US3918147A - Hermetic enclosure for electronic component - Google Patents
Hermetic enclosure for electronic component Download PDFInfo
- Publication number
- US3918147A US3918147A US454289A US45428974A US3918147A US 3918147 A US3918147 A US 3918147A US 454289 A US454289 A US 454289A US 45428974 A US45428974 A US 45428974A US 3918147 A US3918147 A US 3918147A
- Authority
- US
- United States
- Prior art keywords
- collar
- container
- outwardly protruding
- protruding flange
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011324 bead Substances 0.000 claims abstract description 52
- 239000011521 glass Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 33
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 24
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 24
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 22
- 239000004332 silver Substances 0.000 claims abstract description 22
- 230000006835 compression Effects 0.000 claims abstract description 20
- 238000007906 compression Methods 0.000 claims abstract description 20
- 239000005394 sealing glass Substances 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 8
- 238000007789 sealing Methods 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 239000012611 container material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 13
- 239000003792 electrolyte Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- ROSDCCJGGBNDNL-UHFFFAOYSA-N [Ta].[Pb] Chemical compound [Ta].[Pb] ROSDCCJGGBNDNL-UHFFFAOYSA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000619 316 stainless steel Inorganic materials 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
Definitions
- Asslgnee 1(slogung Glass Works, Corning, ABSTRACT A hermetic enclosure for an electrical component, [22] Filed 1974 particularly for a tantalum capacitor, and a method of [21] Appl. No.: 454,289 forming it is disclosed.
- a silver container is provided having an open end at which an outwardly protruding flange is formed.
- a quantity of sealing glass is sealed 29/5ggiJ2%5/(8)(8) to a lead and formed into a bead about the lead intep [58] 447 mediate the ends thereof.
- Ametallic collar having an le o are 30 l outwardly protruding flange is disposed about the bead.
- the present invention relates to enclosing of any electrical component but in particular electrical components having gaseous or liquid matter which may leak or escape.
- the objects of this invention are to provide an electronic device enclosure, assembly, and method of manufacture which is economical, provides a hermetic seal for the leads and the container, and overcomes the heretofore noted disadvantages.
- a silver container open at one end is provided.
- a unitary outwardly protruding flange is formed at the open end from the container material.
- To the tantalum component lead a quantity of sealing glass is sealed to form a bead about the lead intermediate the ends thereof.
- a metallic collar having an outwardly protruding flange is disposed about the bead.
- the metallic collar and glass bead together with a metallic band, having a temperature coefficient of expansion greater than the glass bead, is heated and the metallic band is disposed about the collar so as to place the collar and the glass bead in compression upon cooling, thereby effecting a compression seal between the collar and the glass bead.
- the outwardly protruding flange of the collar is disposed adjacent the outwardly protruding flange of the container and hermetic seal is effected between these flanges. Thereby, an electrical component attached to the lead is hermetically enclosed within the container. A second lead may thereafter be attached to the container at the end opposite the open end.
- FIGURE is a cross-sectional view of an electronic device encapsulated in accordance with the present invention.
- housing 10 within which a porous tantalum slug 12 is disposed.
- the preferred material for housing or container 10 is silver.
- Porous tantalum slug 12 may be positioned within housing 10 by any means known in the art such as, for example, a synthetic rubber cup-like member or boot 14 formed of material electrically and chemically compatible with the various materials of the capacitor.
- An electrolyte gel 16 is disposed within housing or container l0 totally immersing porous tantalum slug 12.
- a tatalum lead 18 is affixed to porous tantalum slug l2 and extends a sufficient distance outside the container so as to permit an external lead to be attached thereto.
- a film 20 of Ta O is formed on the surface of the enclosed portion of tantalum lead 18 and slug 12.
- An outwardly protruding unitary flange 22 is formed of the housing material at the open end of housing 10.
- a quantity of dielectric sealing glass is sealed to lead 18 to form a bead 24 about lead 18 intermediate the ends thereof.
