US3658618A - Method of providing individual bodies on a basic body - Google Patents

Method of providing individual bodies on a basic body Download PDF

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US3658618A
US3658618A US868062A US3658618DA US3658618A US 3658618 A US3658618 A US 3658618A US 868062 A US868062 A US 868062A US 3658618D A US3658618D A US 3658618DA US 3658618 A US3658618 A US 3658618A
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individual bodies
basic body
carrier member
support
bodies
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US868062A
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Wolfgang Gramann
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Telefunken Electronic GmbH
Telefunken Patentverwertungs GmbH
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Telefunken Patentverwertungs GmbH
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/18—Surface bonding means and/or assembly means with handle or handgrip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • Carrier members and support members are provided for carrying out the method.
  • METHOD OF PROVIDING INDIVIDUAL BODIES ON A BASIC BODY BACKGROUND OF THE INVENTION arises of providing a relatively large number of semiconductor devices, that is to say semiconductor bodies provided with component, structures as well as electrodes etc., separately from one another on a common base or basic body. This is necessary, for example in the production of switching circuits which comprise a relatively large number of components, when the semiconductor material used, such as compound semiconductors of the groups Ill-V and II-VI, does not permit the construction of a monolithic solid-state switching circuit with the structures of all the components in one semiconductor body, or when different semiconductor materials are to be used for the construction of such a switching circuit.
  • the manufacture of semiconductor devices in which a plurality of luminescence diodes of gallium-arsenide (GaAs) is used, the diodes being disposed side by side on a base, and which being used for the reading of punched tapes or as a solid-state display screen for the representation of figures and writing, involves enormous difficulties.
  • the diodes are laid individually by hand in the required relationship to one another on the base or basic body which is then covered, at its surface adapted for securing the diodes, with a layer of tin or another solder for example so that the diodes can be firmly soldered to this base by brief heating of the base to soldering temperature.
  • a method for the simultaneous provision of a plurality of individual bodies on a common basic body comprising the steps of first laying said individual bodies on a common support, laying a carrier member with an adhesive surface over said bodies resting on the support and pressing it against said support in so that all said individual bodies adhere to said carrier member, removing said carrier member from said support with said individual bodies adhering thereto and arranging said carrier or said basic body so that said individual bodies to be secured rest with their surface remote from said carrier body on said basic body, and removing said carrier member from said basic body after the individual bodies have been secured.
  • FIG. 1 is a perspective view of a support for positioning a plurality of semiconductor bodies
  • FIG. 2 is a perspective view of a carrier member for transferring the semiconductor bodies from the support of FIG. 1 and,
  • FIG. 3 is a perspective view of the carrier member of FIG. 2 together with a base' on which the semiconductor bodies are to be positioned and attached.
  • the invention proposes that during the simultaneous provision of a plurality of individual bodies on a basic body, these individual bodies should first be laid on a common support, that then a carrier member with an adhesive surface should be brought over these individual bodies lying on the support and be pressed against the support in such a manner that all the individual bodies cling to said carrier member. Then the carrier member with the individual bodies adhering thereto is removed from the support and placed on the basic body in such a manner that the individual bodies lie with their surface remote from the carrier member on the basic body for securing. After the individual dual bodies have been secured to the basic body, the carrier member is removed again according to the invention.
  • the advantage of the method according to the invention consists primarily in that all the individual bodies are applied to the basic body in a single operation and so the time-wasting, separate provision of the individual bodies is eliminated.
  • assurance is provided that the individual bodies are held by the carrier plate up to the moment when they are firmly bonded to the basic body and thus cannot be mutually displaced.
  • the method according to the invention therefore, it is possible to determine the subsequent relationship of the individual bodies to one another on the basic body by their particular arrangement on the support, and in many cases this facilitates work considerably, particularly as the supports used can easily be equipped with auxiliary means whichdecisively simplify the necessary grouping of the individual bodies.
  • the securing of the individual bodies to this basic body is preferably efiected by means of a soldered connection although it would easily be possible, within the scope of the method according to the invention, to secure the individual bodies by glueing or other means.
  • a soldered connection although it would easily be possible, within the scope of the method according to the invention, to secure the individual bodies by glueing or other means.
