US3453783A - Apparatus for holding silicon slices - Google Patents
Apparatus for holding silicon slices Download PDFInfo
- Publication number
- US3453783A US3453783A US561943A US3453783DA US3453783A US 3453783 A US3453783 A US 3453783A US 561943 A US561943 A US 561943A US 3453783D A US3453783D A US 3453783DA US 3453783 A US3453783 A US 3453783A
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- US
- United States
- Prior art keywords
- slices
- polishing
- block
- rings
- recesses
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Definitions
- a conventional manner of mounting the slices involves affixing the slices to a polishing block by use of cerese wax or beeswax.
- the metal polishing block on which the slices are to be mounted is first heated by placing the block on a hot plate or the like. When hot, the block is rubber with a solid stick of the wax which melts to form a layer of molten wax.
- the wafers are dropped onto the molten wax and the block removed from the hot plate to permit the wax to solidify.
- a weight is placed on the slices during solidification of the wax. Any wax contacting the top, or exposed face of the slice must be removed with a suitable solvent, such as trichloroethylene.
- the polishing block may then be inverted and the exposed face of the wafer contacted with a rotating grinder or polisher, or alternatively the slices are rotated and contacted with a stationary grinder or polisher.
- the wax used to affix them to the polishing block must be very clean since any particles lodging beneath the slice could cause a crack to form during application of the weight or during the grinding and polishing operations destroying the electrical properties of the silicon.
- the polishing block When polishing of the slices has been completed, the polishing block is again placed on a hot plate or the like to remelt the wax to permit removal of the slices.
- the slices upon removal and before treatment with doping agents and the like, must be cleaned with a suitable solvent such as trichloroethylene to remove any wax adhering to the slice.
- the present invention involves apparatus which greatly reduces the time necessary to mount and demount slices which are to be ground and polished.
- the invention may be generally described as apparatus for holding thin slices so that one face of the slice is exposed for polishing which includes means defining an opening having a configuration within which the slice may be relatively snugly accommodated.
- An elastomeric member forms with the opening a recess having a depth less than the thickness of the slice, and the elastomeric element is supported in this relationship by suitable means.
- FIGURE 1 is a top plan view of one embodiment of the invention.
- FIGURE 2 is a cross-sectional view along line 2-2 of FIGURE 1;
- FIGURES 3 is an enlarged cross-sectional view of a portion of the embodiment illustrated in FIGURES 1 and 2;
- FIGURE 4 is a partial top plan view of an alternative embodiment.
- a conventional polishing block 4 formed of a cylindrical plate of metal or the like is provided about its periphery with a plurality of teeth 5 adapted to engage a gear, not illustrated, for driving the block.
- an adhesive 6, such as Pliobond brand adhesive is an elastomeric member which takes the form of rubber pad 7. Rubber pad 7 preferably has a durometer of about 60 and may conveniently be between and inch thick.
- Affixed to the relatively planar elastomeric surface 10 of pad 7 by an adhesive 8, such as Pliobond brand adhesive are a plurality of opening defining members, such as annular rings 9. Rings 9 are preferably made of a relatively deformable plastic material such as Mylar film which preferably have a thickness on the order of about 7.5 mils. While a Mylar film is preferred, other relatively deformable plastics and rubbers may be used.
- Rings 9 form with pad 7 a plurality of recesses 11 which are adapted to receive, and accommodate relatively snugly, a plurality of silicon slices 12.
- the depth of recesses 11 is less than that of the thickness of the slices 12 so that faces 13 of the slices are exposed above the rings 9 to prevent contact between a grinding or polishing wheel and rings 9.
- Slices 12 may be retained within recesses 11 to permit inversion of the polishing block 4 in the conventional manner by placing a drop of water on the bottom face 14 of the slice. The surface tension of the water will serve to retain the relatively light slices within recesses 11.
- faces 13 and 14 of the slices 12 are rough before polishing.
- Pad 7 due to its elastomeric nature, will conform to the irregularities in face 14 preventing the creation of unwanted stresses in slice 12 during polishing.
- the rings 9 are of a relatively deformable plastic, any engagement of the periphery 15 of the slices with rings 9 during polishing will not result in chipping of the perihpery 15 of slice 12.
- FIG- URES 1-3 While the particular embodiment illustrated in FIG- URES 1-3 is the preferred one, it is also contemplated that a plurality of recesses may be drilled in polishing block 4 and an elastomeric member placed in the bottom of the recess to abs-orb the irregularities in faces 14 of slices 12.
