US5328087A - Thermally and electrically conductive adhesive material and method of bonding with same - Google Patents
Thermally and electrically conductive adhesive material and method of bonding with same Download PDFInfo
- Publication number
- US5328087A US5328087A US08/038,420 US3842093A US5328087A US 5328087 A US5328087 A US 5328087A US 3842093 A US3842093 A US 3842093A US 5328087 A US5328087 A US 5328087A
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- US
- United States
- Prior art keywords
- adhesive
- filler
- pads
- contacting
- solidified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Abstract
Description
TABLE I ______________________________________ Liquid Metals (Melting Point) ______________________________________ Gallium (30° C.) Gallium/Tin (16° C.) Gallium/Indium (15° C.) Gallium/Indium/Tin (5° C.) Any of the above with Mercury, Cadmium, and Bismuth Mercury (-39° C.) Mercury/Zinc (-41.6° C.) ______________________________________
Claims (68)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/038,420 US5328087A (en) | 1993-03-29 | 1993-03-29 | Thermally and electrically conductive adhesive material and method of bonding with same |
US08/263,623 US5445308A (en) | 1993-03-29 | 1994-06-22 | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/038,420 US5328087A (en) | 1993-03-29 | 1993-03-29 | Thermally and electrically conductive adhesive material and method of bonding with same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/263,623 Continuation-In-Part US5445308A (en) | 1993-03-29 | 1994-06-22 | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
Publications (1)
Publication Number | Publication Date |
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US5328087A true US5328087A (en) | 1994-07-12 |
Family
ID=21899846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/038,420 Expired - Lifetime US5328087A (en) | 1993-03-29 | 1993-03-29 | Thermally and electrically conductive adhesive material and method of bonding with same |
Country Status (1)
Country | Link |
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US (1) | US5328087A (en) |
Cited By (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
US5588207A (en) * | 1992-09-22 | 1996-12-31 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing two-sided and multi-layered printed circuit boards |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
US5628099A (en) * | 1994-03-18 | 1997-05-13 | Fujitsu Limited | Method of producing series-resonant device using conductive adhesive resin |
US5661042A (en) * | 1995-08-28 | 1997-08-26 | Motorola, Inc. | Process for electrically connecting electrical devices using a conductive anisotropic material |
US5695872A (en) * | 1994-01-20 | 1997-12-09 | Siemens Aktiengesellschaft | Thermally conductive, electrically insulating glued connection, method for the production thereof and employment thereof |
US5741430A (en) * | 1996-04-25 | 1998-04-21 | Lucent Technologies Inc. | Conductive adhesive bonding means |
US5799392A (en) * | 1995-11-17 | 1998-09-01 | Fujitsu Limited | Method of manufacturing a connecting structure of printed wiring boards |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5807766A (en) * | 1995-09-21 | 1998-09-15 | Mcbride; Donald G. | Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process |
US5808874A (en) * | 1996-05-02 | 1998-09-15 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US5906043A (en) | 1995-01-18 | 1999-05-25 | Prolinx Labs Corporation | Programmable/reprogrammable structure using fuses and antifuses |
US5934914A (en) * | 1994-06-07 | 1999-08-10 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5983492A (en) * | 1996-11-27 | 1999-11-16 | Tessera, Inc. | Low profile socket for microelectronic components and method for making the same |
US6027575A (en) * | 1997-10-27 | 2000-02-22 | Ford Motor Company | Metallic adhesive for forming electronic interconnects at low temperatures |
US6080264A (en) * | 1996-05-20 | 2000-06-27 | Micron Technology, Inc. | Combination of semiconductor interconnect |
US6101708A (en) * | 1993-07-27 | 2000-08-15 | Citizen Watch Co., Ltd. | Method for electrically connecting terminals to each other |
US6111324A (en) * | 1998-02-05 | 2000-08-29 | Asat, Limited | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package |
US6120885A (en) * | 1997-07-10 | 2000-09-19 | International Business Machines Corporation | Structure, materials, and methods for socketable ball grid |
US6178630B1 (en) * | 1997-05-12 | 2001-01-30 | International Business Machines Corporation | Conductive bonding design and method for aluminum backed circuits |
US6297559B1 (en) * | 1997-07-10 | 2001-10-02 | International Business Machines Corporation | Structure, materials, and applications of ball grid array interconnections |
US6315856B1 (en) * | 1998-03-19 | 2001-11-13 | Kabushiki Kaisha Toshiba | Method of mounting electronic component |
US6337522B1 (en) * | 1997-07-10 | 2002-01-08 | International Business Machines Corporation | Structure employing electrically conductive adhesives |
US6339120B1 (en) | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US6339875B1 (en) | 1996-04-08 | 2002-01-22 | Heat Technology, Inc. | Method for removing heat from an integrated circuit |
US6342682B1 (en) * | 1996-01-11 | 2002-01-29 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method thereof |
US20020060092A1 (en) * | 1999-07-21 | 2002-05-23 | Sony Chemicals Corp. | Method for connecting electrical components |
US6404043B1 (en) | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
US6410854B1 (en) * | 1995-11-20 | 2002-06-25 | Koninklijke Philips Electronics N.V. | Wire and solder arrangement of ease of wave soldering |
US6426549B1 (en) | 1999-05-05 | 2002-07-30 | Harlan R. Isaak | Stackable flex circuit IC package and method of making same |
