US3652332A - Manufacture of printed circuits - Google Patents
Manufacture of printed circuits Download PDFInfo
- Publication number
- US3652332A US3652332A US52520A US3652332DA US3652332A US 3652332 A US3652332 A US 3652332A US 52520 A US52520 A US 52520A US 3652332D A US3652332D A US 3652332DA US 3652332 A US3652332 A US 3652332A
- Authority
- US
- United States
- Prior art keywords
- ink
- film
- substrate
- printing
- papers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Definitions
- This invention relates to the manufacture of electrical components and circuits, and more particularly to low-cost production thereof by use of high-speed printing equipment.
- Paper is a wholly natural or obvious choice as a printing substrate, and appears to have been contemplated in the early speculative predictions mentioned above. However, there have been found no reported experiments with such a substrate. In view of the results of the investigations which have led to the present invention it may be speculated that the early workers considered substrate porosity as such a handicap that the failures with substrates such as plastics made it appear obvious that results'with porous substrates must be even more remote from acceptability.
- PC printed circuit
- a second main line of development in which impedance elements are also deposited as films by graphic-derived techniques, normally employs a glazed ceramic or similar substrate upon which the films are deposited in various manners which have become known in recent years as thick film and thin film” deposition methods.
- the present invention is in essence an improvement in thick film” technology. (It will of course be understood that the term thick film as used in the art to contrast with thin film” does not alter the ordinary meaning of film as describing a layer which is in either case thin relative to the substrate.)
- the invention is based on experimental investigation of the electrical characteristics of circuit components, particularly resistors, mass-produced by a printing press.
- the experimental data demonstrate that the production of satisfactory electrical circuits in this manner is feasible provided the inks and substrates employed are properly correlated in accordance with the criteria of selection which the invention provides.
- the principal object of the experimental work which resulted in the invention to make the use of a printing press in such circuit production practical, the broader aspects of the teachings may be employed to improve and simplify other production methods, such as those employing silkscreening and similar methods of deposition of films on substrates.
- the present invention flows from observation that a printing-press has a greater inherent capability for producing wholly uniform film deposition than other pattern-producing methods, followed by investigation of the manner in which this potential superiority can be realized in terms of reliability of electrical characteristics of the deposited films.
- As a result of experimental investigation of parameters producing a wide range of results as regards useability of the printed circuit output it has been ascertained that the assumption apparently heretofore made that non-porous materials are superior to porous materials as regards ability to produce electrical uniformity of deposited films of inks and paints is erroneous if the porosity characteristics of the substrate are properly related to the composition of the ink or paint employed.
- the type of film-pattern deposition typified by employment of a printing press, silk screen, etc., employs a liquid or semiliquid composition of the type known variously as an ink, a paint or a paste, dependent primarily on the general degree of viscosity or plasticity.
- a medium in general consists of particles of solid material, herein called the pigment, along with liquid components in which the particulate matter is dispersed to give the overall composition the liquid or semiliquid character required for the process employed and to provide an ultimate binder for the particles and adherence to the substrate.
- the liquid components are partially solidified and partially eliminated by evaporation, etc., with the solidified portion forming a binder or matrix holding the pigment particles and adhering to the substrate.
- most compositions for forming such films have substantially more than two components.
- Ink and paint compositions commonly employ separate constituents for the binder material and a diluent employed to impart the desired viscosity properties, and there are also present additives to speed the drying or curing and for similar purposes.
- the current pattern through such a conductor is wholly different than that through a wire, the overall conductivity of such a conductor being primarily determined by randomly-occurring regions of low conductivity. Nevertheless, because the primary performance requirement of a conductor is some minimum of conductivity, i.e., a maximum resistance, a small excess of binder can be tolerated, although not desirable.
- the film is deposited with substantial excess liquid vehicle and the excess vehicle is removed from the film prior to solidification by a filtering action which leaves the pigment in a relatively low concentration of binder material on the surface of the substrate to closely approximate the idealized film-production already discussed.
