US6004832A - Method of fabricating an electrostatic ultrasonic transducer - Google Patents
Method of fabricating an electrostatic ultrasonic transducer Download PDFInfo
- Publication number
- US6004832A US6004832A US08/792,114 US79211497A US6004832A US 6004832 A US6004832 A US 6004832A US 79211497 A US79211497 A US 79211497A US 6004832 A US6004832 A US 6004832A
- Authority
- US
- United States
- Prior art keywords
- layer
- membrane
- silicon nitride
- substrate
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000012528 membrane Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 22
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000002210 silicon-based material Substances 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 abstract description 21
- 238000004108 freeze drying Methods 0.000 abstract description 3
- 238000000859 sublimation Methods 0.000 abstract description 3
- 230000008022 sublimation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 238000006073 displacement reaction Methods 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 238000003491 array Methods 0.000 description 4
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
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- 238000003384 imaging method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 238000003957 acoustic microscopy Methods 0.000 description 1
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- 238000011065 in-situ storage Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
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- 230000002265 prevention Effects 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
- B06B1/0696—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF with a plurality of electrodes on both sides
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/006—Electrostatic motors of the gap-closing type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
V(t)=V.sub.0 +V.sub.1 cos (ωt) (3)
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/792,114 US6004832A (en) | 1994-10-21 | 1997-01-31 | Method of fabricating an electrostatic ultrasonic transducer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/327,210 US5619476A (en) | 1994-10-21 | 1994-10-21 | Electrostatic ultrasonic transducer |
US08/792,114 US6004832A (en) | 1994-10-21 | 1997-01-31 | Method of fabricating an electrostatic ultrasonic transducer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/327,210 Division US5619476A (en) | 1994-10-21 | 1994-10-21 | Electrostatic ultrasonic transducer |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/739,446 Continuation-In-Part US5870351A (en) | 1994-10-21 | 1996-10-29 | Broadband microfabriated ultrasonic transducer and method of fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
US6004832A true US6004832A (en) | 1999-12-21 |
Family
ID=23275601
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/327,210 Expired - Lifetime US5619476A (en) | 1994-10-21 | 1994-10-21 | Electrostatic ultrasonic transducer |
US08/739,446 Expired - Lifetime US5870351A (en) | 1994-10-21 | 1996-10-29 | Broadband microfabriated ultrasonic transducer and method of fabrication |
US08/792,114 Expired - Lifetime US6004832A (en) | 1994-10-21 | 1997-01-31 | Method of fabricating an electrostatic ultrasonic transducer |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/327,210 Expired - Lifetime US5619476A (en) | 1994-10-21 | 1994-10-21 | Electrostatic ultrasonic transducer |
US08/739,446 Expired - Lifetime US5870351A (en) | 1994-10-21 | 1996-10-29 | Broadband microfabriated ultrasonic transducer and method of fabrication |
Country Status (1)
Country | Link |
---|---|
US (3) | US5619476A (en) |
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US6150227A (en) * | 1997-03-24 | 2000-11-21 | Nec Corporation | Integrated circuit structure with a gap between resistor film and substrate |
US6292435B1 (en) | 1999-05-11 | 2001-09-18 | Agilent Technologies, Inc. | Circuit and method for exciting a micro-machined transducer to have low second order harmonic transmit energy |
US6309946B1 (en) * | 1995-10-31 | 2001-10-30 | Micron Technology, Inc. | Reduced RC delay between adjacent substrate wiring lines |
US6314057B1 (en) | 1999-05-11 | 2001-11-06 | Rodney J Solomon | Micro-machined ultrasonic transducer array |
US6328697B1 (en) * | 2000-06-15 | 2001-12-11 | Atl Ultrasound, Inc. | Capacitive micromachined ultrasonic transducers with improved capacitive response |
US6381197B1 (en) | 1999-05-11 | 2002-04-30 | Bernard J Savord | Aperture control and apodization in a micro-machined ultrasonic transducer |
US20020083771A1 (en) * | 2000-07-14 | 2002-07-04 | Khuri-Yakub Butrus T. | Fluidic device with integrated capacitive micromachined ultrasonic transducers |
US6426582B1 (en) | 1999-05-19 | 2002-07-30 | Siemens Aktiengesellschaft | Micromechanical, capacitative ultrasound transducer and method for the manufacture thereof |
US6504795B1 (en) | 1999-05-19 | 2003-01-07 | Siemens Aktiengesellschaft | Arrangement of micromechanical ultrasound transducers |
US20030022505A1 (en) * | 2001-07-24 | 2003-01-30 | Luc Ouellet | Micro-fluidic devices |
US20030048698A1 (en) * | 2001-09-07 | 2003-03-13 | Siemens Medical Systems, Inc. | Bias control of electrostatic transducers |