- the peripheries of the recesses would be lined with a relatively deformable material to protect the peripheries 15 of the slices during the polishing.
- rings 9 may be formed of a ferromagnetic metal in which case block 4 could be magnetized and the rings 9 adhered directly to the surface of block 4 by magnetic attraction. An elastomeric pad could then be placed in the bottom of rings 9 and adhered in place by any suitable adhesive.
- the need for the adhesive used in the embodiment shown in FIG- URES 1-3 is eliminated.
- the polishing block 16 is covered with an elastomeric' pad 17 which in turn is covered by a circular Mylar film 18 having a plurality of apertures 19 which, with pad 17, define recesses 20 adapted to receive silicon slices 12.
- the elastomeric pad 17 and Mylar film 18 are retained in juxtaposition by a plurality of nuts 21 which are threadably received about a plurality of screws 22 extending through block 16, pad 17 and film 18.
- the slices 12 illustrated in FIGURES 13 may be removed by flowing water into recesses 11 to float the slices from the recesses 11.
- the slices 12 illustrated in FIGURE 4 are removed in the same manner.
- the adhesive used in the embodiment illustrated in FIG- URES l-3 is preferably one which will withstand repeated application of Water without deterioration.
- An apparatus for holding a plurality of thin wafers so that one face of each Wafer is exposed for polishing comprising:
- annular rings comprise a magnetized ferromagnetic material.
Description
July 8, 1969 w. D. QUEEN 3,453,783
APPARATUS FOR HOLDING SILICON SLICES Filed June 50, 1966 INVENTORZ l LIAM D. U FIG. 3 WL O EEN ATTORNEY United States Patent 3,453,783 APPARATUS FOR HOLDING SILICON SLICES William D. Queens, Dallas, Tex., assignor to Texas Instruments Incorporated, Dallas, Tex., a corporation of Delaware Filed June 30, 1966, Ser. No. 561,943 Int. Cl. B24b 41/06, /00, 29/00 US. Cl. 51-216 3 Claims ABSTRACT OF THE DISCLOSURE This invention relates to apparatus for holding thin wafers for polishing, and more particularly, but not by way of limitation, to apparatus for holding silicon slices for polishing.
In the manufacture of electronic devices from silicon, it is common to form relatively thin silicon slices which must be polished on at least one face.
A conventional manner of mounting the slices involves affixing the slices to a polishing block by use of cerese wax or beeswax. The metal polishing block on which the slices are to be mounted is first heated by placing the block on a hot plate or the like. When hot, the block is rubber with a solid stick of the wax which melts to form a layer of molten wax. The wafers are dropped onto the molten wax and the block removed from the hot plate to permit the wax to solidify. To assure that the slices are level on the polishing block, a weight is placed on the slices during solidification of the wax. Any wax contacting the top, or exposed face of the slice must be removed with a suitable solvent, such as trichloroethylene. The polishing block may then be inverted and the exposed face of the wafer contacted with a rotating grinder or polisher, or alternatively the slices are rotated and contacted with a stationary grinder or polisher.
Since the slices are relatively thin, in some cases having a thickness of about mils, the wax used to affix them to the polishing block must be very clean since any particles lodging beneath the slice could cause a crack to form during application of the weight or during the grinding and polishing operations destroying the electrical properties of the silicon.
When polishing of the slices has been completed, the polishing block is again placed on a hot plate or the like to remelt the wax to permit removal of the slices. The slices, upon removal and before treatment with doping agents and the like, must be cleaned with a suitable solvent such as trichloroethylene to remove any wax adhering to the slice.
The steps of mounting and demounting the slices are time consuming, manual operations which are quite costly.
The present invention involves apparatus which greatly reduces the time necessary to mount and demount slices which are to be ground and polished. The invention may be generally described as apparatus for holding thin slices so that one face of the slice is exposed for polishing which includes means defining an opening having a configuration within which the slice may be relatively snugly accommodated. An elastomeric member forms with the opening a recess having a depth less than the thickness of the slice, and the elastomeric element is supported in this relationship by suitable means.
ice
To be more specific, reference is here made to the drawings, in which:
FIGURE 1 is a top plan view of one embodiment of the invention;
FIGURE 2 is a cross-sectional view along line 2-2 of FIGURE 1;
FIGURES 3 is an enlarged cross-sectional view of a portion of the embodiment illustrated in FIGURES 1 and 2; and
FIGURE 4 is a partial top plan view of an alternative embodiment.