  • the semiconductor components are then laid on the support so that they rest with their surface provided with solder on said support. The components are subsequently removed from the support by means of the carrier member, as described, and pressed against the base, which is heated to soldering temperature, until the solder has solidified after the cooling down of the base and a firm connection is established between base and component.
  • the carrier member may advantageously be provided with a flux which has adhesive properties such as rosin varnish or silicone oil, at least at that portion of its surface to which the individual bodies are to adhere.
  • a flux which has adhesive properties such as rosin varnish or silicone oil
  • a carrier member which consists of silicone rubber, at least at the surface at which the individual bodies are to adhere, is particularly suitable for carrying out the method according to the invention.
  • the carrier member already has the adhesive surface necessary for carrying out the method according to the invention without a coat- 'ing of the above-mentioned adhesive flux or another adhesive substance.
  • the carrier member which is preferably plane at its surface adapted to receive the individual bodies, as is the support, may
  • the arrangement of the individual bodies on the support can be rationalized by providing the support with a plurality of recesses. The individual bodies are then inserted in these recesses and are thus automatically in the required position in relation to one another, predetermined by the arrangement of the recesses. Furthermore, when such a support provided with recesses is used, there is also the possibility of placing a large number of individual bodies initially at random on the support and then occupying each of these recesses, the lateral dimensions of which match the individual bodies, with such a body by shaking and/or holding said support inclined, and removing the individual bodies which are not accommodated in recesses from the support.
  • the recesses which are preferably arranged in the form of a grid, are naturally so constructed that all the individual bodies accommodated therein project from the recesses with their surface remote from the support.
  • Such a support with recesses arranged in the form of a grid can easily be realised by placing a grating made of. metal for example or a wire netting on as plane a surface as possible, in which case the meshes of this grating or netting form recesses to receive the individual bodies.
  • FIG. 1 shows a support 1 on the surface of which there are provided several cell-like recesses 2.
  • the edges of the recesses are formed by a grating 3 forexample a metal grating which is laid on the plane surface ofthe support 1 and secured there.
  • a grating 3 forexample a metal grating which is laid on the plane surface ofthe support 1 and secured there.
  • sizes of the openings in the grating-or meshes forming the recesses are selected so large that one.flat individual body 4, for example a semiconductor component, just fits into each of the recesses arranged in the form of a grid.
  • the thickness of the grating is less than the height of the bodies 4 so that these bodies project from the recesses with their surface remote from the support 1.
  • FIG. 2 shows a carrier member 5 for transferring the individual bodies 4 from the support to the basic body or base.
  • This carrier member comprises a handle 6 on its upper side, in the manner of a stamp, to improve manipulation.
  • the carrier member consists, at least at its plane face 7, of silicone rubber which imparts adhesive characteristics to this face so that the individual bodies resting on this support remain suspended, as illustrated in FIG. 2, after the carrier member has been pressed against the support.
  • the adhesive properties of the carrier member can, of course, likewise be improved here by providing at least the face 7 of the carrier member with a flux having adhesive properties before it is used.
  • FIG. 3 shows the carrier member 5 and a housing base 8 on which the semiconductor components 4 adhering to the carrier member are to be secured by means of a soldered connection.
  • the electrode leads 9 project, then, through bones provided in this heating plate specially for this purpose.
  • this is first heated to soldering temperature by meansof the heating plate and then the carrier member with the components is pressed against the base.
  • Base and/or semiconductor components are provided with solder and flux, as described above, so that after the heating plate 10 has cooled down, for example by switching off a heating current heating said plate, the components are secured to the base 8 in the predetermined position.
  • FIGS. 1 to 3 naturally only give a diagrammatic illustration of the means tobe used advantageously in carrying out the method according, to the invention. As a result of the teaching of the invention, however, it is easily possible to adapt the carrier member in its specific construction, to each particular application in an optimum manner in the sense of the invention.
  • a method for simultaneously securing a plurality of individual bodies, each of which has a layer of solder and flux on one surface thereof, to a common basic body comprising the steps of:

Abstract

A method of providing individual bodies on a basic body by firstly laying the individual bodies on a common support picking them up and transferring them, by means of a carrier member with an adhesive surface, to the basic body and holding them on the basic body until they are secured by suitable means such as glueing or soldering. Carrier members and support members are provided for carrying out the method.