- An example of a suitable dielectric sealing glass is as follows in weight percent on an oxide basis: SiO 65 percent, A1 0 7 percent, B 0 10 percent, Li O 3 percent, Na O 2 percent, BaO 6 percent, Fe O 3 percent, and F 4 percent.
- a metallic collar 26 formed of a material which can be hermetically sealed to the material of container 10 is formed within outwardly protruding flange 28.
- a suitable material for metallic collar 26 for sealing to a silver container 10 is silver.
- a metallic band 30 is formed to closely fit about metallic collar 26 and is formed of a material having a temperature coefficient of expansion greater than that of the glass bead. Materials suitable for metallic band 30 are stainless steel, bronzes, and other high tensile strength alloys.
- glass bead 24, collar 26, and metallic band 30 are heated to a temperature sufficient to provide a compression seal, such for example as a temperature below about 600C.
- Metallic collar 28 is then disposed about glass bead 24 and metallic band 30 is then fitted around collar 26.
- collar 30 having a greater temperature coefficient of expansion than the glass bead will shrink more than the glass bead placing the collar and the glass bead in compression thereby effecting a compression seal between the collar and the glass bead.
- the tantalum slug with its lead 18 and the glass bead, metallic collar, and metallic band assembly is then disposed with the porous slug 12 within the housing or container 10, the tantalum slug being immersed in electrolyte gel 16.
- Outwardly protruding flange 28 is thereby disposed adjacent outwardly protruding flange 22.
- the peripheral portion of outwardly protruding flange 22 is then crimped over to sandwich outwardly protruding flange 28 as shown in the drawing.
- the two outwardly protruding flanges are then hermetically sealed together by ultrasonic welding or the like in a manner well known in the art.
- tantalum slug 12 forms one electrode of the capacitor while housing forms the other electrode.
- a second lead 32 is attached to housing 10 by any means known in the art such, for example, as welding or soldering.
- metallic collar 26 in the construction of a tantalum capacitor, the material of metallic collar 26 must generally be formed of a rather ductile material such as silver or the like for corrosion resistance to sulfuric acid and good scaling to the silver housing. If, however, metallic collar 26 may be formed of less ductile material, such as those suitable for metallic band 30 but without corrosion problems, then a compression seal could be effected between metallic collar 26 and glass bead 24 without an additional metallic band 30.
- an enclosure is formed by first preparing a cylindrical container or housing of silver.
- the housing is formed closed at one end so as to have a cavity sufficiently large to receive an electrical component such as a porous tantalum slug.
- an outwardly protruding flange is formed at the open end of the housing.
- a cup shaped member formed of Viton a fluoroelastomer rubber produced by E. I. du Pont de Nemours & Co., Inc. is disposed within which the tantalum slug will be deposited.
- a tantalum lead is welded to the tantalum slug or may be impressed within the slug during the sintering process thereof.
- a quantity of sealing glass such as that heretofore described, is sealed to the tantalum lead intermediate the ends thereof to form a glass bead.
- a silver collar having an outwardly protruding flange is provided as is a type 316 stainless steel band.
- the glass bead, silver collar, and stainless steel band are heated to a temperature somewhat below 600C. and the silver collar is disposed about the glass bead with the stainless steel band snugly fitted around the silver collar.
- the stainless steel band having a temperature coefficient of expansion substantially greater than that of the glass bead will place the silver collar and glass bead in the compression thereby effecting a compression seal between the silver collar and the glass bead.
- An electrolyte gel formed of a mixture of 38% sulfuric acid and an anhydrous and particulate colloidal silica material commercially known as Cab-O-Sil available from the Cabot Corporation of Boston, Massachusetts is disposed within the container.
- the tantalum slug with the tantalum lead and glass bead assembly is disposed within the container and snuggly fitted within a cupshaped member in a manner so that the lead protrudes from the open end of the container and the electrolyte gel completely covers the tantalum slug.
- the outwardly protruding flange of the silver collar is disposed adjacent the outwardly protruding flange formed at the open end of the container.
- the container flange is then crimped around the collar flange and the flanges are then ultrasonically welded.
