein, 'work-engaging means Y of insulation material secured sto andl extending beyond said electrode vfor causing retraction of the electrode into said housing;V as the thickness of the electroplating on thework increases', a switch carried 5 6 in which the electrode is interposed, means for opening said switch operative by retraction of REFERENCES CITED said electrode in a predetermined degreey and
- the following references are of record in the means on said electrode for supplying electrole of this patenti plating Solution between Said electrode and the 5 work.
Description
DEC. 28, 1948. V G VAN ORNUM 2,457,510
'I ELECTRPLATING APPARATUS Filed Jan/25, 194e y 2 sheen-sheet 1 Dec. 28, 1948. D. G. VAN ORNUM i ELECTROPLATING APPARATUS Filed Jan. 25, 1946v 2 Sheets-Sheet 2 lll vel/lor Patented Dec. 28, 1948 UNITED STATES PATENT OFFICE ELECTROPLATING APPARATUS Delbert G. .Van Ornum, Great Falls, Mont.
Application January 23, 1946, Serial No. .642,921
4 Claims. (Cl. 204-224) The present invention relates to new and useful improvements in electroplating apparatus and more particularly to a machine for accurately building up to exact dimensions various types of metal surfaces, such as shafts, internal or external cylinder walls, or flat surfaces by means of an electrode mounted for movement over the work and maintained in slightly spaced relation from the work While an electroplating solution bridges the space between the work and the electrode.
An important object of the invention is to provide a yieldable mounting for the electrode embodying spring means for holding the electrode in closely spaced relation with respect to the work and an electric switch operable to open a circuit connected to the electrode upon a building-up of the surface of the work to a predetermined thickness through a movement ofA the electrode by the building action.
A further object of the invention is to provide a device of this character adapted for operation while immersed in the electroplating solution, or in which the solution may be applied to the contacting end of the electrode and conned between the electrode and the surface of the work during the electroplating action.
A still further object is to provide a device of this character of simple and practical construction, which is eifcient and reliable in operation, relatively inexpensive to manufacture and otherwise well adapted for the purposes for which the same is intended.
Other objects and advantages reside in the details of construction and operation as more fully hereinafter described and claimed, reference being had to the accompanying drawings forming part hereof, wherein like numerals refer to like parts throughout, and in which:
Figure 1 is a perspective View.
Figure 2 is an enlarged plan view of the switch with the cover plate for the switch housing removed.
Figure 3 is a fragmentary longitudinal sectional view of the contacting end of the electrode.
Figure 4 is a transverse sectional view taken on a line 4 4 of Figure 2.
Figure 5 is an enlarged bottom plan View of the rear end of the electrode with the cover plate for the electrode housing removed.
Figure 6 is an enlarged longitudinal sectional View through the switch housing.
Figure 7 is a fragmentary side elevational view of the contacting end of the electrode showing an applicator attached thereto for the electroplating solution, and
Figures is a perspective view of the switchoperating arm. y
Referring now to the drawings in detail and first with respect to the form of invention illustrated in Figures 1 to 6 inclusive the numeral 5 designates an elongated substantially flat housing of insulation material having its bottom surface formed with a longitudinally extending channel or groove 6 open at one end of thehousing and having an electrode in the form of a bar 'I slidably` mounted therein.
l The electrode 'I is projected forwardly at the frontend of the housing 5 by means of a coil spring -8 positioned against the rear end `ofthe electrode at thechannel 6, the spring forming a conductor between the electrode and a terminal 9 extending outwardly through the top of the housing- 5 and designed to be connectedin an electric circuit in a manner and for a purpose presently clear.
The front outer end of the electrode 'l is bifurcated as shown at I0 and in which is rotatably mounted an/insulation non-conducting disk- II by means of a pin or rivet I2 and also rotatably mounted on the pin I2 at one side of the disk II is a disk I3 of conductive material and of a diameter less than the disk I I as shown to advantage in Figure 3 of the drawings.