With reference to FIGURES l, 2, and 3 a conventional polishing block 4 formed of a cylindrical plate of metal or the like is provided about its periphery with a plurality of teeth 5 adapted to engage a gear, not illustrated, for driving the block. Affixed to the surface of block 4 by an adhesive 6, such as Pliobond brand adhesive, is an elastomeric member which takes the form of rubber pad 7. Rubber pad 7 preferably has a durometer of about 60 and may conveniently be between and inch thick. Affixed to the relatively planar elastomeric surface 10 of pad 7 by an adhesive 8, such as Pliobond brand adhesive, are a plurality of opening defining members, such as annular rings 9. Rings 9 are preferably made of a relatively deformable plastic material such as Mylar film which preferably have a thickness on the order of about 7.5 mils. While a Mylar film is preferred, other relatively deformable plastics and rubbers may be used.
Rings 9 form with pad 7 a plurality of recesses 11 which are adapted to receive, and accommodate relatively snugly, a plurality of silicon slices 12. The depth of recesses 11 is less than that of the thickness of the slices 12 so that faces 13 of the slices are exposed above the rings 9 to prevent contact between a grinding or polishing wheel and rings 9.
With particular reference to FIGURE 3, it will be noted that faces 13 and 14 of the slices 12 are rough before polishing. Pad 7, due to its elastomeric nature, will conform to the irregularities in face 14 preventing the creation of unwanted stresses in slice 12 during polishing. Additionally since the rings 9 are of a relatively deformable plastic, any engagement of the periphery 15 of the slices with rings 9 during polishing will not result in chipping of the perihpery 15 of slice 12.
While the particular embodiment illustrated in FIG- URES 1-3 is the preferred one, it is also contemplated that a plurality of recesses may be drilled in polishing block 4 and an elastomeric member placed in the bottom of the recess to abs-orb the irregularities in faces 14 of slices 12. Preferably, the peripheries of the recesses would be lined with a relatively deformable material to protect the peripheries 15 of the slices during the polishing.
It is also contemplated that rings 9 may be formed of a ferromagnetic metal in which case block 4 could be magnetized and the rings 9 adhered directly to the surface of block 4 by magnetic attraction. An elastomeric pad could then be placed in the bottom of rings 9 and adhered in place by any suitable adhesive.
In the embodiment illustrated in FIGURE 4, the need for the adhesive used in the embodiment shown in FIG- URES 1-3 is eliminated. In FIGURE 4, the polishing block 16 is covered with an elastomeric' pad 17 which in turn is covered by a circular Mylar film 18 having a plurality of apertures 19 which, with pad 17, define recesses 20 adapted to receive silicon slices 12. The elastomeric pad 17 and Mylar film 18 are retained in juxtaposition by a plurality of nuts 21 which are threadably received about a plurality of screws 22 extending through block 16, pad 17 and film 18.
Once the slices 12 illustrated in FIGURES 13 have been polished, they may be removed by flowing water into recesses 11 to float the slices from the recesses 11. The slices 12 illustrated in FIGURE 4 are removed in the same manner.
Because the slices are preferably retained in recesses 11 by use of Water and are demounted by use of Water, the adhesive used in the embodiment illustrated in FIG- URES l-3 is preferably one which will withstand repeated application of Water without deterioration.
While rather specific terms have been used in describing embodiments of the invention, they are not intended nor should they be construed as a limitation on the invention as defined by the claims.
What is claimed is:
1. An apparatus for holding a plurality of thin wafers so that one face of each Wafer is exposed for polishing, comprising:
a block having a planar surface,
an elastomeric sheet affixed to said surface,
and a plurality of annular rings afiixed to said elastomeric sheet within which said wafers may be relatively snugly accommodated,
.4 said rings being of height less than the thickness of said Wafers. 2. The apparatus of claim 1, wherein said annular rings are of a relatively deformable plastic material.
3. The apparatus of claim 1, wherein said annular rings comprise a magnetized ferromagnetic material.
References Cited UNITED STATES PATENTS 1,673,903 6/1928 Cripe 51 216 XR 1,911,221 5/1933 Blair 51-216 2,112,636 3/1938 Sawyer. 2,309,080 1/1'943 Hunt 51-283 x 2,395,700 2/1946 Walker 51 216 2,539,561 1/1951 Wolfskill 51 133 2,632,288 3/1953 Diller 51 237 X 2,736,993 3/1956 Tripp 51 131 2,699,633 1/1955 Lapenas 51 216 HAROLD D. WHITEHEAD, Primary Examiner.