- An external lead of nickel wire or the like may be attached to the tantalum lead by electric welding, while a second lead is attached to the closed end of the housing by silver soldering or the like thereby completing the capacitor.
- enclosures formed in accordance with the present invention are hermetic and do not permit the leakage of an electrolyte gel during the operation of the device environmental stress.
Abstract
A hermetic enclosure for an electrical component, particularly for a tantalum capacitor, and a method of forming it is disclosed. A silver container is provided having an open end at which an outwardly protruding flange is formed. A quantity of sealing glass is sealed to a lead and formed into a bead about the lead intermediate the ends thereof. A metallic collar having an outwardly protruding flange is disposed about the bead. This assembly and a metallic band, having a temperature coefficient of expansion greater than the glass bead, is heated and the metallic band is disposed about the collar so as to place the collar and glass bead in compression upon cooling thereby effecting a compression seal between the collar and the glass bead. A hermetic seal is then effected between the outwardly protruding flange of the container and the outwardly protruding flange of the collar.
Description
Herczog HERMETIC ENCLOSURE FOR ELECTRONIC COMPONENT Nov. 11, 1975 Primary Examiner-W. Tupman Attorney, Agent, or FirmWalter S. Zebrowski; Clarence R. Patty, Jr.
[75] Inventor: Andrew Herczog, Painted Post, NY.
[73] Asslgnee: 1(slogung Glass Works, Corning, ABSTRACT A hermetic enclosure for an electrical component, [22] Filed 1974 particularly for a tantalum capacitor, and a method of [21] Appl. No.: 454,289 forming it is disclosed. A silver container is provided having an open end at which an outwardly protruding flange is formed. A quantity of sealing glass is sealed 29/5ggiJ2%5/(8)(8) to a lead and formed into a bead about the lead intep [58] 447 mediate the ends thereof. Ametallic collar having an le o are 30 l outwardly protruding flange is disposed about the bead. This assembly and a metallic band, having a temperature coefficient of expansion greater than the glass bead, is heated and the metallic band is disposed [56] References Cited about the collar so as to place the collar and glass bead in compression upon cooling thereby effecting a UNITED STA TES PATENTS compression seal between the collar and the glass 2,122,392 6/1938 ROblnSOn 29/570 b A hermetic Seal is then ff t d between the 3'623'196 11/1971 Bongenaa 59/447 outwardly protruding flange of the container and the giggl outwardly protruding flange of the collar. l- 16 Claims, 1 Drawing Figure x 0 2 i 2:: 11R 2o g 1::3 l6
s sw IIIIIIIIIIIII U.S. Patant Nov. 11, 1975 HERMETIC ENCLOSURE FOR ELECTRONIC COMPONENT BACKGROUND OF THE INVENTION l. Field of the Invention The present invention relates to enclosing of any electrical component but in particular electrical components having gaseous or liquid matter which may leak or escape.
2. Description of the Prior Art In the manufacture of wet tantalum capacitors, it has been necessary to enclose a porous tantalum slug properly positioned within the metal container by means of a plastic sleeve or cup. A substantially liquid acidic electrolyte was disposed in between the slug and the container. A substantially inert plastic element was inserted on top of the slug and the container was crimped to hold the plastic element and thereby the tantalum slug in place. On top of the plastic element, the container is enclosed with the help of a concentric metal to glass to metal seal having its inside metal portion soldered to the lead and its outside metal ring to the container. The lead extends beyond the closure. The liquid seal takes place between the plastic element and the crimped container walls and perhaps at the glass to metal seal and soldered joints as well, which is undesirable if the metal parts are not all corrosion resistant. It has been found, however, that such prior art construction permits the leakage of the electrolyte after a period of time through corrosion or otherwise thereby rendering the device inoperative. Furthermore, such construction requires costly equipment and complicated assembly work.
SUMMARY OF THE INVENTION The objects of this invention are to provide an electronic device enclosure, assembly, and method of manufacture which is economical, provides a hermetic seal for the leads and the container, and overcomes the heretofore noted disadvantages.
