US6091255A - System and method for tasking processing modules based upon temperature - Google Patents
System and method for tasking processing modules based upon temperature Download PDFInfo
- Publication number
- US6091255A US6091255A US09/074,786 US7478698A US6091255A US 6091255 A US6091255 A US 6091255A US 7478698 A US7478698 A US 7478698A US 6091255 A US6091255 A US 6091255A
- Authority
- US
- United States
- Prior art keywords
- temperature
- integrated circuit
- chip
- circuit
- thermometers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal
Definitions
- This invention relates to integrated circuits in general and, more particularly, to an on-chip thermometer and methods for using the on-chip thermometer to measure a local temperature on an integrated circuit and to operate the integrated circuit in response to received measurements.
- ICs integrated circuits
- chip manufacturers are able to place up to ten million transistors on a single integrated circuit or monolithic substrate. It is anticipated that within several years chip makers will be able to place one billion transistors on a single chip.
- computer systems are evolving toward comprising a handful of computer chips, where each computer chip comprises a plurality of functions.
- the integration of a plurality of modules or functions on a single computer chip requires improved chip architectures. Due to the shorter distances and tighter integration of components on a chip, the operating temperatures of new data transfer architectures are increasing. As the operating temperatures of a chip increase, the lifetime for that chip tend to decrease due to permanent migration of charge carriers. Therefore an improved system and method of operation are necessary to assure that integrated circuits are operated at proper temperatures even when multiple processing modules are present on the integrated circuit.
- the on-chip thermometer comprises a clock circuit, a temperature responsive circuit, and a counter.
- the clock circuit operates at a fixed frequency and generates a clock signal at the fixed frequency.
- the temperature responsive circuit couples to the clock circuit and receives the clock signal from the clock circuit.
- the temperature responsive circuit In response to receiving an enable signal, the temperature responsive circuit generates an output signal.
- the counter is coupled to receive the output signal from the temperature responsive circuit. The counter then generates a value indicative of a local temperature of the integrated circuit.
- the temperature responsive circuit is a ring oscillator, and the temperature responsive circuit generates an oscillating signal in response to receiving the clock signal.
- the oscillating signal comprises a plurality of oscillations dependent on a local temperature of the integrated circuit. The oscillations are counted to generate a value indicative of the local temperature.
- a task delegation module is coupled to each of the plurality of on-chip thermometers and the plurality of processing modules.
- Each of the plurality of on-chip thermometers is operable to generate a value indicative of a local temperature of the integrated circuit.
- the task delegation module receives output values from each of the plurality of on-chip thermometers and assigns processing tasks to each of the plurality of processing modules based on the local temperatures at each respective location.
- the on-chip thermometer may include a temperature dependent response curve in a constant, linear, logarithmic or other shape.
- the curve may vary until a threshold temperature is reached at an upper end of the temperature dependent response curve. Decisions based on local temperatures are dependent upon the temperature threshold being reached or surpassed.
- a method of operating an integrated circuit including a plurality of processing modules located at respective locations and a plurality of on-chip thermometers, with one of the on-chip thermometers located proximate to each of the plurality of processing modules, comprises each of these thermometers generating an output signal indicative of the local temperature.
- a task delegation module receives the outputs from each of the plurality of on-chip thermometers.
- the task delegation module determines a local temperature for each of the plurality of processing modules.
- the task delegation module assigns processing tasks to each of the plurality of processing modules based on the local temperatures.
- the task delegation module may assign a new task to a processing module with a lowest local temperature.
- the task delegation module may also reassign a processing task from a processing module with a higher temperature to a processing module with a lower temperature or a temperature below the temperature threshold.
- FIG. 1 illustrates a perspective view of an integrated circuit
- FIG. 2 illustrates an embodiment of a thermometer comprised of a temperature indicating circuit, according to the present invention
- FIGS. 3A and 3B illustrate embodiments of the temperature indicating circuit shown in FIG. 2, according to the present invention
- FIG. 4 illustrates an embodiment of the integrated circuit shown in FIG. 1, according to the present invention
- FIG. 5 illustrates an embodiment of a flow chart of a method for indicating a local temperature
- FIG. 6 illustrates an embodiment of a flow chart of a method for operating the integrated circuit of FIG. 1 with local heating and temperatures, according to the present invention.
- the present invention comprises an on-chip thermometer and methods for measuring a local temperature on an integrated circuit and operating the integrated circuit in response to received measurements.
- FIG. 1 shows a computer chip 100 from a perspective view.
- Computer chip 100 preferably comprises a monolithic silicon substrate comprising a plurality of transistors.
- the computer chip 100 may also use gallium arsenide (GaAs) or another suitable semiconductor material; the computer chip 100 may also use optical transmission.
- GaAs gallium arsenide
- PGA ceramic socket mount pin grid array
- the computer chip 100 may be packaged in any of various ways, including as a surface mount, socket mount, or insertion/socket mount.
- Materials used in the packaging of computer chip 100 may include ceramic packages, leadless chip carrier packages (LCC), glass-sealed packages, or plastic packages.
- Chip package for computer chip 100 may include, ceramic quad flatpack (CQFP), PGA, ceramic dual in-line package (C-DIP), LCC socket or surface mount, ceramic dual in-line package (CERDIP), ceramic quadpack (CERQUAD), small outline package gull wing (SOP), small outline package J-lead (SOJ), thin small outline package (TSOP) etc. and may have any of various types of connectivity including pin grid array (PGA), ball grid array (BGA), direct chip attach (DCA), metal bands or pins etc. Also usable is the controlled collapse chip connection (C4) method, commonly known as the "flip chip” method.
- CQFP ceramic quad flatpack
- C-DIP ceramic dual in-line package
- CERDIP ceramic dual in-line package
- CERDIP ceramic quadpack
- SOP small outline package gull wing
- SOJ small outline package J-lead
- TSOP thin small outline package
- C4 method commonly known as the "flip chip” method.
