Recherche Images Maps Play YouTube Actualités Gmail Drive Plus »
Connexion
Les utilisateurs de lecteurs d'écran peuvent cliquer sur ce lien pour activer le mode d'accessibilité. Celui-ci propose les mêmes fonctionnalités principales, mais il est optimisé pour votre lecteur d'écran.

Brevets

  1. Recherche avancée dans les brevets
Numéro de publicationUS3654585 A
Type de publicationOctroi
Date de publication4 avr. 1972
Date de dépôt11 mars 1970
Date de priorité11 mars 1970
Numéro de publicationUS 3654585 A, US 3654585A, US-A-3654585, US3654585 A, US3654585A
InventeursWickersham Price D
Cessionnaire d'origineBrooks Research And Mfg Inc
Exporter la citationBiBTeX, EndNote, RefMan
Liens externes: USPTO, Cession USPTO, Espacenet
Coordinate conversion for the testing of printed circuit boards
US 3654585 A
Résumé
An array of spring pin contact elements are arranged in a matrix on a uniform rectangular grid and, through a coordinate conversion interface, provide access to the random-arranged contact points of a single or multiple layer printed circuit board for the purpose of conducting electrical tests. The interface is a transition plate constructed in accordance with the artwork of a given board and comprises a baseplate provided with contact pads on one side having the same random arrangement as the contact points of the board, and corresponding contact pads on the opposite side each positioned at an individual contact location having the same planar coordinates as a particular one of the spring pin contact elements. The corresponding pads are electrically interconnected through the baseplate. The board and the interface are supported on a shiftable platen with the random-arranged pads engaging the contact points, the platen being spaced from and aligned with the spring pin elements such that, upon movement of the platen toward the spring pin elements, the pads on the opposite side of the interface are brought into engagement with the elements of like coordinates.
Images(2)
Previous page
Next page
Revendications  disponible en
Description  (Le texte OCR peut contenir des erreurs.)

United States Patent Wickersham [72] Inventor: Price D. Wickersham, Shawnee Mission,

Kans.

[73] Assignee: Brooks Research and Manufacturing, Inc.,

Kansas City, Mo. [22] Filed: Mar. 11, 1970 [21] Appl. No.: 18,486

[52] US. Cl ..339/17 M, 174/685, 324/158 F, 339/18 C, 339/151 B, 339/156 R [51] Int. Cl. ..H05k 1/02 [58] FieldofSearch 339/176; 174/D1G. 3, 68.5; 29/592, 593; 317/101;

[is] 3,654,585 Apr. 4, 1972 1,236,627 6/1960 France ...317/|01 CE Great Britain ..339/18 C Primary Examiner-Marvin A. Champion Assistant Examiner-Terrell P. Lewis AnrneySchmidt, Johnson, Hovey & Williams 57 ABSTRACT interface is a transition plate constructed in accordance with the artwork of a given board and comprises a baseplate pro- 1 vided with contact pads on one side having the same random arrangement as the contact points of the board, and cor- 324/ 158 F responding contact pads on the opposite side each positioned at an individual contact location having the same planar coor- [5 6] References Cited dinates as a particular one of the spring pin contact elements. The corresponding pads are electrically interconnected UNITED STATES PATENTS through the baseplate. The board and the interface are sup- 2,878,587 3/1959 Jubenville ..339/1s P x ported on a Shiftable platen with the random-arranged p 3,043,022 7/1962 Crews et al..... ....339/17 0 x engaging the Contact points, the platen being spewed from and 3,205,469 9/1965 Frank et al ,339/ 18 C aligned with the spring pin elemen Such that, "P mOVe- 3,302,065 1/ 1967 Karol et a1. ..339/18 B X ment of the platen toward the spring pin elements, the pads on 3,406,368 10/ 1968 Curran ..339/l4 R X the opposite side of the interface are brought into engagement 3,434,208 3/1969 Toomey et al.. ..29/626 with the elements of like coordinates. 3,453,586 7/1969 Brendlen, Jr. ..339/45 M 7 Claims, 11 Drawing Figures FORElGN PATENTS OR APPLICATIONS 1,150,441 10/1958 France 339/18 C I y l ,l

ll 1 46 F lllllll ll PATENTEDAPR 41972 3,654,585

m'vg/v'mR. Price D. WIckersham QTTORNEYS:

COORDINATE GONVERSION FOR THE TESTING OF P e. il TED CIRCUIT BOARDS This invention relates generally to the testing of printed circuit boards or the like and, in particular, to a method and structure for making electrical connections to the random-arranged contact points of a single or multiple layer board.

With the continuing use of printed circuit techniques in the construction of electrical apparatus, it has become both desirable and advantageous to employ an automatic circuit analyzer to test printed circuit modules prior to assembly of the composite apparatus. This has led to the recent development of a special fixture for providing access to the various nodes of multilayer printed circuit boards utilized to form the modules. The access fixture permits electrical contact to be made to all of the nodes of a board for the purpose of conducting insulation and continuity resistance tests or general electrical tests. The board to be tested is inserted into the fixture beneath an array of spring pin contacts with each spring pin contact being aligned with a corresponding node on the board. The board issupported by a pneumatically actuated platen which is then caused to shift toward the spring pins to bring the latter into pressure engagement with the nodes. The means by which the platen is actuated is incidental, and may be hydraulic or motor-driven through appropriate gearing.

Since the patterns and layouts of the artwork of printed circuit boards present a nearly infinite variety of spacings and land routings, it has been necessary to accommodate this variable by providing a different spring pin array for each artwork to be tested. Such arrays take the form of matrix boxes which are selectively positionable in the access fixture and are provided with a standard connector to form the interface between the matrix box and the circuit analyzer. This arrangement provides considerable flexibility when testing boards having different artwork in that it is only necessary to change matrix boxes to achieve access to the different node patterns.