Broadly, according to the present invention, a silver container open at one end is provided. A unitary outwardly protruding flange is formed at the open end from the container material. To the tantalum component lead a quantity of sealing glass is sealed to form a bead about the lead intermediate the ends thereof. A metallic collar having an outwardly protruding flange is disposed about the bead. The metallic collar and glass bead together with a metallic band, having a temperature coefficient of expansion greater than the glass bead, is heated and the metallic band is disposed about the collar so as to place the collar and the glass bead in compression upon cooling, thereby effecting a compression seal between the collar and the glass bead. The outwardly protruding flange of the collar is disposed adjacent the outwardly protruding flange of the container and hermetic seal is effected between these flanges. Thereby, an electrical component attached to the lead is hermetically enclosed within the container. A second lead may thereafter be attached to the container at the end opposite the open end.
Additional objects, features, and advantages of the present invention will become apparent to those skilled in the art, from the following detailed description and the attached drawing on which, by way of example, only the preferred embodiment of this invention is illustrated.
BRIEF DESCRIPTION OF THE DRAWING The single FIGURE is a cross-sectional view of an electronic device encapsulated in accordance with the present invention.
DETAILED DESCRIPTION It is to be noted that the drawing is illustrative and symbolic of the invention, and there is no intention to indicate scale or relative proportion of the elements shown therein. For the purposes of simplicity, the present invention will be described in connection with a hermetic enclosure for a wet tantalum capacitor, however, the present invention is in no way limited to such an enclosure, rather is applicable to any enclosure for an electronic or other device.
Referring to the drawing, there is shown housing 10 within which a porous tantalum slug 12 is disposed. The preferred material for housing or container 10 is silver. Porous tantalum slug 12 may be positioned within housing 10 by any means known in the art such as, for example, a synthetic rubber cup-like member or boot 14 formed of material electrically and chemically compatible with the various materials of the capacitor. An electrolyte gel 16 is disposed within housing or container l0 totally immersing porous tantalum slug 12. A tatalum lead 18 is affixed to porous tantalum slug l2 and extends a sufficient distance outside the container so as to permit an external lead to be attached thereto. As is well understood, a film 20 of Ta O is formed on the surface of the enclosed portion of tantalum lead 18 and slug 12. An outwardly protruding unitary flange 22 is formed of the housing material at the open end of housing 10. A quantity of dielectric sealing glass is sealed to lead 18 to form a bead 24 about lead 18 intermediate the ends thereof. An example of a suitable dielectric sealing glass is as follows in weight percent on an oxide basis: SiO 65 percent, A1 0 7 percent, B 0 10 percent, Li O 3 percent, Na O 2 percent, BaO 6 percent, Fe O 3 percent, and F 4 percent.
A metallic collar 26 formed of a material which can be hermetically sealed to the material of container 10 is formed within outwardly protruding flange 28. A suitable material for metallic collar 26 for sealing to a silver container 10 is silver. A metallic band 30 is formed to closely fit about metallic collar 26 and is formed of a material having a temperature coefficient of expansion greater than that of the glass bead. Materials suitable for metallic band 30 are stainless steel, bronzes, and other high tensile strength alloys. Thereafter, glass bead 24, collar 26, and metallic band 30 are heated to a temperature sufficient to provide a compression seal, such for example as a temperature below about 600C. Metallic collar 28 is then disposed about glass bead 24 and metallic band 30 is then fitted around collar 26. Upon cooling, collar 30 having a greater temperature coefficient of expansion than the glass bead will shrink more than the glass bead placing the collar and the glass bead in compression thereby effecting a compression seal between the collar and the glass bead. The tantalum slug with its lead 18 and the glass bead, metallic collar, and metallic band assembly is then disposed with the porous slug 12 within the housing or container 10, the tantalum slug being immersed in electrolyte gel 16. Outwardly protruding flange 28 is thereby disposed adjacent outwardly protruding flange 22. The peripheral portion of outwardly protruding flange 22 is then crimped over to sandwich outwardly protruding flange 28 as shown in the drawing. The two outwardly protruding flanges are then hermetically sealed together by ultrasonic welding or the like in a manner well known in the art.