US. Cl. X.R. 51--13l, 237
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56194366A | 1966-06-30 | 1966-06-30 |
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US3453783A true US3453783A (en) | 1969-07-08 |
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US561943A Expired - Lifetime US3453783A (en) | 1966-06-30 | 1966-06-30 | Apparatus for holding silicon slices |
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Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3593462A (en) * | 1969-03-24 | 1971-07-20 | Western Electric Co | Apparatus for abrading articles |
US3699722A (en) * | 1970-11-23 | 1972-10-24 | Radiation Inc | Precision polishing of semiconductor crystal wafers |
JPS49125995A (en) * | 1973-04-04 | 1974-12-03 | ||
FR2384589A1 (en) * | 1977-03-22 | 1978-10-20 | Wacker Chemitronic | PROCESS FOR BONDING DISCS INTENDED TO BE POLISHED WITH MASTIC |
US4132037A (en) * | 1977-02-28 | 1979-01-02 | Siltec Corporation | Apparatus for polishing semiconductor wafers |
US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
US4239567A (en) * | 1978-10-16 | 1980-12-16 | Western Electric Company, Inc. | Removably holding planar articles for polishing operations |
US4332636A (en) * | 1979-05-03 | 1982-06-01 | Ferranti Limited | Method of bonding an optical element to a support |
US4397208A (en) * | 1979-10-17 | 1983-08-09 | Stalhut B R | Jewelry tag marking method |
DE3319327A1 (en) * | 1982-06-01 | 1983-12-01 | General Signal Corp., 06904 Stamford, Conn. | Work support device for thin disc-like workpieces |
US4512113A (en) * | 1982-09-23 | 1985-04-23 | Budinger William D | Workpiece holder for polishing operation |
US4519168A (en) * | 1979-09-18 | 1985-05-28 | Speedfam Corporation | Liquid waxless fixturing of microsize wafers |
US4530139A (en) * | 1983-09-23 | 1985-07-23 | At&T Bell Laboratories | Method of contouring crystal plates |
EP0185767A1 (en) * | 1984-05-29 | 1986-07-02 | MITSUI TOATSU CHEMICALS, Inc. | Film for machining wafers |
US4689001A (en) * | 1985-04-23 | 1987-08-25 | Plasti-Bat, Inc. | Bat for potters wheel |
EP0517594A1 (en) * | 1991-06-06 | 1992-12-09 | Commissariat A L'energie Atomique | Polishing machine with a tensioned finishing belt and an improved work supporting head |
FR2677293A1 (en) * | 1991-06-06 | 1992-12-11 | Commissariat Energie Atomique | Polishing machine with improved wafer-support head |
US5365700A (en) * | 1991-06-04 | 1994-11-22 | Fujitsu Limited | Apparatus and method for producing magnetic head sliders |
US5398459A (en) * | 1992-11-27 | 1995-03-21 | Kabushiki Kaisha Toshiba | Method and apparatus for polishing a workpiece |
US5533924A (en) * | 1994-09-01 | 1996-07-09 | Micron Technology, Inc. | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers |
US6152807A (en) * | 1998-07-07 | 2000-11-28 | International Business Machines Corporation | Lapping and polishing fixture having flexible sides |
US6419555B1 (en) * | 1999-06-03 | 2002-07-16 | Brian D. Goers | Process and apparatus for polishing a workpiece |
EP1839812A2 (en) * | 2006-03-31 | 2007-10-03 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
US20080003934A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080003932A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080064310A1 (en) * | 2006-09-08 | 2008-03-13 | Chung-Chih Feng | Polishing pad having hollow fibers and the method for making the same |
US20090252876A1 (en) * | 2007-05-07 | 2009-10-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US20100048105A1 (en) * | 2006-11-21 | 2010-02-25 | 3M Innovative Properties Company | Lapping Carrier and Method |
US20110281504A1 (en) * | 2010-05-11 | 2011-11-17 | Disco Corporation | Grinding method for workpiece having a plurality of bumps |
CN102581737A (en) * | 2012-03-27 | 2012-07-18 | 赫得纳米科技(昆山)有限公司 | Modified structure of polishing epoxy plate |