Although the foregoing access approach has proven to be successful from the standpoint of operability, it may be appreciated that considerable tooling is required to produce a matrix box for each artwork configuration. This involves the construction of spring pin arrays having different relative locations of the pins thereof to accommodate the unique node spacing of each individual artwork configuration. Manifestly, tooling costs and hence the overall cost of the testing equipment and procedure could be materially reduced if a single matrix box were utilized to provide access to all artwork configurations regardless of the degree of variance of the patterns and layouts.

It is, therefore, the primary object of the present invention to eliminate the need for providing a specially constructed matrix box to permit access to each artwork configuration in order to thereby facilitate the testing of multiple layer printed circuit boards both before and after assembly thereof and, therefore, facilitate the testing of printed circuit boards in general including single and multiple layer types employing integrated circuits or discrete components, and other similar electrical circuit structures having accessible contact points.

In accordance with the foregoing object, it is another important aim of this invention to provide a method of and structure for, in effect, transferring the random-arranged nodes of printed circuit boards to contact locations having predetermined planar coordinates such that a universal array of contact elements in the nature of spring pins or the like may be employed to provide access to all artwork configurations.

In furtherance of the above aim, it is a particular and important object of the invention to provide a coordinate conversion interface for use in conjunction with a printed circuit board and the aforesaid universal array of contact elements, in order that the latter may accommodate and provide access to any artwork configuration through the use of a conversion interface appropriate to each of the different configurations.

Another important object of the invention is to provide a method and apparatus for making electrical connections to the random-arranged nodes or contact points of a printed circuit board or the like wherein only a single universal array of contact elements as aforesaid is work of the board under test.

In the drawings:

FIG. l is a diagrammatic, front view of an access fixture for use in making electrical connections to a printed circuit board;

FIG. 2 is an enlarged, top view of the apparatus shown in FIG. I, the lid of the fixture and the cover of the matrix box being removed to reveal the array of spring pins and leads extending therefrom;

FIG. 3 is a fragmentary, cross-sectional, detailed view showing a group of spring pins in contact with the superimposed transition plate interface and printed circuit board under test;

FIG. 4 is a fragmentary, bottom view of the matrix box enlarged with respect to FIG. 2 and showing the uniform grid of spring pins;

FIG. 5 is a fragmentary, top view of an exemplary printed circuit board and associated transition plate interface on the same scale as FIG. 4, showing the same shifted relative to each other rather than in flieir superimposed, operative interrelationship in order to provide a visual comparison of the configurations of the board and the interface;

FIG. 6 is a fragmentary, bottom view of the same portion of the transition plate interface illustrated in FIG. 5, and shown on the same scale;

FIG. 7 is a greatly enlarged, cross-sectional, detailed view illustrating coordinate conversion by the interface;

FIG. 8 is a fragmentary, diagrammatic, top view of a printed circuit board;

FIG. 9 is a fragmentary, diagrammatic, bottom view of a transition plate interface for use with the board illustrated in FIG. 8;

FIG. 10 is a fragmentary, transition plate of FIG. 9; and

FIG. 11 is a superimposed, diagrammatic mechanical and electrical schematic illustration depicting the circuit resistances in an electrical continuity test utilizing the transition plate interface of the present invention.

Referring initially to FIGS. 1 and 2, an access fixture 20 is illustrated and comprises an upright, rectangular housing having a pair of sidewalls 22 and a rear wall 24. A horizontal, rectangular frame 26 is secured to the sidewalls 22 within the fixture 20 and serves as a support for a horizontal, vertically reciprocable platen 28 shown in its lowermost position resting on the frame 26. A pneumatic piston and cylinder assembly 30 is mounted on the base of the fixture 20 beneath the platen 28 and, when actuated, shifts the platen 28 upwardly toward a matrix box broadly denoted 32.

The matrix box 32 has a substantially square base 34 of plexiglass or similar material which is supported by a pair of opposed side support members 36 secured to respective sidewalls 22 of the fixture 20 above the frame 26. The matrix base 34 is held in a horizontal position in parallelism with the platen 28 and is normally enclosed by a cover 38 and an overlying lid 40 of the fixture 20 seen in FIG. 1. A connector panel 42 is secured to the rear edge portion of the base 34 and may, for example, receive a mating plu -in connector (not shown) for the purpose of making electrical connections to a multitude of leads 44 that extend from an array of contact elements 46 to the connector panel 42.

The contact elements 46 are best seen in FIGS. 3, 4 and 7. As is apparent in FIG. 4, the elements 46 are arranged in a matrix on a uniform rectangular grid, each cluster of four elements 46 defining the corners of a square. The contact elements 46 are in the nature of spring pins projecting vertically downwardly equal distances from the matrix base 34. To provide a means of mounting the spring pin elements 46 on uniform centers, the base 34 is drilled on such centers and elongated, tubular sockets 48 are inserted into the holes and held by a press fit. As is clear in FIG. 3, the upper end of each socket 48 is provided with a terminal 50 to which a respective lead 44 is connected. In FIG. 7, it may be seen that the lower end of each socket 438 receives plunger portion of the spring required regardless of the artdiagrammatic, top view of the pin 46. Thus, the pin 46, barrel 51, and spring 52 form a contact assembly which is conveniently inserted into the respective socket 48 by a press fit. The spring pins 46 are normally held by the springs 52 at fully extended positions, the springs 52 permitting the pins 46 to retract under applied upward pressure to form resilient contacts as will be appreciated hereinafter.