As will be readily understood, tantalum slug 12 forms one electrode of the capacitor while housing forms the other electrode. A second lead 32 is attached to housing 10 by any means known in the art such, for example, as welding or soldering.
It will also be understood that the preceding description has assumed that in the construction ofa tantalum capacitor, the material of metallic collar 26 must generally be formed of a rather ductile material such as silver or the like for corrosion resistance to sulfuric acid and good scaling to the silver housing. If, however, metallic collar 26 may be formed of less ductile material, such as those suitable for metallic band 30 but without corrosion problems, then a compression seal could be effected between metallic collar 26 and glass bead 24 without an additional metallic band 30.
As a typical example, an enclosure is formed by first preparing a cylindrical container or housing of silver. The housing is formed closed at one end so as to have a cavity sufficiently large to receive an electrical component such as a porous tantalum slug. At the open end of the housing an outwardly protruding flange is formed. At the bottom of the housing cavity a cup shaped member formed of Viton a fluoroelastomer rubber produced by E. I. du Pont de Nemours & Co., Inc. is disposed within which the tantalum slug will be deposited. A tantalum lead is welded to the tantalum slug or may be impressed within the slug during the sintering process thereof. A quantity of sealing glass such as that heretofore described, is sealed to the tantalum lead intermediate the ends thereof to form a glass bead. A silver collar having an outwardly protruding flange is provided as is a type 316 stainless steel band. The glass bead, silver collar, and stainless steel band are heated to a temperature somewhat below 600C. and the silver collar is disposed about the glass bead with the stainless steel band snugly fitted around the silver collar. As this assembly is permitted to cool, the stainless steel band having a temperature coefficient of expansion substantially greater than that of the glass bead will place the silver collar and glass bead in the compression thereby effecting a compression seal between the silver collar and the glass bead.
An electrolyte gel formed of a mixture of 38% sulfuric acid and an anhydrous and particulate colloidal silica material commercially known as Cab-O-Sil available from the Cabot Corporation of Boston, Massachusetts is disposed within the container. The tantalum slug with the tantalum lead and glass bead assembly is disposed within the container and snuggly fitted within a cupshaped member in a manner so that the lead protrudes from the open end of the container and the electrolyte gel completely covers the tantalum slug. The outwardly protruding flange of the silver collar is disposed adjacent the outwardly protruding flange formed at the open end of the container. The container flange is then crimped around the collar flange and the flanges are then ultrasonically welded.
An external lead of nickel wire or the like may be attached to the tantalum lead by electric welding, while a second lead is attached to the closed end of the housing by silver soldering or the like thereby completing the capacitor.
It has been found that enclosures formed in accordance with the present invention are hermetic and do not permit the leakage of an electrolyte gel during the operation of the device environmental stress.
Although the present invention has been described with respect to details of certain embodiments thereof it is not intended that such details be limitations upon the scope of the invention except insofar as set forth in the following claims.
I claim:
1. The method of forming an enclosurecomprising the steps of providing a silver container open at one end,
forming from said container material a unitary outwardly protruding flange at the open end of said container, providing a lead,
sealing to said lead a quantity of sealing glass to form a bead about said lead intermediate the ends thereof,
providing a metallic collar having an outwardly protruding flange,
disposing said collar about said bead,
providing a metallic band having a temperature coefficient of expansion greater than said glass bead, heating said metallic band, collar and glass bead, disposing said metallic band about said collar so as to place said collar and glass bead in compression upon cooling thereby effecting a compression seal between said collar and said glass bead,
providing an article to be enclosed in said container,
disposing said article in said container,
disposing the outwardly protruding flange of said collar adjacent the outwardly protruding flange of said container, and
hermetically sealing said outwardly protruding flange of said collar to the outwardly protruding flange of said container.