US6558330B1 (en) | 2000-12-06 | 2003-05-06 | Acuson Corporation | Stacked and filled capacitive microelectromechanical ultrasonic transducer for medical diagnostic ultrasound systems |
US6605043B1 (en) * | 1998-11-19 | 2003-08-12 | Acuson Corp. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
US20030183888A1 (en) * | 2002-03-28 | 2003-10-02 | Eyal Bar-Sadeh | Corrugated diaphragm |
US6645145B1 (en) | 1998-11-19 | 2003-11-11 | Siemens Medical Solutions Usa, Inc. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
US6659954B2 (en) | 2001-12-19 | 2003-12-09 | Koninklijke Philips Electronics Nv | Micromachined ultrasound transducer and method for fabricating same |
WO2004016036A2 (en) | 2002-08-08 | 2004-02-19 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
US6714484B2 (en) | 2000-10-19 | 2004-03-30 | Sensant Corporation | Microfabricated acoustic transducer with suppressed substrate modes |
US20040127068A1 (en) * | 2002-10-30 | 2004-07-01 | Masayuki Furuhashi | Semiconductor device fabrication method and semiconductor fabrication control method |
US20040174773A1 (en) * | 2003-03-06 | 2004-09-09 | Kai Thomenius | Mosaic arrays using micromachined ultrasound transducers |
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US20050057284A1 (en) * | 2003-03-06 | 2005-03-17 | Wodnicki Robert Gideon | Method and apparatus for controlling scanning of mosaic sensor array |
US20050094490A1 (en) * | 2003-03-06 | 2005-05-05 | Thomenius Kai E. | Integrated interface electronics for reconfigurable sensor array |
US20050096546A1 (en) * | 2003-03-06 | 2005-05-05 | Hazard Christopher R. | Optimized switching configurations for reconfigurable arrays of sensor elements |
US20050124882A1 (en) * | 2003-02-14 | 2005-06-09 | Igal Ladabaum | System and method of operating microfabricated ultrasonic transducers for harmonic imaging |
US20050146240A1 (en) * | 2003-12-29 | 2005-07-07 | Smith Lowell S. | Micromachined ultrasonic transducer cells having compliant support structure |
US20050169107A1 (en) * | 2003-03-06 | 2005-08-04 | Thomenius Kai E. | Switching circuitry for reconfigurable arrays of sensor elements |
US20050219953A1 (en) * | 2004-04-06 | 2005-10-06 | The Board Of Trustees Of The Leland Stanford Junior University | Method and system for operating capacitive membrane ultrasonic transducers |
US20050237858A1 (en) * | 2003-03-06 | 2005-10-27 | Thomenius Kai E | Reconfigurable linear sensor arrays for reduced channel count |
US20060173342A1 (en) * | 2003-02-14 | 2006-08-03 | Satchi Panda | Method and apparatus for improving the performance of capacitive acoustic transducers using bias polarity control and multiple firings |
WO2006123299A2 (en) * | 2005-05-18 | 2006-11-23 | Kolo Technologies, Inc. | Methods for fabricating micro-electro-mechanical devices |
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US7215018B2 (en) | 2004-04-13 | 2007-05-08 | Vertical Circuits, Inc. | Stacked die BGA or LGA component assembly |
US7415121B2 (en) * | 2004-10-29 | 2008-08-19 | Sonion Nederland B.V. | Microphone with internal damping |
EP2289392B1 (en) | 2004-11-24 | 2012-05-09 | Remon Medical Technologies Ltd. | Implantable medical device with integrated acoustic transducer |
US7489593B2 (en) * | 2004-11-30 | 2009-02-10 | Vermon | Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor |
ITRM20050093A1 (en) * | 2005-03-04 | 2006-09-05 | Consiglio Nazionale Ricerche | MICROMECHANICAL SURFACE PROCEDURE FOR THE MANUFACTURE OF ULTRACUSTIC TRANSDUCERS MICRO-FINISHED CAPACITORS AND THEIR ULTRACUSTIC CAPACITIVE MICROLAVORIZED TRANSDUCER. |
US7152481B2 (en) * | 2005-04-13 | 2006-12-26 | Yunlong Wang | Capacitive micromachined acoustic transducer |
US7493821B2 (en) * | 2005-04-16 | 2009-02-24 | Yunlong Wang | Micromachined acoustic transducer and method of operating the same |
US7276892B2 (en) * | 2005-04-29 | 2007-10-02 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Resonator based spectrum analyzer and method |
TWI260940B (en) * | 2005-06-17 | 2006-08-21 | Ind Tech Res Inst | Method for producing polymeric capacitive ultrasonic transducer |
US20080212807A1 (en) * | 2005-06-08 | 2008-09-04 | General Mems Corporation | Micromachined Acoustic Transducers |
US8477983B2 (en) * | 2005-08-23 | 2013-07-02 | Analog Devices, Inc. | Multi-microphone system |
DE602005006419T2 (en) * | 2005-09-14 | 2008-09-25 | Esaote S.P.A. | Electroacoustic transducer for high frequency applications |
US8094704B2 (en) * | 2005-09-15 | 2012-01-10 | Avago Technologies Wiresless IP (Singapore) Pte. Ltd. | Detecting wireless channel status from acoustic discrimination of spectral content |
CN104646260B (en) | 2005-10-18 | 2018-08-28 | 株式会社日立制作所 | Ultrasonic probe |
DE102005054128A1 (en) * | 2005-11-14 | 2007-05-16 | Bosch Gmbh Robert | Machine tool monitoring device |
US8764664B2 (en) | 2005-11-28 | 2014-07-01 | Vizyontech Imaging, Inc. | Methods and apparatus for conformable medical data acquisition pad and configurable imaging system |
JP4755500B2 (en) * | 2006-01-26 | 2011-08-24 | 株式会社日立製作所 | Ultrasonic probe |
US20070180916A1 (en) * | 2006-02-09 | 2007-08-09 | General Electric Company | Capacitive micromachined ultrasound transducer and methods of making the same |
US8456958B2 (en) * | 2006-02-21 | 2013-06-04 | Vermon S.A. | Capacitive micro-machined ultrasonic transducer for element transducer apertures |