US6429382B1 (en) * | 1999-04-13 | 2002-08-06 | Matsushita Electric Industrial Co., Ltd. | Electrical mounting structure having an elution preventive film |
US6490786B2 (en) * | 2001-04-17 | 2002-12-10 | Visteon Global Technologies, Inc. | Circuit assembly and a method for making the same |
US20020185309A1 (en) * | 2001-05-01 | 2002-12-12 | Fujitsu Limited | Method for mounting electronic part and paste material |
US6498308B2 (en) * | 1999-04-02 | 2002-12-24 | Oki Electric Industry Co., Ltd. | Semiconductor module |
US20030002267A1 (en) * | 2001-06-15 | 2003-01-02 | Mantz Frank E. | I/O interface structure |
DE10133959A1 (en) * | 2001-07-18 | 2003-02-06 | Infineon Technologies Ag | Electronic component used in flip-chip technology, comprises a semiconductor chip having contact surfaces on its active surface connected to contact connecting surfaces of a wiring plate via an anisotropic soldering adhesive |
US20030027910A1 (en) * | 2000-04-05 | 2003-02-06 | The Bergquist Company | Morphing fillers and thermal interface materials |
US20030051911A1 (en) * | 2001-09-20 | 2003-03-20 | Roeters Glen E. | Post in ring interconnect using 3-D stacking |
US20030076665A1 (en) * | 1998-12-04 | 2003-04-24 | Salman Akram | Electrical device allowing for increased device densities |
US6573461B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
US20030152764A1 (en) * | 2002-02-06 | 2003-08-14 | Bunyan Michael H. | Thermal management materials having a phase change dispersion |
US20030153667A1 (en) * | 2002-02-08 | 2003-08-14 | Saikumar Jayaraman | Phase change material containing fusible particles as thermally conductive filler |
US6617199B2 (en) | 1998-06-24 | 2003-09-09 | Honeywell International Inc. | Electronic device having fibrous interface |
US20030178730A1 (en) * | 2002-02-08 | 2003-09-25 | Rumer Christopher L. | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
US20030183332A1 (en) * | 2002-03-26 | 2003-10-02 | Simila Charles E. | Screen printed thermal expansion standoff |
US20030187116A1 (en) * | 2000-04-05 | 2003-10-02 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
US20030203188A1 (en) * | 2002-02-06 | 2003-10-30 | H. Bunyan Michael | Thermal management materials |
US20030222249A1 (en) * | 2002-05-31 | 2003-12-04 | Bunyan Michael H. | Thermally or electrically-conductive form-in-place gap filter |
US20030234074A1 (en) * | 2002-06-25 | 2003-12-25 | Bhagwagar Dorab Edul | Thermal interface materials and methods for their preparation and use |
US6676796B2 (en) * | 1998-06-24 | 2004-01-13 | Honeywell International Inc. | Transferrable compliant fibrous thermal interface |
US20040012080A1 (en) * | 2002-05-28 | 2004-01-22 | Harry Hedler | Connection of integrated circuits |
US6703566B1 (en) * | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
US6713151B1 (en) | 1998-06-24 | 2004-03-30 | Honeywell International Inc. | Compliant fibrous thermal interface |
US20040108584A1 (en) * | 2002-12-05 | 2004-06-10 | Roeters Glen E. | Thin scale outline package |
US6764938B2 (en) * | 1994-07-20 | 2004-07-20 | Fujitsu Limited | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
US6802446B2 (en) * | 2002-02-01 | 2004-10-12 | Delphi Technologies, Inc. | Conductive adhesive material with metallurgically-bonded conductive particles |
US20040207990A1 (en) * | 2003-04-21 | 2004-10-21 | Rose Andrew C. | Stair-step signal routing |
US20040235221A1 (en) * | 2001-06-22 | 2004-11-25 | Kazuyuki Taguchi | Electronic device and method for manufacturing the same |
US20040265538A1 (en) * | 2003-06-26 | 2004-12-30 | Intel Corporation | Thermal interface apparatus, systems, and methods |
US20050228097A1 (en) * | 2004-03-30 | 2005-10-13 | General Electric Company | Thermally conductive compositions and methods of making thereof |
US7019221B1 (en) * | 1998-11-27 | 2006-03-28 | Nec Corporation | Printed wiring board |
WO2006050755A1 (en) * | 2004-11-11 | 2006-05-18 | Agilent Technologies, Inc. | Glueing two parts by stopping a liquid adhessive |
US7081373B2 (en) | 2001-12-14 | 2006-07-25 | Staktek Group, L.P. | CSP chip stack with flex circuit |
US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
US20070029107A1 (en) * | 2004-04-13 | 2007-02-08 | Kabushiki Kaisha Toshiba | Wiring board and production method of wiring board |
US20070219595A1 (en) * | 2006-03-14 | 2007-09-20 | Advanced Bionics Corporation | Stimulator system with electrode array and the method of making the same |
US7473995B2 (en) * | 2002-03-25 | 2009-01-06 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
US20090129022A1 (en) * | 2002-01-11 | 2009-05-21 | Intel Corporation | Micro-chimney and thermosiphon die-level cooling |
US20090162622A1 (en) * | 2004-05-27 | 2009-06-25 | Dutch Polymer Institute | Composition of a solder, and method of manufacturing a solder connection |
WO2010024674A1 (en) * | 2008-09-01 | 2010-03-04 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Solder interconnection |
US20100102431A1 (en) * | 2007-03-22 | 2010-04-29 | Toyota Jidosha Kabushiki Kaisha | Power module and inverter for vehicles |
US20100123115A1 (en) * | 2008-11-20 | 2010-05-20 | Farnworth Warren M | Interconnect And Method For Mounting An Electronic Device To A Substrate |
US20100208432A1 (en) * | 2007-09-11 | 2010-08-19 | Dorab Bhagwagar | Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use |
US20100209699A1 (en) * | 2007-09-26 | 2010-08-19 | Nitto Denko Corporation | Electroconductive pressure-sensitive adhesive tape |
EP2232969A1 (en) * | 2007-12-26 | 2010-09-29 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
US20100328895A1 (en) * | 2007-09-11 | 2010-12-30 | Dorab Bhagwagar | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use |
KR20110053838A (en) * | 2009-11-16 | 2011-05-24 | 중앙대학교 산학협력단 | Conductive adhesive, method for packaging semiconductors and wafer level package using the same |
US20110198067A1 (en) * | 2006-06-08 | 2011-08-18 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