Description

United States Patent Gramann 14 1 Apr. 25, 1972 [5 METHOD OF PROVIDING INDIVIDUAL [56] References Cited BODIES ON A BASIC BODY UNITED STATES PATENTS [72] :3?" "Gemundem 3,565,7i9 2/1971 Webb ..29/5s9 3,550,228 i2/l970 Asscher ..29/590 [73] Assignee: Teleiunken Patentverwertungsgesellrchait 3,043,732 7/1962 Shepherd, Jr ..156/247 m.b.H., Ulm/Donau, Germany 3,l |3,90O l2/i963 Abernathy et-al. ..l56/299 X 3,287,192 ll/l966 ....i56/247 X [221 1959 3,350,253 l0/l967 Goodhart ..l56/$79 x [2i] Appl. No.: 868,062
Primary Examiner-Carl D. Ouarforth Assistant Etamt'nur-Roger S. Gaither [30] Foreign Application Priority Data s & Kaye 5, 96 ..P i805 l74.6 Oct 2 l 8 Germany ABSTRACT 155/289 156/299' A method of providing individual bodies on a basic body by i56/3i l, i56/539, l56/579, 29/589, 29/590, 294/l firstly laying the individual bodies on a common support R picking them up and transferring them, by means of a carrier [5 In. C'- -.B44C member with an adhesive surface to the basic and hold- Fllld 156/91, 235, ing them on the basic body until they are secured by suitable l56/297, 299, 300, 305, 31 i, 230, 539, SM, 556, 560, 579, 60, 63; 294/l R, 64 R, 65, 65.5, DIG. 2; 29/589, 590, 591
means such as glueing or soldering. Carrier members and support members are provided for carrying out the method.
5 Claims, 3 Drawing Figures Patented April 25, 1972 2 Sheets-Sheet l V lave/liar:
Wolfgang Gmmonn Patented April 25, 1972 3,658,618
2 Sheets-Sheet 2 In vefilar Wolfgang Grumonn ATTORNEYS.
METHOD OF PROVIDING INDIVIDUAL BODIES ON A BASIC BODY BACKGROUND OF THE INVENTION arises of providing a relatively large number of semiconductor devices, that is to say semiconductor bodies provided with component, structures as well as electrodes etc., separately from one another on a common base or basic body. This is necessary, for example in the production of switching circuits which comprise a relatively large number of components, when the semiconductor material used, such as compound semiconductors of the groups Ill-V and II-VI, does not permit the construction of a monolithic solid-state switching circuit with the structures of all the components in one semiconductor body, or when different semiconductor materials are to be used for the construction of such a switching circuit. Thus the manufacture of semiconductor devices in which a plurality of luminescence diodes of gallium-arsenide (GaAs) is used, the diodes being disposed side by side on a base, and which being used for the reading of punched tapes or as a solid-state display screen for the representation of figures and writing, involves enormous difficulties. For according to the methods hitherto usual, the diodes are laid individually by hand in the required relationship to one another on the base or basic body which is then covered, at its surface adapted for securing the diodes, with a layer of tin or another solder for example so that the diodes can be firmly soldered to this base by brief heating of the base to soldering temperature. This soldering process in turn involves difficulties in the known methods because when the solder melts the individual diodes begin to float on the molten solder and are displaced from their predetermined position. With this method, therefore, it is often necessary to push individual diodes into their correct position before the solder solidifies and in the course of this it is often impossible to prevent solder from being forced up between the diodes and short-circuiting their PNjunctions.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for the simultaneous provision of a plurality of individual bodies on a common basic body, which, in particular, also simplifies and decisively improves the securing of individual semiconductor components to a common basic body or base.
According to the invention, there is provided a method for the simultaneous provision of a plurality of individual bodies on a common basic body, comprising the steps of first laying said individual bodies on a common support, laying a carrier member with an adhesive surface over said bodies resting on the support and pressing it against said support in so that all said individual bodies adhere to said carrier member, removing said carrier member from said support with said individual bodies adhering thereto and arranging said carrier or said basic body so that said individual bodies to be secured rest with their surface remote from said carrier body on said basic body, and removing said carrier member from said basic body after the individual bodies have been secured.
BRIEF DESCRIPTION OF THE DRAWINGS The invention will now be described in greater detail by way of example with reference to the accompanying drawings in which:
FIG. 1 is a perspective view of a support for positioning a plurality of semiconductor bodies;
FIG. 2 is a perspective view of a carrier member for transferring the semiconductor bodies from the support of FIG. 1 and,
FIG. 3 is a perspective view of the carrier member of FIG. 2 together with a base' on which the semiconductor bodies are to be positioned and attached.