US8372680B2 (en) | 2006-03-10 | 2013-02-12 | Stc.Unm | Three-dimensional, ultrasonic transducer arrays, methods of making ultrasonic transducer arrays, and devices including ultrasonic transducer arrays |
JP4730162B2 (en) * | 2006-03-24 | 2011-07-20 | 株式会社日立製作所 | Ultrasonic transmitting / receiving device, ultrasonic probe, and manufacturing method thereof |
US7745973B2 (en) * | 2006-05-03 | 2010-06-29 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic crosstalk reduction for capacitive micromachined ultrasonic transducers in immersion |
US7949396B2 (en) | 2006-07-21 | 2011-05-24 | Cardiac Pacemakers, Inc. | Ultrasonic transducer for a metallic cavity implated medical device |
US7912548B2 (en) | 2006-07-21 | 2011-03-22 | Cardiac Pacemakers, Inc. | Resonant structures for implantable devices |
US7911881B2 (en) * | 2007-04-20 | 2011-03-22 | Tsd Integrated Controls, Llc | Method and apparatus for ultrasonic sensing |
US8825161B1 (en) | 2007-05-17 | 2014-09-02 | Cardiac Pacemakers, Inc. | Acoustic transducer for an implantable medical device |
US8723332B2 (en) * | 2007-06-11 | 2014-05-13 | Invensas Corporation | Electrically interconnected stacked die assemblies |
US7634318B2 (en) | 2007-06-14 | 2009-12-15 | Cardiac Pacemakers, Inc. | Multi-element acoustic recharging system |
WO2008157722A1 (en) * | 2007-06-19 | 2008-12-24 | Vertical Circuits, Inc. | Wafer level surface passivation of stackable integrated circuit chips |
US20090005685A1 (en) * | 2007-06-29 | 2009-01-01 | Canon Kabushiki Kaisha | Ultrasonic probe and inspection apparatus equipped with the ultrasonic probe |
WO2009035849A2 (en) | 2007-09-10 | 2009-03-19 | Vertical Circuits, Inc. | Semiconductor die mount by conformal die coating |
US20100256498A1 (en) * | 2007-11-16 | 2010-10-07 | Hiroki Tanaka | Ultrasonic imaging device |
WO2009073753A1 (en) * | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Cmut packaging for ultrasound system |
US8767514B2 (en) | 2007-12-03 | 2014-07-01 | Kolo Technologies, Inc. | Telemetric sensing using micromachined ultrasonic transducer |
WO2009073748A1 (en) * | 2007-12-03 | 2009-06-11 | Kolo Technologies, Inc. | Stacked transducing devices |
KR101554761B1 (en) | 2008-03-12 | 2015-09-21 | 인벤사스 코포레이션 | Support mounted electrically interconnected die assembly |
US20110062535A1 (en) * | 2008-05-07 | 2011-03-17 | Mcmullen Robert Errol | Mems transducers |
US9153517B2 (en) | 2008-05-20 | 2015-10-06 | Invensas Corporation | Electrical connector between die pad and z-interconnect for stacked die assemblies |
US7863159B2 (en) * | 2008-06-19 | 2011-01-04 | Vertical Circuits, Inc. | Semiconductor die separation method |
EP2154491A1 (en) | 2008-08-07 | 2010-02-17 | UAB Minatech | Ultrasonic flow meter, transducer assembly and method |
FR2938918B1 (en) * | 2008-11-21 | 2011-02-11 | Commissariat Energie Atomique | METHOD AND DEVICE FOR THE ACOUSTIC ANALYSIS OF MICROPOROSITIES IN MATERIALS SUCH AS CONCRETE USING A PLURALITY OF CMUTS TRANSDUCERS INCORPORATED IN THE MATERIAL |
US8472648B2 (en) * | 2009-01-20 | 2013-06-25 | General Mems Corporation | Miniature MEMS condenser microphone package and fabrication method thereof |
US8325951B2 (en) | 2009-01-20 | 2012-12-04 | General Mems Corporation | Miniature MEMS condenser microphone packages and fabrication method thereof |
WO2010151578A2 (en) * | 2009-06-26 | 2010-12-29 | Vertical Circuits, Inc. | Electrical interconnect for die stacked in zig-zag configuration |
EP2269746B1 (en) | 2009-07-02 | 2014-05-14 | Nxp B.V. | Collapsed mode capacitive sensor |
EP2271134A1 (en) | 2009-07-02 | 2011-01-05 | Nxp B.V. | Proximity sensor comprising an acoustic transducer for receiving sound signals in the human audible range and for emitting and receiving ultrasonic signals. |
US9147583B2 (en) | 2009-10-27 | 2015-09-29 | Invensas Corporation | Selective die electrical insulation by additive process |
TWI544604B (en) | 2009-11-04 | 2016-08-01 | 英維瑟斯公司 | Stacked die assembly having reduced stress electrical interconnects |
JP5550330B2 (en) * | 2009-12-25 | 2014-07-16 | キヤノン株式会社 | Capacitance detection type electromechanical transducer manufacturing method |
EP2520101B1 (en) | 2009-12-31 | 2021-03-17 | ZetrOZ Systems LLC | Low-profile ultrasound transducer |
JP5875244B2 (en) | 2011-04-06 | 2016-03-02 | キヤノン株式会社 | Electromechanical transducer and method for manufacturing the same |
CN103875068B (en) * | 2011-10-17 | 2018-07-10 | 皇家飞利浦有限公司 | Through-wafer highway device and its manufacturing method |
FR2983349B1 (en) * | 2011-11-25 | 2013-12-13 | St Microelectronics Tours Sas | DEVICE FOR TRANSMITTING GALVANIC ISOLATION INFORMATION |
JP6071285B2 (en) * | 2012-07-06 | 2017-02-01 | キヤノン株式会社 | Capacitive transducer |
JP5986441B2 (en) | 2012-07-06 | 2016-09-06 | キヤノン株式会社 | Capacitive transducer |
JP6057571B2 (en) | 2012-07-06 | 2017-01-11 | キヤノン株式会社 | Capacitive transducer |
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EP2796210B1 (en) * | 2013-04-25 | 2016-11-30 | Canon Kabushiki Kaisha | Capacitive transducer and method of manufacturing the same |
JP6265758B2 (en) * | 2014-01-27 | 2018-01-24 | キヤノン株式会社 | Capacitive transducer |
KR102250185B1 (en) | 2014-01-29 | 2021-05-10 | 삼성전자주식회사 | Electro acoustic transducer |
KR102155695B1 (en) * | 2014-02-12 | 2020-09-21 | 삼성전자주식회사 | Electro acoustic transducer |
WO2015131083A1 (en) | 2014-02-28 | 2015-09-03 | The Regents Of The University Of California | Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut) |