Referring to FIG. 5, one corner portion of a printed circuit board 54 is shown extending from beneath a transition plate 56 which, as will be discussed, forms a coordinate conversion interface that cooperates with both the array of spring pins 46 and the printed circuit board 54. It should be noted that the board 54 has a characteristic pattern of artwork that presents a number of random-arranged nodes or contact points 58. The board 54 illustrated herein is one of the laminae of a multilayer printed circuit board, it being desired to test the lamina 54 prior to assembly of the multilayer board. It should be understood, however, that the lamina 54 is only illustrative of one particular type of printed circuit board that may be accommodated by the present invention, since both single layer boards and multilayer boards after assembly can be accommodated plus single or multilayer boards having electronic components mounted thereon if the application of the transition plate 56 should be to provide access to the nodes of the fully assembled boards for the purpose of performing tests other than simple continuity and insulation resistance tests,

e.g., impedance or functional tests.

The transition plate interface 56 comprises a thin baseplate 60 of insulating material, such as a thin fiberglass sheet. In use, the transition plate 56 is horizontally disposed thereby presenting a top side or face seen in FIG. and a bottom side or face seen in FIG. 6. Initially, the baseplate 60 is coated on each side with a layer of copper or similar conductive material, each copper layer then being etched to leave only the contact pads 62 on the bottom side of the baseplate 60, and the contact pads 64 (and other contact structure to be discussed) on the top side of the baseplate 60. For purposes of illustration, it is assumed that the baseplate 60 is translucent; thus the same is advantageously provided with a pair of register marks 66 adjacent two or more corners thereof. Similarly, the board 54 is provided with a pair of register marks 68 adjacent its corresponding corners. It may be seen that the register marks 66 and 63 are in the form of a bulls-eye and a right angle corner indication, these marks being superimposed in exact register in order to properly position the transition plate 56 in overlying, superimposed relationship to the board 54. The contact pads 62 on the bottom side of the baseplate 60 have the same random arrangement as the contact points 58 of the board 54; therefore, with the plate 56 and the board 54 in register, the pads 62 engage corresponding contact points 58 therebeneath.

It may be appreciated from the foregoing that the bottom side of the baseplate 60 is etched in a manner to reveal segments of the copper layer only where the contact points 58 will be presented beneath the copper segments when the transition plate 56 and the board 54 are brought into proper register. Accordingly, the segments forming the pads 62 are preferably of no greater outside diameter than the corresponding contact points 58 in order to preclude the possibility of shorting across other nodes or lands of the board 54. In some instances, it may be desired to actually reduce the outside diameter of the contact pads 62 as compared with the corresponding contact points 58 to increase the allowable tolerances and to minimize the possibility of inadvertent shorting should, for some reason, the transition plate 56 and the board 54 be aligned in use in other than perfect register.

In contrast to the random arrangement of the lower contact pads 62, the upper pads 64 are arranged on the same uniform grid as the spring pin contact elements 46. Viewed in terms of a planar coordinate system, the upper contact pads 64 have predetermined planar coordinates selected arbitrarily with respect to the positions of the lower contact pads 62, the coordinate location of each of the upper pads 64 being identical to a corresponding spring pin contact element 46.

The effect of the transition plate 56 is to achieve coordinate conversion as is best depicted in the simplified illustrations of FIGS. 8-10. A portion of the board 54 (FIG. 8) is shown having contact points 58a, 58b, 55c and 58d. A pair of lands 70 interconnect points 58a and 58b, and points 58c and 56d respectively. Manifestly, if the continuity, for example, of the lands 70 is to be tested, connections must be made to the contact points 58a-58d.

A corresponding portion of the transition plate 56 (bottom side) is shown in FIG. 9. The contact pads 62a, 62b, 62c and 62d are arranged in the same pattern as the contact points 5811-58 and, when the transition plate 56 and the board 54 are in proper register, the pads 62a62d will directly overlie and engage the corresponding points 58a-58d. The array of crosses 74 shown on the transition plate 56 in FIG. 9 represent contact locations having the same planar coordinates as certain of the spring pins 46 depending from the matrix box 32. In other words, with the transition plate 56 and the board 54 in register and properly positioned on the platen 28, these contact locations 74 comprise vertical projections of the axes of the overlying spring pins 46.

The top side of the same portion of the transition plate 56 is shown in FIG. 10. It may be seen that the contact pads 62a62 extend completely through the baseplate 60 and are electrically connected with corresponding upper contact pads 64(1-64. Each of the pads 64a-64d is centered on a different one of the contact locations 74 and thus serves to effect coordinate conversion by virtue of a transition land 76 interconnecting each of the pairs of pads 62a, 64a,- 62b, 64b; 62c, 64c; and 62d, 64d respectively. It is now possible to gain access to the contact points 58a-58d of the board 54 at four contact locations 74 having planar coordinates that are the same as those of four of the spring pins 46. In effect, therefore, as illustrated by the pattern of contact locations 74 shown in FIG. 8 on the board 54, the contact points 58a-58d are transferred from their random positions to four of the predetermined locations 74. By virtue of the nature of their respective functions, the top pads 64 are hereinafter at times referred to as the coordinate conversion pads, while the bottom pads 62 are at times referred to as the intermediate pads.