DESCRIPTION OF THE PREFERRED EMBODIMENT Basically the invention proposes that during the simultaneous provision of a plurality of individual bodies on a basic body, these individual bodies should first be laid on a common support, that then a carrier member with an adhesive surface should be brought over these individual bodies lying on the support and be pressed against the support in such a manner that all the individual bodies cling to said carrier member. Then the carrier member with the individual bodies adhering thereto is removed from the support and placed on the basic body in such a manner that the individual bodies lie with their surface remote from the carrier member on the basic body for securing. After the individual dual bodies have been secured to the basic body, the carrier member is removed again according to the invention.
The advantage of the method according to the invention consists primarily in that all the individual bodies are applied to the basic body in a single operation and so the time-wasting, separate provision of the individual bodies is eliminated. In addition, with the method according to the invention, assurance is provided that the individual bodies are held by the carrier plate up to the moment when they are firmly bonded to the basic body and thus cannot be mutually displaced. With the method according to the invention, therefore, it is possible to determine the subsequent relationship of the individual bodies to one another on the basic body by their particular arrangement on the support, and in many cases this facilitates work considerably, particularly as the supports used can easily be equipped with auxiliary means whichdecisively simplify the necessary grouping of the individual bodies.
Provided that the individual bodies as well as the basic body used permit, the securing of the individual bodies to this basic body is preferably efiected by means of a soldered connection although it would easily be possible, within the scope of the method according to the invention, to secure the individual bodies by glueing or other means. Thus when a plurality of semiconductor components are provided simultaneously on a common base, components and/or base are provided with a layer of solder and possibly also with a flux at the surface at which they are to be connected to one another. In the case of the semiconductor components at least, the provision of this a layer of solder may most appropriately be effected directly during their manufacture. With the method according to the invention, the semiconductor components are then laid on the support so that they rest with their surface provided with solder on said support. The components are subsequently removed from the support by means of the carrier member, as described, and pressed against the base, which is heated to soldering temperature, until the solder has solidified after the cooling down of the base and a firm connection is established between base and component.
Particularly when the securing of the individual bodies to the basic body is effected by means of soldering, the carrier member may advantageously be provided with a flux which has adhesive properties such as rosin varnish or silicone oil, at least at that portion of its surface to which the individual bodies are to adhere. In this manner, the carrier member acquires the adhesive surface necessary for carrying out the method according to the invention or adhesive properties of the carrier member which may already have been caused by other substances are at least reinforced while at the same time assurance is provided that a sufficient quantity of flux will be present for the soldering operation.
A carrier member which consists of silicone rubber, at least at the surface at which the individual bodies are to adhere, is particularly suitable for carrying out the method according to the invention. As a result of the use of this rubber, the carrier member already has the adhesive surface necessary for carrying out the method according to the invention without a coat- 'ing of the above-mentioned adhesive flux or another adhesive substance.
The carrier member which is preferably plane at its surface adapted to receive the individual bodies, as is the support, may
be mounted, for example, on the carrying arm of a micromanipulator, so as to simplify in this manner the provision of very small individual bodies on basic bodies-having only small dimensions, as for example the provision of a plurality of semiconductor components on a common base.
' The arrangement of the individual bodies on the support can be rationalized by providing the support with a plurality of recesses. The individual bodies are then inserted in these recesses and are thus automatically in the required position in relation to one another, predetermined by the arrangement of the recesses. Furthermore, when such a support provided with recesses is used, there is also the possibility of placing a large number of individual bodies initially at random on the support and then occupying each of these recesses, the lateral dimensions of which match the individual bodies, with such a body by shaking and/or holding said support inclined, and removing the individual bodies which are not accommodated in recesses from the support.