JP6424507B2 (en) * | 2014-07-28 | 2018-11-21 | コニカミノルタ株式会社 | Ultrasonic transducer and ultrasonic diagnostic apparatus |
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US9871019B2 (en) | 2015-07-17 | 2018-01-16 | Invensas Corporation | Flipped die stack assemblies with leadframe interconnects |
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US9490195B1 (en) | 2015-07-17 | 2016-11-08 | Invensas Corporation | Wafer-level flipped die stacks with leadframes or metal foil interconnects |
JP6429759B2 (en) | 2015-10-24 | 2018-11-28 | キヤノン株式会社 | Capacitance type transducer and information acquisition device including the same |
US9508691B1 (en) | 2015-12-16 | 2016-11-29 | Invensas Corporation | Flipped die stacks with multiple rows of leadframe interconnects |
US20170240418A1 (en) * | 2016-02-18 | 2017-08-24 | Knowles Electronics, Llc | Low-cost miniature mems vibration sensor |
US10566310B2 (en) | 2016-04-11 | 2020-02-18 | Invensas Corporation | Microelectronic packages having stacked die and wire bond interconnects |
US9595511B1 (en) | 2016-05-12 | 2017-03-14 | Invensas Corporation | Microelectronic packages and assemblies with improved flyby signaling operation |
JP7216550B2 (en) | 2016-06-13 | 2023-02-01 | コーニンクレッカ フィリップス エヌ ヴェ | Broadband ultrasonic transducer |
US9728524B1 (en) | 2016-06-30 | 2017-08-08 | Invensas Corporation | Enhanced density assembly having microelectronic packages mounted at substantial angle to board |
US10618078B2 (en) * | 2016-07-18 | 2020-04-14 | Kolo Medical, Ltd. | Bias control for capacitive micromachined ultrasonic transducers |
CN113891767B (en) * | 2019-05-23 | 2023-04-07 | 弗劳恩霍夫应用研究促进协会 | Sensor and method for generating a spatially coded sound field by means of sound emission apertures having spatially varying frequencies and bandwidths |
FR3116630B1 (en) * | 2020-11-26 | 2023-06-02 | Commissariat A L’Energie Atomique Et Aux Energies Alternatives | Haptic interface |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4262399A (en) * | 1978-11-08 | 1981-04-21 | General Electric Co. | Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit |
US4566935A (en) * | 1984-07-31 | 1986-01-28 | Texas Instruments Incorporated | Spatial light modulator and method |
US4665610A (en) * | 1985-04-22 | 1987-05-19 | Stanford University | Method of making a semiconductor transducer having multiple level diaphragm structure |
US4783821A (en) * | 1987-11-25 | 1988-11-08 | The Regents Of The University Of California | IC processed piezoelectric microphone |
US4910840A (en) * | 1987-10-30 | 1990-03-27 | Microtel, B.V. | Electroacoustic transducer of the so-called "electret" type, and a method of making such a transducer |
US5013693A (en) * | 1989-02-16 | 1991-05-07 | Wisconsin Alumni Research Foundation | Formation of microstructures with removal of liquid by freezing and sublimation |
US5285131A (en) * | 1990-12-03 | 1994-02-08 | University Of California - Berkeley | Vacuum-sealed silicon incandescent light |
US5367429A (en) * | 1991-10-18 | 1994-11-22 | Hitachi, Ltd | Electrostatic type micro transducer and control system using the same |
US5408731A (en) * | 1992-11-05 | 1995-04-25 | Csem Centre Suisse D'electronique Et De Microtechnique S.A. - Rechere Et Developpement | Process for the manufacture of integrated capacitive transducers |
US5436452A (en) * | 1992-06-15 | 1995-07-25 | California Institute Of Technology | Uncooled tunneling infrared sensor |
US5459610A (en) * | 1992-04-28 | 1995-10-17 | The Board Of Trustees Of The Leland Stanford, Junior University | Deformable grating apparatus for modulating a light beam and including means for obviating stiction between grating elements and underlying substrate |
US5633552A (en) * | 1993-06-04 | 1997-05-27 | The Regents Of The University Of California | Cantilever pressure transducer |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE892773C (en) * | 1941-04-17 | 1953-10-12 | Siemens Ag | Condenser microphone |
US3715638A (en) * | 1971-05-10 | 1973-02-06 | Bendix Corp | Temperature compensator for capacitive pressure transducers |
US3736552A (en) * | 1971-07-27 | 1973-05-29 | Bell Telephone Labor Inc | Acoustic imaging device using multiple element electret transducer |
JPS4861126A (en) * | 1971-12-02 | 1973-08-27 | ||
US3786495A (en) * | 1972-05-17 | 1974-01-15 | Ncr | Stored charge transducer |
US3973146A (en) * | 1974-03-18 | 1976-08-03 | North American Philips Corporation | Signal detector comprising field effect transistors |
US4081626A (en) * | 1976-11-12 | 1978-03-28 | Polaroid Corporation | Electrostatic transducer having narrowed directional characteristic |
US4246449A (en) * | 1979-04-24 | 1981-01-20 | Polaroid Corporation | Electrostatic transducer having optimum sensitivity and damping |
US4439641A (en) * | 1981-09-02 | 1984-03-27 | Polaroid Corporation | Ultrasonic transducer for use in a vibratory environment |
US4429192A (en) * | 1981-11-20 | 1984-01-31 | Bell Telephone Laboratories, Incorporated | Electret transducer with variable electret foil thickness |
US4439847A (en) * | 1981-12-21 | 1984-03-27 | The Stoneleigh Trust | High efficiency broadband directional sonar transducer |
US4530077A (en) * | 1983-05-19 | 1985-07-16 | Xecutek Corporation | Efficient low cost transducer system |