- the ink is deposited with an excess of binder on a porous substrate surface having a pore-size selected to act as a filter passing the excess binder while admitting relatively little ofthe pigment from the surface of the substrate.
- the liquid of the ink composition is removed to the point where the film, upon drying, contains an amount of binder closely approximating the theoretical optimum earlier described.
- the constancy of resistance values from one circuit to the next obtained in the printing-press production of circuits compares favorably with that obtained by far more complex and expensive production methods.
- the pore-structure for producing the filtering action is selected by experimental matching to the characteristics of the particular ink composition, particularly in accordance with the size of the particles of the resistive pigment (normally carbon).
- the most readily available and inexpensive type of porous substrate material is of course paper. It is found, however, that most ordinary papers are not suitable with the pigments most practical for use. As in the case of an ordinary discrete carbon resistor, the employment of relatively coarse carbon particles produces resistors of prohibitively high noisegeneration, as well as making reproducibility of resistance values difiicult or impossible. It is found that papers selected without care, when employed with pigments of relatively fine particle-size giving the best resistor performance, produce wholly insufficient filtering action.
- the ink is absorbed in the paper with little or no filtering action, and the results are at least as unacceptable as in the case of impervious substrates.
- the pigment With proper pore structure at the surface of the substrate, the pigment is retained in the surface while the excess binder is absorbed into the body of the substrate.
- the binder Upon solidification of the binder, there remains on the surface a matrix containing the pigment particles with approximately the minimum amount of binder required to provide cohesiveness. This is securely bound to the substrate by the absorbed binder material, which contains relatively little pigment.
- the concentration of binder in the surface film can be well below that required to obtain adherence to a nonporous substrate.
- porous substrates may be employed successfully.
- clay-coated papers appear most suitable for use with the fine-ground carbon pigments which are preferred for resistive components.
- the invention further provides certain improvements or refinements of the general process as above described.
- Practical printing of electronic circuits requires a plurality of successive layers or superimposed films.
- Conductor patterns are coupled to margins of resistive patterns and capacitors are desirably formed by a number of successive layers of deposition. Layers above the first layer cannot employ the filtering action described above. This is found to constitute no major restriction on the utility of the invention, since it is only the resistance elements in which the filtering action is found highly critical to acceptability. Accordingly, the over-printing of successive layers of non-resistive ink patterns may, if so desired, be performed with inks of the same composition as the base layer.
- inks which permit substantial removal of liquid by means other than fluid flow.
- One manner of accomplishing this is by employment of a combustible liquid as a primary constituent, deposition of the film being followed by flaming or flashing.
- Such a printing process is greatly advantageous in that it providesvery rapid curing of the binder constituent and overall drying of the film.
- resistive films where precision is required, a type of ink which dries more slowly but gives somewhat better compaction of the pigment particles as a result of the filtering action of the substrate.
- FIG. 1 is a schematic enlarged fragmentary sectional view of a printed circuit element made in accordance with the invention
- FIG. 2 is a schematic illustration of the random-contact orientation of pigment particles when incorporated in a substantial excess of binder
- FIG. 3 is a schematic diagram corresponding to FIG. 2 but illustrating a more ideal relation of pigment particles
- FIG. 4 is an idealized graph illustrating the general approximate relation between resistance and substrate pore-size for film patterns formed by identical deposition of a given printing ink
- FIG. 5 is a schematic illustration of the operation of a rotary letterpress printing press employed in the printing of circuits in accordance withthe invention.
- FIG. -6 is a fragmentary schematic sectional view of a capacitor formed by overprinting a number of layers in accordance with the invention.
- FIG. 1 there is there illustrated in schematic form a greatly magnified section of a printed circuit element of the invention comprising a resistance element film pattern 10 on a substrate generally indicated at 12.
- a printed circuit element of the invention comprising a resistance element film pattern 10 on a substrate generally indicated at 12.