US20110284262A1 (en) * | 2010-05-21 | 2011-11-24 | Purdue Research Foundation | Controlled Self Assembly of Anisotropic Conductive Adhesives Based on Ferromagnetic Particles |
WO2012081992A2 (en) | 2010-12-15 | 2012-06-21 | Condalign As | Method for forming uv-curable conductive compositions and a domposition thus formed |
US20160229552A1 (en) * | 2015-02-05 | 2016-08-11 | The Boeing Company | Intermetallic and composite metallic gap filler |
US9682533B1 (en) * | 2014-09-09 | 2017-06-20 | Hrl Laboratories, Llc | Methods to form electrical-mechanical connections between two surfaces, and systems and compositions suitable for such methods |
CN109852281A (en) * | 2019-02-01 | 2019-06-07 | 东南大学 | A kind of preparation method of the anisotropy conductiving glue based on liquid metal |
US10456991B2 (en) | 2016-10-03 | 2019-10-29 | Altec Industries, Inc. | Spacer for use in precision bonding applications that provides enhanced shear strength |
CN110741737A (en) * | 2017-05-31 | 2020-01-31 | 克里奥瓦克有限公司 | Electronic device, method and apparatus for manufacturing electronic device, and composition thereof |
US11220066B2 (en) | 2016-10-03 | 2022-01-11 | Altec Industries, Inc. | Spacer for use in precision bonding applications that provides enhanced shear strength |
US11224927B2 (en) * | 2015-11-25 | 2022-01-18 | International Business Machines Corporation | Circuit card attachment for enhanced robustness of thermal performance |
US20220254541A1 (en) * | 2020-04-17 | 2022-08-11 | Beijing Dream Ink Technologies Co., Ltd. | Flexible conductive paste and flexible electronic device |
Citations (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3141238A (en) * | 1960-11-22 | 1964-07-21 | Jr George G Harman | Method of low temperature bonding for subsequent high temperature use |
US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
US3395443A (en) * | 1965-09-29 | 1968-08-06 | Gen Electric | Method of forming a high temperatureresistant bond between aluminum and a dissimilarmetal |
US3805123A (en) * | 1972-12-12 | 1974-04-16 | Itt | Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them |
US4098452A (en) * | 1975-03-31 | 1978-07-04 | General Electric Company | Lead bonding method |
US4233103A (en) * | 1978-12-20 | 1980-11-11 | The United States Of America As Represented By The Secretary Of The Air Force | High temperature-resistant conductive adhesive and method employing same |
US4299715A (en) * | 1978-04-14 | 1981-11-10 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4398975A (en) * | 1980-12-25 | 1983-08-16 | Sony Corporation | Conductive paste |
US4403410A (en) * | 1980-01-23 | 1983-09-13 | International Computers Limited | Manufacture of printed circuit boards |
US4410457A (en) * | 1981-05-11 | 1983-10-18 | Sumitomo Chemical Co., Ltd. | Conductive paste |
US4435611A (en) * | 1980-03-24 | 1984-03-06 | Sony Corporation | Conductive paste |
US4442966A (en) * | 1980-10-15 | 1984-04-17 | U.S. Philips Corporation | Method of simultaneously manufacturing multiple electrical connections between two electrical elements |
US4448240A (en) * | 1982-12-20 | 1984-05-15 | International Business Machines Corporation | Telescoping thermal conduction element for cooling semiconductor devices |
US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
US4611745A (en) * | 1984-02-24 | 1986-09-16 | Kabushiki Kaisha Toshiba | Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same |
US4732702A (en) * | 1986-02-13 | 1988-03-22 | Hitachi Chemical Company, Ltd. | Electroconductive resin paste |
US4740252A (en) * | 1986-01-31 | 1988-04-26 | Senju Metal Industry Co., Ltd. | Solder paste for electronic parts |
US4740830A (en) * | 1986-06-04 | 1988-04-26 | W. R. Grace & Co. | Low temperature single step curing polyimide adhesive |
US4744850A (en) * | 1983-04-21 | 1988-05-17 | Sharp Kabushiki Kaisha | Method for bonding an LSI chip on a wiring base |
US4749120A (en) * | 1986-12-18 | 1988-06-07 | Matsushita Electric Industrial Co., Ltd. | Method of connecting a semiconductor device to a wiring board |
US4769525A (en) * | 1986-09-02 | 1988-09-06 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
US4769690A (en) * | 1985-04-25 | 1988-09-06 | Hitachi, Ltd. | Metallizing paste for silicon carbide sintered body and a semiconductor device including the same |
US4796157A (en) * | 1988-01-04 | 1989-01-03 | Motorola, Inc. | Substrate mounting assembly |
US4804132A (en) * | 1987-08-28 | 1989-02-14 | Difrancesco Louis | Method for cold bonding |
US4875617A (en) * | 1987-01-20 | 1989-10-24 | Citowsky Elya L | Gold-tin eutectic lead bonding method and structure |
US4929597A (en) * | 1988-03-25 | 1990-05-29 | Mitsubishi Metal Corporation | Superconductor containing internal stress absorber |
US4949220A (en) * | 1988-02-24 | 1990-08-14 | Nec Corporation | Hybrid IC with heat sink |
US4995546A (en) * | 1988-03-31 | 1991-02-26 | Bt&D Technologies Limited | Device mounting |
US5019201A (en) * | 1987-05-01 | 1991-05-28 | Canon Kabushiki Kaisha | External-circuit connecting method and packaging structure |
US5024264A (en) * | 1986-10-20 | 1991-06-18 | Fujitsu Limited | Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
US5053195A (en) * | 1989-07-19 | 1991-10-01 | Microelectronics And Computer Technology Corp. | Bonding amalgam and method of making |
US5056706A (en) * | 1989-11-20 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5062896A (en) * | 1990-03-30 | 1991-11-05 | International Business Machines Corporation | Solder/polymer composite paste and method |
US5147210A (en) * | 1988-03-03 | 1992-09-15 | Western Digital Corporation | Polymer film interconnect |
US5170930A (en) * | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5183969A (en) * | 1990-10-05 | 1993-02-02 | Shin-Etsu Polymer Co., Ltd. | Anisotropically electroconductive adhesive and adhesively bonded structure therewith |