- thermometer 200 comprised on the integrated circuit 100 of FIG. 1 is given in FIG. 2.
- a clock 210 also called a clock circuit, is coupled to a temperature responsive circuit 220, or temperature sensor, and a counter 230.
- the temperature sensor 220 is also coupled to the counter 230.
- the counter 230 is optionally coupled to one or more registers 240.
- the clock 210 operates at and generates a clock signal at a given frequency.
- the operation of the clock circuit 210 is preferably temperature independent, that is, changes in temperature do not change the frequency of the clock 210.
- the clock signal is output to the counter 230 and the temperature responsive circuit 220.
- the temperature responsive circuit 220 Upon receiving an enable signal 215, the temperature responsive circuit 220 generates an output signal and sends the output signal to the counter 230.
- the counter 230 receives the output signal from the temperature sensor 220 and generates a value indicative of the local temperature of the integrated circuit 100.
- the counter 230 may optionally output the value indicative of the local temperature of the integrated circuit 100 to a register 240. Additional information, such as raw input/output values or time values, may also be output to registers 240.
- the on-chip thermometer 200 of FIG. 2 is located at a first location on the integrated circuit 100 and generates a value indicative of a temperature of the integrated circuit 100 at the first location.
- the integrated circuit 100 may include a plurality of on-chip thermometers 200. Each thermometer 200 of the plurality of on-chip thermometers 200 generates a value indicative of the local temperature at the respective location for each of the thermometers 200. Values indicative of local temperatures may be calibrated values on standard temperature scales, such as kelvin, or may be uncalibrated raw values, as desired.
- the temperature responsive circuit 220 of the on-chip to thermometer 200 may be any circuit or device which outputs a signal which varies according to temperature or change in temperature. Such circuits or devices include temperature sensors and temperature transducers, including but not limited to thermistors, thermocouples, resistance temperature detectors, radiation thermometers/pyrometers and semiconductor devices which inherently measure or indicate temperatures or changes in temperatures, as well as circuits which simply react to temperature or changes in temperature.
- the temperature responsive circuit 220 is contemplated as being integrated into the semiconductor integrated circuit 100, but the temperature responsive circuit 220 may also be physically separate from the integrated circuit 100 and only coupled to the integrated circuit 100 at desired locations.
- the preferred embodiment of the temperature sensor 220 is shown in FIG. 3A, a ring oscillator 220A comprised of a plurality of connected logic inverters 310A-310E, preferably an odd plurality. An enable signal activates the ring oscilator.
- FIG. 3B Another embodiment of temperature sensor 220 is shown in FIG. 3B, a delay chain 220B comprised of logic inverters 310A-310Z, registers 320, and a control module 330.
- CLK clock signal
- the inverters 310 change state and pass the clock signal along to the next inverter 310.
- the clock signal is passed down the chain of inverters 310.
- the current state of the inverters 310 is passed to registers 320.
- a control module 330 latches the contents of the registers 320 and resets the registers 320.
- Control module 330 operates to determine changes in the number of inverters that change state between any two clock cycles.
- the shape of the curve representing the output signal of the temperature responsive circuit 220 as a function of temperature may be linear, logarithmic, or other shape.
- the curve may also be constant until a threshold temperature is reached before changing with temperature.
- the threshold temperature represents an upper limit to the region of constant value as a function of temperature.
- an integrated circuit 100 comprising a plurality of processing modules 120, a plurality of on-chip thermometers 200, and a task delegation module 130 coupled to each of the on-chip thermometers 200 and the processing modules 120.
- Each of the plurality of processing modules 120 is located at a respective location in the integrated circuit 100.
- Each of the plurality of on-chip thermometers 200 is located proximate to one of the processing modules 120.
- Each of the on-chip thermometers 200 is also operable to generate a value indicative of a local temperature of the integrated circuit 100 at its location.
- the task delegation module 130 is operable to receive the output signals from each of the on-chip thermometers 200, as shown at 420.
- the task delegation module 130 determines a local temperature for each of the processing modules 120 and operates to assign processing tasks, both continuing and new, to each one of the plurality of processing modules 120 based on the local temperatures, as shown at 410.
- the on-chip thermometers 200 are each comprised of one or more circuits which operate at a given speed. The speed of at least one of the circuits in each thermometer changes as the circuits are exposed to changes in local temperature.
- each of the on-chip thermometers includes a clock 210 coupled to a temperature responsive circuit 220, and a counter 230.
- the temperature responsive circuit 220 is also coupled to the counter 230.
- the counter 230 is optionally coupled to one or more registers 240.
- the temperature responsive circuit 220 is preferably a ring oscillator, but it is contemplated that other circuits may be used, as shown in FIG. 3B.
- Desirable properties of the temperature responsive circuit 220 may include an operating speed that is substantially constant over an operating temperature range, with the operating speed slowing as the local temperature increases beyond the threshold, or upper limit, of the operating temperature range.
- any temperature sensing device may also be used, as noted above.
- FIG. 5 illustrates an embodiment of a flowchart describing a method of measuring a local temperature.
- the method comprises the following. First, generating a clock signal 510. Next, the method provides the clock signal to the temperature responsive circuit 520. The temperature responsive circuit generates a signal in response to receiving the clock signal 530. The method then counts the response signal from the temperature responsive circuit 540. The method next compares the rate or frequency of the clock signal to the response signal from the temperature responsive circuit 550. Finally, the method indicates a local temperature based on the comparison between the clock signal and the response signal from the temperature responsive circuit 560.
- the clock signal is counted in parallel with the response signal from the temperature responsive circuit. In another embodiment, counting the clock signal while counting the output signal indicates the local temperature.
- the output signal may be an oscillating signal from a ring oscillator 220A. Signals from other embodiments of the temperature responsive circuit 220 are contemplated.
