US2935665A - Selenium rectifier - Google Patents

Selenium rectifier Download PDF

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Publication number
US2935665A
US2935665A US759692A US75969258A US2935665A US 2935665 A US2935665 A US 2935665A US 759692 A US759692 A US 759692A US 75969258 A US75969258 A US 75969258A US 2935665 A US2935665 A US 2935665A
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United States
Prior art keywords
conductor
housing
cap
assembly
imperfect
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Expired - Lifetime
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US759692A
Inventor
William J Coyle
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United Carr Fastener Corp
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United Carr Fastener Corp
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Priority to US759692A priority Critical patent/US2935665A/en
Priority to GB28416/59A priority patent/GB869724A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the primary object of this invention is to provide a resilient lead-in conductor which would exert at all times an even, unvarying pressure on the imperfect conductors.
  • Another object of the invention is to provide a spring like conductor which can not be loosened under normal operating conditions.
  • Fig. 1 is a perspective view of the rectifier assembly
  • Fig. 2 is a section taken on line 2-2 of Fig. 1;
  • Fig. 3 is a section taken on line 33 of Fig. 2;
  • Fig. 4 is a section taken on line 4-4 of Fig. 1;
  • Fig. 5 is a plan view of the cap.
  • the improved rectifier assembly comprises an insulating rectilinear housing 12, three terminals consisting of two cathode leads 14 and an anode lead 16, a resilient spring conductor or contact 18, a plate or cap 20, and a semiconductor (rectifying cell) 22.
  • the housing 12 comprises a rectangular base 24 having two circular recessses 26 with a recess aperture 28 formed axially in the bottom of the recess 26 through the base 24.
  • a third aperture 30 is formed through the base 24 midway between the recesses 26 without being recessed.
  • a shoulder 36 is formed in each of the end walls 34 as illustrated in Fig. 3.
  • the resilient spring conductor 18 comprises a comparatively long rectangular piece of conductive material, such as copper, whose terminal ends 38 are bent back upon themselves to form an elbow 40 and two converging legs 41.
  • a conductor aperture 42 is formed in the conductor 18 midway between the two elbows 40 so that the conductor aperture 42 will be superimposed upon that lead-in aperture 30 when the conductor 18 is placed on the base 24.
  • the three pig tails or leads numbered 14 and 16 are all constructed of conductive material and comprise a long, thin cylindrical tail 44 integrally capped by a comparatively fiat circular head 46.
  • a semi-conductor 22 is affixed to the head 46 of the cathode leads 14. In the preferred embodiment a selenium cell is used, however, any other semi-conductor such as germanium will work.
  • the cap is a rectangular piece of non-conductive material formed to rest on the shoulders 36 and whose 'ice edges will bear against the walls 32 and 34 when engaged with the housing 12. Any type of non-conductive material may be used, however, in the preferred embodiment plastic was used.
  • the tails 44 of the cathode leads 14, with their semi-conductors 22 attached are passed through the apertures 28.
  • the tails 44 are of sufficient length to extend a few inches beyond the base 24 after being forced through the apertures 28.
  • the heads 46 bear against the bottom of the recesses 26 and the semi-conductors 22 extend a slight distance above the face 48 of the base 24.
  • the tail 44 of the anode 16 is passed through the conductor aperture 42 so that the head 46 bears against the upper surface of the conductor 18.
  • the head 46 of the anode lead 16 is then afiixed to the conductor 18 by any of the numerous means available. In the preferred embodiment the said head and conductor are soldered together.
  • the head 46 may be formed to clip into the conductor 18.
  • the tail 44 of the anode 16 is then passed through the aperture 38 until the conductor 18 bears against the semiconductors 22.
  • the terminal ends 38 of the conductor 18 extend slightly above the line of the shoulders 36.
  • the cap 20 is placed on top of the terminal ends 38 of the conductor 18 forcing the legs 41 toward each other until the cap rests on the shoulders 36.
  • the conductor 18 is firmly pressed against the semi-conductors 22 forming a good electrical connection.
  • the area between the walls 32 and 34 over the cap 20 is filled with potting compound 50 to hold the cap in place and seal the electrical connectors from outside dirt and moisture.
  • the external dimensions of the housing 12 may be varied to suit difierent applications.
  • the assembly will also work efficiently if only one cathode lead is used, since the axial force is equal along the contact points between the conductor and any number of semiconductors.
  • An encapsulated rectifier assembly comprising terminal leads, a housing of non-conductive material, aresilient spring conductor in said housing having its terminal ends bent back upon themselves to form two elbows, an imperfect conductor in said housing of the class described having one portion sprayed with a metallic layer, and a means of transmitting electrical current to said spring conductor, a 'cap holding said conductor in assembly with said housing, said spring conductor exerting horizontal pressure on said imperfect conductor when said cap is placed in said housing.
  • An encapsulated rectifier assembly comprising a housing of non-conductive material having a cap, a rectifying cell of the class described, a resilient spring conductor having its terminal ends bent back upon themselves to form two U-shaped elbows, and a means of transmitting electrical current to said spring conductor, said spring conductor kept in contact with said rectifying cell through mechanical operation of the cap and the said terminal ends of the spring conductor.
  • An encapsulated semi-conductor rectifying assembly comprising a housing of non-conductive material, a resilient spring conductor in said housing having its terminal ends bent back upon themselves to form two elbows, three terminal leads, said leads consisting of an anode lead attached to said spring conductor between said elbows and two separate cathode leads, an imperfect 2,93 5,665 3 4 Gpnductor in said housing of the class described having References Cited in the file 'of this patent one portion sprayed with a metallic layer, a cap holding UNITED STATES PATENTS said conductor in assembly with said housing, said spring conductor exerting horizontal pressure on said imperfect 2707252 Peter et 1955 conductor when said cap is placed in assembly with said 5 2'853662 Woods Sept 1958 housing.

