US4918277A - Heated tool with non-flat heating surface for avoiding solder-bridging - Google Patents

Heated tool with non-flat heating surface for avoiding solder-bridging Download PDF

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Publication number
US4918277A
US4918277A US07/215,628 US21562888A US4918277A US 4918277 A US4918277 A US 4918277A US 21562888 A US21562888 A US 21562888A US 4918277 A US4918277 A US 4918277A
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Prior art keywords
pads
heated
tool
tool member
spacer
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Expired - Fee Related
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US07/215,628
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Gero Zimmer
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PATENTECH Inc
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Productech Inc
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Assigned to PRODUCTECH GMBH reassignment PRODUCTECH GMBH ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: ZIMMER, GERO
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Publication of US4918277A publication Critical patent/US4918277A/en
Assigned to Notaro & Michalos P.C. reassignment Notaro & Michalos P.C. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). FEB. 24, 1991 Assignors: PRODUCTECH GMBH
Assigned to PATENTECH INC. reassignment PATENTECH INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Notaro & Michalos P.C., PRODUCTECH GMBH, PRODUCTECH INC., PRODUCTECH REFLOW SOLDER EQUIPMENT INC., ZIMMER, GERO
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B23K20/025—Bonding tips therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Definitions

  • the present invention relates in general to heated tools, and in particular to a new and useful heated tool for soldering objects to a plurality of pads which are spaced apart by a certain spacing, the heated tool including spacer bars for isolating the pads from each other.
  • the heating tools may either be moved to the objects to be treated or connected, or mounted in a fixed position with the object to be treated or connected being brought to the heated tool.
  • Thermal energy is either supplied to the objects to be treated or connected, by radiant heating from heated surfaces of the tool, or by direct thermal contact between the heated tool and the object. A controlled force is usually applied against the object by the heated tool.
  • An additional thermal conductive material may be used to increase heat flow from the heated tool to the object. Flux, for example, may be provided for increasing the transfer of heat and for reducing oxidation during the thermal process.
  • Such tools may supply heat either continuously or during selected time periods only. Heat may be applied during heating pulses which may be activated or controlled by various external conditions, for example, by forcing the heated tool against the object to be heated or connected.
  • Hot gases and/or electric current for example may be used for heating specified heat supplying areas or surfaces of the tool.
  • a known generally U-shaped heated tool is disclosed in German Pat. reference No. 2,848,519.
  • This heated tool is mounted to holders either using screws or by welding. This keeps the heat supplying areas of the tool in position and further is used to provide electrical connectors for feeding electrical heating current to the tool.
  • Such tools can be manufactured using sheet metal designs (see German Pat. Nos. 3,144,048.7, 3,137,859.5 and 3,137,860.9 to the present inventor). These heated tools can also be machined from solid materials.
  • force-controlled thermal contact for transferring thermal energy from a tool to a part must also be accurately controlled. For this reason force-controlled thermal contact has limited applications. Objects having high thermal conductivity, for example objects made of metal oxides, require different procedures. Continuous preheating for example may be necessary for such applications. A heating tool is simply set at a much higher temperature to compensate for thermal loads. This has limitation however in that excess heat may be damaging to some materials.
  • An object of the present invention is to provide a heated tool which can join two or more parts together by thermal treatment and which can reduce or illiminate solder-bridging of parts or areas which are located close to each other.
  • the parts of electric components which are to be joined by solder or similar materials can be positioned to within only certain spacings from each other. Closer spacings cannot be utilized since solder may flow between the parts causing undesirable bridging and short circuits. This occurs when conventional heated tools having flat heating surfaces are utilized.
  • Another object of the present invention is to provide spacer bars on the heating surface of the heated tool which are shaped to match or compliment the spacing between the parts that are to be soldered or otherwise heat treated. This prevents the undesirable flow of solder from one part to the other during the heating cycle.
  • the spacer bars can be formed as one piece with the heated tools or can be added on as additional structures onto the heating surface of the heated tools.
  • the spacer bars can be made of materials having different properties than the material of the heating surface. Materials having different thermal properites (such as low conductivity) or wetting capabilities can be used. Lower temperatures can thus be supplied to areas between the parts that are to be soldered, to reduce the flow of heat to these areas. By selecting wetting properties, the flow of solder to the areas between the parts can also be reduced.
  • Spacer bars with special shapes and special thermal properties can thus be provided on the heated tool. Higher or lower temperatures can be provided across the heated tool and its spacer bars to advantageously and closely control the flow of solder.