US4533795A (en) * | 1983-07-07 | 1985-08-06 | American Telephone And Telegraph | Integrated electroacoustic transducer |
US4524247A (en) * | 1983-07-07 | 1985-06-18 | At&T Bell Laboratories | Integrated electroacoustic transducer with built-in bias |
US4887246A (en) * | 1983-09-15 | 1989-12-12 | Ultrasonic Arrays, Inc. | Ultrasonic apparatus, system and method |
DE3807251A1 (en) * | 1988-03-05 | 1989-09-14 | Sennheiser Electronic | CAPACITIVE SOUND CONVERTER |
DE3812244C1 (en) * | 1988-04-13 | 1989-11-09 | Honeywell-Elac-Nautik Gmbh, 2300 Kiel, De | |
US4887248A (en) * | 1988-07-07 | 1989-12-12 | Cleveland Machine Controls, Inc. | Electrostatic transducer and method of making and using same |
US5241512A (en) * | 1991-04-25 | 1993-08-31 | Hutchinson 2 | Acoustic protection material and apparatus including such material |
US5208789A (en) * | 1992-04-13 | 1993-05-04 | Lectret S. A. | Condenser microphones based on silicon with humidity resistant surface treatment |
US5619476A (en) * | 1994-10-21 | 1997-04-08 | The Board Of Trustees Of The Leland Stanford Jr. Univ. | Electrostatic ultrasonic transducer |
-
1994
- 1994-10-21 US US08/327,210 patent/US5619476A/en not_active Expired - Lifetime
-
1996
- 1996-10-29 US US08/739,446 patent/US5870351A/en not_active Expired - Lifetime
-
1997
- 1997-01-31 US US08/792,114 patent/US6004832A/en not_active Expired - Lifetime
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4262399A (en) * | 1978-11-08 | 1981-04-21 | General Electric Co. | Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit |
US4432007A (en) * | 1978-11-08 | 1984-02-14 | General Electric Company | Ultrasonic transducer fabricated as an integral part of a monolithic integrated circuit |
US4566935A (en) * | 1984-07-31 | 1986-01-28 | Texas Instruments Incorporated | Spatial light modulator and method |
US4665610A (en) * | 1985-04-22 | 1987-05-19 | Stanford University | Method of making a semiconductor transducer having multiple level diaphragm structure |
US4910840A (en) * | 1987-10-30 | 1990-03-27 | Microtel, B.V. | Electroacoustic transducer of the so-called "electret" type, and a method of making such a transducer |
US4783821A (en) * | 1987-11-25 | 1988-11-08 | The Regents Of The University Of California | IC processed piezoelectric microphone |
US5013693A (en) * | 1989-02-16 | 1991-05-07 | Wisconsin Alumni Research Foundation | Formation of microstructures with removal of liquid by freezing and sublimation |
US5285131A (en) * | 1990-12-03 | 1994-02-08 | University Of California - Berkeley | Vacuum-sealed silicon incandescent light |
US5367429A (en) * | 1991-10-18 | 1994-11-22 | Hitachi, Ltd | Electrostatic type micro transducer and control system using the same |
US5459610A (en) * | 1992-04-28 | 1995-10-17 | The Board Of Trustees Of The Leland Stanford, Junior University | Deformable grating apparatus for modulating a light beam and including means for obviating stiction between grating elements and underlying substrate |
US5436452A (en) * | 1992-06-15 | 1995-07-25 | California Institute Of Technology | Uncooled tunneling infrared sensor |
US5408731A (en) * | 1992-11-05 | 1995-04-25 | Csem Centre Suisse D'electronique Et De Microtechnique S.A. - Rechere Et Developpement | Process for the manufacture of integrated capacitive transducers |
US5633552A (en) * | 1993-06-04 | 1997-05-27 | The Regents Of The University Of California | Cantilever pressure transducer |
Cited By (128)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6548883B2 (en) | 1995-10-31 | 2003-04-15 | Micron Technology, Inc. | Reduced RC between adjacent substrate wiring lines |
US6309946B1 (en) * | 1995-10-31 | 2001-10-30 | Micron Technology, Inc. | Reduced RC delay between adjacent substrate wiring lines |
US6150227A (en) * | 1997-03-24 | 2000-11-21 | Nec Corporation | Integrated circuit structure with a gap between resistor film and substrate |
US7549962B2 (en) | 1998-11-19 | 2009-06-23 | Siemens Medical Solutions Usa, Inc. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
US6773401B1 (en) * | 1998-11-19 | 2004-08-10 | Acuson Corp. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
US6645145B1 (en) | 1998-11-19 | 2003-11-11 | Siemens Medical Solutions Usa, Inc. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
US6605043B1 (en) * | 1998-11-19 | 2003-08-12 | Acuson Corp. | Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components |
US6292435B1 (en) | 1999-05-11 | 2001-09-18 | Agilent Technologies, Inc. | Circuit and method for exciting a micro-machined transducer to have low second order harmonic transmit energy |
US6314057B1 (en) | 1999-05-11 | 2001-11-06 | Rodney J Solomon | Micro-machined ultrasonic transducer array |
US6381197B1 (en) | 1999-05-11 | 2002-04-30 | Bernard J Savord | Aperture control and apodization in a micro-machined ultrasonic transducer |
US6426582B1 (en) | 1999-05-19 | 2002-07-30 | Siemens Aktiengesellschaft | Micromechanical, capacitative ultrasound transducer and method for the manufacture thereof |
US6504795B1 (en) | 1999-05-19 | 2003-01-07 | Siemens Aktiengesellschaft | Arrangement of micromechanical ultrasound transducers |
US6443901B1 (en) * | 2000-06-15 | 2002-09-03 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasonic transducers |
US6632178B1 (en) | 2000-06-15 | 2003-10-14 | Koninklijke Philips Electronics N.V. | Fabrication of capacitive micromachined ultrasonic transducers by micro-stereolithography |