2. The method of claim 1 further comprising the steps of providing an electrical component,
electrically connecting said lead to said component,
and disposing said component within said container.
3. The method of claim 1 wherein said lead is formed of tantalum.
4. The method of claim 1 wherein said outwardly protruding flange of said container is stepped and said stepped flange is crimped about the outwardly protruding flange of said collar.
5.' The method of claim 1 wherein said collar is formed of silver.
6. The method of claim 1 wherein said metallic band is formed of stainless steel.
7. The method of claim 6 wherein said metallic band sealing to said lead a quantity of sealing glass to form a bead about said lead intermediate the ends thereof,
providing a metallic collar having an outwardly protruding flange and a temperature coefficient of expansion greater than said glass bead,
heating said metallic collar and glass bead,
disposing said collar about said bead so as to place said glass bead in compression upon cooling thereby effecting a compression seal between said collar and said glass bead,
providing an article to be enclosed in said container,
disposing said article in said container,
disposing the outwardly protruding flange of said collar adjacent the outwardly protruding flange of said container, and
hermetically sealing said outwardly protruding flange of said collar to the outwardly protruding flange of said collar to the outwardly protruding flange of said container.
11. The method of claim 10 further comprising the steps of providing an electrical component,
electrically connecting said lead to said component,
and
disposing said component within said container.
12. The method of claim 10 wherein said lead is formed of tantalum.
13. The method of claim 10 wherein said outwardly protruding flange of said container is stepped and said stepped flange is crimped about the outwardly protruding flange of said collar.
14. The method of claim 10 wherein said metallic collar is formed of stainless Steel.
15. The method of claim 10 wherein said outwardly protruding flange of said collar is welded to said outwardly protruding flange of said container.
16. The method of claim 10 further comprising the step of attaching a second lead to the end of said container opposite said open end.
Claims (16)
1. THE METHOD OF FORMING AN ENCLOSURE COMPRISING THE STEPS OF PROVIDING A SILVER CONTAINER OPEN AT ONE DEND, FORMING FROM SAID CONTAINER MATERIAL IN UNITARY OUTWARDLY PROTRUDING FLANGE AT THE OPEN END OF SAID CONTAINER, PROVIDING A LEAD, SEALING TO SAID LEAD A QUANTITY OF SEALING GLASS TO FORM A BEAD ABOUT SAID LEAD INTERMEDIATE THE ENDS THEREOF, PROVIDING A METALLIC COLLAR HAVING AN OUTWARDLY PROTRUDING FLANGE. DISPOSING SAID COLLAR ABOUT SAID BEAD, PROVIDING A METALLIC BAND HAVING A TEMPERAURE COEFFICIEN OF EXPANSION GREATER THAN SAID GLASS BEAD. HEATING SAID METALLIC BAND, COLLAR AND GLASS BEAD. DISPOSING SAID METALLIC BAND ABOUT SAID COLLAR SO AS TO PLACE SAID COLLAR AND GLASS BEAD IN COMPRESSION UPON COOLING THERBY EFFECTING A COMPRESSION SEAL BETWEEN SAID COLLAR AND SAID GLASS BEAD. PROVIDING AN ARTICLE TO BE ENCLOSED IN SAID CONTAINER, DISPOSING SAID ARTICLE IN SAID CONTAINER DISPOSING THE OUTWARDLY PROTRUDING FLANGE OF SAID COLLAR ADJACENT THE OUTWARDLY PROTRUDING FLANGE OF SAID CONTAINER, AND HERMETICALLY SEALING SAID OUTWARDLY PROTRUDING FLANGE OF SAID COLLAR TO THE OUTWARDLY PROTRUDING FLANGE OF SAID CONTAINER.
2. The method of claim 1 further comprising the steps of providing an electrical component, electrically connecting said lead to said component, and disposing said component within said container.
3. The method of claim 1 wherein said lead is formed of tantalum.
4. The method of claim 1 wherein said outwardly protruding flange of said container is stepped and said stepped flange is crimped about the outwardly protruding flange of said collar.