One edge of the electrode 'I is formed with rack teeth I4 engaging a pinion I5 secured to the lower end of a shaft I6 journaled in the housing 5 and projecting upwardly therefrom into a liquidtight switch housing I7 secured on top of the housing'E. An arm I8 is positioned in the switch housing and secured to the upper end of the shaft I6 for swinging the arm in one direction in accordance with a predetermined inward sliding movement of the electrode 1.
The arm I8 is of non-conductive material and engages one side of a Aresilient switch arm I9 `of conductive material which has one end anchored in a split post 2B of nom-conductive material rising in the housing` Il. The free end of the switch arm I9 is provided with a breaker point 2l adapted for movement into and out of engagement with :a stationary breaker point 22, the switch arm vand the breaker point 22 having circuit wires 23 and 24 -connected thereto and extending outwardly through adjacent ends of the housing II for a purpose presently seen. The switch housing I I is closed by a liquid-tight cover plate 25. The housing is designed to be partly immersed, that is, to the housing I'I, in an electroplating solution 3 with the insulation disk I I positioned to travel against the surface of work also immersed in the solution and the housing 5 and electrode 'I are de-j signed to be moved in a xed path to travel along the surface of the work, by xing the housing 5 in a lathe, or the like, not shown. The insulation disk I I is held against the surface of the work by the spring 8 which projects the electrode 'I outwardly of the housing 5 therebyrreleasine the switch .arm Iza to close the breaker points 2l and 22.
The electrode 'I is designed to be interposed in a suitable electric circuit, a diagrammatic representation of which has been shown in Fig-ure 1' with a battery I3 representing the source oi electrical energy and grounded as at 32 with -a line 33v to one side 34 0f a spring` opened solenoidac:
switch 35 remote from the device and outside of the solution, lsaid line 33 having a control switch 3E therein. The other side 37 of said switch 35 is connected by a line 38A to the terminal'of the electrode l. The wire 23 branches from the line 33 and the wire 24 extends to one sideaof the solenoid 33 of said Iswitch 35 :and which is ground-` -ed-asat 461 to` be energized when the breaker `points ZI, 22 are closed and therebt7 operate the core dI to close said switch 35.
lThe dev-ice i-s moved, as bythe means previousM vl'ymentioned, over the-work, as shown'for instance at 29,- to be eleotroplated and the electrode l is Ynormally' extended outwardly of the housing y5 vby the spring 8 so that thebreaker points 2l, 22
are closed. Therefore, with the switch 35 closed,
the solenoid 39 will vbe energized to maintain the `s-olenoidao switch 35 closed and the electrode `I vwillbe energized. As they surface of thev work- 29, over which the. disks Il `and I3 travel, is built up, thev electrode 'If w-ill be' shoved inwardly *of the housing' 5 until a predetermined thickness of electroplati-ng isattained, whereupon, the Iarm Ils will be actuated by the raoliz'y I4 and. pinion I5 to move the switch arm I 9 to separate the breakerl points alg, 2.2, whereupon, the solenoidv 39 willk be deener- 'goed to permit the soienoidac Switch at` to open and thereby deenergiie the electrode 1:, in a mannen-whiohwill b e clear.
As will be understood, when the brealierwpoints 2.1i, 22 are closed, or engagf'ed,I and the solenoidac Aswitch 35 closed', electric current will flow through the electrode 'l1 and solution, not shown, wherer by the Work 23:, as shown, will be electroplatedaccording to the usual Well known process, and when the. electrode. 'l is deenergized, in the manner described in the foregoing, the` electroplating processwill be stopped. 1
In Figure 7', I' have illustrated a modiiied form of lthe invention which comprises a tube 26. secured to the outer end of the electrodey 1a, by a bracket 21. and attached' to. the-discharge end of the tube is a wick 2B positioned. beneath the tube and wiping against the work 29) immediately above the conductor disk I3 a and non-conductive disk I I', the tube beingy adapted to supply electro.- plating solution tothe wick for action thereon bfy the electrode to electroplate the` surface V0f the work.