- thermometers each indicate a respective local temperature 610.
- a control unit receives the respective local temperature indications 620.
- the control unit next determines relative local temperatures and changes in relative local temperatures 630.
- the control unit also determines that a new task is ready for assignment to one or more processors at locations with respective local temperatures 640.
- the control unit assigns the new task to one or more processors based on the respective local temperatures 650.
- the control unit also re-assigns an existing process to the processor with a lowest respective local temperature from a processor with a higher respective local temperature 660.
- the present invention comprises an on-chip thermometer and methods for using the on-chip thermometer.
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/074,786 US6091255A (en) | 1998-05-08 | 1998-05-08 | System and method for tasking processing modules based upon temperature |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/074,786 US6091255A (en) | 1998-05-08 | 1998-05-08 | System and method for tasking processing modules based upon temperature |
Publications (1)
Publication Number | Publication Date |
---|---|
US6091255A true US6091255A (en) | 2000-07-18 |
Family
ID=22121685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/074,786 Expired - Lifetime US6091255A (en) | 1998-05-08 | 1998-05-08 | System and method for tasking processing modules based upon temperature |
Country Status (1)
Country | Link |
---|---|
US (1) | US6091255A (en) |
Cited By (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6217211B1 (en) * | 1998-01-27 | 2001-04-17 | Michael Hesky Gmbh | Temperature measuring and monitoring |
US6321175B1 (en) * | 1998-12-21 | 2001-11-20 | Intel Corporation | Thermal sensing of multiple integrated circuits |
US20020019949A1 (en) * | 2000-07-24 | 2002-02-14 | Hewlett-Packard Company | Voltage regulation in an integrated circuit |
US20020087903A1 (en) * | 2000-12-29 | 2002-07-04 | James Hermerding | Mechanism for managing power generated in a computer system |
US20030097603A1 (en) * | 2001-11-16 | 2003-05-22 | Athas William C. | Method and apparatus for increasing the operating frequency of an electronic circuit |
US20030126478A1 (en) * | 2001-12-28 | 2003-07-03 | Burns James S. | Multiple mode power throttle mechanism |
US20030126479A1 (en) * | 2001-12-28 | 2003-07-03 | Burns James S. | Digital throttle for multiple operating points |
US6676289B2 (en) * | 2000-08-22 | 2004-01-13 | Kabushiki Kaisha Toshiba | Temperature measuring method in pattern drawing apparatus |
US20040017234A1 (en) * | 2002-07-26 | 2004-01-29 | Tam Simon M. | VCC adaptive dynamically variable frequency clock system for high performance low power microprocessors |
US20040037346A1 (en) * | 2002-08-23 | 2004-02-26 | Stefan Rusu | Apparatus for thermal management of multiple core microprocessors |
US20040066837A1 (en) * | 2002-10-04 | 2004-04-08 | Armour Joshua W. | Method and apparatus for providing accurate junction temperature in an integrated circuit |
US20040128663A1 (en) * | 2002-12-31 | 2004-07-01 | Efraim Rotem | Method and apparatus for thermally managed resource allocation |
US20040128101A1 (en) * | 2002-12-30 | 2004-07-01 | Hermerding James G. | Automated method and apparatus for processor thermal validation |
US6774653B2 (en) * | 2001-08-22 | 2004-08-10 | Sun Microsystems, Inc. | Two-pin thermal sensor calibration interface |
US6874933B1 (en) * | 2002-10-15 | 2005-04-05 | National Semiconductor Corporation | Apparatus for digital temperature measurement in an integrated circuit |
US20050097554A1 (en) * | 2003-11-03 | 2005-05-05 | Burden David C. | Charge rationing aware scheduler |
US20050099163A1 (en) * | 2003-11-08 | 2005-05-12 | Andigilog, Inc. | Temperature manager |
US20050132239A1 (en) * | 2003-12-16 | 2005-06-16 | Athas William C. | Almost-symmetric multiprocessor that supports high-performance and energy-efficient execution |
US20050140385A1 (en) * | 2003-12-26 | 2005-06-30 | Hon Hai Precision Industry Co., Ltd. | System and method for testing and recording temperatures of a CPU |
US6933739B1 (en) * | 2003-05-23 | 2005-08-23 | Marvell Semiconductor Israel Ltd. | Ring oscillator system |
US20050278520A1 (en) * | 2002-04-03 | 2005-12-15 | Fujitsu Limited | Task scheduling apparatus in distributed processing system |
US20060090086A1 (en) * | 2004-10-27 | 2006-04-27 | Efraim Rotem | Method and apparatus to monitor power consumption of processor |
US20060095913A1 (en) * | 2004-11-03 | 2006-05-04 | Intel Corporation | Temperature-based thread scheduling |
US20060136074A1 (en) * | 2004-12-22 | 2006-06-22 | Susumi Arai | Thermal management of a multi-processor computer system |
US7078955B2 (en) | 2003-07-04 | 2006-07-18 | Samsung Electronics Co., Ltd. | Temperature sensing circuit and method |
US20060178857A1 (en) * | 2005-02-10 | 2006-08-10 | Barajas Leandro G | Quasi-redundant smart sensing topology |
US7138813B2 (en) | 1999-06-30 | 2006-11-21 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US20070061603A1 (en) * | 2001-11-16 | 2007-03-15 | Cox Keith A | Method and apparatus for selectively increasing the operating speed of an electronic circuit |
US20070064768A1 (en) * | 2005-09-16 | 2007-03-22 | Taylor John P | Apparatus and method for determining a temperature of a temperature sensing element |
US20070081575A1 (en) * | 2005-10-07 | 2007-04-12 | Advanced Micro Devices, Inc. | Method and apparatus for temperature sensing in integrated circuits |