FIG. 7 is a greatly enlarged, fragmentary view illustrating the coordinate conversion action of the transition plate interface 56. The intermediate pad 62 is shown directly overlying the corresponding contact point 58 from which one of the lands 70 extends along the circuit board 54. In etching the top side of the baseplate 60 of the transition plate interface 56, a copper segment 80 aligned with the pad 62 is left on the top side of the baseplate 60 in order to provide a means of establishing electrical continuity through the thickness of the baseplate 60. This is done by drilling a hole through the baseplate 60 in alignment with the centers of the pad 62 and the segment 80. The opening 82 thus formed is plated with a conductive substance 84 such as copper so that, as illustrated, the pad 62, the segment 80 and the intercommunicating plating 84 in effect become an integral conductive body. If the pad 62 happened to be positioned at or near a coordinate location corresponding to one of the spring pins 46, then the transition land 76 would not be required (this condition is illustrated for a number of segments 80 in FIG. 5). However, where a substantial change in coordinate location must be effected as illustrated in FIG. 7, the coordinate conversion pad 64 is positioned at an adjacent spring pin coordinatelocation and electrically connected to the segment 80 (and hence the intermediate pad 62) by the transition land 76.

In the practice of the present invention, a transition plate interface is made for every artwork pattern which it is desired to accommodate, but the matrix of spring pins 46 is utilized to provide access to the contact points of all circuit boards. In the case of multilayer boards, a different transition plate interface would be utilized to provide access to the contact points of each of the laminae for testing prior to assembly. Once assembled into a multilayer board, one or more interfaces would then be utilized to test the composite board. Testing after assembly is desired since, during the pressing operation required representation of the structural in uniting the laminae, a land may break or short to another land or metal chips from drilling may become trapped within the assembly and cause shorting.

Access to the boards is rapidly achieved through the use of the fixture 20. The board under test and its associated interface are positioned in mutual register on the platen 28, the latter being provided with suitable register marks, guides or the like (not shown) for assuring registration of the coordinate conversion pads of the interface with the planar coordinate system of the spring pin matrix. The pneumatic piston and cylinder assembly 30 is then actuated to shift the platen 28 vertically until the coordinate conversion pads are brought to bear against the spring pins 46 and the latter partially compress the springs 52. The platen 28 is then left in a stationary, elevated position during the testing program. The elevated position of the platen 28 is best illustrated in FIG. 3 where a portion of a row of spring pins 46 are shown in engagement with corresponding pads 64 of the transition plate interface 56. An automatic circuit analyzer for conducting insulation and continuity resistance tests, for example, is connected to the spring pins 46 via the connector panel 42 at the rear of the matrix box 32.

FIG. 11 is an equivalent schematic of the circuit involved in resistance measurement, superimposed upon a diagrammatic elements of the circuit. The conditions depicted in FIG. 11 are representative of those between any pair of spring pins 6. The resistance of the land 70 on the board 54 is to be checked, its resistance being represented by R R and R, are the pin-to-pad contact resistances of the two spring pins 46 and respective underlying pads 64. R and R are the resistances of the two transition lands 76. R and R are the resistances of the plating 84 through the holes in the baseplate 60. R and R are the butt contact resistances of the intermediate pads 62 and respective contact points 58.

In actuality, as may be seenin FIG. 5, the transition lands 76 are significantly shorter and wider than the lands 70 of the board 54. Thus, it may be assumed that R,, and R are negligible. Furthermore, since the distance between each segment 80 and its associated intermediate pad 62 is only the thickness of the baseplate 60, the resistances R and R may also be considered to be negligible. This leaves R,, R R and R, as the major series resistances in the circuit between the two spring pins 46, other than the unknown resistance R, of the land 70 to be checked. Since these remaining resistances are all attributed to the resistance between the various contact structures of the series circuit, their significance may be significantly reduced by plating the copper pads of the transition plate interface 56 with a suitable contact material such as gold, and assuring that the relative positions of the platen 28 (when elevated) and the matrix box 32 are such as to cause uniform deflection of the pins 416 against their springs 52 to an extent to establish solid electrical contact. The terminals 86 in FIG. 11 electrically connected to the spring pins 46 represent connections to suitable testing instrumentation such as an automatic circuit analyzer.

Having thus described the invention, what is claimed as new and desired to be secured by Letters Patent is:

1. Apparatus for making temporary electrical connections to a multiplicity of electrical contact points on a printed circuit board or the like having said contact points arranged in an irregular planar pattern peculiar to a particular type of such boards or the like, said apparatus comprising:

a set of contact elements including a number thereof at least as great as said multiplicity but arranged in a fixed, regular, planar, matrix pattern different from said pattern of said contact points and having predetermined coordinates in the plane of said set;

a coordinate conversion interface comprising a baseplate of insulating material having a pair of opposed sides, a first array of contact pads on one of said sides including a contact pad for each of said contact points respectively and arranged in said irregular pattern peculiar to said type,

and a second array of contact pads on the other of said sides including a contact pad for each of the contact pads of said first array but arranged in said regular pattern, each of said contact pads of said first array being electrically coupled with a corresponding contact pad of said second array, each of the contact pads of first array being positioned for conductively engaging a corresponding contact point of said board or the like, each of the contact pads of said second array being positioned for conductively engaging a corresponding contact element;

support means spaced from said contact elements and relatively shiftable with respect to the latter for receiving said circuit board or the like and said interface in superimposed relationship to each other with the contact pads of said first array in conductive engagement with corresponding contact points of said circuit board or the like and the contacts of said second array facing said contact elements; and

means for relatively shifting said contact elements and said support means to move the contact pads of said second array into conductive engagement with the contact elements of like coordinates, whereby to establish electrical continuity between each of said contact points and an individual contact element.

2. Apparatus as claimed in claim 1, said interface having means extending through said baseplate thereof electrically interconnecting corresponding contact pads of said first and second arrays.

3. Apparatus as claimed in claim 2, said interconnecting means including a transition land on said other side extending between each interconnected pair of contact pads which are substantially out of alignment.

4. Apparatus as claimed in claim 1, said matrix pattern arrangement disposing said contact elements on the intersections of a uniform rectangular grid.