US6328697B1 (en) * | 2000-06-15 | 2001-12-11 | Atl Ultrasound, Inc. | Capacitive micromachined ultrasonic transducers with improved capacitive response |
US6854338B2 (en) | 2000-07-14 | 2005-02-15 | The Board Of Trustees Of The Leland Stanford Junior University | Fluidic device with integrated capacitive micromachined ultrasonic transducers |
US20020083771A1 (en) * | 2000-07-14 | 2002-07-04 | Khuri-Yakub Butrus T. | Fluidic device with integrated capacitive micromachined ultrasonic transducers |
US6714484B2 (en) | 2000-10-19 | 2004-03-30 | Sensant Corporation | Microfabricated acoustic transducer with suppressed substrate modes |
US6862254B2 (en) * | 2000-10-19 | 2005-03-01 | Sensant Corporation | Microfabricated ultrasonic transducer with suppressed substrate modes |
US6558330B1 (en) | 2000-12-06 | 2003-05-06 | Acuson Corporation | Stacked and filled capacitive microelectromechanical ultrasonic transducer for medical diagnostic ultrasound systems |
US20030022505A1 (en) * | 2001-07-24 | 2003-01-30 | Luc Ouellet | Micro-fluidic devices |
US6825127B2 (en) * | 2001-07-24 | 2004-11-30 | Zarlink Semiconductor Inc. | Micro-fluidic devices |
US6795374B2 (en) | 2001-09-07 | 2004-09-21 | Siemens Medical Solutions Usa, Inc. | Bias control of electrostatic transducers |
US20030048698A1 (en) * | 2001-09-07 | 2003-03-13 | Siemens Medical Systems, Inc. | Bias control of electrostatic transducers |
US6659954B2 (en) | 2001-12-19 | 2003-12-09 | Koninklijke Philips Electronics Nv | Micromachined ultrasound transducer and method for fabricating same |
US20030183888A1 (en) * | 2002-03-28 | 2003-10-02 | Eyal Bar-Sadeh | Corrugated diaphragm |
US20060141658A1 (en) * | 2002-03-28 | 2006-06-29 | Eyal Bar-Sadeh | Corrugated diaphragm |
EP1552721A2 (en) * | 2002-08-08 | 2005-07-13 | The Board of Trustees of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
EP1552721A4 (en) * | 2002-08-08 | 2010-07-28 | Univ Leland Stanford Junior | Micromachined ultrasonic transducers and method of fabrication |
US20040085858A1 (en) * | 2002-08-08 | 2004-05-06 | Khuri-Yakub Butrus T. | Micromachined ultrasonic transducers and method of fabrication |
WO2004016036A2 (en) | 2002-08-08 | 2004-02-19 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
US6958255B2 (en) | 2002-08-08 | 2005-10-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined ultrasonic transducers and method of fabrication |
US6800538B2 (en) * | 2002-10-30 | 2004-10-05 | Fujitsu Limited | Semiconductor device fabrication method and semiconductor fabrication control method |
US20040127068A1 (en) * | 2002-10-30 | 2004-07-01 | Masayuki Furuhashi | Semiconductor device fabrication method and semiconductor fabrication control method |
US7780597B2 (en) * | 2003-02-14 | 2010-08-24 | Siemens Medical Solutions Usa, Inc. | Method and apparatus for improving the performance of capacitive acoustic transducers using bias polarity control and multiple firings |
US20060173342A1 (en) * | 2003-02-14 | 2006-08-03 | Satchi Panda | Method and apparatus for improving the performance of capacitive acoustic transducers using bias polarity control and multiple firings |
US20050124882A1 (en) * | 2003-02-14 | 2005-06-09 | Igal Ladabaum | System and method of operating microfabricated ultrasonic transducers for harmonic imaging |
US7618373B2 (en) | 2003-02-14 | 2009-11-17 | Siemens Medical Solutions Usa, Inc. | Microfabricated ultrasonic transducer array for 3-D imaging and method of operating the same |
US7635332B2 (en) | 2003-02-14 | 2009-12-22 | Siemens Medical Solutions Usa, Inc. | System and method of operating microfabricated ultrasonic transducers for harmonic imaging |
US7280435B2 (en) | 2003-03-06 | 2007-10-09 | General Electric Company | Switching circuitry for reconfigurable arrays of sensor elements |
US7313053B2 (en) | 2003-03-06 | 2007-12-25 | General Electric Company | Method and apparatus for controlling scanning of mosaic sensor array |
US7443765B2 (en) | 2003-03-06 | 2008-10-28 | General Electric Company | Reconfigurable linear sensor arrays for reduced channel count |
US20050057284A1 (en) * | 2003-03-06 | 2005-03-17 | Wodnicki Robert Gideon | Method and apparatus for controlling scanning of mosaic sensor array |
US20050237858A1 (en) * | 2003-03-06 | 2005-10-27 | Thomenius Kai E | Reconfigurable linear sensor arrays for reduced channel count |
US7353056B2 (en) | 2003-03-06 | 2008-04-01 | General Electric Company | Optimized switching configurations for reconfigurable arrays of sensor elements |
CN100452469C (en) * | 2003-03-06 | 2009-01-14 | 通用电气公司 | Mosaic array of ultrasound transducer by micromachining |
US6865140B2 (en) | 2003-03-06 | 2005-03-08 | General Electric Company | Mosaic arrays using micromachined ultrasound transducers |
US20040174773A1 (en) * | 2003-03-06 | 2004-09-09 | Kai Thomenius | Mosaic arrays using micromachined ultrasound transducers |
US20050094490A1 (en) * | 2003-03-06 | 2005-05-05 | Thomenius Kai E. | Integrated interface electronics for reconfigurable sensor array |
US20050169107A1 (en) * | 2003-03-06 | 2005-08-04 | Thomenius Kai E. | Switching circuitry for reconfigurable arrays of sensor elements |
US20050096546A1 (en) * | 2003-03-06 | 2005-05-05 | Hazard Christopher R. | Optimized switching configurations for reconfigurable arrays of sensor elements |
