US4878070A - Thermal ink jet print cartridge assembly - Google Patents
Thermal ink jet print cartridge assembly Download PDFInfo
- Publication number
- US4878070A US4878070A US07/258,957 US25895788A US4878070A US 4878070 A US4878070 A US 4878070A US 25895788 A US25895788 A US 25895788A US 4878070 A US4878070 A US 4878070A
- Authority
- US
- United States
- Prior art keywords
- board
- printing device
- ink
- printhead
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14024—Assembling head parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14379—Edge shooter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- the invention relates to thermal ink jet printing systems and, more particularly to a cartidge assembly for use in such a system which is constructed with improved electrical interconnections and thermal efficiency.
- a thermal printhead comprises one or more ink-filled channels communicating with a relatively small ink supply chamber at one end and having an opening at the opposite end, referred to as a nozzle.
- a plurality of thermal energy generators usually resistors, are located in the channels at a predetermined distance from the nozzle. The resistors are individually addressed with a current pulse to momentarily vaporize the ink and form a bubble which expels an ink droplet. As the bubble grows, the ink bulges from the nozzle and is contained by the surface tension on the ink as a meniscus.
- the ink still in the channel between the nozzle and bubble starts to move towards the collapsing bubble, causing a volumetric contraction of the ink at the nozzle and resulting in the separating of the bulging ink as a droplet.
- the acceleration of the ink out of the nozzle while the bubble is growing provides the momentum and velocity of the droplet in a substantially straight line direction towards a recording medium, such as paper.
- the channels terminate with orifices or nozzles aligned perpendicular to the carriage reciprocating direction and parallel to the stepping direction of the recording medium which is stepped by the printing device a distance equal to the pinted swath in the direction of arrow 17.
- the printhead then moves in the opposite direction printing another swath of information.
- Droplets 18 are expelled and propelled to the recording medium from the nozzles in response to digital data signals received by the printing device controller (not shown), which in turn selectively addresses the individual heating elements, located in the printhead channels a predetermined distance from the nozzles, with a current pulse.
- the current pulses passing through the printhead heating elements vaporize the ink contacting the heating elements and produce temporary vapor bubbles to expel droplets of ink from the nozzles.
- ink supply cartridges 12 and fixedly mounted electrode board or daughter boards 19 are shown in which, sandwiched therebetween, are printheads 11, one of which is shown in dashed line.
- the printhead is permanently attached to electrode board 19 and their respective electrodes are wire-bonded together,
- a printhead fill hole 25, shown in FIG. 2 is sealing positioned against and coincident with an aperture (not shown) in the cartridge, so that ink from the cartridge is continuously supplied to the ink channels via the manfold during operation of the printing device.
- FIG. 2 A plan view of an electrode board 19 and printhead 11 is shown in FIG. 2.
- the electrode board electrodes 23 are on a one - to - one ratio with the electrodes on the opposite side of the board electrically connected at locations 26.
- Electrodes 33 are connected to individual heating resistors 34 within the printhead, several of which are shown as dotted lines. Each resistor 34 is associated with a droplet-emitting nozzle.
- Electrodes 33 all terminate at electrical terminals 21 at the edge of the daughterboard. Further interconnection is made to a card edge connector. In a typical connection, 50 electrical connections are made from the resistor to terminals 21. This results in a high line density requiring a high-cost photo-definition process. The high density also contributes to a temperature buildup which must be dissipated by the introduction of heat sinks or the like.
- Bunnell discloses a high density mother/daughter circuit board connector including a multi-layer flat flexible circuit containing a plurality of patterned array circuit paths on each layer. The circuits of the boards are preferably terminated by a plurality of contact pads 20, 22 (in FIGS. 1 and 2) which protrude from the respective surfaces in a patterned array and which provide alignment of the different circuit board layers.
- the present invention is directed to an improved design for a printing device of the type shown in FIGS. 1, 2. More particularly, the high electrical conductor line density is reduced by using an improved daughterboard reduced in size and modified so as to terminate the electrode along the top and bottom surfaces of the board. A second, flexible printed circuit is aligned with the daughterboard, the printed circuit effectively replacing the card edge connector of the prior art.
- the ink cartridge, printhead, daughter board and flexible printed circuit board are accurately aligned by a plurality of accurately drilled alignment holes. Since the electrical terminations are now dispersed throughout a larger layer area, the packing density is reduced, permitting the conductive material to be formed by a relatively less expensive screen print process. Thermal performance is enhanced by fabricating plating holes through the daughterboard to a heat sink.