US5225157A (en) * | 1989-07-19 | 1993-07-06 | Microelectronics And Computer Technology Corporation | Amalgam composition for room temperature bonding |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
US5258577A (en) * | 1991-11-22 | 1993-11-02 | Clements James R | Die mounting with uniaxial conductive adhesive |
-
1993
- 1993-03-29 US US08/038,420 patent/US5328087A/en not_active Expired - Lifetime
Patent Citations (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3141238A (en) * | 1960-11-22 | 1964-07-21 | Jr George G Harman | Method of low temperature bonding for subsequent high temperature use |
US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
US3395443A (en) * | 1965-09-29 | 1968-08-06 | Gen Electric | Method of forming a high temperatureresistant bond between aluminum and a dissimilarmetal |
US3805123A (en) * | 1972-12-12 | 1974-04-16 | Itt | Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them |
US4098452A (en) * | 1975-03-31 | 1978-07-04 | General Electric Company | Lead bonding method |
US4299715A (en) * | 1978-04-14 | 1981-11-10 | Whitfield Fred J | Methods and materials for conducting heat from electronic components and the like |
US4233103A (en) * | 1978-12-20 | 1980-11-11 | The United States Of America As Represented By The Secretary Of The Air Force | High temperature-resistant conductive adhesive and method employing same |
US4403410A (en) * | 1980-01-23 | 1983-09-13 | International Computers Limited | Manufacture of printed circuit boards |
US4435611A (en) * | 1980-03-24 | 1984-03-06 | Sony Corporation | Conductive paste |
US4442966A (en) * | 1980-10-15 | 1984-04-17 | U.S. Philips Corporation | Method of simultaneously manufacturing multiple electrical connections between two electrical elements |
US4398975A (en) * | 1980-12-25 | 1983-08-16 | Sony Corporation | Conductive paste |
US4410457A (en) * | 1981-05-11 | 1983-10-18 | Sumitomo Chemical Co., Ltd. | Conductive paste |
US4515304A (en) * | 1982-09-27 | 1985-05-07 | Northern Telecom Limited | Mounting of electronic components on printed circuit boards |
US4448240A (en) * | 1982-12-20 | 1984-05-15 | International Business Machines Corporation | Telescoping thermal conduction element for cooling semiconductor devices |
US4744850A (en) * | 1983-04-21 | 1988-05-17 | Sharp Kabushiki Kaisha | Method for bonding an LSI chip on a wiring base |
US4611745A (en) * | 1984-02-24 | 1986-09-16 | Kabushiki Kaisha Toshiba | Method for preparing highly heat-conductive substrate and copper wiring sheet usable in the same |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
US4769690A (en) * | 1985-04-25 | 1988-09-06 | Hitachi, Ltd. | Metallizing paste for silicon carbide sintered body and a semiconductor device including the same |
US4740252A (en) * | 1986-01-31 | 1988-04-26 | Senju Metal Industry Co., Ltd. | Solder paste for electronic parts |
US4732702A (en) * | 1986-02-13 | 1988-03-22 | Hitachi Chemical Company, Ltd. | Electroconductive resin paste |
US4740830A (en) * | 1986-06-04 | 1988-04-26 | W. R. Grace & Co. | Low temperature single step curing polyimide adhesive |
US4769525A (en) * | 1986-09-02 | 1988-09-06 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
US5024264A (en) * | 1986-10-20 | 1991-06-18 | Fujitsu Limited | Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit |
US4749120A (en) * | 1986-12-18 | 1988-06-07 | Matsushita Electric Industrial Co., Ltd. | Method of connecting a semiconductor device to a wiring board |
US4875617A (en) * | 1987-01-20 | 1989-10-24 | Citowsky Elya L | Gold-tin eutectic lead bonding method and structure |
US5019201A (en) * | 1987-05-01 | 1991-05-28 | Canon Kabushiki Kaisha | External-circuit connecting method and packaging structure |
US4804132A (en) * | 1987-08-28 | 1989-02-14 | Difrancesco Louis | Method for cold bonding |
US4796157A (en) * | 1988-01-04 | 1989-01-03 | Motorola, Inc. | Substrate mounting assembly |
US4949220A (en) * | 1988-02-24 | 1990-08-14 | Nec Corporation | Hybrid IC with heat sink |
US5147210A (en) * | 1988-03-03 | 1992-09-15 | Western Digital Corporation | Polymer film interconnect |
US4929597A (en) * | 1988-03-25 | 1990-05-29 | Mitsubishi Metal Corporation | Superconductor containing internal stress absorber |
US4995546A (en) * | 1988-03-31 | 1991-02-26 | Bt&D Technologies Limited | Device mounting |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
US5053195A (en) * | 1989-07-19 | 1991-10-01 | Microelectronics And Computer Technology Corp. | Bonding amalgam and method of making |
US5225157A (en) * | 1989-07-19 | 1993-07-06 | Microelectronics And Computer Technology Corporation | Amalgam composition for room temperature bonding |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
US5056706A (en) * | 1989-11-20 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5062896A (en) * | 1990-03-30 | 1991-11-05 | International Business Machines Corporation | Solder/polymer composite paste and method |
US5183969A (en) * | 1990-10-05 | 1993-02-02 | Shin-Etsu Polymer Co., Ltd. | Anisotropically electroconductive adhesive and adhesively bonded structure therewith |
US5170930A (en) * | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
US5258577A (en) * | 1991-11-22 | 1993-11-02 | Clements James R | Die mounting with uniaxial conductive adhesive |
Non-Patent Citations (32)
Title |
---|
"IBM Technical Disclosure Bulletin" vol. 31, No. 5, Oct. 1988, pp. 34-35. |
Darveaux et al., "Thermal/Stress Analysis of a Multichip Package Design," Proceedings of the 39th Electronic Components Conference, 1989, pp. 668-671. |
Darveaux et al., Thermal/Stress Analysis of a Multichip Package Design, Proceedings of the 39th Electronic Components Conference, 1989, pp. 668 671. * |
Glushkova et al., "Gallium-Copper and Gallium-Nickel Paste Solders," Svar. Proiz., No. 11, 1968, pp. 36-37. |
Glushkova et al., Gallium Copper and Gallium Nickel Paste Solders, Svar. Proiz., No. 11, 1968, pp. 36 37. * |