EP1783608A1 (en) * | 2004-06-22 | 2007-05-09 | Sony Computer Entertainment Inc. | Processor, information processor and control method of processor |
US20070150225A1 (en) * | 2003-06-26 | 2007-06-28 | Boerstler David W | Thermal sensing method and system |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
WO2008043861A1 (en) | 2006-10-09 | 2008-04-17 | Incide, S.A. | Wireless temperature sensor |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
US7480588B1 (en) * | 2006-04-19 | 2009-01-20 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7681312B2 (en) | 1998-07-14 | 2010-03-23 | Cascade Microtech, Inc. | Membrane probing system |
US20100073068A1 (en) * | 2008-09-22 | 2010-03-25 | Hanwoo Cho | Functional block level thermal control |
US7688062B2 (en) | 2000-09-05 | 2010-03-30 | Cascade Microtech, Inc. | Probe station |
US7688097B2 (en) | 2000-12-04 | 2010-03-30 | Cascade Microtech, Inc. | Wafer probe |
US7688091B2 (en) | 2003-12-24 | 2010-03-30 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US7720627B1 (en) | 2006-04-19 | 2010-05-18 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7750652B2 (en) | 2006-06-12 | 2010-07-06 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7759953B2 (en) | 2003-12-24 | 2010-07-20 | Cascade Microtech, Inc. | Active wafer probe |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7831873B1 (en) * | 2007-03-07 | 2010-11-09 | Xilinx, Inc. | Method and apparatus for detecting sudden temperature/voltage changes in integrated circuits |
US7857510B2 (en) | 2003-11-08 | 2010-12-28 | Carl F Liepold | Temperature sensing circuit |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US7893704B2 (en) | 1996-08-08 | 2011-02-22 | Cascade Microtech, Inc. | Membrane probing structure with laterally scrubbing contacts |
US7898281B2 (en) | 2005-01-31 | 2011-03-01 | Cascade Mircotech, Inc. | Interface for testing semiconductors |
US7898273B2 (en) | 2003-05-23 | 2011-03-01 | Cascade Microtech, Inc. | Probe for testing a device under test |
US7969173B2 (en) | 2000-09-05 | 2011-06-28 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US8069491B2 (en) | 2003-10-22 | 2011-11-29 | Cascade Microtech, Inc. | Probe testing structure |
EP1615134A3 (en) * | 2004-07-05 | 2011-11-30 | Sony Corporation | System and method for distributing processing among a plurality of processors based on information regarding the temperature of each processor |
US20120039041A1 (en) * | 2009-05-22 | 2012-02-16 | Mowry Anthony C | Heat management using power management information |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US20130169347A1 (en) * | 2012-01-04 | 2013-07-04 | Samsung Electronics Co., Ltd. | Temperature Management Circuit, System on Chip Including the Same and Method of Managing Temperature |
US9075585B2 (en) | 2010-08-06 | 2015-07-07 | International Business Machines Corporation | Initializing components of an integrated circuit |
WO2015126541A1 (en) * | 2014-02-19 | 2015-08-27 | The Boeing Company | Electronics operation for temperature controlled systems |
US9194754B2 (en) | 2014-03-28 | 2015-11-24 | Darryl G. Walker | Power up of semiconductor device having a temperature circuit and method therefor |
KR20160024581A (en) * | 2014-08-26 | 2016-03-07 | 삼성전자주식회사 | Clock monitor and system on chip including the same |
US9286991B1 (en) | 2015-02-17 | 2016-03-15 | Darryl G. Walker | Multi-chip non-volatile semiconductor memory package including heater and sensor elements |
US20160148905A1 (en) * | 2014-11-20 | 2016-05-26 | Ki Hun YU | Semiconductor chip for sensing temperature and semiconductor system including the same |
CN105652916A (en) * | 2016-01-06 | 2016-06-08 | 京东方科技集团股份有限公司 | Processor temperature control circuit |
US20160216719A1 (en) * | 2015-01-22 | 2016-07-28 | Qualcomm, Incorporated | Systems and methods for detecting thermal runaway |
US9645191B2 (en) | 2014-08-20 | 2017-05-09 | Darryl G. Walker | Testing and setting performance parameters in a semiconductor device and method therefor |
CN113551793A (en) * | 2021-08-18 | 2021-10-26 | 联芸科技(杭州)有限公司 | Temperature detection circuit |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5406212A (en) * | 1991-07-19 | 1995-04-11 | Sumitomo Electric Industries, Ltd. | Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors |
US5473259A (en) * | 1993-12-29 | 1995-12-05 | Nec Corporation | Semiconductor device tester capable of simultaneously testing a plurality of integrated circuits at the same temperature |
US5513235A (en) * | 1993-02-05 | 1996-04-30 | Dallas Semiconductor Corporation | Integrated circuit thermometer |
-
1998
- 1998-05-08 US US09/074,786 patent/US6091255A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5406212A (en) * | 1991-07-19 | 1995-04-11 | Sumitomo Electric Industries, Ltd. | Burn-in apparatus and method for self-heating semiconductor devices having built-in temperature sensors |
US5513235A (en) * | 1993-02-05 | 1996-04-30 | Dallas Semiconductor Corporation | Integrated circuit thermometer |
US5473259A (en) * | 1993-12-29 | 1995-12-05 | Nec Corporation | Semiconductor device tester capable of simultaneously testing a plurality of integrated circuits at the same temperature |
Cited By (150)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7893704B2 (en) | 1996-08-08 | 2011-02-22 | Cascade Microtech, Inc. | Membrane probing structure with laterally scrubbing contacts |
US6217211B1 (en) * | 1998-01-27 | 2001-04-17 | Michael Hesky Gmbh | Temperature measuring and monitoring |
US7681312B2 (en) | 1998-07-14 | 2010-03-23 | Cascade Microtech, Inc. | Membrane probing system |