vIn view of the foregoing descriptionL taken in conjunction withy the accompanying drawings it is believed; that a clear understanding-of the` Coni.-
structiOn, operation and advantages of the. device will be' kquite apparent to those skilled in this art. A more detailed description is accordinglydeemed unnecessary;
It is to. be understood, however, thatA even thoughr there. is herein shown and: described. .a
preferred embodiment of the invention the same is susceptible to certain changes fully comprehended by the spirit of the invention as herein described andthe scope of th-e appended claims.
Having thus described the invention, what is Y ing slidably mounted in said housing for retractiontherein;workeengaging means of insulation material secured to and extending beyond said electrode'for causing retraction of the electrode l i; intosaid housing as the thickness of the electroplating on the work increases, a switch carried b'y saidv housing for controlling an electric circuit in which the electrode is interposed, and means for opening said switch operative by retractionV of said electrode in a predetermined degree.,
2. Anfelectroplating device comprising a housing .of non-conductive material and adapted to be moved in a iixed path over a piece of work lto be electroplated,r an electrode projecting out vof said housing to traveltherewith with one end in close proximity to the work, said electrode being slidably mounted in .said housing for retraction therein, work-engaging means of insulation material secured to and extending beyond saidk electrode for-causing retraction ofthe electrodeinto said housing as the thickness of the eiectroplating on the work increases, a switch carried by said housing for controlling an electrio circuit in .which the electrode isr interposed,
means for opening said switch operative by rem traction of said electrode ina predetermined de- V,cg-roda terminal on said housing adapted to. be
interposed in said circuit',l and spring means for opposing retraction` of said electrode and forming an electrical lconductor between said electrode and terminal.
3.` -An electroplating device comprising a housing of nonconductive` material and adapted to be moved in a fixed path over a piece of work to be electroplated, anelectrode, projecting out of said housing to. travel `therewith with one endv in, close. proximity to the work,r said-electrode being: sldably, mounted in saidv housingk for retraction, therein,- work-engaging means of, insulationv material secured to and extending beyond f said electrode for causing retraction4 of" the electrede into. said housingas the thickness of the vto be electroplated, anhelectrode projectingv out of` said' housing to travel' therewith with one end in close proximity to the work, said Aelectrode be'- ing',K slidalolyA mounted` in said housing for retraco tionl therein, 'work-engaging means Y of insulation material secured sto andl extending beyond said electrode vfor causing retraction of the electrode into said housing;V as the thickness of the electroplating on thework increases', a switch carried 5 6 in which the electrode is interposed, means for opening said switch operative by retraction of REFERENCES CITED said electrode in a predetermined degreey and The following references are of record in the means on said electrode for supplying electrole of this patenti plating Solution between Said electrode and the 5 work.