Hansen, Constitution of Binary Alloys, McGraw Hill, 1958, p. 22 & 96. * |
Hansen, Constitution of Binary Alloys, McGraw-Hill, 1958, p. 22 & 96. |
Harman, "Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples," The Review of Scientific Instruments, vol. 31, No. 7, Jul. 1960, pp. 717-720. |
Harman, Hard Gallium Alloys for Use as Low Contact Resistance Electrodes and for Bonding Thermocouples into Samples, The Review of Scientific Instruments, vol. 31, No. 7, Jul. 1960, pp. 717 720. * |
Hwang et al., "A Thermal Module Design for Advanced Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 347-355. |
Hwang et al., A Thermal Module Design for Advanced Packaging, Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 347 355. * |
IBM Technical Disclosure Bulletin vol. 31, No. 5, Oct. 1988, pp. 34 35. * |
Keeler, "Liquid Interconnects For Fine Pitch Assembly?" Electronic Packaging & Production, vol. 14, Jun. 1989 pp. 14-15. |
Keeler, Liquid Interconnects For Fine Pitch Assembly Electronic Packaging & Production, vol. 14, Jun. 1989 pp. 14 15. * |
Nayak et al., "A High Performance Thermal Module for Computer Packaging," Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 357-364. |
Nayak et al., A High Performance Thermal Module for Computer Packaging, Journal of Electronic Materials, vol. 16, No. 5, 1987, pp. 357 364. * |
P. Bujard, "Thermal Conductivity of Boron Nitride Filled Epoxy Resins: Temperature Dependence Influence of Sample Penetration", Intersociety Conference on THERMAL Performance in the Fabrication and Operation of Electronic Components 1988, Los Angeles, Calif., May 11-13, 1988, pp. 41-49. |
P. Bujard, Thermal Conductivity of Boron Nitride Filled Epoxy Resins: Temperature Dependence Influence of Sample Penetration , Intersociety Conference on THERMAL Performance in the Fabrication and Operation of Electronic Components 1988, Los Angeles, Calif., May 11 13, 1988, pp. 41 49. * |
Product Brochure entitled "High Performance Electronic Materials Manufactured by A. I. Technology, Inc." by A. I. Technology, Inc., Princeton, N.J. (date unknown) pp. 1-5. |
Product Brochure entitled "INDALLOY™ Fusible Alloys Available" by Indium Corporation of America, Utica, N.Y. (date unknown) pp. 1-5. |
Product Brochure entitled "Z link™ Multilayer Technology" by Sheldahl, Inc., Northfield, Minn., (date unknown) pp. 1-8. |
Product Brochure entitled High Performance Electronic Materials Manufactured by A. I. Technology, Inc. by A. I. Technology, Inc., Princeton, N.J. (date unknown) pp. 1 5. * |
Product Brochure entitled INDALLOY Fusible Alloys Available by Indium Corporation of America, Utica, N.Y. (date unknown) pp. 1 5. * |
Product Brochure entitled Z link Multilayer Technology by Sheldahl, Inc., Northfield, Minn., (date unknown) pp. 1 8. * |
Technical Bulletin entitled "DieGlas™ Die Attach Material Processing Recommendations" by Alphametals, Jersey City, N.J., Feb. 1992, pp. 1-2. |
Technical Bulletin entitled DieGlas Die Attach Material Processing Recommendations by Alphametals, Jersey City, N.J., Feb. 1992, pp. 1 2. * |
Thomas Dolbear, "Liquid Metal Paste for Thermal Connections", Proceedings of the International Electronic Packaging Society (IEPS), Sep., 1992, pp. 475-485. |
Thomas Dolbear, Liquid Metal Paste for Thermal Connections , Proceedings of the International Electronic Packaging Society (IEPS), Sep., 1992, pp. 475 485. * |
Tikhomirova, et al., "Effect of the Particle Shape and Size of a Second Component on the Properties of the Gallium Solders," Poroshkovaya Metallurgiya, No. 12 (84), Dec. 1969, pp. 51-56. |
Tikhomirova, et al., "Soldering Copper with Copper-Gallium Solders," Svar. Proiz., No. 10, 1967, pp. 16-18. |
Tikhomirova, et al., Effect of the Particle Shape and Size of a Second Component on the Properties of the Gallium Solders, Poroshkovaya Metallurgiya, No. 12 (84), Dec. 1969, pp. 51 56. * |
Tikhomirova, et al., Soldering Copper with Copper Gallium Solders, Svar. Proiz., No. 10, 1967, pp. 16 18. * |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
US6101708A (en) * | 1993-07-27 | 2000-08-15 | Citizen Watch Co., Ltd. | Method for electrically connecting terminals to each other |
US5695872A (en) * | 1994-01-20 | 1997-12-09 | Siemens Aktiengesellschaft | Thermally conductive, electrically insulating glued connection, method for the production thereof and employment thereof |
US5628099A (en) * | 1994-03-18 | 1997-05-13 | Fujitsu Limited | Method of producing series-resonant device using conductive adhesive resin |
US6205660B1 (en) | 1994-06-07 | 2001-03-27 | Tessera, Inc. | Method of making an electronic contact |
US6938338B2 (en) | 1994-06-07 | 2005-09-06 | Tessera, Inc. | Method of making an electronic contact |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5980270A (en) * | 1994-06-07 | 1999-11-09 | Tessera, Inc. | Soldering with resilient contacts |
US5812378A (en) * | 1994-06-07 | 1998-09-22 | Tessera, Inc. | Microelectronic connector for engaging bump leads |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
US5934914A (en) * | 1994-06-07 | 1999-08-10 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US6764938B2 (en) * | 1994-07-20 | 2004-07-20 | Fujitsu Limited | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
US20040209453A1 (en) * | 1994-07-20 | 2004-10-21 | Fujitsu Limited | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
US5906043A (en) | 1995-01-18 | 1999-05-25 | Prolinx Labs Corporation | Programmable/reprogrammable structure using fuses and antifuses |
US5962815A (en) | 1995-01-18 | 1999-10-05 | Prolinx Labs Corporation | Antifuse interconnect between two conducting layers of a printed circuit board |
US5661042A (en) * | 1995-08-28 | 1997-08-26 | Motorola, Inc. | Process for electrically connecting electrical devices using a conductive anisotropic material |
US5807766A (en) * | 1995-09-21 | 1998-09-15 | Mcbride; Donald G. | Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process |