US7761986B2 (en) | 1998-07-14 | 2010-07-27 | Cascade Microtech, Inc. | Membrane probing method using improved contact |
US8451017B2 (en) | 1998-07-14 | 2013-05-28 | Cascade Microtech, Inc. | Membrane probing method using improved contact |
US6321175B1 (en) * | 1998-12-21 | 2001-11-20 | Intel Corporation | Thermal sensing of multiple integrated circuits |
US7138813B2 (en) | 1999-06-30 | 2006-11-21 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
US20020019949A1 (en) * | 2000-07-24 | 2002-02-14 | Hewlett-Packard Company | Voltage regulation in an integrated circuit |
US7062663B2 (en) * | 2000-07-24 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | Voltage regulation in an integrated circuit |
US6676289B2 (en) * | 2000-08-22 | 2004-01-13 | Kabushiki Kaisha Toshiba | Temperature measuring method in pattern drawing apparatus |
US7688062B2 (en) | 2000-09-05 | 2010-03-30 | Cascade Microtech, Inc. | Probe station |
US7969173B2 (en) | 2000-09-05 | 2011-06-28 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7761983B2 (en) | 2000-12-04 | 2010-07-27 | Cascade Microtech, Inc. | Method of assembling a wafer probe |
US7688097B2 (en) | 2000-12-04 | 2010-03-30 | Cascade Microtech, Inc. | Wafer probe |
US20020087903A1 (en) * | 2000-12-29 | 2002-07-04 | James Hermerding | Mechanism for managing power generated in a computer system |
US7492175B2 (en) | 2001-08-21 | 2009-02-17 | Cascade Microtech, Inc. | Membrane probing system |
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US6774653B2 (en) * | 2001-08-22 | 2004-08-10 | Sun Microsystems, Inc. | Two-pin thermal sensor calibration interface |
US20050060589A1 (en) * | 2001-11-16 | 2005-03-17 | Athas William C. | Method and apparatus for increasing the operating frequency of an electronic circuit |
US7340622B2 (en) | 2001-11-16 | 2008-03-04 | Apple Inc. | Method and apparatus for selectively increasing the operating speed of an electronic circuit |
US6813719B2 (en) * | 2001-11-16 | 2004-11-02 | Apple Computer, Inc. | Method and apparatus for increasing the operating frequency of an electronic circuit |
US20030097603A1 (en) * | 2001-11-16 | 2003-05-22 | Athas William C. | Method and apparatus for increasing the operating frequency of an electronic circuit |
US20070061603A1 (en) * | 2001-11-16 | 2007-03-15 | Cox Keith A | Method and apparatus for selectively increasing the operating speed of an electronic circuit |
US7689846B1 (en) | 2001-11-16 | 2010-03-30 | Apple Inc. | Method and apparatus for increasing the operating frequency of an electronic circuit |
US6966008B2 (en) | 2001-11-16 | 2005-11-15 | Apple Computer, Inc. | Method and apparatus for increasing the operating frequency of an electronic circuit |
US7281140B2 (en) | 2001-12-28 | 2007-10-09 | Intel Corporation | Digital throttle for multiple operating points |
US20030126479A1 (en) * | 2001-12-28 | 2003-07-03 | Burns James S. | Digital throttle for multiple operating points |
US6931559B2 (en) | 2001-12-28 | 2005-08-16 | Intel Corporation | Multiple mode power throttle mechanism |
US20030126478A1 (en) * | 2001-12-28 | 2003-07-03 | Burns James S. | Multiple mode power throttle mechanism |
US20050278520A1 (en) * | 2002-04-03 | 2005-12-15 | Fujitsu Limited | Task scheduling apparatus in distributed processing system |
US20040017234A1 (en) * | 2002-07-26 | 2004-01-29 | Tam Simon M. | VCC adaptive dynamically variable frequency clock system for high performance low power microprocessors |
US6762629B2 (en) | 2002-07-26 | 2004-07-13 | Intel Corporation | VCC adaptive dynamically variable frequency clock system for high performance low power microprocessors |
US7144152B2 (en) * | 2002-08-23 | 2006-12-05 | Intel Corporation | Apparatus for thermal management of multiple core microprocessors |
EP1552367B1 (en) * | 2002-08-23 | 2019-01-09 | Sony Corporation of America | An apparatus for thermal management of multiple core microprocessors |
US6908227B2 (en) * | 2002-08-23 | 2005-06-21 | Intel Corporation | Apparatus for thermal management of multiple core microprocessors |
US20050180488A1 (en) * | 2002-08-23 | 2005-08-18 | Stefan Rusu | Apparatus for thermal management of multiple core microprocessors |
US20040037346A1 (en) * | 2002-08-23 | 2004-02-26 | Stefan Rusu | Apparatus for thermal management of multiple core microprocessors |
US20040066837A1 (en) * | 2002-10-04 | 2004-04-08 | Armour Joshua W. | Method and apparatus for providing accurate junction temperature in an integrated circuit |
US6874933B1 (en) * | 2002-10-15 | 2005-04-05 | National Semiconductor Corporation | Apparatus for digital temperature measurement in an integrated circuit |
US20040128101A1 (en) * | 2002-12-30 | 2004-07-01 | Hermerding James G. | Automated method and apparatus for processor thermal validation |
US7275012B2 (en) | 2002-12-30 | 2007-09-25 | Intel Corporation | Automated method and apparatus for processor thermal validation |
US20040128663A1 (en) * | 2002-12-31 | 2004-07-01 | Efraim Rotem | Method and apparatus for thermally managed resource allocation |
US7876115B2 (en) | 2003-05-23 | 2011-01-25 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7898273B2 (en) | 2003-05-23 | 2011-03-01 | Cascade Microtech, Inc. | Probe for testing a device under test |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US6933739B1 (en) * | 2003-05-23 | 2005-08-23 | Marvell Semiconductor Israel Ltd. | Ring oscillator system |
US7358755B1 (en) | 2003-05-23 | 2008-04-15 | Marvell Semiconductor Israel Ltd. | Ring oscillator system |
US20070150225A1 (en) * | 2003-06-26 | 2007-06-28 | Boerstler David W | Thermal sensing method and system |