- the present invention is directed towards an ink jet printing device for a drop-on-demand thermal ink jet printer, the printing device including an ink supply cartridge having a printhead mounted within the cartridge, said printhead being of the type having a plurality of parallel channels, each channel being supplied with ink and having one open end which serves as an ink droplet ejecting nozzle, a heating element being positioned in each channel a predetermined distance from the nozzle, ink droplets being ejected from the nozzles by the selective application of the current pulses to the heating elements in respond to signals from a remote source, the heating elements transferring thermal energy to the ink in contact therewith causing the formation and collapse of temporary vapor bubbles that expel the ink droplets, said printing device further comprising a first electrode board bonded to said printhead and mechanically connected to said cartridge, said first electrode board providing electrical connection between said heating elements and a plurality of terminals located at discrete points on both surfaces of said first board, said printing device further comprising a second electrode board in mechanical and
- FIG. 1 is a schematic isometric view of a prior art thermal ink jet printing system.
- FIG. 2 is a plan view of the printing device shown in FIG. 1.
- FIG. 3 is a top view of an electrode board designed according to the principles of the present invention to which a printhead of the type shown in FIG. 2 is bonded.
- FIG. 4 is a top view of a second flexible electrode board held in mechanical and electrical contact with the first board.
- FIG. 5 is a front view showing the sandwich assembly of an ink cartridge, printhead, a first rigid and second flexible electrode board.
- FIG. 3 shows a modified daughterboard design.
- FIG. 4 shows a flexible printed circuit board which is mechanically aligned with and electrically connected to a modified daughterboard.
- FIG. 5 shows a exploded front view of the assembly comprising a prior art ink cartridge in printhead sandwiched together with the modified daughterboard and the flexible printed circuit.
- daughterboard 40 now has a printhead 11 centrally located at the print edge.
- a plurality of staggered wire bonding pads 42 and through holes 44 connect input lines 46, 48, (on backside of board 40) respectively, to through holes 50 and corresponding gold plated landing pads 52.
- Four precision drilled alignment holes 53 are formed at each corner of board 40.
- Pads 52 contact corresponding pads 54 on flexible printed circuit 60 shown in FIG. 4.
- Pads 54 are connected by electrodes 62 to the driver electronics.
- the pads 54 are raised from the surface by embossing the base material with "dimples" beneath the pad lands to ensure pad-to-pad contact. Rubber pads 64 with raised dimples are housed behind the flexed circuit 60. Electrical interconnection is then made as circuit 60 is sandwiched between the carriage 14 and daughterboard 40.
- Through alignment holes 65 are formed at three corners of circuit 50.
- FIG. 5 shows a front cut away view of the printing assembly.
- Daughterboard 40 is held in contact with cartridge 12 by pressure against a rubber O ring 66.
- Printhead 11 is in contact with ink supply orifice 68.
- Pressure contact points between board 40 and circuit 60 are made at contacts 70 on the daughterboard and raised dimple pads 72 on the circuit board.
- the assembly is aligned in the X-Y direction by means of pins 65 placed through alignment holes 53. With the components fully assembled, as long as the pressure on rubber pad 64 is less than the pressure exerted by the O ring 66, the daughterboard remains vertical with respect to the carriage.
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/258,957 US4878070A (en) | 1988-10-17 | 1988-10-17 | Thermal ink jet print cartridge assembly |
JP1263802A JPH02151445A (en) | 1988-10-17 | 1989-10-09 | Improved thermal-ink printing cartridge assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/258,957 US4878070A (en) | 1988-10-17 | 1988-10-17 | Thermal ink jet print cartridge assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
US4878070A true US4878070A (en) | 1989-10-31 |
Family
ID=22982853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/258,957 Expired - Fee Related US4878070A (en) | 1988-10-17 | 1988-10-17 | Thermal ink jet print cartridge assembly |
Country Status (2)
Country | Link |
---|---|
US (1) | US4878070A (en) |
JP (1) | JPH02151445A (en) |