5. A method of making temporary electrical connections to a multiplicity of electrical contact points on a printed circuit board or the like having said contact points arranged in an irregular planar pattern peculiar to a particular type of such boards or the like, said method comprising the steps of:

a. providing a set of connection locations including a number thereof at least as great as said multiplicity but arranged in a fixed, regular, planar, matrix pattern different from said pattern of said contact points and having predetermined coordinates in the plane of said set;

b. disposing said board or the like in spaced relationship to said set of connection locations with the plane of said contact points parallel to the plane of said connection locations;

c. interposing between said board or the like and said connection locations a pair of spaced, parallel, relatively fixed, planar arrays of contact pads with the planes of said arrays substantially parallel to the planes of said contact points and said connection locations, the first of said arrays including a contact pad for each of said contact points respectively and arranged in said irregular pattern peculiar to said type, the second of said arrays of contact pads including a contact pad for each of the contact pads of said first array but arranged in said regular matrix pattern, each of said contact pads of said first array being electrically coupled with a corresponding contact pad of said second array;

d. moving said arrays jointly to align the contact pads of said first array with said contact points and to align the contact pads of said second set with said connection locations; and

e. relatively moving said board or the like, said arrays of contact pads and said connection locations in the direction perpendicular to their planes to bring the same together with each contact pad of said first array thereof electrically contacting a corresponding contact point of said board or the like and each contact pad of said second array thereof electrically contacting a corresponding connection location,

6. A coordinate conversion interface for use in making temporary electrical connections to a multiplicity of electrical contact points on a printed circuit board or the like having said contact points arranged in an irregular pattern peculiar to a particular type of such board or the like from a set of contact elements arranged in a fixed, regular, planar pattern difierent from said pattern of said contact points and having predeter-w mined coordinates in the plane of said set, said interface comprising:

a baseplate of insulating material having a pair of opposed, substantially parallel sides and adapted to be interposed between said board or the like and said set of contact elements, said baseplate having openings therein communicating said sides of the baseplate and extending through the contact pads of said first array;

a first array of electrically conductive contact pads on one of said sides of said baseplate including a contact pad for each of said contact points respectively and arranged in said irregular pattern peculiar to said type;

a'second array of electrically conductive contact pads on the other side of said baseplate including a contact pad for each of the contact pads of said first array but arranged in said regular pattern, each of said contact pads of said first array being electrically coupled with a corresponding contact pad of said second array,

the contact pads of said first array each being adapted to conductively engage a corresponding one of said contact oints while each of the contact pads of said second array is conductively engaging a corresponding contact element; and

means extending through said baseplate electrically interconnecting corresponding contact pads of said first and second arrays, said interconnecting means including an electrically conductive plating on the baseplate within said openings and electrically connected to respective contact pads of said first array.

7. A coordinate conversion interface for use in making temporary electrical connections to a multiplicity of electrical contact points on a printed circuit board or the like having said contact points arranged in an irregular pattern peculiar to a particular type of such board or the like from a set of contact elements arranged in a fixed, regular, planar pattern different from said pattern of said contact points and having predetermined coordinates in the plane of said set, said interface comprising:

a baseplate of insulating material having a pair of opposed, substantially parallel sides and adapted to be interposed between said board or the like and said set of contact elements;

a first array of electrically conductive contact pads on one of said sides of said baseplate including a contact pad for each of said contact points respectively and arranged in said irregular pattern peculiar to said type; and

a second array of electrically conductive contact pads on the other side of said baseplate including a contact pad for each of the contact pads of said first array but arranged in said regular pattern, each of said contact pads of said first array being electrically coupled with a corresponding contact pad of said second array,

said contact elements and conductive padsof said second array both being arranged in the same matrix pattern disposing said elements at the intersections of a uniform rectangular grid and the contact pads of said second array at the intersections of a similar uniform rectangular grid,

the contact pads of said first array each being adapted to conductively engage a corresponding one of said contact points while each of the contact pads of said second array is conductively engaging a corresponding contact element.