  • FIG. 1 is a fragmentary side elevational view of a heated tool in accordance with the present invention for connecting a flat cable having four wire or wire bundles to four pads of a circuit board or substrate;
  • FIG. 2 view similar to FIG. 1 showing a further embodiment of the invention having differently shaped spacer bars;
  • FIG. 3 is a fragmentary enlarged cross-sectional view of an area of tool having differently shaped spacer bars made as one piece with the heating surface of the tool;
  • FIG. 3A is iew similar to FIG. 3 of an embodiment of the invention wherein the spacer bars are made as separate pieces from the heating surface of the tool;
  • FIG. 4 is a perspective view showing the manner of connection to a circuit board in accordance with the invention.
  • FIG. 5 is the assembled cable connection
  • FIG. 6 is a fragmentary side elevational view of a further embodiment of wherein the cross-sectional shape of the heated can be selected for controlling the amount of heat being supplied to various areas;
  • FIG. 6A is a view similar to FIG. 6 of a still further embodiment of invention.
  • FIG. 1 the invention embodied in FIG. 1 comprises a heated tool 1 having a non-flat heating surface la which is provided with a plurality of spacer bars 3. Electrical current and pressure is supplied to the heating surface la by a pair of connector bars 2, 2.
  • the heated tool is particularly useful for connecting an insulated flat cable 4 having a plurality of wire or wire bundles 5 that are spaced from each other by an insulated web 6, to connector pads 7 which are spaced apart by a pitch 9 on the surface of a substrate or a circuit board 13.
  • Each pad 7 is provided with a coating of solder 8 for connecting the wires 5 to the pads 7.
  • a section of cable 4 which is to be connected to pads 7 is stripped and rendered free of insulation to expose the wires 5.
  • the pads 7 to the wires 5 tool is heated in its heating area, as schematically illustrated by crosses 11 and brought down under pressure in the direction of arrows 12 onto the wires 5.
  • the heating causes the solder to melt. Because of the existence of spacer bars on the heating surface, the solder is precluded from flowing from one pad to the other. The flowing solder is blocked and dammed by the spacer bars as shown at 10.
  • FIG. 2 also illustrates that the spacer bars can be differently shaped.
  • Spacer bar 3a can, for example, be broader than the space between the pads and narrow in the vertical direction so that a solder connection is made without contacting the spacer bar 3a with the top surface of the pads.
  • the spacer bar 3b can be narrow and deep to engage fully between the pads.
  • a pitch 9 of 1.27 mm or less can be achieved. This corresponds to an equally small pitch for the wires 5 in the cable 4. As noted above, this is achieved without the danger of solder bridging between adjacent pads.
  • FIG. 3 illustrates an embodiment of the invention where one of the spacer bars is provided with a plating or coating of material 16.
  • Material 16 can be selected to have certain advantageous properties. For example, a material having low thermal conductivity can be selected for decreasing the amount of heat transferred to the areas between the pads. Alternatively, the material can have a higher thermal conductivity for increasing the amount of heat provided between the pads.
  • Spacer bar 15 of the long narrow type may also be utilized for almost touching the board 13 to physically separate the pads from each other.
  • FIG. 3 shows the example of the invention wherein the spacer bars are made as one piece with the heated tool.
  • FIG. 3A includes a spacer bar 31 which is connected to an otherwise flat heating surface 1a, for example by welding.
  • Another spacer bar 32 can be connected into a slot 14 provided in heating surface 1a.
  • the materials of the spacer bars 31, 32 can be selected for desirable properties such as heat transmission or wetting. Material which has low wetting affinity for solder may be desirable to avoid the flow of solder between the space between pads.
  • FIG. 4 shows a manner of assembling and connecting the cable 4 to a circuit board 13 which is provided with holes 19 for receiving the arms of a cable clamp 18.
  • cable 4 with areas of wires 5 stripped is brought down in the direction of arrow 211 onto pads 7 which are precoated with solder 8.
  • the heated tool 1 is then brought down onto the wires and pads in the direction of arrow 212 and supplied with electrical current sufficient to melt the solder. Spacer bars 3 prevent flow of solder between pads.
  • the heated tool 1 is then removed and the solder solidifies.
  • Clamp 18 is then brought down in the direction arrow 213 into holes 19 to firmly clamp cable 4 to circuit board 13.
  • FIG. 5 shows the assembled connection
  • FIG. 6 shows another embodiment of the invention wherein the heated tool 1 has a non-flat configuration with areas having different cross sections.
  • a lower cross section increases the resistance to electricity and would increase the temperature of the heated tool in this area.
  • small cross sectioned area 21 can be provided at the spacer bar and can be dimensioned to contact the surface of adjacent pads at 23. This helps transfer heat directly to the pads thus improving and increase the rate at which the solder melts and the connection is made.
  • an additional projection 22 may be provided at the bottom of the spacer bar 21.
  • FIG. 6A shows a version of the invention wherein each of the spacer bars is solid and touches adjacent pads at 25. Again, heat is transferred to the pads, but less heat is provided since the spacer bars have a greater cross section than the remainder of the heated tool.