- Appropriate film pattern shapes for formation of circuit elements are well-known, for example as shown in US. Pat. No. 3,484,654 of Vladimir Paul I-Ioneiser, and accordingly not illustrated.
- the substrate is here a coated paper, the body 14 being coated with a surface layer of a filter coating 16, such as the clay coating of certain commercially available papers later mentioned.
- a coating on only one side is illustrated, it will of course be understood that coatings on both sides are employed where circuit patterns are printed on both sides of a substrate.
- the expected general or gross effect of varying the porosity characteristics of substrates upon resistance values of a resistive film, with deposit of a given quantity of the same ink in a predetermined pattern, is shown in the graph of FIG. 4.
- the porosity or pore-size characteristics may be considered to have three general regions.
- the lowermost region is designated that of impermeability and has as its lower limit a substrate which is wholly impermeable, such as a solid sheet of smooth plastic, a paper with a coating of solid plastic, or a glazed ceramic.
- a substrate which is wholly impermeable such as a solid sheet of smooth plastic, a paper with a coating of solid plastic, or a glazed ceramic.
- FIG. 5 a schematic illustration of the rotary letterpress printing process.
- the invention in its broad aspects may be employed with printing processes and equipment of other types, these presently appear to be less satisfactory. It is found that the reproduction of resistance values is a far more sensitive indicator of uniformity of deposited films than any other known, and that best results are obtained with the rotary letterpress process.
- the illustrated rotary letterpress will be recognized as conventional by those skilled in the printing arts.
- the plate cylinder 22 and the impression cylinder 24 rotate at constant speed to deposit on the substrate, on the plate pattern, the ink delivered to the patterned plate by the train of inking rollers 26 from a suitable ink reservoir and fountain rolls.
- the constant-speed rotary motion of all components produces a uniformity of film deposition from sample to sample which cannot be achieved in any other known manner.
- assuring constancy of film deposition from sample to sample has been found to be wholly insufficient in itself to produce corresponding uniformity of the electrical characteristics of circuits so printed.
- no fully satisfactory results are found to be obtained with either impervious substrate materials or with papers not giving the filtering action earlier described.
- the commercially available papers found most desirable are papers having a coated surface of much finer pore structure than the body or core.
- Particularly advantageous are papers having a surface layer of fine-ground particles, such as claycoated papers.
- Even among papers of this description there are appreciable differences in merit as measured by variation of resistance values among a large number of samples printed on each particular paper. However these differences in merit (as measured by the statistical variation of individual samples about the mean resistance value obtained with the particular paper) are relatively minor as compared with the superiority of any of such coated papers over either uncoated papers, on the one hand, or impermeable substrates, on the other.
- the papers found to produce the best resistive films were commercially available papers of the type generally called clay-coated," having a fine-pared smooth printing surface overlying the more coarsely porous body. Even within this group, which are sufficiently similar so that quantitative information on relevant structural differences is not available, there were observed differences in merit of the circuits produced, even though these differences were relatively small as compared with the differences between this group as a whole and papers lying outside the porosity range wherein wholly useable resistors are obtained.
- curing of the binder is effected by polymerization and air oxidation, either at room temperature or, for somewhat greater speed, in a suitable oven.
- Common components of the binder of such an ink vehicle are certain alkyds, vegetable oils, hydrocarbons and linseed oil.
- the type of ink known as heatset" normally employs as the binder a suitable varnish thinned to the desired consistency by a relatively non-volatile hydrocarbon composition of fairly low flash point, and is dried rapidly by a burning-off of the hydrocarbon by flaming.
- the filtering action of the invention may not proceed to completion and the degree of compaction of the pigment obtained is not quite as high.
- the result is that resistors printed with heatset inks and cured by flaming tend to have a somewhat higher deviation of resistance values from one sample to the next than the best results obtainable with the oxidizable inks. (Note that it is not generally possible to produce an exact match of the amount of pigment deposited on a given pattern area with different types of inks but with the same settings of other press conditions so that correlation between mean resistance value and absence of sample-to-sample variations cannot be expected in such comparisons).