Citations de brevets
Brevet cité Date de dépôt Date de publication Déposant Titre
US2878587 *22 juin 195324 mars 1959Jubenville Arthur RPlug-in mounting block for electrical instruction board
US3043022 *2 juil. 195910 juil. 1962Electronic Training Aids IncTraining panel for electronic technicians
US3205469 *12 juil. 19617 sept. 1965Gen Precision IncPin board
US3302065 *21 déc. 196531 janv. 1967Amp IncPlugboard actuating mechanism
US3406368 *16 mai 196615 oct. 1968Solitron DevicesInterconnection system
US3434208 *16 déc. 196625 mars 1969John W ToomeyCircuit assembly process
US3453586 *12 sept. 19671 juil. 1969Hewlett Packard CoExtractor-lock mechanism
FR1150441A * Titre non disponible
FR1236627A * Titre non disponible
GB593296A * Titre non disponible
Référencé par
Brevet citant Date de dépôt Date de publication Déposant Titre
US3745509 *2 mars 197110 juil. 1973Bunker RamoHigh density electrical connector
US3787768 *21 déc. 197122 janv. 1974Matsushita Electric Ind Co LtdInspection apparatus for printed circuit boards
US3806800 *26 déc. 197223 avr. 1974IbmMethod and apparatus for determining the location of electrically conductive members on a structure
US3970934 *12 août 197420 juil. 1976Akin AksuPrinted circuit board testing means
US4038501 *10 juil. 197526 juil. 1977Volk Victor FApparatus and method for automatically connecting to the individual conductors of a multiconductor cable
US4099120 *8 juin 19774 juil. 1978Akin AksuProbe head for testing printed circuit boards
US4160207 *27 juin 19773 juil. 1979Haines Fred EPrinted circuit board tester with removable head
US4164704 *1 nov. 197614 août 1979Metropolitan Circuits, Inc.Plural probe circuit card fixture using a vacuum collapsed membrane to hold the card against the probes
US4183609 *16 mars 197815 janv. 1980Luna L JackInsulator board for spring probe fixtures
US4209745 *12 juin 197824 juin 1980Everett/Charles, Inc.Interchangeable test head for loaded test member
US4311352 *30 mai 198019 janv. 1982Dit-Mco International CorporationApparatus for effecting electrical connections with multiple contact points
US4322682 *21 mai 197930 mars 1982Everett/Charles Inc.Vacuum actuated test head having programming plate
US4352061 *24 mai 197928 sept. 1982Fairchild Camera & Instrument Corp.Universal test fixture employing interchangeable wired personalizers
US4374003 *2 juil. 198115 févr. 1983General Dynamics, Pomona DivisionFine line circuitry probes and method of manufacture
US4374708 *2 juil. 198122 févr. 1983General Dynamics, Pomona DivisionFine line circuitry probes and method of manufacture
US4417204 *11 févr. 198122 nov. 1983Luther & Maelzer GmbhPrinted circuit board tester and adapter with memory
US4443756 *25 nov. 198017 avr. 1984Lightbody James DApparatus and method for testing circuit boards
US4531799 *9 mars 198430 juil. 1985Raytheon CompanyElectrical connector
US4551673 *30 sept. 19815 nov. 1985Riba-Pruftechnik GmbhTesting arrangement for printed circuit boards
US4551675 *19 déc. 19835 nov. 1985Ncr CorporationApparatus for testing printed circuit boards
US4573009 *7 déc. 198325 févr. 1986Zehntel, Inc.Printed circuit board test fixture with flexion means for providing registration between the test probes and the circuit board
US4649338 *21 juin 198210 mars 1987General Dynamics, Pomona DivisionFine line circuitry probes and method of manufacture
US4724377 *4 nov. 19839 févr. 1988Martin MaelzerApparatus for testing electrical printed circuit boards
US4724383 *3 mai 19859 févr. 1988Testsystems, Inc.PC board test fixture
US4774459 *6 nov. 198627 sept. 1988Martin MaelzerAdapter for a printed circuit board testing apparatus
US4833402 *4 nov. 198723 mai 1989Boegh Petersen AllanConnector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circuit board by means of a circuit board testing machine
US5207585 *31 oct. 19904 mai 1993International Business Machines CorporationThin interface pellicle for dense arrays of electrical interconnects
US5216358 *20 mars 19911 juin 1993International Market DevelopmentDevice for testing a printed circuit board
US5376882 *16 sept. 199227 déc. 1994Sun Microsystems, Inc.Method and apparatus for positioning an integrated circuit device in a test fixture
US5444386 *15 janv. 199322 août 1995Tokyo Seimitsu Co., Ltd.Probing apparatus having an automatic probe card install mechanism and a semiconductor wafer testing system including the same
US5563509 *19 déc. 19958 oct. 1996Vlsi Technology, Inc.Adaptable load board assembly for testing ICs with different power/ground bond pad and/or pin configurations
US5793218 *15 déc. 199511 août 1998Lear Astronics CorporationGeneric interface test adapter
US5811982 *12 mars 199622 sept. 1998International Business Machines CorporationHigh density cantilevered probe for electronic devices
US6049214 *5 déc. 199711 avr. 2000Nidec-Read CorporationUniversal printed circuit board inspection apparatus, and method of using same
US6097199 *22 janv. 19981 août 2000Lsi Logic CorporationUniversal decoder test board
US6137297 *6 janv. 199924 oct. 2000Vertest Systemsn Corp.Electronic test probe interface assembly and method of manufacture
US6147505 *23 déc. 199714 nov. 2000Hewlett-Packard CompanyAdapter arrangement for electrically testing printed circuit boards
US6160412 *5 nov. 199812 déc. 2000Wentworth Laboratories, Inc.Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6211690 *13 oct. 19983 avr. 2001Tessera, Inc.Apparatus for electrically testing bare printed circuits
US624624718 sept. 199812 juin 2001Formfactor, Inc.Probe card assembly and kit, and methods of using same
US625560215 mars 19993 juil. 2001Wentworth Laboratories, Inc.Multiple layer electrical interface
