US3664933A - Process for acid copper plating of zinc - Google Patents
Process for acid copper plating of zinc Download PDFInfo
- Publication number
- US3664933A US3664933A US834909A US3664933DA US3664933A US 3664933 A US3664933 A US 3664933A US 834909 A US834909 A US 834909A US 3664933D A US3664933D A US 3664933DA US 3664933 A US3664933 A US 3664933A
- Authority
- US
- United States
- Prior art keywords
- copper
- grams per
- per liter
- zinc
- immersion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Abstract
Description
Claims (5)
- 2. The process as claimed in claim 1 wherein subsequent to the formation of the displacement copper deposit on the zinc surface and prior to the copper electrodeposit from the acid copper plating bath, the surface is treated with an immersion nickel plating bath to form a displacement nickel deposit on the surface.
- 3. The process as claimed in claim 2 wherein the immersion copper plating bath is an aqueous solution comprising from about 8 to 30 grams per liter of copper supplied by a water soluble copper salt, from about 30 to 350 grams per liter of a primary complexing agent for cupric ions, from about 5 to 80 grams per liter of an alkali metal hydroxide, from about 5 to 70 grams per liter of an accelerator selected from alkali metal chlorides and from about 0.2 to 5 grams per liter of a secondary complexing agent selected from alkali metal cyanides and ammonium hydroxide.
- 4. The process as claimed in claim 3 wherein the water soluble copper salt is copper sulfate, the primary complexing agent is sodium gluconate and the accelerator is sodium chloride and the secondary complexing agent is sodium cyanide.
- 5. A process for the copper electroplating of complex zinc die castings having recessed areas which comprises applying an electrolytic copper strike to the zinc surface to be treated, treating the thus strike plated zinc surface with an immersion copper plating bath which is an aqueous solution comprising from about 8 to 30 grams per liter of copper supplied by a water soluble copper salt, from about 30 to 350 grams per liter of a primary complexing agent for cupric ions, from about 5 to 80 grams per liter of an alkali metal hydroxide, from about 5 to 70 grams per liter of an accelerator selected from alkali metal chlorides and 0.2 to 5 grams per liter of a secondary complexing agent selected from alkali metal cyanides and ammonium hydroxide, forming a displacement copper deposit on the uncoated, recessed, zinc surface and, thereafter, electrodepositing copper on the thus treated surfaces from aqueous acidic copper electroplating bath.
- 6. The process as claimed in claim 5 wherein the water soluble copper salt is copper sulfate, the primary complexing agent for cupric ions is sodium gluconate and the accelerator is sodium chloride and the secondary complexing agent is sodium cyanide.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83490969A | 1969-06-19 | 1969-06-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3664933A true US3664933A (en) | 1972-05-23 |
Family
ID=25268111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US834909A Expired - Lifetime US3664933A (en) | 1969-06-19 | 1969-05-19 | Process for acid copper plating of zinc |
Country Status (8)
Country | Link |
---|---|
US (1) | US3664933A (en) |
JP (1) | JPS4843787B1 (en) |
BE (1) | BE751427A (en) |
CA (1) | CA924670A (en) |
DE (1) | DE2026698A1 (en) |
FR (1) | FR2046885B1 (en) |
GB (1) | GB1294027A (en) |
NL (1) | NL7008864A (en) |
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4272570A (en) * | 1980-04-11 | 1981-06-09 | Sunbeam Corporation | Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys |
US4454168A (en) * | 1982-09-29 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from metallized photoadhesive layers |
US5558759A (en) * | 1994-07-26 | 1996-09-24 | Sargent Manufacturing Company | Metal finishing process |
EP1064417A1 (en) * | 1998-03-20 | 2001-01-03 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6180179B1 (en) * | 1997-06-02 | 2001-01-30 | Nihon Parkerizing Co., Ltd. | Displace deposition-plated and doping-modified metal material and process for producing same |
US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US20020053509A1 (en) * | 1996-07-15 | 2002-05-09 | Hanson Kyle M. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US20020125141A1 (en) * | 1999-04-13 | 2002-09-12 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20020139678A1 (en) * | 1999-04-13 | 2002-10-03 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20030020928A1 (en) * | 2000-07-08 | 2003-01-30 | Ritzdorf Thomas L. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6541188B2 (en) * | 2001-05-11 | 2003-04-01 | Kodak Polychrome Graphics Llc | Developer for alkaline-developable lithographic printing plates |
US20030062258A1 (en) * | 1998-07-10 | 2003-04-03 | Woodruff Daniel J. | Electroplating apparatus with segmented anode array |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
US6569297B2 (en) | 1999-04-13 | 2003-05-27 | Semitool, Inc. | Workpiece processor having processing chamber with improved processing fluid flow |
US20030217929A1 (en) * | 2002-05-08 | 2003-11-27 | Peace Steven L. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US20040023494A1 (en) * | 1998-03-13 | 2004-02-05 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
US20040038052A1 (en) * | 2002-08-21 | 2004-02-26 | Collins Dale W. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US6806186B2 (en) | 1998-02-04 | 2004-10-19 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
US20040228719A1 (en) * | 1996-07-15 | 2004-11-18 | Woodruff Daniel J. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US20050214460A1 (en) * | 2002-05-22 | 2005-09-29 | Pascal Doppelt | Method of depositing copper on a support |
US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20060280872A1 (en) * | 2005-06-10 | 2006-12-14 | Enthone Inc. | Method for direct metallization of non-conducting substrates |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20080264774A1 (en) * | 2007-04-25 | 2008-10-30 | Semitool, Inc. | Method for electrochemically depositing metal onto a microelectronic workpiece |
US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
WO2011029507A1 (en) * | 2009-09-11 | 2011-03-17 | Umicore Galvanotechnik Gmbh | Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation |
US11618951B2 (en) | 2020-05-27 | 2023-04-04 | Global Circuit Innovations Incorporated | Chemical evaporation control system |
US11661666B2 (en) | 2019-10-10 | 2023-05-30 | The Boeing Company | Electrodeposited zinc and iron coatings for corrosion resistance |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112013003430A2 (en) | 2010-08-17 | 2016-06-21 | Chemetall Gmbh | "process for covering metallic substrates without electric current." |
CN116686000A (en) | 2020-12-28 | 2023-09-01 | 三菱电机株式会社 | Image processing device, program, and image processing method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US43557A (en) * | 1864-07-12 | Improved mode of coating and bronzing metals | ||
US2128550A (en) * | 1933-02-06 | 1938-08-30 | Gen Motors Corp | Anticorrosion process for zinc base castings |
GB792847A (en) * | 1955-08-08 | 1958-04-02 | Nat Alloys Ltd | Improvements in or relating to immersion brass finishing of zinc-alloy die-castings |
US2903403A (en) * | 1954-02-10 | 1959-09-08 | Dehydag Gmbh | Method of copper-plating metal surfaces |
FR1288498A (en) * | 1961-05-03 | 1962-03-24 | Photocircuits Corp | Non-galvanic copper plating process, and baths used for the implementation of this process |
US3282659A (en) * | 1965-08-24 | 1966-11-01 | Westinghouse Electric Corp | Plated zinc base articles and method of making |
-
1969
- 1969-05-19 US US834909A patent/US3664933A/en not_active Expired - Lifetime
-
1970
- 1970-05-06 CA CA082040A patent/CA924670A/en not_active Expired
- 1970-05-13 GB GB23269/70A patent/GB1294027A/en not_active Expired
- 1970-06-01 DE DE19702026698 patent/DE2026698A1/en active Pending
- 1970-06-02 FR FR7020172A patent/FR2046885B1/fr not_active Expired
- 1970-06-03 BE BE751427D patent/BE751427A/en unknown
- 1970-06-17 NL NL7008864A patent/NL7008864A/xx unknown
- 1970-06-18 JP JP45052484A patent/JPS4843787B1/ja active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US43557A (en) * | 1864-07-12 | Improved mode of coating and bronzing metals | ||
US2128550A (en) * | 1933-02-06 | 1938-08-30 | Gen Motors Corp | Anticorrosion process for zinc base castings |
US2903403A (en) * | 1954-02-10 | 1959-09-08 | Dehydag Gmbh | Method of copper-plating metal surfaces |
GB792847A (en) * | 1955-08-08 | 1958-04-02 | Nat Alloys Ltd | Improvements in or relating to immersion brass finishing of zinc-alloy die-castings |
FR1288498A (en) * | 1961-05-03 | 1962-03-24 | Photocircuits Corp | Non-galvanic copper plating process, and baths used for the implementation of this process |
US3282659A (en) * | 1965-08-24 | 1966-11-01 | Westinghouse Electric Corp | Plated zinc base articles and method of making |
Non-Patent Citations (3)
Title |
---|
Electroless Plating for Electronic Applications by Lordi, Plating, April 1967 pages 382 383 * |
Handbook of Chemistry & Physics, 32nd edition, 1950 1951, page 1521 * |
Metal Finishing Guidebook Directory, 1966, pages 422 425 * |
Cited By (68)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4272570A (en) * | 1980-04-11 | 1981-06-09 | Sunbeam Corporation | Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys |
US4454168A (en) * | 1982-09-29 | 1984-06-12 | E. I. Du Pont De Nemours And Company | Printed circuits prepared from metallized photoadhesive layers |
US5558759A (en) * | 1994-07-26 | 1996-09-24 | Sargent Manufacturing Company | Metal finishing process |
US6921467B2 (en) | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US20040228719A1 (en) * | 1996-07-15 | 2004-11-18 | Woodruff Daniel J. | Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces |
US20020053509A1 (en) * | 1996-07-15 | 2002-05-09 | Hanson Kyle M. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6180179B1 (en) * | 1997-06-02 | 2001-01-30 | Nihon Parkerizing Co., Ltd. | Displace deposition-plated and doping-modified metal material and process for producing same |
US20050051436A1 (en) * | 1998-02-04 | 2005-03-10 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
US6806186B2 (en) | 1998-02-04 | 2004-10-19 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
US20060208272A1 (en) * | 1998-02-04 | 2006-09-21 | Semitool, Inc. | Method for filling recessed micro-structures with metallization in the production of a microelectronic device |
US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
US7399713B2 (en) | 1998-03-13 | 2008-07-15 | Semitool, Inc. | Selective treatment of microelectric workpiece surfaces |
US20040023494A1 (en) * | 1998-03-13 | 2004-02-05 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
US7115196B2 (en) | 1998-03-20 | 2006-10-03 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
US20040040857A1 (en) * | 1998-03-20 | 2004-03-04 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6565729B2 (en) | 1998-03-20 | 2003-05-20 | Semitool, Inc. | Method for electrochemically depositing metal on a semiconductor workpiece |
EP1064417A1 (en) * | 1998-03-20 | 2001-01-03 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20030141194A1 (en) * | 1998-03-20 | 2003-07-31 | Chen Linlin | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6638410B2 (en) | 1998-03-20 | 2003-10-28 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US7332066B2 (en) | 1998-03-20 | 2008-02-19 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
EP1064417A4 (en) * | 1998-03-20 | 2006-07-05 | Semitool Inc | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6932892B2 (en) | 1998-03-20 | 2005-08-23 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6197181B1 (en) | 1998-03-20 | 2001-03-06 | Semitool, Inc. | Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece |
US20040035708A1 (en) * | 1998-03-20 | 2004-02-26 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20040035710A1 (en) * | 1998-03-20 | 2004-02-26 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6290833B1 (en) | 1998-03-20 | 2001-09-18 | Semitool, Inc. | Method for electrolytically depositing copper on a semiconductor workpiece |
US6811675B2 (en) | 1998-03-20 | 2004-11-02 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US6919013B2 (en) | 1998-03-20 | 2005-07-19 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a workpiece |
US6277263B1 (en) * | 1998-03-20 | 2001-08-21 | Semitool, Inc. | Apparatus and method for electrolytically depositing copper on a semiconductor workpiece |
US20030062258A1 (en) * | 1998-07-10 | 2003-04-03 | Woodruff Daniel J. | Electroplating apparatus with segmented anode array |
US7357850B2 (en) | 1998-07-10 | 2008-04-15 | Semitool, Inc. | Electroplating apparatus with segmented anode array |
US7147760B2 (en) | 1998-07-10 | 2006-12-12 | Semitool, Inc. | Electroplating apparatus with segmented anode array |
US6916412B2 (en) | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7585398B2 (en) | 1999-04-13 | 2009-09-08 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US20040188259A1 (en) * | 1999-04-13 | 2004-09-30 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7566386B2 (en) | 1999-04-13 | 2009-07-28 | Semitool, Inc. | System for electrochemically processing a workpiece |
US6660137B2 (en) | 1999-04-13 | 2003-12-09 | Semitool, Inc. | System for electrochemically processing a workpiece |
US7267749B2 (en) | 1999-04-13 | 2007-09-11 | Semitool, Inc. | Workpiece processor having processing chamber with improved processing fluid flow |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7020537B2 (en) | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7160421B2 (en) | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US7189318B2 (en) | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20020139678A1 (en) * | 1999-04-13 | 2002-10-03 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20010032788A1 (en) * | 1999-04-13 | 2001-10-25 | Woodruff Daniel J. | Adaptable electrochemical processing chamber |