- oxidizable inks papers found best for use, with proper press adjustment, show as little as less than 3 percent average deviation of resistance values over a large number of samples in some runs. Average percentage deviations with heatset inks were somewhat higher, but the oxidizable inks were found less satisfactory when sought to be employed for overprinting a layer already printed, particularly in building up a large number of layers, as in a capacitor construction such as shown in FIG. 6.
- Such a construction employs a conductive film 30 directly deposited on the substrate 32. Over this are deposited a number of layers (of the order of five to ten) of dielectric films to form the overall dielectric 34, upon which is printed a further conductor 36 forming the upper electrode of the capacitor.
- Exemplary oxidizable ink formulations suitable for use with clay-coated papers for direct surface application are:
- Resistive ink 17 parts carbon black (Cabot XC727R); 40 parts alkyd (LV498); 31 parts Magic Oil No. 470; parts boiled linseed oil; and two parts dryer (337).
- Conductive ink 59 parts flake silver (Silflake 135); 10 parts alkyd (V172); 10 parts Magic Oil No. 470; 10 parts boiled linseed oil; and one part dryer (337).
- Dielectric ink 75 parts barium titanate; eight parts alkyd (V498); eight parts alkyd (V172); seven parts boiled linseed oil; and two parts dryer (337).
- Desirable compositions for heatset inks are:
- Resistive ink parts carbon black (Cabot XC727R); 78 parts varnish (El4-24A); and seven parts Magie Oil No. 400.
- Conductive ink 70 parts silver flake (Silfiake 135); parts varnish (El4-24A); and 10 parts Magic Oil No. 440.
- Dielectric ink 80 parts barium titanate; 11 parts varnish (El4-34A); five parts Magic Oil” No. 440; 3% parts alkyd (V l 72); and one-halfpart dryer (337),
- ком ⁇ онент For composite-type inks, mixtures of equal parts of the respective resistive and conductive inks above are found suitable.
- a desirable formulation is: 67 parts barium titanate; 19% parts varnish (El4-B34A); eight parts Magic Oil" No. 440; five parts alkyd (V172); one-fourth part dryer (337); and one-fourth part non-dryer (Eugenol).
- the time for completion of the filtering action is not determined wholly by the porosity of the coating, but depends on a number of other factors such as the coating thickness and the coarseness or fineness of the body of the paper.
- desirable carbon resistive pigments it is believed that the end-point of penetration is more or less automatically established by the capillary counter-force exerted by the filtered pigment residue as it reaches its compacted condition.
- coarser pigments it may be possible to reach a condition of over-extraction of vehicle, in which case cohesiveness of the film will be adversely affected.
- the printed circuits so produced are desirably encapsulated or terminals extending), preferably a multilayer laminate of plastics designed to prevent all types of substances, as well as thermal effects, from producing change in the film resistance.
- a laminate including polyethylene, Saran, Surlyn, and nylon was found particularly desirable for this purpose.
- the encapsulation may be done by dipping, and a suitable wax applied for additional moistureproofing after curing of the encapsulant.
- the leads or terminals preferably attached to the printed film structure by a conductive epoxy cement, are of course embedded in the encapsulant except for their extending ends, as is conventional.
- porous body is paper.
- the paper comprises a body portion having a porous coating on said surface of substantially smaller pore-size than the body portion.
Abstract
Description
Claims (6)
- 2. The method of claim 1 wherein the vehicle is filtered from the surface film by absorption in a porous body.
- 3. The method of claim 2 wherein the porous body is the substrate.
- 4. The method of claim 3 wherein the porous body is paper.
- 5. The method of claim 4 wherein the paper comprises a body portion having a porous coating on said surface of substantially smaller pore-size than the body portion.