US643758410 oct. 200020 août 2002Cascade Microtech, Inc.Membrane probing system with local contact scrub
US6498504 *27 août 200124 déc. 2002Nec CorporationWafer inspection device and wafer inspection method
US657826411 avr. 200017 juin 2003Cascade Microtech, Inc.Method for constructing a membrane probe using a depression
US661548527 déc. 20019 sept. 2003Formfactor, Inc.Probe card assembly and kit, and methods of making same
US66246485 déc. 200123 sept. 2003Formfactor, Inc.Probe card assembly
US670838622 mars 200123 mars 2004Cascade Microtech, Inc.Method for probing an electrical device having a layer of oxide thereon
US6783645 *20 févr. 200231 août 2004Dionex CorporationDisposable working electrode for an electrochemical cell
US682567722 mars 200130 nov. 2004Cascade Microtech, Inc.Membrane probing system
US683889029 nov. 20004 janv. 2005Cascade Microtech, Inc.Membrane probing system
US683889310 juin 20034 janv. 2005Formfactor, Inc.Probe card assembly
US686000922 mars 20011 mars 2005Cascade Microtech, Inc.Probe construction using a recess
US692758520 mai 20029 août 2005Cascade Microtech, Inc.Membrane probing system with local contact scrub
US693049829 juil. 200416 août 2005Cascade Microtech, Inc.Membrane probing system
US693703716 juil. 200230 août 2005Formfactor, Et Al.Probe card assembly for contacting a device with raised contact elements
US694582723 déc. 200220 sept. 2005Formfactor, Inc.Microelectronic contact structure
US706125712 juil. 200413 juin 2006Formfactor, Inc.Probe card assembly
US706456616 mars 199820 juin 2006Formfactor, Inc.Probe card assembly and kit
US708614930 avr. 20018 août 2006Formfactor, Inc.Method of making a contact structure with a distinctly formed tip structure
US710973117 juin 200519 sept. 2006Cascade Microtech, Inc.Membrane probing system with local contact scrub
US712276025 nov. 200217 oct. 2006Formfactor, Inc.Using electric discharge machining to manufacture probes
US71487113 juin 200512 déc. 2006Cascade Microtech, Inc.Membrane probing system
US716136318 mai 20049 janv. 2007Cascade Microtech, Inc.Probe for testing a device under test
US717823616 avr. 200320 févr. 2007Cascade Microtech, Inc.Method for constructing a membrane probe using a depression
US723316019 nov. 200119 juin 2007Cascade Microtech, Inc.Wafer probe
US726688914 janv. 200511 sept. 2007Cascade Microtech, Inc.Membrane probing system
US727160328 mars 200618 sept. 2007Cascade Microtech, Inc.Shielded probe for testing a device under test
US72859695 mars 200723 oct. 2007Cascade Microtech, Inc.Probe for combined signals
US73044881 déc. 20064 déc. 2007Cascade Microtech, Inc.Shielded probe for high-frequency testing of a device under test
US735219613 juin 20061 avr. 2008Formfactor, Inc.Probe card assembly and kit
US735542019 août 20028 avr. 2008Cascade Microtech, Inc.Membrane probing system
US73689275 juil. 20056 mai 2008Cascade Microtech, Inc.Probe head having a membrane suspended probe
US7385407 *12 mai 200610 juin 2008Aehr Test SystemsAssembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
US74001553 févr. 200415 juil. 2008Cascade Microtech, Inc.Membrane probing system
US740302523 août 200622 juil. 2008Cascade Microtech, Inc.Membrane probing system
US740302822 févr. 200722 juil. 2008Cascade Microtech, Inc.Test structure and probe for differential signals
US741744622 oct. 200726 août 2008Cascade Microtech, Inc.Probe for combined signals
US74203818 sept. 20052 sept. 2008Cascade Microtech, Inc.Double sided probing structures
US742786821 déc. 200423 sept. 2008Cascade Microtech, Inc.Active wafer probe
US743619424 oct. 200714 oct. 2008Cascade Microtech, Inc.Shielded probe with low contact resistance for testing a device under test
US74431869 mars 200728 oct. 2008Cascade Microtech, Inc.On-wafer test structures for differential signals
US744989924 avr. 200611 nov. 2008Cascade Microtech, Inc.Probe for high frequency signals
US745327618 sept. 200718 nov. 2008Cascade Microtech, Inc.Probe for combined signals
US745664618 oct. 200725 nov. 2008Cascade Microtech, Inc.Wafer probe
US748282324 oct. 200727 janv. 2009Cascade Microtech, Inc.Shielded probe for testing a device under test
US748891717 oct. 200610 févr. 2009Formfactor, Inc.Electric discharge machining of a probe array
US748914924 oct. 200710 févr. 2009Cascade Microtech, Inc.Shielded probe for testing a device under test
US749217510 janv. 200817 févr. 2009Cascade Microtech, Inc.Membrane probing system
US749546118 oct. 200724 févr. 2009Cascade Microtech, Inc.Wafer probe
US749882919 oct. 20073 mars 2009Cascade Microtech, Inc.Shielded probe for testing a device under test
US750184219 oct. 200710 mars 2009Cascade Microtech, Inc.Shielded probe for testing a device under test
US750484211 avr. 200717 mars 2009Cascade Microtech, Inc.Probe holder for testing of a test device
US7511520 *20 août 200731 mars 2009Micron Technology, Inc.Universal wafer carrier for wafer level die burn-in
US751494410 mars 20087 avr. 2009Cascade Microtech, Inc.Probe head having a membrane suspended probe
US751838727 sept. 200714 avr. 2009Cascade Microtech, Inc.Shielded probe for testing a device under test
US75334621 déc. 200619 mai 2009Cascade Microtech, Inc.Method of constructing a membrane probe
US753524718 janv. 200619 mai 2009Cascade Microtech, Inc.Interface for testing semiconductors
US754182129 août 20072 juin 2009Cascade Microtech, Inc.Membrane probing system with local contact scrub
US760907711 juin 200727 oct. 2009Cascade Microtech, Inc.Differential signal probe with integral balun
US76160161 avr. 200810 nov. 2009Formfactor, Inc.Probe card assembly and kit