US20130267155A1 (en) * | 2012-04-09 | 2013-10-10 | Phuong Van Nguyen | Wafer Polishing Pad Holder Template |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1673903A (en) * | 1925-06-15 | 1928-06-19 | Libbeyowens Sheet Glass Compan | Grinding and polishing table |
US1911221A (en) * | 1926-05-06 | 1933-05-30 | Libbey Owens Ford Glass Co | Glass surfacing apparatus |
US2112636A (en) * | 1936-09-02 | 1938-03-29 | Brush Dev Co | Method of making piezoelectric units |
US2309080A (en) * | 1941-12-06 | 1943-01-19 | Grover C Hunt | Work holder for grinding machines |
US2395700A (en) * | 1943-03-23 | 1946-02-26 | Alncin Inc | Method and apparatus for shaping optical objects and the like |
US2539561A (en) * | 1946-12-13 | 1951-01-30 | John M Wolfskill | Piezoelectric crystal lapping apparatus |
US2632288A (en) * | 1951-02-02 | 1953-03-24 | Alfred I Diller | Lens grinding and polishing machine |
US2699633A (en) * | 1949-02-09 | 1955-01-18 | Optron Lab | Precision supporting of articles |
US2736993A (en) * | 1953-03-25 | 1956-03-06 | American Optical Corp | Abrading apparatus |
-
1966
- 1966-06-30 US US561943A patent/US3453783A/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1673903A (en) * | 1925-06-15 | 1928-06-19 | Libbeyowens Sheet Glass Compan | Grinding and polishing table |
US1911221A (en) * | 1926-05-06 | 1933-05-30 | Libbey Owens Ford Glass Co | Glass surfacing apparatus |
US2112636A (en) * | 1936-09-02 | 1938-03-29 | Brush Dev Co | Method of making piezoelectric units |
US2309080A (en) * | 1941-12-06 | 1943-01-19 | Grover C Hunt | Work holder for grinding machines |
US2395700A (en) * | 1943-03-23 | 1946-02-26 | Alncin Inc | Method and apparatus for shaping optical objects and the like |
US2539561A (en) * | 1946-12-13 | 1951-01-30 | John M Wolfskill | Piezoelectric crystal lapping apparatus |
US2699633A (en) * | 1949-02-09 | 1955-01-18 | Optron Lab | Precision supporting of articles |
US2632288A (en) * | 1951-02-02 | 1953-03-24 | Alfred I Diller | Lens grinding and polishing machine |
US2736993A (en) * | 1953-03-25 | 1956-03-06 | American Optical Corp | Abrading apparatus |
Cited By (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3593462A (en) * | 1969-03-24 | 1971-07-20 | Western Electric Co | Apparatus for abrading articles |
US3699722A (en) * | 1970-11-23 | 1972-10-24 | Radiation Inc | Precision polishing of semiconductor crystal wafers |
JPS49125995A (en) * | 1973-04-04 | 1974-12-03 | ||
US4132037A (en) * | 1977-02-28 | 1979-01-02 | Siltec Corporation | Apparatus for polishing semiconductor wafers |
FR2384589A1 (en) * | 1977-03-22 | 1978-10-20 | Wacker Chemitronic | PROCESS FOR BONDING DISCS INTENDED TO BE POLISHED WITH MASTIC |
US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
US4239567A (en) * | 1978-10-16 | 1980-12-16 | Western Electric Company, Inc. | Removably holding planar articles for polishing operations |
US4332636A (en) * | 1979-05-03 | 1982-06-01 | Ferranti Limited | Method of bonding an optical element to a support |
US4519168A (en) * | 1979-09-18 | 1985-05-28 | Speedfam Corporation | Liquid waxless fixturing of microsize wafers |
US4397208A (en) * | 1979-10-17 | 1983-08-09 | Stalhut B R | Jewelry tag marking method |
DE3319327A1 (en) * | 1982-06-01 | 1983-12-01 | General Signal Corp., 06904 Stamford, Conn. | Work support device for thin disc-like workpieces |
US4512113A (en) * | 1982-09-23 | 1985-04-23 | Budinger William D | Workpiece holder for polishing operation |
US4530139A (en) * | 1983-09-23 | 1985-07-23 | At&T Bell Laboratories | Method of contouring crystal plates |
EP0185767A1 (en) * | 1984-05-29 | 1986-07-02 | MITSUI TOATSU CHEMICALS, Inc. | Film for machining wafers |
EP0185767A4 (en) * | 1984-05-29 | 1987-09-02 | Mitsui Toatsu Chemicals | Film for machining wafers. |
US4689001A (en) * | 1985-04-23 | 1987-08-25 | Plasti-Bat, Inc. | Bat for potters wheel |
US5365700A (en) * | 1991-06-04 | 1994-11-22 | Fujitsu Limited | Apparatus and method for producing magnetic head sliders |