5. The method of claim 1 wherein said collar is formed of silver.
6. The method of claim 1 wherein said metallic band is formed of stainless steel.
7. The method of claim 6 wherein said metallic band in shrunk-fit about said collar and glass bead.
8. The method of claim 1 wherein said outwardly protruding flange of said collar is welded to said outwardly protruding flange of said container.
9. The method of claim 1 further comprising the step of attaching a second lead to the end of said container opposite said open end.
10. The method of forming an enclosure comprising the steps of providing a silver container open at one end, forming from said container material a unitary outwardly protruding flange at the open end of said container, providing a lead, sealing to said lead a quantity of sealing glass to form a bead about said lead intermediate the ends thereof, providing a metallic collar having an outwardly protruding flange and a temperature coefficient of expansion greater than said glass bead, heating said metallic collar and glass bead, disposing said collar about said bead so as to place said glass bead in compression upon cooling thereby effecting a compression seal between said collar and said glass bead, providing an article to be enclosed in said container, disposing said article in said container, disposing the outwardly protruding flange of said collar adjacent the outwardly protruding flange of said container, and hermetically sealing said outwardly protruding flange of said collar to the outwardly protruding flange of said collar to the outwardly protruding flange of said container.
11. The method of claim 10 further comprising the steps of providing an electrical component, electrically connecting said lead to said component, and disposing said component within said container.
12. The method of claim 10 wherein said lead is formed of tantalum.
13. The method of claim 10 wherein said outwardly protruding flange of said container is stepped and said stepped fLange is crimped about the outwardly protruding flange of said collar.
14. The method of claim 10 wherein said metallic collar is formed of stainless steel.
15. The method of claim 10 wherein said outwardly protruding flange of said collar is welded to said outwardly protruding flange of said container.
16. The method of claim 10 further comprising the step of attaching a second lead to the end of said container opposite said open end.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US454289A US3918147A (en) | 1974-03-25 | 1974-03-25 | Hermetic enclosure for electronic component |
| US05/569,186 US4065636A (en) | 1974-03-25 | 1975-04-18 | Hermetic enclosure for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US454289A US3918147A (en) | 1974-03-25 | 1974-03-25 | Hermetic enclosure for electronic component |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US05/569,186 Division US4065636A (en) | 1974-03-25 | 1975-04-18 | Hermetic enclosure for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3918147A true US3918147A (en) | 1975-11-11 |
Family
ID=23804064
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US454289A Expired - Lifetime US3918147A (en) | 1974-03-25 | 1974-03-25 | Hermetic enclosure for electronic component |
| US05/569,186 Expired - Lifetime US4065636A (en) | 1974-03-25 | 1975-04-18 | Hermetic enclosure for electronic component |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US05/569,186 Expired - Lifetime US4065636A (en) | 1974-03-25 | 1975-04-18 | Hermetic enclosure for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | US3918147A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993938A (en) * | 1974-07-17 | 1976-11-23 | Corning Glass Works | Electrical component hermetic enclosure |
| US4008486A (en) * | 1975-06-02 | 1977-02-15 | International Rectifier Corporation | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
| CN114213025A (en) * | 2021-12-15 | 2022-03-22 | 西安赛尔电子材料科技有限公司 | Preparation method and sealing process for tantalum capacitor cover group sealing glass |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4309507A (en) * | 1981-02-23 | 1982-01-05 | Motorola, Inc. | Glass and hermetic seal |
| US4479168A (en) * | 1983-12-19 | 1984-10-23 | Sprague Electric Company | Electrolytic capacitor with a hermetic seal |