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991008112A1 (en) * | 1989-11-29 | 1991-06-13 | Siemens Aktiengesellschaft | Printing head for ink-jet printer |
US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
US5180311A (en) * | 1991-01-22 | 1993-01-19 | Hughes Aircraft Company | Resilient interconnection bridge |
EP0611653A2 (en) * | 1993-02-19 | 1994-08-24 | Compaq Computer Corporation | High density interconnect apparatus for an ink-jet printhead |
EP0641659A2 (en) * | 1993-09-07 | 1995-03-08 | Hewlett-Packard Company | Self aligning orifice construction for thermal ink jet printheads |
US5426568A (en) * | 1992-12-23 | 1995-06-20 | Rheinmetall Gmbh | Launch-protected electronic assembly |
US5461482A (en) * | 1993-04-30 | 1995-10-24 | Hewlett-Packard Company | Electrical interconnect system for a printer |
US5471163A (en) * | 1993-11-16 | 1995-11-28 | Hewlett-Packard Company | Tab circuit fusible links for disconnection or encoding information |
US5539436A (en) * | 1993-04-30 | 1996-07-23 | Hewlett-Packard Company | Modular carriage assembly for an inkjet printer |
US5568171A (en) * | 1992-04-02 | 1996-10-22 | Hewlett-Packard Company | Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof |
US5632627A (en) * | 1995-02-15 | 1997-05-27 | Brother Kogyo Kabushiki Kaisha | Connection electrode connecting device |
US5901425A (en) | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
EP1087871A1 (en) * | 1998-06-19 | 2001-04-04 | Lexmark International, Inc. | A heater chip module for use in an ink jet printer |
US6644791B1 (en) | 2002-08-23 | 2003-11-11 | Xerox Corporation | Ink jet printhead having efficient heat dissipation and removal of air |
US20040060969A1 (en) * | 2002-09-27 | 2004-04-01 | Koji Imai | Structure and method for connecting flexible printed circuit board to inkjet print head |
US20070000974A1 (en) * | 2005-06-30 | 2007-01-04 | Brother Kogyo Kabushiki Kaisha | Printed board and ink jet head |
US20070132812A1 (en) * | 2005-12-14 | 2007-06-14 | Xerox Corporation. | Circuitry for printer |
US20070222838A1 (en) * | 2006-03-27 | 2007-09-27 | Akihisa Wanibe | Liquid cartridge and circuit board |
US20100103223A1 (en) * | 2008-10-28 | 2010-04-29 | Canon Kabushiki Kaisha | Flexible printed circuit board and liquid discharge head including the same |
US8662639B2 (en) | 2009-01-30 | 2014-03-04 | John A. Doran | Flexible circuit |
US20150305140A1 (en) * | 2014-04-18 | 2015-10-22 | Xerox Corporation | Circuit board reflow of components using on board copper traces as heating element |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4616609B2 (en) * | 2004-10-05 | 2011-01-19 | ブラザー工業株式会社 | Inkjet head |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3863261A (en) * | 1973-05-11 | 1975-01-28 | Electroprint Inc | Electrically addressed apertured modulator for electrostatic printing |
US4567543A (en) * | 1983-02-15 | 1986-01-28 | Motorola, Inc. | Double-sided flexible electronic circuit module |
US4587596A (en) * | 1984-04-09 | 1986-05-06 | Amp Incorporated | High density mother/daughter circuit board connector |
US4601777A (en) * | 1985-04-03 | 1986-07-22 | Xerox Corporation | Thermal ink jet printhead and process therefor |
US4791440A (en) * | 1987-05-01 | 1988-12-13 | International Business Machine Corporation | Thermal drop-on-demand ink jet print head |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57110755A (en) * | 1980-12-26 | 1982-07-09 | Kawasaki Heavy Ind Ltd | Small sized engine |
US4706097A (en) * | 1986-04-03 | 1987-11-10 | Hewlett Packard Company | Near-linear spring connect structure for flexible interconnect circuits |
-
1988
- 1988-10-17 US US07/258,957 patent/US4878070A/en not_active Expired - Fee Related
-
1989
- 1989-10-09 JP JP1263802A patent/JPH02151445A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3863261A (en) * | 1973-05-11 | 1975-01-28 | Electroprint Inc | Electrically addressed apertured modulator for electrostatic printing |
US4567543A (en) * | 1983-02-15 | 1986-01-28 | Motorola, Inc. | Double-sided flexible electronic circuit module |
US4587596A (en) * | 1984-04-09 | 1986-05-06 | Amp Incorporated | High density mother/daughter circuit board connector |
US4601777A (en) * | 1985-04-03 | 1986-07-22 | Xerox Corporation | Thermal ink jet printhead and process therefor |
US4791440A (en) * | 1987-05-01 | 1988-12-13 | International Business Machine Corporation | Thermal drop-on-demand ink jet print head |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991008112A1 (en) * | 1989-11-29 | 1991-06-13 | Siemens Aktiengesellschaft | Printing head for ink-jet printer |
US5138436A (en) * | 1990-11-16 | 1992-08-11 | Ball Corporation | Interconnect package having means for waveguide transmission of rf signals |