US5799392A (en) * | 1995-11-17 | 1998-09-01 | Fujitsu Limited | Method of manufacturing a connecting structure of printed wiring boards |
US6902097B2 (en) | 1995-11-20 | 2005-06-07 | Koninklijke Philips Electronics N.V. | Electrically conductive wire |
US6410854B1 (en) * | 1995-11-20 | 2002-06-25 | Koninklijke Philips Electronics N.V. | Wire and solder arrangement of ease of wave soldering |
US6752310B2 (en) | 1995-11-20 | 2004-06-22 | Koninklijke Philips Electronics N.V. | Electrically conductive wire |
US20040188498A1 (en) * | 1995-11-20 | 2004-09-30 | Philips Corporation | Electrically conductive wire |
US6342682B1 (en) * | 1996-01-11 | 2002-01-29 | Ibiden Co., Ltd. | Printed wiring board and manufacturing method thereof |
US6339875B1 (en) | 1996-04-08 | 2002-01-22 | Heat Technology, Inc. | Method for removing heat from an integrated circuit |
US5741430A (en) * | 1996-04-25 | 1998-04-21 | Lucent Technologies Inc. | Conductive adhesive bonding means |
US5808874A (en) * | 1996-05-02 | 1998-09-15 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US6096574A (en) * | 1996-05-02 | 2000-08-01 | Tessera, Inc. | Methods of making microelectronic corrections with liquid conductive elements |
US6202298B1 (en) | 1996-05-02 | 2001-03-20 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US6774306B2 (en) | 1996-05-02 | 2004-08-10 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US6437240B2 (en) | 1996-05-02 | 2002-08-20 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US20030150635A1 (en) * | 1996-05-02 | 2003-08-14 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US6238938B1 (en) | 1996-05-02 | 2001-05-29 | Tessera, Inc. | Methods of making microelectronic connections with liquid conductive elements |
US6080264A (en) * | 1996-05-20 | 2000-06-27 | Micron Technology, Inc. | Combination of semiconductor interconnect |
US6229100B1 (en) | 1996-11-27 | 2001-05-08 | Tessera, Inc. | Low profile socket for microelectronic components and method for making the same |
US5983492A (en) * | 1996-11-27 | 1999-11-16 | Tessera, Inc. | Low profile socket for microelectronic components and method for making the same |
US6178630B1 (en) * | 1997-05-12 | 2001-01-30 | International Business Machines Corporation | Conductive bonding design and method for aluminum backed circuits |
US6120885A (en) * | 1997-07-10 | 2000-09-19 | International Business Machines Corporation | Structure, materials, and methods for socketable ball grid |
US6337522B1 (en) * | 1997-07-10 | 2002-01-08 | International Business Machines Corporation | Structure employing electrically conductive adhesives |
US6297559B1 (en) * | 1997-07-10 | 2001-10-02 | International Business Machines Corporation | Structure, materials, and applications of ball grid array interconnections |
US6300164B1 (en) | 1997-07-10 | 2001-10-09 | International Business Machines Corporation | Structure, materials, and methods for socketable ball grid |
US6027575A (en) * | 1997-10-27 | 2000-02-22 | Ford Motor Company | Metallic adhesive for forming electronic interconnects at low temperatures |
US6111324A (en) * | 1998-02-05 | 2000-08-29 | Asat, Limited | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package |
US6315856B1 (en) * | 1998-03-19 | 2001-11-13 | Kabushiki Kaisha Toshiba | Method of mounting electronic component |
US6617199B2 (en) | 1998-06-24 | 2003-09-09 | Honeywell International Inc. | Electronic device having fibrous interface |
US6676796B2 (en) * | 1998-06-24 | 2004-01-13 | Honeywell International Inc. | Transferrable compliant fibrous thermal interface |
US6740972B2 (en) | 1998-06-24 | 2004-05-25 | Honeywell International Inc. | Electronic device having fibrous interface |
US6713151B1 (en) | 1998-06-24 | 2004-03-30 | Honeywell International Inc. | Compliant fibrous thermal interface |
US7019221B1 (en) * | 1998-11-27 | 2006-03-28 | Nec Corporation | Printed wiring board |
US6909055B2 (en) * | 1998-12-04 | 2005-06-21 | Micron Technology, Inc. | Electrical device allowing for increased device densities |
US20030076665A1 (en) * | 1998-12-04 | 2003-04-24 | Salman Akram | Electrical device allowing for increased device densities |
US6498308B2 (en) * | 1999-04-02 | 2002-12-24 | Oki Electric Industry Co., Ltd. | Semiconductor module |
US6429382B1 (en) * | 1999-04-13 | 2002-08-06 | Matsushita Electric Industrial Co., Ltd. | Electrical mounting structure having an elution preventive film |
US6426549B1 (en) | 1999-05-05 | 2002-07-30 | Harlan R. Isaak | Stackable flex circuit IC package and method of making same |
US20020060092A1 (en) * | 1999-07-21 | 2002-05-23 | Sony Chemicals Corp. | Method for connecting electrical components |
US6760969B2 (en) | 1999-07-21 | 2004-07-13 | Sony Chemicals Corp. | Method for connecting electrical components |
US6624224B1 (en) | 2000-04-05 | 2003-09-23 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
USRE39992E1 (en) | 2000-04-05 | 2008-01-01 | The Bergquist Company | Morphing fillers and thermal interface materials |
US20030027910A1 (en) * | 2000-04-05 | 2003-02-06 | The Bergquist Company | Morphing fillers and thermal interface materials |
US6984685B2 (en) | 2000-04-05 | 2006-01-10 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
US6339120B1 (en) | 2000-04-05 | 2002-01-15 | The Bergquist Company | Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
US6797758B2 (en) | 2000-04-05 | 2004-09-28 | The Bergquist Company | Morphing fillers and thermal interface materials |
US20030187116A1 (en) * | 2000-04-05 | 2003-10-02 | The Bergquist Company | Thermal interface pad utilizing low melting metal with retention matrix |
US6878571B2 (en) | 2000-06-21 | 2005-04-12 | Staktek Group L.P. | Panel stacking of BGA devices to form three-dimensional modules |
US6472735B2 (en) | 2000-06-21 | 2002-10-29 | Harlan R. Isaak | Three-dimensional memory stacking using anisotropic epoxy interconnections |