- 6. The method of claim 5 wherein the paper is clay-coated.
- 7. The method of claim 1 wherein the pigment particles are carbon and the printed elements are resistors.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5252070A | 1970-07-06 | 1970-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3652332A true US3652332A (en) | 1972-03-28 |
Family
ID=21978150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US52520A Expired - Lifetime US3652332A (en) | 1970-07-06 | 1970-07-06 | Manufacture of printed circuits |
Country Status (2)
Country | Link |
---|---|
US (1) | US3652332A (en) |
CA (1) | CA929674A (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3784406A (en) * | 1972-01-24 | 1974-01-08 | Esb Inc | Method of applying battery electrodes onto continuous carrier strip |
US3895158A (en) * | 1973-08-15 | 1975-07-15 | Westinghouse Electric Corp | Composite glass cloth-cellulose fiber epoxy resin laminate |
US4045636A (en) * | 1976-01-28 | 1977-08-30 | Bowmar Instrument Corporation | Keyboard switch assembly having printed circuit board with plural layer exposed contacts and undersurface jumper connections |
FR2516740A1 (en) * | 1981-11-17 | 1983-05-20 | Bosch Gmbh Robert | METHOD FOR MAKING ELECTRICALLY CONDUCTIVE ZONES ON A SUPPORT |
EP0411639A2 (en) * | 1989-08-03 | 1991-02-06 | Ibiden Co., Ltd. | Electronic circuit substrate |
WO1991015863A1 (en) * | 1990-04-03 | 1991-10-17 | Vistatech | Pre-engineered electrode/dielectric composite film and related manufacturing process for multilayer ceramic chip capacitors |
FR2709038A1 (en) * | 1993-08-10 | 1995-02-17 | Leroux Gilles Sa | Method of manufacture for a plastic support, manufacturing device for such a support and use of the method for manufacturing integrated circuit cards |
US20030228748A1 (en) * | 2002-05-23 | 2003-12-11 | Nelson Richard A. | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
US20040003734A1 (en) * | 2002-07-02 | 2004-01-08 | Shively J. Thomas | Method and apparatus for printing using an electrically conductive ink |
US20080272983A1 (en) * | 2005-11-14 | 2008-11-06 | Astrium Sas | Method for Producing a Non-Developable Surface Printed Circuit and the Thus Obtained Printed Circuit |
EP2239368A1 (en) * | 2009-04-09 | 2010-10-13 | Cham Paper Group Schweiz AG | Laminar substrate on an organic basis, use of such a substrate and method |
WO2011029865A1 (en) | 2009-09-14 | 2011-03-17 | Felix Schoeller Jr. Foto- Und Spezialpapiere Gmbh & Co. Kg | Substrate for electronic circuits |
CN102686509A (en) * | 2009-11-13 | 2012-09-19 | Vtt科技研究中心 | Method and products related to deposited particles |
US20130099666A1 (en) * | 2011-10-21 | 2013-04-25 | Almax Rp Corp. | Selectively controlling the resistance of resistive traces printed on a substrate to supply equal current to an array of light sources |
US10942070B2 (en) * | 2018-05-21 | 2021-03-09 | Haesung Ds Co., Ltd. | Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and method of manufacturing the temperature sensor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2056928A (en) * | 1930-05-31 | 1936-10-06 | Resistelite Corp | Method of making resistance units |
US2353061A (en) * | 1940-10-29 | 1944-07-04 | Ibm | Circuit connecting device |
US2473183A (en) * | 1947-07-16 | 1949-06-14 | Bates Mfg Co | Electrically conductive fabric |
-
1970
- 1970-07-06 US US52520A patent/US3652332A/en not_active Expired - Lifetime
-
1971
- 1971-04-01 CA CA109366A patent/CA929674A/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2056928A (en) * | 1930-05-31 | 1936-10-06 | Resistelite Corp | Method of making resistance units |