Abstract

A heated tool for soldering objects to a plurality of pads which are spaced apart by a selected pitch, comprises a tool member having a heating surface with a plurality of spacer bars thereon, spaced by the pitch between the pads. The spacer bars act to separate one pad from the other to avoid the flow of solder between the pads.

Description

FIELD AND BACKGROUND OF THE INVENTION
The present invention relates in general to heated tools, and in particular to a new and useful heated tool for soldering objects to a plurality of pads which are spaced apart by a certain spacing, the heated tool including spacer bars for isolating the pads from each other. The heating tools may either be moved to the objects to be treated or connected, or mounted in a fixed position with the object to be treated or connected being brought to the heated tool.
Thermal energy is either supplied to the objects to be treated or connected, by radiant heating from heated surfaces of the tool, or by direct thermal contact between the heated tool and the object. A controlled force is usually applied against the object by the heated tool. An additional thermal conductive material may be used to increase heat flow from the heated tool to the object. Flux, for example, may be provided for increasing the transfer of heat and for reducing oxidation during the thermal process.
Such tools may supply heat either continuously or during selected time periods only. Heat may be applied during heating pulses which may be activated or controlled by various external conditions, for example, by forcing the heated tool against the object to be heated or connected.
Various sources of heat are known for heating the heated tool to a variety of selected temperatures. Hot gases and/or electric current for example may be used for heating specified heat supplying areas or surfaces of the tool.
For the present invention, it is preferable to utilize the flow of electrical current through a heated tool for heating the tool. This permits controlled pulse-heating featuring fast heating rates as well as precise temperature control at various areas of the tool.
A known generally U-shaped heated tool is disclosed in German Pat. reference No. 2,848,519. This heated tool is mounted to holders either using screws or by welding. This keeps the heat supplying areas of the tool in position and further is used to provide electrical connectors for feeding electrical heating current to the tool. Such tools can be manufactured using sheet metal designs (see German Pat. Nos. 3,144,048.7, 3,137,859.5 and 3,137,860.9 to the present inventor). These heated tools can also be machined from solid materials.
When transferring thermal energy to one or more objects using one or more heated tools, excess heat and relatively long periods of time are sometimes needed, particularly when the objects are made of materials having high thermal loads.
The use of force-controlled thermal contact for transferring thermal energy from a tool to a part must also be accurately controlled. For this reason force-controlled thermal contact has limited applications. Objects having high thermal conductivity, for example objects made of metal oxides, require different procedures. Continuous preheating for example may be necessary for such applications. A heating tool is simply set at a much higher temperature to compensate for thermal loads. This has limitation however in that excess heat may be damaging to some materials.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a heated tool which can join two or more parts together by thermal treatment and which can reduce or illiminate solder-bridging of parts or areas which are located close to each other. Usually, the parts of electric components which are to be joined by solder or similar materials, can be positioned to within only certain spacings from each other. Closer spacings cannot be utilized since solder may flow between the parts causing undesirable bridging and short circuits. This occurs when conventional heated tools having flat heating surfaces are utilized.
Another object of the present invention is to provide spacer bars on the heating surface of the heated tool which are shaped to match or compliment the spacing between the parts that are to be soldered or otherwise heat treated. This prevents the undesirable flow of solder from one part to the other during the heating cycle.
In accordance with the invention, the spacer bars can be formed as one piece with the heated tools or can be added on as additional structures onto the heating surface of the heated tools. In this way the spacer bars can be made of materials having different properties than the material of the heating surface. Materials having different thermal properites (such as low conductivity) or wetting capabilities can be used. Lower temperatures can thus be supplied to areas between the parts that are to be soldered, to reduce the flow of heat to these areas. By selecting wetting properties, the flow of solder to the areas between the parts can also be reduced.
Spacer bars with special shapes and special thermal properties can thus be provided on the heated tool. Higher or lower temperatures can be provided across the heated tool and its spacer bars to advantageously and closely control the flow of solder.
The various features of novelty which characterize the invention are pointed out with particularity in the claims annexed to and forming a part of this disclosure. For a better understanding of the invention, its operating advantages and specific objects attained by its uses, reference is made to the accompanying drawings and descriptive matter in which the preferred embodiments of the invention are illustrated.
BRIEF DESCRIPTION OF THE DRAWINGS
In the Drawings:
FIG. 1 is a fragmentary side elevational view of a heated tool in accordance with the present invention for connecting a flat cable having four wire or wire bundles to four pads of a circuit board or substrate;