US761941928 avr. 200617 nov. 2009Cascade Microtech, Inc.Wideband active-passive differential signal probe
US765617218 janv. 20062 févr. 2010Cascade Microtech, Inc.System for testing semiconductors
US768131231 juil. 200723 mars 2010Cascade Microtech, Inc.Membrane probing system
US768809726 avr. 200730 mars 2010Cascade Microtech, Inc.Wafer probe
US772399922 févr. 200725 mai 2010Cascade Microtech, Inc.Calibration structures for differential signal probing
US773154616 sept. 20058 juin 2010Formfactor, Inc.Microelectronic contact structure
US775065211 juin 20086 juil. 2010Cascade Microtech, Inc.Test structure and probe for differential signals
US775995314 août 200820 juil. 2010Cascade Microtech, Inc.Active wafer probe
US776198318 oct. 200727 juil. 2010Cascade Microtech, Inc.Method of assembling a wafer probe
US776198610 nov. 200327 juil. 2010Cascade Microtech, Inc.Membrane probing method using improved contact
US776407222 févr. 200727 juil. 2010Cascade Microtech, Inc.Differential signal probing system
US778674418 déc. 200831 août 2010King Yuan Electronics Co., Ltd.Probe card assembly and test probes therein
US78761147 août 200825 janv. 2011Cascade Microtech, Inc.Differential waveguide probe
US78889576 oct. 200815 févr. 2011Cascade Microtech, Inc.Probing apparatus with impedance optimized interface
US789370420 mars 200922 févr. 2011Cascade Microtech, Inc.Membrane probing structure with laterally scrubbing contacts
US789827317 févr. 20091 mars 2011Cascade Microtech, Inc.Probe for testing a device under test
US789828112 déc. 20081 mars 2011Cascade Mircotech, Inc.Interface for testing semiconductors
US794006915 déc. 200910 mai 2011Cascade Microtech, Inc.System for testing semiconductors
US80136233 juil. 20086 sept. 2011Cascade Microtech, Inc.Double sided probing structures
US83734284 août 200912 févr. 2013Formfactor, Inc.Probe card assembly and kit, and methods of making same
US841080620 nov. 20092 avr. 2013Cascade Microtech, Inc.Replaceable coupon for a probing apparatus
US845101718 juin 201028 mai 2013Cascade Microtech, Inc.Membrane probing method using improved contact
US94296381 avr. 201330 août 2016Cascade Microtech, Inc.Method of replacing an existing contact of a wafer probing assembly
US20010054905 *16 mars 199827 déc. 2001Igor Y. KhandrosProbe card assembly and kit
US20020135388 *20 mai 200226 sept. 2002Gleason K. ReedMembrane probing system with local contact scrub
US20030038647 *16 juil. 200227 févr. 2003Eldridge Benjamin N.Probe card for probing wafers with raised contact elements
US20030132767 *29 nov. 200017 juil. 2003Tervo Paul A.Membrane probing system
US20030222667 *10 juin 20034 déc. 2003Formfactor, Inc.Probe card assembly
US20040093716 *10 nov. 200320 mai 2004Reed GleasonMembrane probing system
US20040099641 *25 nov. 200227 mai 2004Formfactor, Inc.Probe array and method of its manufacture
US20040121627 *23 déc. 200224 juin 2004Formfactor, Inc.Microelectronic contact structure
US20040256216 *7 juil. 200423 déc. 2004Jun ChengDisposable working electrode for an electrochemical cell
US20050007131 *29 juil. 200413 janv. 2005Cascade Microtech, Inc.Membrane probing system
US20050035347 *12 juil. 200417 févr. 2005Khandros Igor Y.Probe card assembly
US20050231223 *17 juin 200520 oct. 2005Cascade Microtech, Inc.Membrane probing system with local contact scrub
US20050248359 *3 juin 200510 nov. 2005Cascade Microtech, Inc.Membrane probing system
US20060267624 *12 mai 200630 nov. 2006Richmond Donald P IiAssembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
US20060279300 *13 juin 200614 déc. 2006Formfactor, Inc.Probe Card Assembly And Kit
US20070062913 *17 oct. 200622 mars 2007Formfactor, Inc.Probe Array and Method of Its Manufacture
US20070270041 *16 sept. 200522 nov. 2007Formfactor, Inc.Microelectronic contact structure
US20070285115 *20 août 200713 déc. 2007Micron Technology, Inc.Universal wafer carrier for wafer level die burn-in
US20080180121 *1 avr. 200831 juil. 2008Formfactor, Inc.Probe card assembly and kit
US20090139965 *10 févr. 20094 juin 2009Formfactor, Inc.Probe array and method of its manufacture
DE2360801A1 *6 déc. 197327 juin 1974IbmPruefeinrichtung mit kontaktiereinrichtung
DE3917528A1 *30 mai 19896 déc. 1990Kloeckner Becorit GmbhElectrical control of solenoid-actuated hydraulic valves - has stacked construction with control unit located on top of unit
DE9013643U1 *28 sept. 19907 févr. 1991Siemens Ag, 8000 Muenchen, DeTitre non disponible
EP0185714B1 *12 juin 19853 avr. 1991BOEGH-PETERSEN, AllanA connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circuit board by means of a circuit board testing machine
EP0343021A1 *11 avr. 198923 nov. 1989Augat Inc.Flex dot wafer probe
WO1986006841A1 *29 avr. 198620 nov. 1986Testsystems, Inc.Pc board test fixture
WO2000040975A1 *16 déc. 199913 juil. 2000Vertest Systems CorporationText probe interface assembly and manufacture method
Classifications
Classification aux États-Unis439/65, 174/262, 174/254, 439/44, 324/750.16, 324/763.1
Classification internationaleG01R1/073
Classification coopérativeG01R1/07314, G01R1/073, G01R1/07378
Classification européenneG01R1/073B9C, G01R1/073, G01R1/073B2
Événements juridiques
DateCodeÉvénementDescription
3 oct. 1984AS02Assignment of assignor's interest
Owner name: DIT-MCO INTERNATIONAL CORPORATION, 5612 BRIGHTON T
Owner name: DIT-MCO INTERNATIONAL CORPORATION, A NY CORP
Owner name: XEBEC CORPORATION
Effective date: 19840927
3 oct. 1984ASAssignment
Owner name: DIT-MCO INTERNATIONAL CORPORATION, 5612 BRIGHTON T
Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:DIT-MCO INTERNATIONAL CORPORATION, A NY CORP;XEBEC CORPORATION;REEL/FRAME:004308/0228
Effective date: 19840927