Description

y 1960 w. J. COYLE 2,935,665
SELENIUM RECTIFIER Filed Sept. 8, 1958 United States Patent SELENIUM RECTIFIER William J. Coyle, Waltham, Mass, assignor to United- Carr Fastener Corporation, Cambridge, Mass, a corporation of Delaware Application September 8, 1958, Serial No. 759,692
3 Claims. (Cl. 317-234) My invention relates to electrical rectifier assemblies and particularly to rectifiers employing asymmetric units of an imperfect conductor.
In rectifiers of this type, pressure of the conductors on the imperfect conductors must be kept at a constant amount. If the pressure exerted on the semi-conductors is increased there is a tendency for an increase to take place in the reverse current of the rectifier lowering its efficiency.
The primary object of this invention is to provide a resilient lead-in conductor which would exert at all times an even, unvarying pressure on the imperfect conductors.
Another object of the invention is to provide a spring like conductor which can not be loosened under normal operating conditions.
Other objects of this invention will, in part, be obvious, and will, in part, appear hereinafter.
In the drawing:
Fig. 1 is a perspective view of the rectifier assembly;
Fig. 2 is a section taken on line 2-2 of Fig. 1;
Fig. 3 is a section taken on line 33 of Fig. 2;
Fig. 4 is a section taken on line 4-4 of Fig. 1; and
Fig. 5 is a plan view of the cap.
Referring now to the drawings, the improved rectifier assembly comprises an insulating rectilinear housing 12, three terminals consisting of two cathode leads 14 and an anode lead 16, a resilient spring conductor or contact 18, a plate or cap 20, and a semiconductor (rectifying cell) 22.
The housing 12 comprises a rectangular base 24 having two circular recessses 26 with a recess aperture 28 formed axially in the bottom of the recess 26 through the base 24. A third aperture 30 is formed through the base 24 midway between the recesses 26 without being recessed. Integral with and at right angles to the edges of the base 24, there are two side walls 32 and two end walls 34 forming a box with the base 24. A shoulder 36 is formed in each of the end walls 34 as illustrated in Fig. 3.
The resilient spring conductor 18 comprises a comparatively long rectangular piece of conductive material, such as copper, whose terminal ends 38 are bent back upon themselves to form an elbow 40 and two converging legs 41. A conductor aperture 42 is formed in the conductor 18 midway between the two elbows 40 so that the conductor aperture 42 will be superimposed upon that lead-in aperture 30 when the conductor 18 is placed on the base 24. The three pig tails or leads numbered 14 and 16 are all constructed of conductive material and comprise a long, thin cylindrical tail 44 integrally capped by a comparatively fiat circular head 46. A semi-conductor 22 is affixed to the head 46 of the cathode leads 14. In the preferred embodiment a selenium cell is used, however, any other semi-conductor such as germanium will work.
The cap is a rectangular piece of non-conductive material formed to rest on the shoulders 36 and whose 'ice edges will bear against the walls 32 and 34 when engaged with the housing 12. Any type of non-conductive material may be used, however, in the preferred embodiment plastic was used.
To assemble the device 10, the tails 44 of the cathode leads 14, with their semi-conductors 22 attached, are passed through the apertures 28. The tails 44 are of sufficient length to extend a few inches beyond the base 24 after being forced through the apertures 28. The heads 46 bear against the bottom of the recesses 26 and the semi-conductors 22 extend a slight distance above the face 48 of the base 24. The tail 44 of the anode 16 is passed through the conductor aperture 42 so that the head 46 bears against the upper surface of the conductor 18. The head 46 of the anode lead 16 is then afiixed to the conductor 18 by any of the numerous means available. In the preferred embodiment the said head and conductor are soldered together. For example, the head 46 may be formed to clip into the conductor 18. The tail 44 of the anode 16 is then passed through the aperture 38 until the conductor 18 bears against the semiconductors 22. At this juncture, the terminal ends 38 of the conductor 18 extend slightly above the line of the shoulders 36. The cap 20 is placed on top of the terminal ends 38 of the conductor 18 forcing the legs 41 toward each other until the cap rests on the shoulders 36. When the cap 20 is engaged as set forth above, the conductor 18 is firmly pressed against the semi-conductors 22 forming a good electrical connection. The area between the walls 32 and 34 over the cap 20 is filled with potting compound 50 to hold the cap in place and seal the electrical connectors from outside dirt and moisture. Of course, the external dimensions of the housing 12 may be varied to suit difierent applications. The assembly will also work efficiently if only one cathode lead is used, since the axial force is equal along the contact points between the conductor and any number of semiconductors.
Since certain other obvious modifications may be made in this device without departing from the scope of the invention, it is intended that all matters contained herein be interpreted in an illustrative and not in a limiting sense.
I claim:
1. An encapsulated rectifier assembly comprising terminal leads, a housing of non-conductive material, aresilient spring conductor in said housing having its terminal ends bent back upon themselves to form two elbows, an imperfect conductor in said housing of the class described having one portion sprayed with a metallic layer, and a means of transmitting electrical current to said spring conductor, a 'cap holding said conductor in assembly with said housing, said spring conductor exerting horizontal pressure on said imperfect conductor when said cap is placed in said housing.
2. An encapsulated rectifier assembly comprising a housing of non-conductive material having a cap, a rectifying cell of the class described, a resilient spring conductor having its terminal ends bent back upon themselves to form two U-shaped elbows, and a means of transmitting electrical current to said spring conductor, said spring conductor kept in contact with said rectifying cell through mechanical operation of the cap and the said terminal ends of the spring conductor.
3. An encapsulated semi-conductor rectifying assembly comprising a housing of non-conductive material, a resilient spring conductor in said housing having its terminal ends bent back upon themselves to form two elbows, three terminal leads, said leads consisting of an anode lead attached to said spring conductor between said elbows and two separate cathode leads, an imperfect 2,93 5,665 3 4 Gpnductor in said housing of the class described having References Cited in the file 'of this patent one portion sprayed with a metallic layer, a cap holding UNITED STATES PATENTS said conductor in assembly with said housing, said spring conductor exerting horizontal pressure on said imperfect 2707252 Peter et 1955 conductor when said cap is placed in assembly with said 5 2'853662 Woods Sept 1958 housing. 2,879,453 hu ert Mar. 24, 1959 UNITED STATES PATENT OFFICE CERTlFlCA'lE 0F CORRECION Patent No 2335,665 May 3', 1960 William J Coyle Q e printed specification It is hereby certified that error appears in th t requiring correction and that the said Letters of the above numbered paten Patent should readas corrected below.
line 63 for "operation day of October 1960,
Column 2 read cooperation Signed and sealed this 25th (SEAL) Attest:
KARL H. AXLINE ROBERT C. WATSON Commissioner of Patents Attesting Oflicer