US5180311A (en) * | 1991-01-22 | 1993-01-19 | Hughes Aircraft Company | Resilient interconnection bridge |
US5568171A (en) * | 1992-04-02 | 1996-10-22 | Hewlett-Packard Company | Compact inkjet substrate with a minimal number of circuit interconnects located at the end thereof |
US5426568A (en) * | 1992-12-23 | 1995-06-20 | Rheinmetall Gmbh | Launch-protected electronic assembly |
EP0611653A2 (en) * | 1993-02-19 | 1994-08-24 | Compaq Computer Corporation | High density interconnect apparatus for an ink-jet printhead |
EP0611653A3 (en) * | 1993-02-19 | 1994-09-14 | Compaq Computer Corporation | High density interconnect apparatus for an ink-jet printhead |
US5461482A (en) * | 1993-04-30 | 1995-10-24 | Hewlett-Packard Company | Electrical interconnect system for a printer |
US5539436A (en) * | 1993-04-30 | 1996-07-23 | Hewlett-Packard Company | Modular carriage assembly for an inkjet printer |
EP0641659A2 (en) * | 1993-09-07 | 1995-03-08 | Hewlett-Packard Company | Self aligning orifice construction for thermal ink jet printheads |
EP0641659A3 (en) * | 1993-09-07 | 1995-12-27 | Hewlett Packard Co | Self aligning orifice construction for thermal ink jet printheads. |
US5471163A (en) * | 1993-11-16 | 1995-11-28 | Hewlett-Packard Company | Tab circuit fusible links for disconnection or encoding information |
US5632627A (en) * | 1995-02-15 | 1997-05-27 | Brother Kogyo Kabushiki Kaisha | Connection electrode connecting device |
US5901425A (en) | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
EP1087871A1 (en) * | 1998-06-19 | 2001-04-04 | Lexmark International, Inc. | A heater chip module for use in an ink jet printer |
EP1087871A4 (en) * | 1998-06-19 | 2001-12-19 | Lexmark Int Inc | A heater chip module for use in an ink jet printer |
US6644791B1 (en) | 2002-08-23 | 2003-11-11 | Xerox Corporation | Ink jet printhead having efficient heat dissipation and removal of air |
US7370943B2 (en) * | 2002-09-27 | 2008-05-13 | Brother Kogyo Kabushiki Kaisha | Structure and method for connecting flexible printed circuit board to inkjet print head |
US7055936B2 (en) * | 2002-09-27 | 2006-06-06 | Brother Kogyo Kabushiki Kaisha | Structure and method for connecting flexible printed circuit board to inkjet print head |
US20060203040A1 (en) * | 2002-09-27 | 2006-09-14 | Koji Imai | Structure and method for connecting flexible printed circuit board to inkjet print head |
US20040060969A1 (en) * | 2002-09-27 | 2004-04-01 | Koji Imai | Structure and method for connecting flexible printed circuit board to inkjet print head |
US20070000974A1 (en) * | 2005-06-30 | 2007-01-04 | Brother Kogyo Kabushiki Kaisha | Printed board and ink jet head |
US7837301B2 (en) * | 2005-06-30 | 2010-11-23 | Brother Kogyo Kabushiki Kaisha | Printed board for ink jet head |
US20090271979A1 (en) * | 2005-12-14 | 2009-11-05 | Xerox Corporation | Circuitry for printer |
US7575302B2 (en) * | 2005-12-14 | 2009-08-18 | Xerox Corporation | Circuitry for printer |
US20070132812A1 (en) * | 2005-12-14 | 2007-06-14 | Xerox Corporation. | Circuitry for printer |
US20070222838A1 (en) * | 2006-03-27 | 2007-09-27 | Akihisa Wanibe | Liquid cartridge and circuit board |
US7914135B2 (en) * | 2006-03-27 | 2011-03-29 | Seiko Epson Corporation | Liquid cartridge and circuit board |
US20100103223A1 (en) * | 2008-10-28 | 2010-04-29 | Canon Kabushiki Kaisha | Flexible printed circuit board and liquid discharge head including the same |
US8096641B2 (en) * | 2008-10-28 | 2012-01-17 | Canon Kabushiki Kaisha | Flexible printed circuit board and liquid discharge head including the same |
US8662639B2 (en) | 2009-01-30 | 2014-03-04 | John A. Doran | Flexible circuit |
US20150305140A1 (en) * | 2014-04-18 | 2015-10-22 | Xerox Corporation | Circuit board reflow of components using on board copper traces as heating element |
US10009993B2 (en) * | 2014-04-18 | 2018-06-26 | Xerox Corporation | Circuit board reflow of components using on board copper traces as heating element |
Also Published As
Publication number | Publication date |
---|---|
JPH02151445A (en) | 1990-06-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: XEROX CORPORATION, STAMFORD, CT. A CORP. OF NEW YO Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:WATROBSKI, THOMAS E.;REEL/FRAME:004960/0605 Effective date: 19881011 Owner name: XEROX CORPORATION, A CORP. OF NEW YORK, CONNECTICU Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:WATROBSKI, THOMAS E.;REEL/FRAME:004960/0605 Effective date: 19881011 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 19971105 |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |