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Brevets

Référencé par

Brevet citant Date de dépôt Date de délivrance Cessionnaire d'origine Titre
US40906179 févr. 197723 mai 1978Seiko Seiki Kabushiki KaishaLoading and unloading device for a workpiece
US452935327 janv. 198316 juil. 1985AT&T Bell LaboratoriesWafer handling apparatus and method
US460932020 juin 19842 sept. 1986Flexible workpiece transporter and roller assembly therefor
US466636617 juil. 198519 mai 1987Canon Kabushiki KaishaArticulated arm transfer device
US468585220 mai 198511 août 1987Machine Technology, Inc.Process apparatus and method and elevator mechanism for use in connection therewith
US46952152 janv. 198522 sept. 1987Ernst Leitz Wetzlar GmbHDevice for automatically transporting disk shaped objects
US472229819 mai 19862 févr. 1988Machine Technology, Inc.Modular processing apparatus for processing semiconductor wafers
US473097629 janv. 198515 mars 1988Aeronca Electronics, Inc.Articulated arm transfer device
US47401358 janv. 198626 avr. 1988SCSS InstrumentsWafer transfer arm mechanism
US47752812 déc. 19864 oct. 1988Teradyne, Inc.Apparatus and method for loading and unloading wafers
US478780018 oct. 198529 nov. 1988Toshiba Corporation
Tokyo Kogaku Kikai Kabushiki Kaisha
Transfer machine in a surface inspection apparatus
US478929427 août 19866 déc. 1988Canon Kabushiki KaishaWafer handling apparatus and method
US480805915 juil. 198628 févr. 1989Peak Systems, Inc.Apparatus and method for transferring workpieces
US481816917 mai 19854 avr. 1989Automated wafer inspection system
US483673321 déc. 19876 juin 1989Varian Associates, Inc.Wafer transfer system
US490021212 déc. 198813 févr. 1990Texas Instruments IncorporatedWafer pick out apparatus
US491556420 juil. 198810 avr. 1990Materials Research CorporationMethod and apparatus for handling and processing wafer-like materials
US49363291 mai 198926 juin 1990Leybold AktiengesellschaftDevice for cleaning, testing and sorting of workpieces
US498495327 mars 199015 janv. 1991Canon Kabushiki KaishaPlate-like article conveying system
US499967129 mai 199012 mars 1991Canon Kabushiki KaishaReticle conveying device
US501136631 juil. 198930 avr. 1991Ultraclean robotic material transfer method
US51155531 sept. 198726 mai 1992The Cooper Companies, Inc.Contact lens manufacturing apparatus
US518027618 avr. 199119 janv. 1993Brooks Automation, Inc.Articulated arm transfer device
US551625111 août 199414 mai 1996Kabushiki Kaisha ShinkawaMagazine carrying apparatus
US557787913 avr. 199526 nov. 1996Brooks Automation, Inc.Articulated arm transfer device
US558464719 janv. 199317 déc. 1996Tokyo Ohka Kogyo Co., Ltd.Object handling devices
US564105116 déc. 199424 juin 1997Mikron SA AgnoProcess and device for transferring workpiece
US564772427 oct. 199515 juil. 1997Brooks Automation Inc.Substrate transport apparatus with dual substrate holders
US57205903 mai 199524 févr. 1998Brooks Automation, Inc.Articulated arm transfer device
US57437049 avr. 199728 avr. 1998Brooks Automation, Inc.Wide wrist articulated arm transfer device
US576598330 mai 199616 juin 1998Brooks Automation, Inc.Robot handling apparatus
US581382330 oct. 199629 sept. 1998Brooks Automation, Inc.Articulated arm transfer device
US589965824 oct. 19974 mai 1999Brooks Automation Inc.Articulated arm transfer device
US606279813 juin 199616 mai 2000Brooks Automation, Inc.Multi-level substrate processing apparatus
US61127352 mars 19995 sept. 2000Micron Technology, Inc.Complete blade and wafer handling and support system without tape
US615894112 janv. 199912 déc. 2000Brooks Automation, Inc.Substrate transport apparatus with double substrate holders
US623129721 janv. 199715 mai 2001Brooks Automation, Inc.Substrate transport apparatus with angled arms
US62610488 nov. 199917 juil. 2001Brooks Automation, Inc.Multi-level substrate processing apparatus
US629940416 janv. 19969 oct. 2001Brooks Automation Inc.Substrate transport apparatus with double substrate holders
US632505730 mai 20004 déc. 2001Micron Technology, Inc.Complete blade and wafer handling and support system without tape
US632505830 mai 20004 déc. 2001Micron Technology, Inc.Complete blade and wafer handling and support system without tape
US634561530 mai 200012 févr. 2002Micron Technology, Inc.Complete blade and wafer handling and support system without tape
US648195620 mars 199819 nov. 2002Brooks Automation Inc.Method of transferring substrates with two different substrate holding end effectors
US649157430 mai 200010 déc. 2002Micron Technology, Inc.Complete blade and wafer handling and support system without tape
US733779228 févr. 20034 mars 2008Tokyo Electron LimitedLiquid processing apparatus and liquid processing method