| US6388866B1 (en) | 1998-04-03 | 2002-05-14 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with tailored anode layers |
| US6477037B1 (en) | 1998-04-03 | 2002-11-05 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with miniaturized epoxy connector droplet |
| US6402793B1 (en) | 1998-04-03 | 2002-06-11 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with cathode/case electrical connections |
| US6118652A (en) * | 1998-04-03 | 2000-09-12 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with laser welded cover |
| US6493212B1 (en) | 1998-04-03 | 2002-12-10 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with porous gas vent within electrolyte fill tube |
| US6459566B1 (en) | 1998-06-24 | 2002-10-01 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with laser welded cover |
| US6212061B1 (en) * | 1998-09-29 | 2001-04-03 | General Electric Company | Sealing an ultracapacitor |
| US6678559B1 (en) | 1999-03-23 | 2004-01-13 | Medtronic, Inc. | Implantable medical device having a capacitor assembly with liner |
| US6952339B1 (en) * | 2004-05-13 | 2005-10-04 | Todd Knowles | Tantalum capacitor case with increased volumetric efficiency |
| US8514547B2 (en) | 2010-11-01 | 2013-08-20 | Avx Corporation | Volumetrically efficient wet electrolytic capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2122392A (en) * | 1934-09-10 | 1938-06-28 | Sprague Specialties Co | Electrolytic device |
| US3623196A (en) * | 1968-08-01 | 1971-11-30 | Philips Corp | Method of providing an anti-implosion clamping band around the envelope of a colour television picture tube |
| US3624458A (en) * | 1969-11-26 | 1971-11-30 | Mallory & Co Inc P R | Capacitor having a glass-to-metal seal and an elastomeric seal |
| US3857993A (en) * | 1973-11-21 | 1974-12-31 | Raytheon Co | Beam lead semiconductor package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE906595C (en) * | 1941-10-29 | 1954-03-15 | Siemens Ag | Vacuum-tight fusion |
| GB892830A (en) * | 1958-12-24 | 1962-03-28 | Georges Alfred Doloy | Improvements in and relating to insulating vacuum-tight seals through metal or malleable alloy and in particular copper |
| GB1006929A (en) * | 1961-02-07 | 1965-10-06 | Ass Elect Ind | Improvements relating to glass-to-metal seals |
| US3264708A (en) * | 1962-10-01 | 1966-08-09 | Sprague Electric Co | Hermetically sealed capacitor |
| US3273028A (en) * | 1963-06-27 | 1966-09-13 | Mallory & Co Inc P R | Hermetically sealed electrolytic capacitor |
| US3548265A (en) * | 1968-06-11 | 1970-12-15 | Gen Electric | Porous anode capacitor |
| US3912985A (en) * | 1974-03-04 | 1975-10-14 | Corning Glass Works | Hermetic device enclosure |
-
1974
- 1974-03-25 US US454289A patent/US3918147A/en not_active Expired - Lifetime
-
1975
- 1975-04-18 US US05/569,186 patent/US4065636A/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2122392A (en) * | 1934-09-10 | 1938-06-28 | Sprague Specialties Co | Electrolytic device |
| US3623196A (en) * | 1968-08-01 | 1971-11-30 | Philips Corp | Method of providing an anti-implosion clamping band around the envelope of a colour television picture tube |
| US3624458A (en) * | 1969-11-26 | 1971-11-30 | Mallory & Co Inc P R | Capacitor having a glass-to-metal seal and an elastomeric seal |
| US3857993A (en) * | 1973-11-21 | 1974-12-31 | Raytheon Co | Beam lead semiconductor package |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993938A (en) * | 1974-07-17 | 1976-11-23 | Corning Glass Works | Electrical component hermetic enclosure |
| US4008486A (en) * | 1975-06-02 | 1977-02-15 | International Rectifier Corporation | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
| CN114213025A (en) * | 2021-12-15 | 2022-03-22 | 西安赛尔电子材料科技有限公司 | Preparation method and sealing process for tantalum capacitor cover group sealing glass |
Also Published As
| Publication number | Publication date |
|---|---|
| US4065636A (en) | 1977-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: AVX CORPORATION, 60 CUTTER MILL RD., GREAT NECK, N Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:CORNING GLASS WORKS;REEL/FRAME:004946/0189 Effective date: 19871110 Owner name: AVX CORPORATION, A CORP. OF DE., NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CORNING GLASS WORKS;REEL/FRAME:004946/0189 Effective date: 19871110 |