DELBERT G. VAN ORNUM. Number Name Date 1,805,215 Hammond May 12, 1931 1,856,409 Bryce May 3, 1932 10 FOREIGN PATENTS Number Country Date 18,643 Great Britain 1899
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US642921A US2457510A (en) | 1946-01-23 | 1946-01-23 | Electroplating apparatus |
Applications Claiming Priority (1)
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US642921A US2457510A (en) | 1946-01-23 | 1946-01-23 | Electroplating apparatus |
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US2457510A true US2457510A (en) | 1948-12-28 |
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US642921A Expired - Lifetime US2457510A (en) | 1946-01-23 | 1946-01-23 | Electroplating apparatus |
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Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2706173A (en) * | 1950-10-12 | 1955-04-12 | Harold R Wells | Apparatus for electro-plating crankshaft journals |
US2782159A (en) * | 1953-06-29 | 1957-02-19 | Ernest V Berry | Electroplating anode structure |
US3008892A (en) * | 1957-09-10 | 1961-11-14 | United States Steel Corp | Apparatus for coating selected portions of the surface of a base material |
US3276988A (en) * | 1959-10-06 | 1966-10-04 | Anocut Eng Co | Electrolytic removal of work material |
US3354073A (en) * | 1963-11-22 | 1967-11-21 | Gen Motors Corp | Electrical stock removal apparatus |
US3417008A (en) * | 1965-01-15 | 1968-12-17 | Udylite Corp | Switch for electrochemical processes |
US4134819A (en) * | 1977-03-14 | 1979-01-16 | Schering Ag | Arrangement for controlling the electric energy supply to an electroplating installation |
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7014538B2 (en) | 1999-05-03 | 2006-03-21 | Applied Materials, Inc. | Article for polishing semiconductor substrates |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7137879B2 (en) | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7278911B2 (en) | 2000-02-17 | 2007-10-09 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB189918643A (en) * | 1899-09-15 | 1900-08-18 | Frederick Hall Snyder | Improvements relating to the Amalgamation and Coating of Metals or Alloys of Metals, with Metals or Alloys of Metals, by the Aid of Electricity, and to Apparatus therefor. |
US1805215A (en) * | 1930-03-05 | 1931-05-12 | Hammond Frederick William | Means for coating metallic articles, particularly the interiors of water mains |
US1856409A (en) * | 1927-11-04 | 1932-05-03 | Dayton Scale Co | Weighing sealing device |
-
1946
- 1946-01-23 US US642921A patent/US2457510A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB189918643A (en) * | 1899-09-15 | 1900-08-18 | Frederick Hall Snyder | Improvements relating to the Amalgamation and Coating of Metals or Alloys of Metals, with Metals or Alloys of Metals, by the Aid of Electricity, and to Apparatus therefor. |
US1856409A (en) * | 1927-11-04 | 1932-05-03 | Dayton Scale Co | Weighing sealing device |
US1805215A (en) * | 1930-03-05 | 1931-05-12 | Hammond Frederick William | Means for coating metallic articles, particularly the interiors of water mains |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2706173A (en) * | 1950-10-12 | 1955-04-12 | Harold R Wells | Apparatus for electro-plating crankshaft journals |
US2782159A (en) * | 1953-06-29 | 1957-02-19 | Ernest V Berry | Electroplating anode structure |
US3008892A (en) * | 1957-09-10 | 1961-11-14 | United States Steel Corp | Apparatus for coating selected portions of the surface of a base material |
US3276988A (en) * | 1959-10-06 | 1966-10-04 | Anocut Eng Co | Electrolytic removal of work material |
US3354073A (en) * | 1963-11-22 | 1967-11-21 | Gen Motors Corp | Electrical stock removal apparatus |
US3417008A (en) * | 1965-01-15 | 1968-12-17 | Udylite Corp | Switch for electrochemical processes |
US4134819A (en) * | 1977-03-14 | 1979-01-16 | Schering Ag | Arrangement for controlling the electric energy supply to an electroplating installation |
US7014538B2 (en) | 1999-05-03 | 2006-03-21 | Applied Materials, Inc. | Article for polishing semiconductor substrates |
US7207878B2 (en) | 2000-02-17 | 2007-04-24 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7137868B2 (en) | 2000-02-17 | 2006-11-21 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US6988942B2 (en) | 2000-02-17 | 2006-01-24 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7344431B2 (en) | 2000-02-17 | 2008-03-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
US7278911B2 (en) | 2000-02-17 | 2007-10-09 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7285036B2 (en) | 2000-02-17 | 2007-10-23 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical polishing |
US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
US7569134B2 (en) | 2000-02-17 | 2009-08-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
US7137879B2 (en) | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
US7311592B2 (en) | 2001-04-24 | 2007-12-25 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7446041B2 (en) | 2004-09-14 | 2008-11-04 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
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