Claims (1)

1. AN ENCAPSULATED RECITIFIER ASSEMBLY COMPRISING TERMINAL LEADS, A HOUSING OF NON-CONDUCTIVE MATERIAL, A RESILIENT SPRING CONDUCTOR IN SAID HOUSING HAVING ITS TERMINAL ENDS BENT BACK UPON THEMSELVES TO FORM TWO ELBOWS, AN IMPERFECT CONDUCTOR IN SAID HOUSING OF THE CLASS DESCRIBED HAVING ONE PORTION SPRAYED WITH A METALLIC LAYER, AND A MEANS OF TRANSMITTING ELECTRICAL CURRENT TO SAID SPRING CONDUCTOR, A CAP HOLDING SAID CONDUCTOR IN ASSEMBLY WITH SAID HOUSING, SAID SPRING CONDUCTOR EXERTING HORIZONTAL PRESSURE ON SAID IMPERFECT CONDUCTOR WHEN SAID CAP IS PLACED IN SAID HOUSING.
US759692A 1958-09-08 1958-09-08 Selenium rectifier Expired - Lifetime US2935665A (en)

Priority Applications (2)

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US759692A US2935665A (en) 1958-09-08 1958-09-08 Selenium rectifier
GB28416/59A GB869724A (en) 1958-09-08 1959-08-19 Improvements in and relating to electrical rectifier assemblies

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3113258A (en) * 1959-09-28 1963-12-03 Walter E Heller & Company Power control device
US3161810A (en) * 1959-12-11 1964-12-15 Texas Instruments Inc Temperature compensated transistor
US3333167A (en) * 1964-10-08 1967-07-25 Dreyfus Jean-Paul Leon Housing for transistor die
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2707252A (en) * 1955-04-26 Metal rectifier assemblies
US2853662A (en) * 1956-06-22 1958-09-23 Int Resistance Co Rectifier construction
US2879458A (en) * 1957-10-30 1959-03-24 Westinghouse Electric Corp Diode matrix

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2707252A (en) * 1955-04-26 Metal rectifier assemblies
US2853662A (en) * 1956-06-22 1958-09-23 Int Resistance Co Rectifier construction
US2879458A (en) * 1957-10-30 1959-03-24 Westinghouse Electric Corp Diode matrix

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3113258A (en) * 1959-09-28 1963-12-03 Walter E Heller & Company Power control device
US3161810A (en) * 1959-12-11 1964-12-15 Texas Instruments Inc Temperature compensated transistor
US3333167A (en) * 1964-10-08 1967-07-25 Dreyfus Jean-Paul Leon Housing for transistor die
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly

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GB869724A (en) 1961-06-07

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