The recesses, which are preferably arranged in the form of a grid, are naturally so constructed that all the individual bodies accommodated therein project from the recesses with their surface remote from the support.
Such a support with recesses arranged in the form of a grid can easily be realised by placing a grating made of. metal for example or a wire netting on as plane a surface as possible, in which case the meshes of this grating or netting form recesses to receive the individual bodies.
Referring now to the drawings, FIG. 1 shows a support 1 on the surface of which there are provided several cell-like recesses 2. The edges of the recesses are formed by a grating 3 forexample a metal grating which is laid on the plane surface ofthe support 1 and secured there. As the Figure shows, the
sizes of the openings in the grating-or meshes forming the recesses are selected so large that one.flat individual body 4, for example a semiconductor component, just fits into each of the recesses arranged in the form of a grid. The thickness of the grating is less than the height of the bodies 4 so that these bodies project from the recesses with their surface remote from the support 1.
FIG. 2 shows a carrier member 5 for transferring the individual bodies 4 from the support to the basic body or base. This carrier member comprises a handle 6 on its upper side, in the manner of a stamp, to improve manipulation. The carrier member consists, at least at its plane face 7, of silicone rubber which imparts adhesive characteristics to this face so that the individual bodies resting on this support remain suspended, as illustrated in FIG. 2, after the carrier member has been pressed against the support. The adhesive properties of the carrier member can, of course, likewise be improved here by providing at least the face 7 of the carrier member with a flux having adhesive properties before it is used.
FIG. 3 shows the carrier member 5 and a housing base 8 on which the semiconductor components 4 adhering to the carrier member are to be secured by means of a soldered connection. The base 8, which comprises a plurality of electrode leads 9, lies on a heating plate 10. The electrode leads 9 project, then, through bones provided in this heating plate specially for this purpose. In order to secure the semiconductor components 4 to the base 8, this is first heated to soldering temperature by meansof the heating plate and then the carrier member with the components is pressed against the base. Base and/or semiconductor components are provided with solder and flux, as described above, so that after the heating plate 10 has cooled down, for example by switching off a heating current heating said plate, the components are secured to the base 8 in the predetermined position.
FIGS. 1 to 3 naturally only give a diagrammatic illustration of the means tobe used advantageously in carrying out the method according, to the invention. As a result of the teaching of the invention, however, it is easily possible to adapt the carrier member in its specific construction, to each particular application in an optimum manner in the sense of the invention.
What I claim as new and desire to secure by Letters Patent of the United States is: I
1. A method for simultaneously securing a plurality of individual bodies, each of which has a layer of solder and flux on one surface thereof, to a common basic body, comprising the steps of:
a. placing said individual bodies on a common support member with the layers of solder and flux resting on said common support member;
b. laying a carrier member with an adhesive surface over said individual bodies resting on said common support member and pressing said adhesive surface against the surfaces of said individual bodies which are opposite to the layers of solder and flux so that all said individual bodies adhere to said adhesive surface of said carrier member;
c. removing said carrier member from over said common support member with said individual bodies adhering thereto; 7 I
d. arranging said carrier, member over said common basic e. pressing the layers of solder and flux of said individual bodies against said common basic body by means of said carrier member;
f. heating-said common basic body briefly to the soldering temperature and continuing the pressure of said individual bodies against said common basic body until solidification of said solder and the resultant establishment of a connection between said common basic body and said individual bodies; and
g. removing said carrier member from said individual bodies after the individual bodies have been secured to said common basic body.
2. A method as defined in claim 1, further comprising grouping said individual bodies on said support in the relationship to one another which they are subsequently to assume on said basic body before laying said carrier member therein.
3. A method as defined in claim 1, further comprising providing said carrier member with a flux with adhesive characteristics at least at that portion of its surface at which the individual bodies are to adhere.
, 4. A method as defined in claim 1, wherein said flux for said carrier member is selected from rosin varnish and silicone oil.
5. A method as defined in claim 1, wherein said flux for said carrier is a mixture of resin varnish and silicone oil.
l l II!