US7257051B2 (en) | 2003-03-06 | 2007-08-14 | General Electric Company | Integrated interface electronics for reconfigurable sensor array |
WO2005012160A3 (en) * | 2003-07-04 | 2005-06-09 | Commissariat Energie Atomique | Method for separating a useful layer and component obtained by said method |
FR2857002A1 (en) * | 2003-07-04 | 2005-01-07 | Commissariat Energie Atomique | Detachment of a useful layer and fixing it to a substrate using a sacrificial layer and an engraving technique, to produce suspended layers for micromechanical components such as drivers and accelerometers |
JP2007525330A (en) * | 2003-07-04 | 2007-09-06 | コミサリア、ア、レネルジ、アトミク | Method for separating useful layers and components obtained by said method |
US7569152B2 (en) | 2003-07-04 | 2009-08-04 | Commissariat A L'energie Atomique | Method for separating a useful layer and component obtained by said method |
WO2005012160A2 (en) * | 2003-07-04 | 2005-02-10 | Commissariat A L'energie Atomique | Method for separating a useful layer and component obtained by said method |
US20060144816A1 (en) * | 2003-07-04 | 2006-07-06 | Commissariat A L'energie Atomique | Method for separating a useful layer and component obtained by said method |
DE102004006156B4 (en) * | 2003-10-21 | 2007-01-11 | Industrial Technology Research Institute, Chutung | Method of manufacturing a microcapacitive ultrasonic transducer |
US20050146240A1 (en) * | 2003-12-29 | 2005-07-07 | Smith Lowell S. | Micromachined ultrasonic transducer cells having compliant support structure |
US20060125348A1 (en) * | 2003-12-29 | 2006-06-15 | Smith Lowell S | Micromachined ultrasonic transducer cells having compliant support structure |
US7030536B2 (en) | 2003-12-29 | 2006-04-18 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
US7408283B2 (en) | 2003-12-29 | 2008-08-05 | General Electric Company | Micromachined ultrasonic transducer cells having compliant support structure |
US20050219953A1 (en) * | 2004-04-06 | 2005-10-06 | The Board Of Trustees Of The Leland Stanford Junior University | Method and system for operating capacitive membrane ultrasonic transducers |
US20080197751A1 (en) * | 2005-05-18 | 2008-08-21 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducers |
US8952595B2 (en) | 2005-05-18 | 2015-02-10 | Kolo Technologies, Inc. | Micro-electro-mechanical transducers |
US8008105B2 (en) | 2005-05-18 | 2011-08-30 | Kolo Technologies, Inc. | Methods for fabricating micro-electro-mechanical devices |
US20080194053A1 (en) * | 2005-05-18 | 2008-08-14 | Kolo Technologies, Inc. | Methods for Fabricating Micro-Electro-Mechanical Devices |
US8120229B2 (en) | 2005-05-18 | 2012-02-21 | Kolo Technologies, Inc. | Middle spring supported micro-electro-mechanical transducers |
CN101578686B (en) * | 2005-05-18 | 2012-07-18 | 科隆科技公司 | Methods for fabricating micro-electro-mechanical devices |
US8247945B2 (en) | 2005-05-18 | 2012-08-21 | Kolo Technologies, Inc. | Micro-electro-mechanical transducers |
WO2006123299A3 (en) * | 2005-05-18 | 2009-06-04 | Kolo Technologies Inc | Methods for fabricating micro-electro-mechanical devices |
US20090140606A1 (en) * | 2005-05-18 | 2009-06-04 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducers |
WO2006123299A2 (en) * | 2005-05-18 | 2006-11-23 | Kolo Technologies, Inc. | Methods for fabricating micro-electro-mechanical devices |
US9224648B2 (en) | 2005-05-18 | 2015-12-29 | Kolo Technologies, Inc. | Through-wafer interconnection |
US20080203556A1 (en) * | 2005-05-18 | 2008-08-28 | Kolo Technologies, Inc. | Through-Wafer Interconnection |
US8105941B2 (en) | 2005-05-18 | 2012-01-31 | Kolo Technologies, Inc. | Through-wafer interconnection |
US20090020001A1 (en) * | 2005-06-14 | 2009-01-22 | Oliver Nelson H | Digital capacitive membrane transducer |
US8014231B2 (en) * | 2005-06-14 | 2011-09-06 | Siemens Medical Solutions Usa, Inc. | Digital capacitive membrane transducer |
US20080290756A1 (en) * | 2005-06-17 | 2008-11-27 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducer Having an Insulation Extension |
US8796901B2 (en) | 2005-06-17 | 2014-08-05 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an insulation extension |
US20100207489A1 (en) * | 2005-08-03 | 2010-08-19 | Kolo Technologies, Inc. | MEMS Ultrasonic Device Having a PZT and CMUT |
US9327967B2 (en) | 2005-08-03 | 2016-05-03 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an optimized non-flat surface |
US7880565B2 (en) | 2005-08-03 | 2011-02-01 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having a surface plate |
US9676617B2 (en) | 2005-08-03 | 2017-06-13 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an optimized non-flat surface |
US8975984B2 (en) | 2005-08-03 | 2015-03-10 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an optimized non-flat surface |
US20110136284A1 (en) * | 2005-08-03 | 2011-06-09 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducer Having a Surface Plate |
US8004373B2 (en) | 2005-08-03 | 2011-08-23 | Kolo Technologies, Inc. | MEMS ultrasonic device having a PZT and cMUT |
US10029912B2 (en) | 2005-08-03 | 2018-07-24 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an optimized non-flat surface |
US20100013574A1 (en) * | 2005-08-03 | 2010-01-21 | Kolo Technologies, Inc. | Micro-Electro-Mechanical Transducer Having a Surface Plate |