FIG. 2 view similar to FIG. 1 showing a further embodiment of the invention having differently shaped spacer bars;
FIG. 3 is a fragmentary enlarged cross-sectional view of an area of tool having differently shaped spacer bars made as one piece with the heating surface of the tool;
FIG. 3A is iew similar to FIG. 3 of an embodiment of the invention wherein the spacer bars are made as separate pieces from the heating surface of the tool;
FIG. 4 is a perspective view showing the manner of connection to a circuit board in accordance with the invention;
FIG. 5 is the assembled cable connection;
FIG. 6 is a fragmentary side elevational view of a further embodiment of wherein the cross-sectional shape of the heated can be selected for controlling the amount of heat being supplied to various areas; and
FIG. 6A is a view similar to FIG. 6 of a still further embodiment of invention.
DESCRIPTION OF EMBODIMENTS
Referring to the drawings in particular, the invention embodied in FIG. 1 comprises a heated tool 1 having a non-flat heating surface la which is provided with a plurality of spacer bars 3. Electrical current and pressure is supplied to the heating surface la by a pair of connector bars 2, 2.
The heated tool is particularly useful for connecting an insulated flat cable 4 having a plurality of wire or wire bundles 5 that are spaced from each other by an insulated web 6, to connector pads 7 which are spaced apart by a pitch 9 on the surface of a substrate or a circuit board 13. Each pad 7 is provided with a coating of solder 8 for connecting the wires 5 to the pads 7.
As also shown in FIG. 4, a section of cable 4 which is to be connected to pads 7 is stripped and rendered free of insulation to expose the wires 5.
As shown in FIG. 2, to heat treat or solder the pads 7 to the wires 5 tool is heated in its heating area, as schematically illustrated by crosses 11 and brought down under pressure in the direction of arrows 12 onto the wires 5. The heating causes the solder to melt. Because of the existence of spacer bars on the heating surface, the solder is precluded from flowing from one pad to the other. The flowing solder is blocked and dammed by the spacer bars as shown at 10.
FIG. 2 also illustrates that the spacer bars can be differently shaped. Spacer bar 3a can, for example, be broader than the space between the pads and narrow in the vertical direction so that a solder connection is made without contacting the spacer bar 3a with the top surface of the pads. Alternatively, the spacer bar 3b can be narrow and deep to engage fully between the pads.
In accordance with the present invention, a pitch 9 of 1.27 mm or less can be achieved. This corresponds to an equally small pitch for the wires 5 in the cable 4. As noted above, this is achieved without the danger of solder bridging between adjacent pads.
FIG. 3 illustrates an embodiment of the invention where one of the spacer bars is provided with a plating or coating of material 16. Material 16 can be selected to have certain advantageous properties. For example, a material having low thermal conductivity can be selected for decreasing the amount of heat transferred to the areas between the pads. Alternatively, the material can have a higher thermal conductivity for increasing the amount of heat provided between the pads.
Spacer bar 15 of the long narrow type may also be utilized for almost touching the board 13 to physically separate the pads from each other. FIG. 3 shows the example of the invention wherein the spacer bars are made as one piece with the heated tool.
The embodiment shown in FIG. 3A includes a spacer bar 31 which is connected to an otherwise flat heating surface 1a, for example by welding. Another spacer bar 32 can be connected into a slot 14 provided in heating surface 1a.
By making the spacer bars 31, 32 as separate units from the rest of the heated tool, the materials of the spacer bars can be selected for desirable properties such as heat transmission or wetting. Material which has low wetting affinity for solder may be desirable to avoid the flow of solder between the space between pads.
FIG. 4 shows a manner of assembling and connecting the cable 4 to a circuit board 13 which is provided with holes 19 for receiving the arms of a cable clamp 18.
In operation, cable 4 with areas of wires 5 stripped, is brought down in the direction of arrow 211 onto pads 7 which are precoated with solder 8. The heated tool 1 is then brought down onto the wires and pads in the direction of arrow 212 and supplied with electrical current sufficient to melt the solder. Spacer bars 3 prevent flow of solder between pads.
The heated tool 1 is then removed and the solder solidifies. Clamp 18 is then brought down in the direction arrow 213 into holes 19 to firmly clamp cable 4 to circuit board 13.
FIG. 5 shows the assembled connection.
FIG. 6 shows another embodiment of the invention wherein the heated tool 1 has a non-flat configuration with areas having different cross sections. A lower cross section increases the resistance to electricity and would increase the temperature of the heated tool in this area. For example, small cross sectioned area 21 can be provided at the spacer bar and can be dimensioned to contact the surface of adjacent pads at 23. This helps transfer heat directly to the pads thus improving and increase the rate at which the solder melts and the connection is made. To help isolate the pads from each other, an additional projection 22 may be provided at the bottom of the spacer bar 21.
FIG. 6A shows a version of the invention wherein each of the spacer bars is solid and touches adjacent pads at 25. Again, heat is transferred to the pads, but less heat is provided since the spacer bars have a greater cross section than the remainder of the heated tool.
While specific embodiments of the invention have been shown and described in detail to illustrate the application of the principles of the invention, it will be understood that the invention may be embodied otherwise without departing from such principles.