US6544815B2 (en) | 2000-06-21 | 2003-04-08 | Harlan R. Isaak | Panel stacking of BGA devices to form three-dimensional modules |
US6566746B2 (en) | 2000-06-21 | 2003-05-20 | Dpac Technologies, Corp. | Panel stacking of BGA devices to form three-dimensional modules |
US20030064548A1 (en) * | 2000-06-21 | 2003-04-03 | Isaak Harlan R. | Panel stacking of BGA devices to form three-dimensional modules |
US6404043B1 (en) | 2000-06-21 | 2002-06-11 | Dense-Pac Microsystems, Inc. | Panel stacking of BGA devices to form three-dimensional modules |
US20030127746A1 (en) * | 2000-06-21 | 2003-07-10 | Isaak Harlan R. | Panel stacking of BGA devices to form three-dimensional modules |
US6703566B1 (en) * | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
US6490786B2 (en) * | 2001-04-17 | 2002-12-10 | Visteon Global Technologies, Inc. | Circuit assembly and a method for making the same |
US20020185309A1 (en) * | 2001-05-01 | 2002-12-12 | Fujitsu Limited | Method for mounting electronic part and paste material |
US6796025B2 (en) * | 2001-05-01 | 2004-09-28 | Fujitsu Limited | Method for mounting electronic part and paste material |
US20030002267A1 (en) * | 2001-06-15 | 2003-01-02 | Mantz Frank E. | I/O interface structure |
US7026188B2 (en) * | 2001-06-22 | 2006-04-11 | Renesas Technology Corp. | Electronic device and method for manufacturing the same |
US20040235221A1 (en) * | 2001-06-22 | 2004-11-25 | Kazuyuki Taguchi | Electronic device and method for manufacturing the same |
DE10133959B4 (en) * | 2001-07-18 | 2006-08-17 | Infineon Technologies Ag | Electronic component with semiconductor chip |
DE10133959A1 (en) * | 2001-07-18 | 2003-02-06 | Infineon Technologies Ag | Electronic component used in flip-chip technology, comprises a semiconductor chip having contact surfaces on its active surface connected to contact connecting surfaces of a wiring plate via an anisotropic soldering adhesive |
US20030051911A1 (en) * | 2001-09-20 | 2003-03-20 | Roeters Glen E. | Post in ring interconnect using 3-D stacking |
US6573461B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
US6573460B2 (en) | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Post in ring interconnect using for 3-D stacking |
US7081373B2 (en) | 2001-12-14 | 2006-07-25 | Staktek Group, L.P. | CSP chip stack with flex circuit |
US8505613B2 (en) * | 2002-01-11 | 2013-08-13 | Intel Corporation | Die having a via filled with a heat-dissipating material |
US20090129022A1 (en) * | 2002-01-11 | 2009-05-21 | Intel Corporation | Micro-chimney and thermosiphon die-level cooling |
US20110297362A1 (en) * | 2002-01-11 | 2011-12-08 | Chrysler Gregory M | Micro-chimney and thermosiphon die-level cooling |
US8006747B2 (en) * | 2002-01-11 | 2011-08-30 | Intel Corporation | Micro-chimney and thermosiphon die-level cooling |
US6802446B2 (en) * | 2002-02-01 | 2004-10-12 | Delphi Technologies, Inc. | Conductive adhesive material with metallurgically-bonded conductive particles |
US6946190B2 (en) | 2002-02-06 | 2005-09-20 | Parker-Hannifin Corporation | Thermal management materials |
US20030152764A1 (en) * | 2002-02-06 | 2003-08-14 | Bunyan Michael H. | Thermal management materials having a phase change dispersion |
US7682690B2 (en) | 2002-02-06 | 2010-03-23 | Parker-Hannifin Corporation | Thermal management materials having a phase change dispersion |
US20030203188A1 (en) * | 2002-02-06 | 2003-10-30 | H. Bunyan Michael | Thermal management materials |
US6926955B2 (en) * | 2002-02-08 | 2005-08-09 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
US20050214523A1 (en) * | 2002-02-08 | 2005-09-29 | Saikumar Jayaraman | Phase change material containing fusible particles as thermally conductive filler |
US7846778B2 (en) * | 2002-02-08 | 2010-12-07 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
US20070287005A1 (en) * | 2002-02-08 | 2007-12-13 | Saikumar Jayaraman | Phase change material containing fusible particles as thermally conductive filler |
US7294394B2 (en) * | 2002-02-08 | 2007-11-13 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
US7960019B2 (en) | 2002-02-08 | 2011-06-14 | Intel Corporation | Phase change material containing fusible particles as thermally conductive filler |
US20030178730A1 (en) * | 2002-02-08 | 2003-09-25 | Rumer Christopher L. | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
US20030153667A1 (en) * | 2002-02-08 | 2003-08-14 | Saikumar Jayaraman | Phase change material containing fusible particles as thermally conductive filler |
US7473995B2 (en) * | 2002-03-25 | 2009-01-06 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
US20030183332A1 (en) * | 2002-03-26 | 2003-10-02 | Simila Charles E. | Screen printed thermal expansion standoff |
US20040012080A1 (en) * | 2002-05-28 | 2004-01-22 | Harry Hedler | Connection of integrated circuits |
US6979591B2 (en) * | 2002-05-28 | 2005-12-27 | Infineon Technologies Ag | Connection of integrated circuits |
US7208192B2 (en) | 2002-05-31 | 2007-04-24 | Parker-Hannifin Corporation | Thermally or electrically-conductive form-in-place gap filter |
US20030222249A1 (en) * | 2002-05-31 | 2003-12-04 | Bunyan Michael H. | Thermally or electrically-conductive form-in-place gap filter |
US7147367B2 (en) * | 2002-06-11 | 2006-12-12 | Saint-Gobain Performance Plastics Corporation | Thermal interface material with low melting alloy |
US20030234074A1 (en) * | 2002-06-25 | 2003-12-25 | Bhagwagar Dorab Edul | Thermal interface materials and methods for their preparation and use |
US6791839B2 (en) | 2002-06-25 | 2004-09-14 | Dow Corning Corporation | Thermal interface materials and methods for their preparation and use |
US20040108584A1 (en) * | 2002-12-05 | 2004-06-10 | Roeters Glen E. | Thin scale outline package |
US6856010B2 (en) | 2002-12-05 | 2005-02-15 | Staktek Group L.P. | Thin scale outline package |
US20040207990A1 (en) * | 2003-04-21 | 2004-10-21 | Rose Andrew C. | Stair-step signal routing |