US7078955B2 (en) | 2003-07-04 | 2006-07-18 | Samsung Electronics Co., Ltd. | Temperature sensing circuit and method |
US8069491B2 (en) | 2003-10-22 | 2011-11-29 | Cascade Microtech, Inc. | Probe testing structure |
US20050097554A1 (en) * | 2003-11-03 | 2005-05-05 | Burden David C. | Charge rationing aware scheduler |
US7857510B2 (en) | 2003-11-08 | 2010-12-28 | Carl F Liepold | Temperature sensing circuit |
US20050099163A1 (en) * | 2003-11-08 | 2005-05-12 | Andigilog, Inc. | Temperature manager |
US20050132239A1 (en) * | 2003-12-16 | 2005-06-16 | Athas William C. | Almost-symmetric multiprocessor that supports high-performance and energy-efficient execution |
US7759953B2 (en) | 2003-12-24 | 2010-07-20 | Cascade Microtech, Inc. | Active wafer probe |
US7688091B2 (en) | 2003-12-24 | 2010-03-30 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US6987399B2 (en) * | 2003-12-26 | 2006-01-17 | Hon Hai Precision Industry Co., Ltd. | Systems and method for testing and recording temperatures of a CPU |
US20050140385A1 (en) * | 2003-12-26 | 2005-06-30 | Hon Hai Precision Industry Co., Ltd. | System and method for testing and recording temperatures of a CPU |
US20070143763A1 (en) * | 2004-06-22 | 2007-06-21 | Sony Computer Entertainment Inc. | Processor for controlling performance in accordance with a chip temperature, information processing apparatus, and mehtod of controlling processor |
US7831842B2 (en) | 2004-06-22 | 2010-11-09 | Sony Computer Entertainment Inc. | Processor for controlling performance in accordance with a chip temperature, information processing apparatus, and method of controlling processor |
EP1783608A4 (en) * | 2004-06-22 | 2010-09-08 | Sony Computer Entertainment Inc | Processor, information processor and control method of processor |
EP1783608A1 (en) * | 2004-06-22 | 2007-05-09 | Sony Computer Entertainment Inc. | Processor, information processor and control method of processor |
EP1615134A3 (en) * | 2004-07-05 | 2011-11-30 | Sony Corporation | System and method for distributing processing among a plurality of processors based on information regarding the temperature of each processor |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
US8013623B2 (en) | 2004-09-13 | 2011-09-06 | Cascade Microtech, Inc. | Double sided probing structures |
US7430672B2 (en) * | 2004-10-27 | 2008-09-30 | Intel Corporation | Method and apparatus to monitor power consumption of processor |
US20060090086A1 (en) * | 2004-10-27 | 2006-04-27 | Efraim Rotem | Method and apparatus to monitor power consumption of processor |
US9063785B2 (en) * | 2004-11-03 | 2015-06-23 | Intel Corporation | Temperature-based thread scheduling |
US20060095913A1 (en) * | 2004-11-03 | 2006-05-04 | Intel Corporation | Temperature-based thread scheduling |
US7793291B2 (en) * | 2004-12-22 | 2010-09-07 | International Business Machines Corporation | Thermal management of a multi-processor computer system |
US20060136074A1 (en) * | 2004-12-22 | 2006-06-22 | Susumi Arai | Thermal management of a multi-processor computer system |
US7898281B2 (en) | 2005-01-31 | 2011-03-01 | Cascade Mircotech, Inc. | Interface for testing semiconductors |
US7940069B2 (en) | 2005-01-31 | 2011-05-10 | Cascade Microtech, Inc. | System for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US20060178857A1 (en) * | 2005-02-10 | 2006-08-10 | Barajas Leandro G | Quasi-redundant smart sensing topology |
US20070064768A1 (en) * | 2005-09-16 | 2007-03-22 | Taylor John P | Apparatus and method for determining a temperature of a temperature sensing element |
US8032323B2 (en) | 2005-09-16 | 2011-10-04 | Kyocera Corporation | Apparatus and method for determining a temperature of a temperature sensing element |
US7413343B2 (en) * | 2005-09-16 | 2008-08-19 | Kyocera Wireless Corp. | Apparatus for determining a temperature sensing element |
US20090281760A1 (en) * | 2005-09-16 | 2009-11-12 | Taylor John Philip | Apparatus and method for determining a temperature of a temperature sensing element |
US20070081575A1 (en) * | 2005-10-07 | 2007-04-12 | Advanced Micro Devices, Inc. | Method and apparatus for temperature sensing in integrated circuits |
WO2007044133A1 (en) * | 2005-10-07 | 2007-04-19 | Advanced Micro Devices, Inc. | Temperature sensing in integrated circuits |
US7455450B2 (en) | 2005-10-07 | 2008-11-25 | Advanced Micro Devices, Inc. | Method and apparatus for temperature sensing in integrated circuits |
US8049145B1 (en) | 2006-04-19 | 2011-11-01 | Agerson Rall Group, L.L.C. | Semiconductor device having variable parameter selection based on temperature and test method |
US8005641B2 (en) | 2006-04-19 | 2011-08-23 | Agersonn Rall Group, L.L.C. | Temperature sensing circuit with hysteresis and time delay |
US20110037138A1 (en) * | 2006-04-19 | 2011-02-17 | Walker Darryl G | Semiconductor Device having variable parameter selection based on temperature and test method |
US10656028B2 (en) | 2006-04-19 | 2020-05-19 | Samsung Electronics Co., Ltd. | Semiconductor device having variable parameter selection based on temperature and test method |
US20110046912A1 (en) * | 2006-04-19 | 2011-02-24 | Walker Darryl G | Semiconductor Device having variable parameter selection based on temperature and test method |
US20110044119A1 (en) * | 2006-04-19 | 2011-02-24 | Walker Darryl G | Semiconductor Device having variable parameter selection based on temperature and test method |
US20110044372A1 (en) * | 2006-04-19 | 2011-02-24 | Walker Darryl G | Semiconductor Device having variable parameter selection based on temperature and test method |