Claims (21)

What is claimed is:
1. A heated tool for connecting objects to a plurality of pads which are spaced from each other by a certain distance, comprising a tool member having a heated bar with a heating surface for each pad and at least one spacer bar connected to said tool member and disposed between said heating surfaces for isolating an object on one pad from an object on another pad, said tool member having different cross-sectional areas at said heating surface and said spacer bar for providing different amounts of heat, each spacer bar having a width selected to be at least greater than the certain distance between the pads for directly contacting the pads to transfer heat to the pads for connecting the objects to the pads.
2. A heated tool according to claim 1 wherein the spacer bar is made as one piece with the tool member and heating surface.
3. A heated tool according to claim 1 wherein said spacer bar is made as separate parts from said tool member, and is connected to said tool member adjacent said heating surface.
4. A heated tool according to claim 1 wherein said spacer bar is coated with a material which is different from that of said tool member.
5. A heated tool according to claim 4 wherein said material coating has a low wetting affinity for solder.
6. A heated tool according to claim 1 including defining a plurality of spacer bars by cutting slots into the tool member to also form said heating surfaces.
7. A heated tool for connecting objects to a plurality of pads which are spaced from each other by a certain distance, comprising a tool member having a heating bar with a heating surface for each pad and at least one spacer bar connected to said tool member and disposed between said heating surfaces for isolating an object on one pad from an object on another pad, and a projection extending from spacer bar.
8. A heated tool according to claim 7 including a plurality of spacer bars, said heating surface with said spacer bars being non-flat, said spacer bars being spaced from each other by about the certain distance between the pads.
9. A heated tool according to claim 7 wherein the spacer bar is made from as one piece with the tool member and heating surface.
10. A heated tool according to claim 7 wherein said spacer bar is made as separate parts from said tool member, and is connected to said tool member adjacent said heating surface.
11. A heated tool according to claim 7 wherein said spacer bar is coated with a material which is different from that of said tool member.
12. A heated tool according to claim 11 wherein said material coating has a low wetting affinity for solder.
13. A heated tool according to claim 7 including defining a plurality of spacer bars by cutting slots into the tool member to also form said heating surfaces.
14. A heated tool according to claim 7 wherein each spacer bar has a width selected to be at least greater than the certain distance between the pads for directly contacting the pads to transfer heat to the pads for connecting the objects to the pads.
15. A heated tool for connecting objects to a plurality of pads which are spaced from each other by a certain distance, comprising a tool member having a heating bar with a heating surface for each pad and at least one spacer bar connected to said tool member and disposed between said heating surfaces for isolating an object on one pad from an object on another pad, said spacer bar being narrower than the distance between the pads for engaging between the pads when said tool member is brought close to the pads for connecting the objects to the pads.