US20020125141A1 (en) * | 1999-04-13 | 2002-09-12 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US6569297B2 (en) | 1999-04-13 | 2003-05-27 | Semitool, Inc. | Workpiece processor having processing chamber with improved processing fluid flow |
US20030020928A1 (en) * | 2000-07-08 | 2003-01-30 | Ritzdorf Thomas L. | Methods and apparatus for processing microelectronic workpieces using metrology |
US7102763B2 (en) | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
US6645700B2 (en) | 2001-05-11 | 2003-11-11 | Kodak Polychrome Graphics Llc | Developer for alkaline-developable lithographic printing plates |
US6541188B2 (en) * | 2001-05-11 | 2003-04-01 | Kodak Polychrome Graphics Llc | Developer for alkaline-developable lithographic printing plates |
US7090751B2 (en) | 2001-08-31 | 2006-08-15 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US20030217929A1 (en) * | 2002-05-08 | 2003-11-27 | Peace Steven L. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US6893505B2 (en) | 2002-05-08 | 2005-05-17 | Semitool, Inc. | Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids |
US7208197B2 (en) * | 2002-05-22 | 2007-04-24 | Centre National De La Recherche Scientifique | Method of depositing copper on a support |
US20050214460A1 (en) * | 2002-05-22 | 2005-09-29 | Pascal Doppelt | Method of depositing copper on a support |
US7025866B2 (en) | 2002-08-21 | 2006-04-11 | Micron Technology, Inc. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20060182879A1 (en) * | 2002-08-21 | 2006-08-17 | Collins Dale W | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20040038052A1 (en) * | 2002-08-21 | 2004-02-26 | Collins Dale W. | Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces |
US20050092611A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Bath and method for high rate copper deposition |
US7351314B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US7351315B2 (en) | 2003-12-05 | 2008-04-01 | Semitool, Inc. | Chambers, systems, and methods for electrochemically processing microfeature workpieces |
US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
US20060280872A1 (en) * | 2005-06-10 | 2006-12-14 | Enthone Inc. | Method for direct metallization of non-conducting substrates |
US20080264774A1 (en) * | 2007-04-25 | 2008-10-30 | Semitool, Inc. | Method for electrochemically depositing metal onto a microelectronic workpiece |
WO2011029507A1 (en) * | 2009-09-11 | 2011-03-17 | Umicore Galvanotechnik Gmbh | Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation |
US11661666B2 (en) | 2019-10-10 | 2023-05-30 | The Boeing Company | Electrodeposited zinc and iron coatings for corrosion resistance |
US11618951B2 (en) | 2020-05-27 | 2023-04-04 | Global Circuit Innovations Incorporated | Chemical evaporation control system |
Also Published As
Publication number | Publication date |
---|---|
NL7008864A (en) | 1970-12-22 |
DE2026698A1 (en) | 1971-01-07 |
FR2046885B1 (en) | 1974-05-24 |
CA924670A (en) | 1973-04-17 |
BE751427A (en) | 1970-12-03 |
FR2046885A1 (en) | 1971-03-12 |
JPS4843787B1 (en) | 1973-12-20 |
GB1294027A (en) | 1972-10-25 |
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Legal Events
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Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
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Owner name: HOOKER CHEMICALS & PLASTICS CORP. Free format text: MERGER;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:004075/0885 Effective date: 19801222 |
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Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
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Owner name: OMI INTERNATIONAL CORPORATION, 21441 HOOVER ROAD, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004190/0827 Effective date: 19830915 |
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Owner name: MANUFACTURERS HANOVER TRUST COMPANY, A CORP OF NY Free format text: SECURITY INTEREST;ASSIGNOR:INTERNATIONAL CORPORATION, A CORP OF DE;REEL/FRAME:004201/0733 Effective date: 19830930 |
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Owner name: FIRST CITY NATIONAL BANK OF MIDLAND, BROWNSVILLE, Free format text: ASSIGNMENT OF 1/4 OF ASSIGNORS INTEREST;ASSIGNOR:TULLOS, MIKE S.;REEL/FRAME:004689/0995 Effective date: 19861209 Owner name: TULLOS, MADGE, S., BROWNSVILLE, TEXAS, CO-TRUSTEES Free format text: ASSIGNMENT OF 1/4 OF ASSIGNORS INTEREST;ASSIGNOR:TULLOS, MIKE S.;REEL/FRAME:004689/0995 Effective date: 19861209 |