EP0517594A1 (en) * | 1991-06-06 | 1992-12-09 | Commissariat A L'energie Atomique | Polishing machine with a tensioned finishing belt and an improved work supporting head |
FR2677293A1 (en) * | 1991-06-06 | 1992-12-11 | Commissariat Energie Atomique | Polishing machine with improved wafer-support head |
US5398459A (en) * | 1992-11-27 | 1995-03-21 | Kabushiki Kaisha Toshiba | Method and apparatus for polishing a workpiece |
US5533924A (en) * | 1994-09-01 | 1996-07-09 | Micron Technology, Inc. | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers |
US5664988A (en) * | 1994-09-01 | 1997-09-09 | Micron Technology, Inc. | Process of polishing a semiconductor wafer having an orientation edge discontinuity shape |
US6152807A (en) * | 1998-07-07 | 2000-11-28 | International Business Machines Corporation | Lapping and polishing fixture having flexible sides |
US6442825B1 (en) | 1998-07-07 | 2002-09-03 | International Business Machines Corporation | Lapping and polishing fixture having flexible sides |
US6419555B1 (en) * | 1999-06-03 | 2002-07-16 | Brian D. Goers | Process and apparatus for polishing a workpiece |
US8485866B2 (en) | 2006-03-31 | 2013-07-16 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
US8267746B2 (en) | 2006-03-31 | 2012-09-18 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
EP1839812A3 (en) * | 2006-03-31 | 2008-01-02 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
KR101081415B1 (en) | 2006-03-31 | 2011-11-08 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate holding apparatus, polishing apparatus and retainer ring |
US20080318492A1 (en) * | 2006-03-31 | 2008-12-25 | Hozumi Yasuda | Substrate holding apparatus, polishing apparatus, and polishing method |
US7967665B2 (en) | 2006-03-31 | 2011-06-28 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
US20070232193A1 (en) * | 2006-03-31 | 2007-10-04 | Hozumi Yasuda | Substrate holding apparatus, polishing apparatus, and polishing method |
US20080318499A1 (en) * | 2006-03-31 | 2008-12-25 | Hozumi Yasuda | Substrate holding apparatus, polishing apparatus, and polishing method |
EP1839812A2 (en) * | 2006-03-31 | 2007-10-03 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
US8100739B2 (en) | 2006-03-31 | 2012-01-24 | Ebara Corporation | Substrate holding apparatus, polishing apparatus, and polishing method |
US20080003932A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US7629554B2 (en) | 2006-07-03 | 2009-12-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7789738B2 (en) * | 2006-07-03 | 2010-09-07 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7316605B1 (en) | 2006-07-03 | 2008-01-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US20080003934A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Sheet for mounting polishing workpiece and method for making the same |
US20080064310A1 (en) * | 2006-09-08 | 2008-03-13 | Chung-Chih Feng | Polishing pad having hollow fibers and the method for making the same |
US8137157B2 (en) | 2006-11-21 | 2012-03-20 | 3M Innovative Properties Company | Lapping carrier and method |
US20100048105A1 (en) * | 2006-11-21 | 2010-02-25 | 3M Innovative Properties Company | Lapping Carrier and Method |
US8795033B2 (en) | 2006-11-21 | 2014-08-05 | 3M Innovative Properties Company | Lapping carrier and method |
US20090252876A1 (en) * | 2007-05-07 | 2009-10-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US20110281504A1 (en) * | 2010-05-11 | 2011-11-17 | Disco Corporation | Grinding method for workpiece having a plurality of bumps |
US8579678B2 (en) * | 2010-05-11 | 2013-11-12 | Disco Corporation | Grinding method for workpiece having a plurality of bumps |
CN102581737A (en) * | 2012-03-27 | 2012-07-18 | 赫得纳米科技(昆山)有限公司 | Modified structure of polishing epoxy plate |
CN102581737B (en) * | 2012-03-27 | 2015-03-18 | 赫得纳米科技(昆山)有限公司 | Modified structure of polishing epoxy plate |
US20130267155A1 (en) * | 2012-04-09 | 2013-10-10 | Phuong Van Nguyen | Wafer Polishing Pad Holder Template |
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