16. A heated tool according to claim 15 including a plurality of spacer bars, said heating surface with said spacer bars being non-flat, said spacer bars being spaced from each other by about the certain distance between the pads.
17. A heated tool according to claim 15 wherein the spacer bar is made from as one piece with the tool member and heating surface.
18. A heated tool according to claim 15 wherein said spacer bar is made as separate parts from said tool member, and is connected to said tool member adjacent said heating surface.
19. A heated tool according to claim 15 wherein said spacer bar is coated with a material which is different from that of said tool member.
20. A heated tool according to claim 19 wherein said material coating has a low wetting affinity for solder.
21. A heated tool according to claim 15 including defining a plurality of spacer bars by cutting slots into the tool member to also form said heating surfaces.
US07/215,628 1987-07-09 1988-07-06 Heated tool with non-flat heating surface for avoiding solder-bridging Expired - Fee Related US4918277A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873722725 DE3722725A1 (en) 1987-07-09 1987-07-09 HEATED STAMP
DE3722725 1987-07-09

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US4918277A true US4918277A (en) 1990-04-17

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Cited By (19)

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US5088639A (en) * 1991-01-25 1992-02-18 Motorola, Inc. Soldering process
US5240165A (en) * 1992-07-06 1993-08-31 Motorola, Inc. Method and apparatus for controlled deformation bonding
US5243278A (en) * 1991-02-08 1993-09-07 Sundstrand Corporation Differential angular velocity sensor that is sensitive in only one degree of freedom
US5490786A (en) * 1994-03-25 1996-02-13 Itt Corporation Termination of contact tails to PC board
US5621619A (en) * 1990-10-25 1997-04-15 Cts Corporation All ceramic surface mount sip and dip networks having spacers and solder barriers
US5868302A (en) * 1995-09-06 1999-02-09 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
US5905201A (en) * 1997-10-28 1999-05-18 Alliedsignal Inc. Micromachined rate and acceleration sensor and method
US5920011A (en) * 1991-02-08 1999-07-06 Alliedsignal Inc. Micromachined rate and acceleration sensor
US6095872A (en) * 1998-10-21 2000-08-01 Molex Incorporated Connector having terminals with improved soldier tails
US6147326A (en) * 1998-09-25 2000-11-14 Seagate Technology, Inc. Soldering device with a plurality of spaced soldering tips and method of use
US6316736B1 (en) 1998-06-08 2001-11-13 Visteon Global Technologies, Inc. Anti-bridging solder ball collection zones
US20070295783A1 (en) * 2006-06-27 2007-12-27 Seagate Technology Llc Multiple tip soldering with individually compliant tip
US20090045245A1 (en) * 2007-08-16 2009-02-19 Fujitsu Limited Solder repairing apparatus and method of repairing solder
US20090078746A1 (en) * 2006-03-28 2009-03-26 Seiji Karashima Bump forming method and bump forming apparatus
CN102761043A (en) * 2011-04-29 2012-10-31 日本压着端子制造株式会社 Welding method for conductive component
US8561879B2 (en) * 2012-01-09 2013-10-22 Apple Inc. Hotbar device and methods for assembling electrical contacts to ensure co-planarity
JP2016015256A (en) * 2014-07-02 2016-01-28 積水化学工業株式会社 Conductive particle, composition for joining, joined structure and method for producing the joined structure
US20190393623A1 (en) * 2018-06-25 2019-12-26 Yazaki Corporation Fixation structure
US20200061730A1 (en) * 2017-05-30 2020-02-27 Continental Automotive France Heating device