US20110044118A1 (en) * | 2006-04-19 | 2011-02-24 | Walker Darryl G | Semiconductor Device having variable parameter selection based on temperature and test method |
US7535786B1 (en) | 2006-04-19 | 2009-05-19 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7480588B1 (en) * | 2006-04-19 | 2009-01-20 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7603249B1 (en) | 2006-04-19 | 2009-10-13 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7953573B2 (en) | 2006-04-19 | 2011-05-31 | Agersonn Rall Group, L.L.C. | Semiconductor device having variable parameter selection based on temperature and test method |
US8497453B2 (en) | 2006-04-19 | 2013-07-30 | Intellectual Ventures Holding 83 LLC | Semiconductor device having variable parameter selection based on temperature |
US9766135B2 (en) | 2006-04-19 | 2017-09-19 | Nytell Software LLC | Semiconductor device having variable parameter selection based on temperature and test method |
US8308359B2 (en) | 2006-04-19 | 2012-11-13 | Intellectual Ventures Holding 83 LLC | Semiconductor device having variable parameter selection based on temperature and test method |
US8081532B2 (en) | 2006-04-19 | 2011-12-20 | Intellectual Ventures Holding 83 LLC | Semiconductor device having variable parameter selection based on temperature and test method |
US8040742B2 (en) | 2006-04-19 | 2011-10-18 | Agersonn Rall Group, L.L.C. | Semiconductor device having variable parameter selection based on temperature and test method |
US7760570B1 (en) | 2006-04-19 | 2010-07-20 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7720627B1 (en) | 2006-04-19 | 2010-05-18 | Darryl Walker | Semiconductor device having variable parameter selection based on temperature and test method |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7750652B2 (en) | 2006-06-12 | 2010-07-06 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
WO2008043861A1 (en) | 2006-10-09 | 2008-04-17 | Incide, S.A. | Wireless temperature sensor |
EP2083254A4 (en) * | 2006-10-09 | 2013-04-03 | Incide S A | Wireless temperature sensor |
EP2083254A1 (en) * | 2006-10-09 | 2009-07-29 | Incide, S.a. | Wireless temperature sensor |
US7831873B1 (en) * | 2007-03-07 | 2010-11-09 | Xilinx, Inc. | Method and apparatus for detecting sudden temperature/voltage changes in integrated circuits |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US20100073068A1 (en) * | 2008-09-22 | 2010-03-25 | Hanwoo Cho | Functional block level thermal control |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US10267848B2 (en) | 2008-11-21 | 2019-04-23 | Formfactor Beaverton, Inc. | Method of electrically contacting a bond pad of a device under test with a probe |
US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US9429638B2 (en) | 2008-11-21 | 2016-08-30 | Cascade Microtech, Inc. | Method of replacing an existing contact of a wafer probing assembly |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
US8665592B2 (en) * | 2009-05-22 | 2014-03-04 | Advanced Micro Devices, Inc. | Heat management using power management information |
US20120039041A1 (en) * | 2009-05-22 | 2012-02-16 | Mowry Anthony C | Heat management using power management information |
US9075585B2 (en) | 2010-08-06 | 2015-07-07 | International Business Machines Corporation | Initializing components of an integrated circuit |
US9484930B2 (en) | 2010-08-06 | 2016-11-01 | International Business Machines Corporation | Initializing components of an integrated circuit |
CN103197747A (en) * | 2012-01-04 | 2013-07-10 | 三星电子株式会社 | Temperature management circuit, system on chip including the same, and method of managing temperature |
CN103197747B (en) * | 2012-01-04 | 2017-07-18 | 三星电子株式会社 | Temperature treatment circuit including its on-chip system and the method for managing temperature |
US20130169347A1 (en) * | 2012-01-04 | 2013-07-04 | Samsung Electronics Co., Ltd. | Temperature Management Circuit, System on Chip Including the Same and Method of Managing Temperature |
KR20130080305A (en) * | 2012-01-04 | 2013-07-12 | 삼성전자주식회사 | Temperature management unit, system on chip including the same and method of managing temperature in a system on chip |
JP2013140979A (en) * | 2012-01-04 | 2013-07-18 | Samsung Electronics Co Ltd | Temperature management method and temperature management circuit for system on chip, system on chip comprising the same, and temperature management apparatus to control the same |
US9405337B2 (en) * | 2012-01-04 | 2016-08-02 | Samsung Electronics Co., Ltd. | Temperature management circuit, system on chip including the same and method of managing temperature |
US10371415B2 (en) | 2014-02-19 | 2019-08-06 | The Boeing Company | Electronics operation for temperature controlled systems |
WO2015126541A1 (en) * | 2014-02-19 | 2015-08-27 | The Boeing Company | Electronics operation for temperature controlled systems |
US9772232B2 (en) | 2014-03-28 | 2017-09-26 | Darryl G. Walker | Semiconductor device having temperature sensor circuit that detects a temperature range upper limit value and a temperature range lower limit value |
US9274007B2 (en) | 2014-03-28 | 2016-03-01 | Darryl G. Walker | Semiconductor device having temperature sensor circuits |
US9194754B2 (en) | 2014-03-28 | 2015-11-24 | Darryl G. Walker | Power up of semiconductor device having a temperature circuit and method therefor |
US9810585B2 (en) | 2014-03-28 | 2017-11-07 | Darryl G. Walker | Semiconductor device having a temperature circuit that provides a plurality of temperature operating ranges |
US9939330B2 (en) | 2014-03-28 | 2018-04-10 | Darryl G. Walker | Semiconductor device having subthreshold operating circuits including a back body bias potential based on temperature range |
