|
| US3943666 | 31 juil. 1974 | 16 mars 1976 | Dysan Corporation | Method and apparatus for burnishing flexible recording material |
| US4179852 | 13 mars 1978 | 25 déc. 1979 | Three Phoenix Company | Method and apparatus for polishing floppy discs |
| US4193226 | 30 août 1978 | 18 mars 1980 | Kayex Corporation | Polishing apparatus |
| US4536992 | 4 nov. 1983 | 27 août 1985 | Magnetic Peripherals | Precision lapping system |
| US4667258 | 27 mars 1984 | 19 mai 1987 | IXI Laboratories, Inc. | Disk drive with multiple head cartridge |
| US4839993 | 16 janv. 1987 | 20 juin 1989 | Fujisu Limited | Polishing machine for ferrule of optical fiber connector |
| US5040337 | 30 nov. 1989 | 20 août 1991 | Tool & Engineering, Div. of Wickes Companies, Inc. | Method and apparatus for honing aircraft blades |
| US5157870 | 8 févr. 1991 | 27 oct. 1992 | | Precision clamp scissors sharpening system |
| US5264010 | 27 avr. 1992 | 23 nov. 1993 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
| US5287663 | 28 avr. 1992 | 22 févr. 1994 | National Semiconductor Corporation | Polishing pad and method for polishing semiconductor wafers |
| US5291690 | 21 oct. 1992 | 8 mars 1994 | | Nipper clamp for precison clamp scissors sharpening system |
| US5302551 | 11 mai 1992 | 12 avr. 1994 | National Semiconductor Corporation | Method for planarizing the surface of an integrated circuit over a metal interconnect layer |
| US5403228 | 8 juil. 1993 | 4 avr. 1995 | LSI Logic Corporation | Techniques for assembling polishing pads for silicon wafer polishing |
| US5422289 | 27 avr. 1992 | 6 juin 1995 | National Semiconductor Corporation | Method of manufacturing a fully planarized MOSFET and resulting structure |
| US5480344 | 12 oct. 1993 | 2 janv. 1996 | The Furukawa Electric Co., Ltd. | Polishing process for optical connector assembly with optical fiber and polishing apparatus |
| US5653624 | 13 sept. 1995 | 5 août 1997 | Ebara Corporation | Polishing apparatus with swinging structures |
| US5692950 | 8 août 1996 | 2 déc. 1997 | Minnesota Mining and Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US5876269 | 5 nov. 1997 | 2 mars 1999 | NEC Corporation | Apparatus and method for polishing semiconductor device |
| US5882156 | 18 juin 1997 | 16 mars 1999 | | Method and apparatus for milling a segment of a spherical surface |
| US5921853 | 4 mars 1997 | 13 juil. 1999 | Matsushita Electric Industrial Co., Ltd. | Apparatus for polishing substrate using resin film or multilayer polishing pad |
| US6007407 | 20 août 1997 | 28 déc. 1999 | Minnesota Mining and Manufacturing Company
Exclusive Design Company, Inc. | Abrasive construction for semiconductor wafer modification |
| US6080044 | 26 mars 1998 | 27 juin 2000 | Gerber Coburn Optical, Inc. | Fining/polishing machine |
| US6315636 | 18 janv. 2000 | 13 nov. 2001 | Fujitsu Limited | Lapping machine, row tool, and lapping method |
| US6402591 | 31 mars 2000 | 11 juin 2002 | Lam Research Corporation | Planarization system for chemical-mechanical polishing |
| US6746311 | 24 janv. 2000 | 8 juin 2004 | 3M Innovative Properties Company | Polishing pad with release layer |