US8018301B2 (en) | 2005-08-03 | 2011-09-13 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having a surface plate |
KR100723909B1 (en) * | 2005-10-13 | 2007-05-31 | 한국표준과학연구원 | Method for a fabrication of capacitive Micromachined Ultrasonic Transducer |
WO2007045208A2 (en) * | 2005-10-19 | 2007-04-26 | Siemens Aktiengesellschaft | Vibration sensor having a micromechanically produced vibration structure |
WO2007045208A3 (en) * | 2005-10-19 | 2007-11-01 | Siemens Ag | Vibration sensor having a micromechanically produced vibration structure |
US20070092982A1 (en) * | 2005-10-21 | 2007-04-26 | Industrial Technolgy Research Institute | Method of fabricating flexible micro-capacitive ultrasonic transducer by the use of imprinting and transfer printing techniques |
US7937834B2 (en) * | 2005-10-28 | 2011-05-10 | Industrial Technology Research Institute | Method of fabricating capacitive ultrasonic transducers |
US20080235936A1 (en) * | 2005-10-28 | 2008-10-02 | Industrial Technology Research Institute | Capacitive Ultrasonic Transducer and Method of Fabricating the Same |
WO2008001252A2 (en) * | 2006-06-29 | 2008-01-03 | Nxp B.V. | Method for manufacturing mems devices with moveable structure |
WO2008001252A3 (en) * | 2006-06-29 | 2008-02-21 | Nxp Bv | Method for manufacturing mems devices with moveable structure |
US8327521B2 (en) | 2007-09-17 | 2012-12-11 | Koninklijke Philips Electronics N.V. | Method for production and using a capacitive micro-machined ultrasonic transducer |
US20100207485A1 (en) * | 2007-09-17 | 2010-08-19 | Koninklijke Philips Electronics N.V. | Production of pre-collapsed capacitive micro-machined ultrasonic transducers and applications thereof |
EP2145696A1 (en) | 2008-07-15 | 2010-01-20 | UAB Minatech | Capacitive micromachined ultrasonic transducer and its fabrication method |
US20100237807A1 (en) * | 2009-03-18 | 2010-09-23 | Lemmerhirt David F | System and method for biasing cmut elements |
US8315125B2 (en) * | 2009-03-18 | 2012-11-20 | Sonetics Ultrasound, Inc. | System and method for biasing CMUT elements |
TWI383130B (en) * | 2009-07-13 | 2013-01-21 | Univ Nat Taiwan | Capacity pressure sensor and method for fabricating thereof |
US8531919B2 (en) | 2009-09-21 | 2013-09-10 | The Hong Kong Polytechnic University | Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance |
US20110068654A1 (en) * | 2009-09-21 | 2011-03-24 | Ching-Hsiang Cheng | Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance |
US9022936B2 (en) | 2011-10-17 | 2015-05-05 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US9028412B2 (en) | 2011-10-17 | 2015-05-12 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US9033884B2 (en) | 2011-10-17 | 2015-05-19 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US9149255B2 (en) | 2011-10-17 | 2015-10-06 | Butterfly Network, Inc. | Image-guided high intensity focused ultrasound and related apparatus and methods |
US9155521B2 (en) | 2011-10-17 | 2015-10-13 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US9198637B2 (en) | 2011-10-17 | 2015-12-01 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US8852103B2 (en) | 2011-10-17 | 2014-10-07 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US9247924B2 (en) | 2011-10-17 | 2016-02-02 | Butterfly Networks, Inc. | Transmissive imaging and related apparatus and methods |
US9268014B2 (en) | 2011-10-17 | 2016-02-23 | Butterfly Network, Inc. | Transmissive imaging and related apparatus and methods |
US9268015B2 (en) | 2011-10-17 | 2016-02-23 | Butterfly Network, Inc. | Image-guided high intensity focused ultrasound and related apparatus and methods |
US20140251014A1 (en) * | 2011-10-28 | 2014-09-11 | Koninklijke Philips N.V. | Pre-collapsed capacitive micro-machined transducer cell with stress layer |
US9534949B2 (en) * | 2011-10-28 | 2017-01-03 | Koninklijke Philips N.V. | Pre-collapsed capacitive micro-machined transducer cell with stress layer |
US9667889B2 (en) | 2013-04-03 | 2017-05-30 | Butterfly Network, Inc. | Portable electronic devices with integrated imaging capabilities |
CN104196650B (en) * | 2014-06-23 | 2016-08-24 | 西北工业大学 | Silica-based MEMS array formula propeller and preparation method thereof |
CN104196650A (en) * | 2014-06-23 | 2014-12-10 | 西北工业大学 | Silicon-based MEMS array propeller and preparation method thereof |
US11147531B2 (en) | 2015-08-12 | 2021-10-19 | Sonetics Ultrasound, Inc. | Method and system for measuring blood pressure using ultrasound by emitting push pulse to a blood vessel |
WO2018026657A1 (en) * | 2016-08-02 | 2018-02-08 | Knowles Electronics, Llc | Mems ultrasonic transducer |
US11612912B2 (en) | 2017-10-19 | 2023-03-28 | Konica Minolta, Inc. | Ultrasound transducer and ultrasound diagnostic apparatus |
US11376628B2 (en) * | 2018-09-05 | 2022-07-05 | Hitachi, Ltd. | Capacitive device and piezoelectric device |
US20210370449A1 (en) * | 2020-05-28 | 2021-12-02 | Toyota Motor Engineering And Manufacturing North America, Inc. | Method of fabricating a microscale canopy wick structure having enhanced capillary pressure and permeability |
US11712766B2 (en) * | 2020-05-28 | 2023-08-01 | Toyota Motor Engineering And Manufacturing North America, Inc. | Method of fabricating a microscale canopy wick structure having enhanced capillary pressure and permeability |
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