US10006959B2 (en) | 2014-08-20 | 2018-06-26 | Darryl G. Walker | Testing and setting performance parameters in a semiconductor device and method therefor |
US9645191B2 (en) | 2014-08-20 | 2017-05-09 | Darryl G. Walker | Testing and setting performance parameters in a semiconductor device and method therefor |
US9658277B2 (en) | 2014-08-20 | 2017-05-23 | Darryl G. Walker | Testing and setting performance parameters in a semiconductor device and method therefor |
KR20160024581A (en) * | 2014-08-26 | 2016-03-07 | 삼성전자주식회사 | Clock monitor and system on chip including the same |
US10985139B2 (en) | 2014-11-20 | 2021-04-20 | Samsung Electronics Co., Ltd. | Semiconductor chip for sensing temperature and semiconductor system including the same |
US20160148905A1 (en) * | 2014-11-20 | 2016-05-26 | Ki Hun YU | Semiconductor chip for sensing temperature and semiconductor system including the same |
US10115702B2 (en) * | 2014-11-20 | 2018-10-30 | Samsung Electronics Co., Ltd. | Semiconductor chip for sensing temperature and semiconductor system including the same |
WO2016118250A1 (en) * | 2015-01-22 | 2016-07-28 | Qualcomm Incorporated | Systems and methods for detecting thermal runaway |
US10061331B2 (en) * | 2015-01-22 | 2018-08-28 | Qualcomm Incorporated | Systems and methods for detecting thermal runaway |
US20160216719A1 (en) * | 2015-01-22 | 2016-07-28 | Qualcomm, Incorporated | Systems and methods for detecting thermal runaway |
US9928925B1 (en) * | 2015-02-17 | 2018-03-27 | Darryl G. Walker | Multi-chip non-volatile semiconductor memory package including heater and sensor elements |
US10141058B1 (en) | 2015-02-17 | 2018-11-27 | Darryl G. Walker | Multi-chip non-volatile semiconductor memory package including heater and sensor elements |
US9286991B1 (en) | 2015-02-17 | 2016-03-15 | Darryl G. Walker | Multi-chip non-volatile semiconductor memory package including heater and sensor elements |
US9613719B1 (en) | 2015-02-17 | 2017-04-04 | Darryl G. Walker | Multi-chip non-volatile semiconductor memory package including heater and sensor elements |
CN105652916A (en) * | 2016-01-06 | 2016-06-08 | 京东方科技集团股份有限公司 | Processor temperature control circuit |
CN105652916B (en) * | 2016-01-06 | 2017-12-01 | 京东方科技集团股份有限公司 | Temperature of processor control circuit |
CN113551793A (en) * | 2021-08-18 | 2021-10-26 | 联芸科技(杭州)有限公司 | Temperature detection circuit |
CN113551793B (en) * | 2021-08-18 | 2022-11-08 | 联芸科技(杭州)股份有限公司 | Temperature detection circuit |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6091255A (en) | System and method for tasking processing modules based upon temperature | |
US7813815B2 (en) | Digital measuring system and method for integrated circuit chip operating parameters | |
Lopez-Buedo et al. | Thermal testing on reconfigurable computers | |
CN100414511C (en) | Duty cycle measurement apparatus and method | |
US20020084797A1 (en) | Parameter variation probing technique | |
Boemo et al. | Thermal monitoring on FPGAs using ring-oscillators | |
US7102417B2 (en) | Integrated circuit die including a temperature detection circuit, and system and methods for calibrating the temperature detection circuit | |
KR100849208B1 (en) | Test circuit having ring oscillator and method thereof | |
US6934652B2 (en) | On-chip temperature measurement technique | |
EP3062077B1 (en) | Multi-sensor assembly | |
JPH0210847A (en) | Method and apparatus for measuring operation speed of integrated circuit chip | |
KR100848202B1 (en) | Semiconductor integrated circuit | |
US7197419B2 (en) | System and method for thermal monitoring of IC using sampling periods of invariant duration | |
JP2760284B2 (en) | Semiconductor integrated circuit device | |
US6515549B2 (en) | Semiconductor device having critical path connected by feedback ring oscillator | |
US20200132752A1 (en) | Chip and performance monitoring method | |
JPH06163340A (en) | Processed substrate provided with information measuring mean | |
US20140247857A1 (en) | System and Method for Measuring Thermal Reliability of Multi-Chip Modules | |
US20090177442A1 (en) | On-chip variation, speed and power regulator | |
US6750664B2 (en) | Apparatus for managing an intergrated circuit | |
US20220215147A1 (en) | Temperature Control Systems And Methods For Integrated Circuits | |
US4581740A (en) | Transfer circuit for defect inspection of an integrated circuit | |
US6219824B1 (en) | Integrated circuit having a programmable input/output processor that is used for increasing the flexibility of communications | |
US20060063285A1 (en) | Methods for measuring die temperature | |
López-Buedo et al. | A method for temperature measurement on reconfigurable systems |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ADVANCED MICRO DEVICES, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GODFREY, GARY MICHAEL;REEL/FRAME:009166/0383 Effective date: 19980504 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: GLOBALFOUNDRIES INC., CAYMAN ISLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:AMD TECHNOLOGIES HOLDINGS, INC.;REEL/FRAME:022764/0544 Effective date: 20090302 Owner name: AMD TECHNOLOGIES HOLDINGS, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ADVANCED MICRO DEVICES, INC.;REEL/FRAME:022764/0488 Effective date: 20090302 |
|
FPAY | Fee payment |
Year of fee payment: 12 |
|
AS | Assignment |
Owner name: GLOBALFOUNDRIES U.S. INC., NEW YORK Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:WILMINGTON TRUST, NATIONAL ASSOCIATION;REEL/FRAME:056987/0001 Effective date: 20201117 |