US2353061A (en) * | 1940-10-29 | 1944-07-04 | Ibm | Circuit connecting device |
US2473183A (en) * | 1947-07-16 | 1949-06-14 | Bates Mfg Co | Electrically conductive fabric |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3784406A (en) * | 1972-01-24 | 1974-01-08 | Esb Inc | Method of applying battery electrodes onto continuous carrier strip |
US3895158A (en) * | 1973-08-15 | 1975-07-15 | Westinghouse Electric Corp | Composite glass cloth-cellulose fiber epoxy resin laminate |
US4045636A (en) * | 1976-01-28 | 1977-08-30 | Bowmar Instrument Corporation | Keyboard switch assembly having printed circuit board with plural layer exposed contacts and undersurface jumper connections |
FR2516740A1 (en) * | 1981-11-17 | 1983-05-20 | Bosch Gmbh Robert | METHOD FOR MAKING ELECTRICALLY CONDUCTIVE ZONES ON A SUPPORT |
EP0411639A2 (en) * | 1989-08-03 | 1991-02-06 | Ibiden Co., Ltd. | Electronic circuit substrate |
EP0411639A3 (en) * | 1989-08-03 | 1991-09-25 | Ibiden Co, Ltd. | Electronic circuit substrate |
US5144536A (en) * | 1989-08-03 | 1992-09-01 | Ibiden Co., Ltd. | Electronic circuit substrate |
WO1991015863A1 (en) * | 1990-04-03 | 1991-10-17 | Vistatech | Pre-engineered electrode/dielectric composite film and related manufacturing process for multilayer ceramic chip capacitors |
FR2709038A1 (en) * | 1993-08-10 | 1995-02-17 | Leroux Gilles Sa | Method of manufacture for a plastic support, manufacturing device for such a support and use of the method for manufacturing integrated circuit cards |
EP0710060A1 (en) * | 1993-08-10 | 1996-05-01 | Gilles Leroux S.A. | Process for fabrication of plastic supports, device for fabrication of such a support and application of the process for production of integrated circuit cards |
US20030228748A1 (en) * | 2002-05-23 | 2003-12-11 | Nelson Richard A. | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
EP1383364A2 (en) * | 2002-05-23 | 2004-01-21 | Nashua Corporation | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
EP1383364A3 (en) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture |
US20040003734A1 (en) * | 2002-07-02 | 2004-01-08 | Shively J. Thomas | Method and apparatus for printing using an electrically conductive ink |
WO2004006635A1 (en) * | 2002-07-02 | 2004-01-15 | R.R. Donnelley | Method and apparatus for printing using an electrically conductive ink |
US20080272983A1 (en) * | 2005-11-14 | 2008-11-06 | Astrium Sas | Method for Producing a Non-Developable Surface Printed Circuit and the Thus Obtained Printed Circuit |
US8481858B2 (en) * | 2005-11-14 | 2013-07-09 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
EP2239368A1 (en) * | 2009-04-09 | 2010-10-13 | Cham Paper Group Schweiz AG | Laminar substrate on an organic basis, use of such a substrate and method |
WO2011029865A1 (en) | 2009-09-14 | 2011-03-17 | Felix Schoeller Jr. Foto- Und Spezialpapiere Gmbh & Co. Kg | Substrate for electronic circuits |
US8815375B2 (en) | 2009-09-14 | 2014-08-26 | Schoeller Technocell Gmbh & Co. Kg | Support for electronic circuits |
CN102686509A (en) * | 2009-11-13 | 2012-09-19 | Vtt科技研究中心 | Method and products related to deposited particles |
US20130099666A1 (en) * | 2011-10-21 | 2013-04-25 | Almax Rp Corp. | Selectively controlling the resistance of resistive traces printed on a substrate to supply equal current to an array of light sources |
US10942070B2 (en) * | 2018-05-21 | 2021-03-09 | Haesung Ds Co., Ltd. | Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and method of manufacturing the temperature sensor |
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