Claims (4)

  1. 2. A method as defined in claim 1, further comprising grouping said individual bodies on said support in the relationship to one another which they are subsequently to assume on said basic body before laying said carrier member therein.
  2. 3. A method as defined in claim 1, further comprising providing said carrier member with a flux with adhesive characteristics at least at that portion of its surface at which the individual bodies are to adhere.
  3. 4. A method as defined in claim 1, wherein said flux for said carrier member is selected from rosin varnish and silicone oil.
  4. 5. A method as defined in claim 1, wherein said flux for said carrier is a mixture of resin varnish and silicone oil.
US868062A 1968-10-25 1969-10-21 Method of providing individual bodies on a basic body Expired - Lifetime US3658618A (en)

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JPS49108975A (en) * 1973-02-20 1974-10-16
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4042439A (en) * 1975-05-12 1977-08-16 Kb-Denver, Inc. Method of making keyboard assemblies
US4073530A (en) * 1976-02-11 1978-02-14 David Seidler Parts pick up and manipulating devices
US4127432A (en) * 1976-04-12 1978-11-28 Matsushita Electric Industrial Co., Ltd. Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4288281A (en) * 1978-09-28 1981-09-08 Sigma Corporation Appliance for adhering a sensing marker on a medium for recording information
US4451324A (en) * 1979-05-12 1984-05-29 Sony Corporation Apparatus for placing chip type circuit elements on a board
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US4724030A (en) * 1985-05-17 1988-02-09 American Telephone And Telegraph Company At&T Technologies, Inc. Adhesive aided transfer of chips
US4916807A (en) * 1989-01-05 1990-04-17 Wiese Paul H Method and apparatus for assembling circuits having surface mounted components
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
US5043296A (en) * 1988-03-15 1991-08-27 Siemens Aktiengesellschaft Method of manufacturing LED rows using a temporary rigid auxiliary carrier
US5190164A (en) * 1991-12-03 1993-03-02 Allen Graves Bead sorting tool
US5256562A (en) * 1990-12-31 1993-10-26 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5258325A (en) * 1990-12-31 1993-11-02 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5383997A (en) * 1991-03-20 1995-01-24 Murata Manufacturing Co., Ltd. Method of handling electronic component chips
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US20030180545A1 (en) * 2000-01-25 2003-09-25 Luigi Capriotti Glazing with electrical terminal
US6695369B2 (en) * 1999-09-01 2004-02-24 Graffinity Pharmaceuticals Ag Device and method for picking up and placing objects
US20040154733A1 (en) * 2001-02-08 2004-08-12 Thomas Morf Chip transfer method and apparatus
WO2004081993A1 (en) * 2003-03-12 2004-09-23 Datacon Semiconductor Equipment Gmbh Device for connecting electronic circuits
DE102004033645A1 (en) * 2004-05-10 2005-12-15 Advanced Chip Engineering Technology Inc. Wafer level package fabrication tool and method of arranging chips
DE102015112085B4 (en) 2014-08-05 2021-08-19 Infineon Technologies Ag Batch process for connecting chips to a carrier