US20040265538A1 (en) * | 2003-06-26 | 2004-12-30 | Intel Corporation | Thermal interface apparatus, systems, and methods |
US20050228097A1 (en) * | 2004-03-30 | 2005-10-13 | General Electric Company | Thermally conductive compositions and methods of making thereof |
US20070029107A1 (en) * | 2004-04-13 | 2007-02-08 | Kabushiki Kaisha Toshiba | Wiring board and production method of wiring board |
US7469941B2 (en) * | 2004-04-13 | 2008-12-30 | Kabushiki Kaisha Toshiba | Method of producing a wiring board |
US9095933B2 (en) | 2004-05-27 | 2015-08-04 | Koninklijke Philips N.V. | Composition of a solder, and method of manufacturing a solder connection |
US9943930B2 (en) | 2004-05-27 | 2018-04-17 | Koninklijke Philips N.V. | Composition of a solder, and method of manufacturing a solder connection |
US20090162622A1 (en) * | 2004-05-27 | 2009-06-25 | Dutch Polymer Institute | Composition of a solder, and method of manufacturing a solder connection |
US8298680B2 (en) * | 2004-05-27 | 2012-10-30 | Koninklijke Philips Electronics N.V. | Composition of a solder, and method of manufacturing a solder connection |
WO2006050755A1 (en) * | 2004-11-11 | 2006-05-18 | Agilent Technologies, Inc. | Glueing two parts by stopping a liquid adhessive |
US8175710B2 (en) * | 2006-03-14 | 2012-05-08 | Boston Scientific Neuromodulation Corporation | Stimulator system with electrode array and the method of making the same |
US20070219595A1 (en) * | 2006-03-14 | 2007-09-20 | Advanced Bionics Corporation | Stimulator system with electrode array and the method of making the same |
US9179579B2 (en) * | 2006-06-08 | 2015-11-03 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
US20110198067A1 (en) * | 2006-06-08 | 2011-08-18 | International Business Machines Corporation | Sheet having high thermal conductivity and flexibility |
DE112008000743B4 (en) * | 2007-03-22 | 2013-12-24 | Toyota Jidosha Kabushiki Kaisha | Power module and inverter for vehicles |
DE112008000743B8 (en) * | 2007-03-22 | 2014-03-13 | Toyota Jidosha Kabushiki Kaisha | Power module and inverter for vehicles |
US20100102431A1 (en) * | 2007-03-22 | 2010-04-29 | Toyota Jidosha Kabushiki Kaisha | Power module and inverter for vehicles |
US20100328895A1 (en) * | 2007-09-11 | 2010-12-30 | Dorab Bhagwagar | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use |
US8334592B2 (en) | 2007-09-11 | 2012-12-18 | Dow Corning Corporation | Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
US20100208432A1 (en) * | 2007-09-11 | 2010-08-19 | Dorab Bhagwagar | Thermal Interface Material, Electronic Device Containing the Thermal Interface Material, and Methods for Their Preparation and Use |
US20100209699A1 (en) * | 2007-09-26 | 2010-08-19 | Nitto Denko Corporation | Electroconductive pressure-sensitive adhesive tape |
EP2232969A4 (en) * | 2007-12-26 | 2014-11-05 | Bergquist Co | Thermally and electrically conductive interconnect structures |
EP2232969A1 (en) * | 2007-12-26 | 2010-09-29 | The Bergquist Company | Thermally and electrically conductive interconnect structures |
WO2010024674A1 (en) * | 2008-09-01 | 2010-03-04 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Solder interconnection |
US20100123115A1 (en) * | 2008-11-20 | 2010-05-20 | Farnworth Warren M | Interconnect And Method For Mounting An Electronic Device To A Substrate |
US8129847B2 (en) * | 2008-11-20 | 2012-03-06 | Farnworth Warren M | Interconnect and method for mounting an electronic device to a substrate |
KR20110053838A (en) * | 2009-11-16 | 2011-05-24 | 중앙대학교 산학협력단 | Conductive adhesive, method for packaging semiconductors and wafer level package using the same |
US8816807B2 (en) * | 2010-05-21 | 2014-08-26 | Purdue Research Foundation | Controlled self assembly of anisotropic conductive adhesives based on ferromagnetic particles |
US20110284262A1 (en) * | 2010-05-21 | 2011-11-24 | Purdue Research Foundation | Controlled Self Assembly of Anisotropic Conductive Adhesives Based on Ferromagnetic Particles |
WO2012081992A2 (en) | 2010-12-15 | 2012-06-21 | Condalign As | Method for forming uv-curable conductive compositions and a domposition thus formed |
US9682533B1 (en) * | 2014-09-09 | 2017-06-20 | Hrl Laboratories, Llc | Methods to form electrical-mechanical connections between two surfaces, and systems and compositions suitable for such methods |
US20160229552A1 (en) * | 2015-02-05 | 2016-08-11 | The Boeing Company | Intermetallic and composite metallic gap filler |
US11224927B2 (en) * | 2015-11-25 | 2022-01-18 | International Business Machines Corporation | Circuit card attachment for enhanced robustness of thermal performance |
US10456991B2 (en) | 2016-10-03 | 2019-10-29 | Altec Industries, Inc. | Spacer for use in precision bonding applications that provides enhanced shear strength |
US11220066B2 (en) | 2016-10-03 | 2022-01-11 | Altec Industries, Inc. | Spacer for use in precision bonding applications that provides enhanced shear strength |
US11639035B2 (en) | 2016-10-03 | 2023-05-02 | Altec Industries, Inc. | Spacer for use in precision bonding applications that provides enhanced shear strength |
CN110741737A (en) * | 2017-05-31 | 2020-01-31 | 克里奥瓦克有限公司 | Electronic device, method and apparatus for manufacturing electronic device, and composition thereof |
CN109852281B (en) * | 2019-02-01 | 2020-07-28 | 扬州富威尔复合材料有限公司 | Preparation method of anisotropic conductive adhesive based on liquid metal |
CN109852281A (en) * | 2019-02-01 | 2019-06-07 | 东南大学 | A kind of preparation method of the anisotropy conductiving glue based on liquid metal |
US20220254541A1 (en) * | 2020-04-17 | 2022-08-11 | Beijing Dream Ink Technologies Co., Ltd. | Flexible conductive paste and flexible electronic device |
US11776709B2 (en) * | 2020-04-17 | 2023-10-03 | Beijing Dream Ink Technologies Co., Ltd. | Flexible conductive paste and flexible electronic device |
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