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DE3828621A1 (en) * 1988-08-23 1990-03-01 Productech Gmbh Arrangement for producing a defined gap between tool and parts in pulse soldering
US5211578A (en) * 1992-05-18 1993-05-18 Amp Incorporated Connector housing assembly for discrete wires
DE102009055857A1 (en) * 2009-11-26 2011-06-16 Osram Gesellschaft mit beschränkter Haftung Method for contacting a printed circuit board with a ribbon cable and printed circuit board

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US4220845A (en) * 1978-10-02 1980-09-02 Burroughs Corporation Flat cable soldering apparatus

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621619A (en) * 1990-10-25 1997-04-15 Cts Corporation All ceramic surface mount sip and dip networks having spacers and solder barriers
US5088639A (en) * 1991-01-25 1992-02-18 Motorola, Inc. Soldering process
US5920011A (en) * 1991-02-08 1999-07-06 Alliedsignal Inc. Micromachined rate and acceleration sensor
US5243278A (en) * 1991-02-08 1993-09-07 Sundstrand Corporation Differential angular velocity sensor that is sensitive in only one degree of freedom
US5240165A (en) * 1992-07-06 1993-08-31 Motorola, Inc. Method and apparatus for controlled deformation bonding
US5490786A (en) * 1994-03-25 1996-02-13 Itt Corporation Termination of contact tails to PC board
US5868302A (en) * 1995-09-06 1999-02-09 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
US5905201A (en) * 1997-10-28 1999-05-18 Alliedsignal Inc. Micromachined rate and acceleration sensor and method
US6316736B1 (en) 1998-06-08 2001-11-13 Visteon Global Technologies, Inc. Anti-bridging solder ball collection zones
US6147326A (en) * 1998-09-25 2000-11-14 Seagate Technology, Inc. Soldering device with a plurality of spaced soldering tips and method of use
US6095872A (en) * 1998-10-21 2000-08-01 Molex Incorporated Connector having terminals with improved soldier tails
SG79262A1 (en) * 1998-10-21 2001-03-20 Molex Inc Connector having terminals with improved solder tails
US20090078746A1 (en) * 2006-03-28 2009-03-26 Seiji Karashima Bump forming method and bump forming apparatus
US8297488B2 (en) * 2006-03-28 2012-10-30 Panasonic Corporation Bump forming method using self-assembling resin and a wall surface
US20070295783A1 (en) * 2006-06-27 2007-12-27 Seagate Technology Llc Multiple tip soldering with individually compliant tip
US7748594B2 (en) * 2007-08-16 2010-07-06 Fujitsu Limited Solder repairing apparatus and method of repairing solder
US20090045245A1 (en) * 2007-08-16 2009-02-19 Fujitsu Limited Solder repairing apparatus and method of repairing solder
CN102761043A (en) * 2011-04-29 2012-10-31 日本压着端子制造株式会社 Welding method for conductive component
CN102761043B (en) * 2011-04-29 2016-06-29 日本压着端子制造株式会社 The welding method of conductive component
US8561879B2 (en) * 2012-01-09 2013-10-22 Apple Inc. Hotbar device and methods for assembling electrical contacts to ensure co-planarity
US8893952B2 (en) 2012-01-09 2014-11-25 Apple Inc. Hotbar device and methods for assembling electrical contacts to ensure co-planarity
JP2016015256A (en) * 2014-07-02 2016-01-28 積水化学工業株式会社 Conductive particle, composition for joining, joined structure and method for producing the joined structure
US20200061730A1 (en) * 2017-05-30 2020-02-27 Continental Automotive France Heating device
US20190393623A1 (en) * 2018-06-25 2019-12-26 Yazaki Corporation Fixation structure
US10693247B2 (en) * 2018-06-25 2020-06-23 Yazaki Corporation Fixation structure

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