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DE3234744C2 (en) * 1982-09-20 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Device for holding a plurality of semiconductor wafers, each provided with integrated circuits, when making contact with strip conductors formed on a film-shaped substrate
DE3923023A1 (en) * 1989-07-12 1991-01-24 Siemens Ag UV CURABLE ADHESIVE FOR A SEMICONDUCTOR CHIP ASSEMBLY PROCESS
DE19840226B4 (en) * 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method of applying a circuit chip to a carrier
DE10128271C1 (en) * 2001-06-12 2002-11-28 Liz Electronics Corp Diode manufacturing method uses shaker with reception openings for alignment of diode chips before adhering to lower conductor layers provided by base plate

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Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49108975A (en) * 1973-02-20 1974-10-16
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4042439A (en) * 1975-05-12 1977-08-16 Kb-Denver, Inc. Method of making keyboard assemblies
US4073530A (en) * 1976-02-11 1978-02-14 David Seidler Parts pick up and manipulating devices
US4127432A (en) * 1976-04-12 1978-11-28 Matsushita Electric Industrial Co., Ltd. Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
US4288281A (en) * 1978-09-28 1981-09-08 Sigma Corporation Appliance for adhering a sensing marker on a medium for recording information
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4451324A (en) * 1979-05-12 1984-05-29 Sony Corporation Apparatus for placing chip type circuit elements on a board
US4724030A (en) * 1985-05-17 1988-02-09 American Telephone And Telegraph Company At&T Technologies, Inc. Adhesive aided transfer of chips
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US5043296A (en) * 1988-03-15 1991-08-27 Siemens Aktiengesellschaft Method of manufacturing LED rows using a temporary rigid auxiliary carrier
US4916807A (en) * 1989-01-05 1990-04-17 Wiese Paul H Method and apparatus for assembling circuits having surface mounted components
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
US5256562A (en) * 1990-12-31 1993-10-26 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5258325A (en) * 1990-12-31 1993-11-02 Kopin Corporation Method for manufacturing a semiconductor device using a circuit transfer film
US5383997A (en) * 1991-03-20 1995-01-24 Murata Manufacturing Co., Ltd. Method of handling electronic component chips
US5571594A (en) * 1991-03-20 1996-11-05 Murata Manufacturing Co., Ltd. Electronic component chip holder including two adhesive surfaces having different adhesiveness
US5622585A (en) * 1991-03-20 1997-04-22 Murata Manufacturing Co., Ltd. Method of handling electronic component chips
US5190164A (en) * 1991-12-03 1993-03-02 Allen Graves Bead sorting tool
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US6695369B2 (en) * 1999-09-01 2004-02-24 Graffinity Pharmaceuticals Ag Device and method for picking up and placing objects
US20030180545A1 (en) * 2000-01-25 2003-09-25 Luigi Capriotti Glazing with electrical terminal
US6774342B2 (en) * 2000-01-25 2004-08-10 Societa Italiana Vetro - Siv S.P.A. Glazing with electrical terminal
USRE41715E1 (en) * 2000-01-25 2010-09-21 Pilkington Italia S.P.A. Glazing with electrical terminal
US20040154733A1 (en) * 2001-02-08 2004-08-12 Thomas Morf Chip transfer method and apparatus
WO2004081993A1 (en) * 2003-03-12 2004-09-23 Datacon Semiconductor Equipment Gmbh Device for connecting electronic circuits
DE102004033645A1 (en) * 2004-05-10 2005-12-15 Advanced Chip Engineering Technology Inc. Wafer level package fabrication tool and method of arranging chips
DE102004033645B4 (en) * 2004-05-10 2006-08-31 Advanced Chip Engineering Technology Inc. Wafer level package fabrication tool and method of arranging chips
DE102015112085B4 (en) 2014-08-05 2021-08-19 Infineon Technologies Ag Batch process for connecting chips to a carrier

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Publication number Publication date
JPS4813568B1 (en) 1973-04-27
FR2021540A7 (en) 1970-07-24
DE1805174A1 (en) 1970-05-14

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