US6480089B1 - Thermal bend actuator - Google Patents
Thermal bend actuator Download PDFInfo
- Publication number
- US6480089B1 US6480089B1 US09/505,152 US50515200A US6480089B1 US 6480089 B1 US6480089 B1 US 6480089B1 US 50515200 A US50515200 A US 50515200A US 6480089 B1 US6480089 B1 US 6480089B1
- Authority
- US
- United States
- Prior art keywords
- arm
- actuator
- illustrates
- extension portion
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
Definitions
- the present invention relates to the field of micro mechanical or micro electro-mechanical devices such as ink jet printers.
- the present invention will be described herein with reference to Micro Electro Mechanical Inkjet technology. However, it will be appreciated that the invention does have broader applications to other micro mechanical or micro electro-mechanical devices, eg. micro electro-mechanical pumps or micro electro-mechanical movers.
- Micro mechanical and micro electro-mechanical devices are becoming increasingly popular and normally involve the creation of devices on the ⁇ m (micron) scale utilizing semi-conductor fabrication techniques.
- micro-mechanical devices For a recent review on micro-mechanical devices, reference is made to the article “The Broad Sweep of Integrated Micro Systems” by S. Tom Picraux and Paul J. McWhorter published December 1998 in IEEE Spectrum at pages 24 to 33.
- micro electro-mechanical devices in which ink is ejected from an ink ejection nozzle chamber. Many forms of ink jet devices are known.
- MEMJET Micro Electro Mechanical Inkjet
- ink is ejected from an ink ejection nozzle chamber utilising an electro mechanical actuator connected to a paddle or plunger which moves towards the ejection nozzle of the chamber for ejection of drops of ink from the ejection nozzle chamber.
- the present invention concerns improvements to a thermal bend actuator for use in the MEMJET technology or other micro mechanical or micro electro-mechanical devices.
- a thermal actuator for micro mechanical or micro electro-mechanical devices comprising a supporting substrate, an actuator extension portion, a first arm attached at a first end thereof to the substrate and at a second end to the extension portion, the first arm being arranged, in use, to be conductively heatable, a second arm attached at a first end to the supporting substrate and at a second end to the extension portion, the second arm being spaced apart from the first arm, the first arm being arranged, in use, to undergo thermal expansion, thereby causing the actuator to apply a force to the extension portion, and wherein the first arm comprises at least one heat sink element substantially at a point of maximum heating of the first arm, being the point where, in use, maximum heating of the first arm would occur.
- the provision of the heat sink element can improve the operational characteristics of the thermal bend actuator in that the maximum temperature in the first arm can be reduced, and in that a more uniform temperature profile can be achieved throughout the first arm. This can maximise the thermal expansion induced in the first arm.
- the heat sink element can be located substantially in the middle of the first arm.
- the heat sink element may be arranged to interconnect the first and second arm.
- the heat sink element can comprise at least one tab body connected to a main body of the first arm.
- the tab body may be connected to the main body via a first thinned neck portion.
- the first arm can comprise a conductive layer whereby the first arm is conductively heatable.
- the actuator may be arranged in a manner such that a current can be supplied to the conductive layer through the supporting substrate.
- the first and second arms are preferably formed from substantially the same material.
- the extension portion can comprise a paddle structure. Accordingly, the actuator may be used inside a liquid ejection chamber, the paddle structure being movable for the ejection of liquid from the chamber.
- the first conductive arm can be formed from titanium nitride and the second arm can be formed from titanium nitride.
- FIG. 1 to FIG. 3 illustrate schematically the operation of the preferred embodiment
- FIG. 4 to FIG. 6 illustrate schematically a first thermal bend actuator
- FIG. 7 to FIG. 8 illustrate schematically a second thermal bend actuator
- FIG. 9 to FIG. 10 illustrate schematically a third thermal bend actuator
- FIG. 11 illustrates schematically a further thermal bend actuator
- FIG. 12 illustrates an example graph of temperature with respect to distance for the arrangement of FIG. 11;
- FIG. 13 illustrates schematically a further thermal bend actuator
- FIG. 14 illustrates an example graph of temperature with respect to distance for the arrangement of FIG. 13;
- FIG. 15 illustrates schematically a further thermal bend actuator
- FIG. 16 illustrates a side perspective view of the CMOS layer of the preferred embodiment
- FIG. 17 illustrates a 1 micron mask
- FIG. 18 illustrates a plan view of a portion of the CMOS layer
- FIG. 19 illustrates a side perspective view of the preferred embodiment with the sacrificial Polyimide Layer
- FIG. 20 illustrates a plan view of the sacrificial Polyimide mask
- FIG. 21 illustrates a side plan view, partly in section, of the preferred embodiment with the sacrificial Polyimide Layer
- FIG. 22 illustrates a side perspective view of the preferred embodiment with the first level Titanium Nitride Layer
- FIG. 23 illustrates a plan view of the first level Titanium Nitride mask
- FIG. 24 illustrates a side plan view, partly in section, of the preferred embodiment with the first level Titanium Nitride Layer
- FIG. 25 illustrates a side perspective view of the preferred embodiment with the second level sacrificial Polyimide Layer
- FIG. 26 illustrates a plan view of the second level sacrificial Polyimide mask
- FIG. 27 illustrates a side plan view, partly in section, of the preferred embodiment with the second level sacrificial Polyimide Layer
- FIG. 28 illustrates a side perspective view of the preferred embodiment with the second level Titanium Nitride Layer
- FIG. 29 illustrates a plan view of the second level Titanium Nitride mask
- FIG. 30 illustrates a side plan view, partly in section, of the preferred embodiment with the second level Titanium Nitride Layer
- FIG. 31 illustrates a side perspective view of the preferred embodiment with the third level sacrificial Polyimide Layer
- FIG. 32 illustrates a plan view of the third level sacrificial Polyimide mask
- FIG. 33 illustrates a side plan view, partly in section, of the preferred embodiment with the third level sacrificial Polyimide Layer
- FIG. 34 illustrates a side perspective view of the preferred embodiment with the conferral PECVD SiNH Layer
- FIG. 35 illustrates a plan view of the conformal PECVD SiNH mask
- FIG. 36 illustrates a side plan view, partly in section, of the preferred embodiment with the conformal PECVD SiNH Layer
- FIG. 37 illustrates a side perspective view of the preferred embodiment with the conformal PECVD SINH nozzle tip etch Layer
- FIG. 38 illustrates a plan view of the conferral PECVD SiNH nozzle tip etch mask
- FIG. 39 illustrates a side plan view, partly in section, of the preferred embodiment with the conformal PECVD SiNH nozzle tip etch Layer
- FIG. 40 illustrates a side perspective view of the preferred embodiment with the conformal PECVD SiNH nozzle roof etch Layer
- FIG. 41 illustrates a plan view of the conformal PECVD SiNH nozzle roof etch mask
- FIG. 42 illustrates a side plan view, partly in section, of the preferred embodiment with the conformal PECVD SiNH nozzle roof etch Layer
- FIG. 43 illustrates a side perspective view of the preferred embodiment with the sacrificial protective polyimide Layer
- FIG. 44 illustrates a plan view of the sacrificial protective polyimide mask
- FIG. 45 illustrates a side plan view, partly in section, of the preferred embodiment with the sacrificial protective polyimide Layer
- FIG. 46 illustrates a side perspective view of the preferred embodiment with the back etch Layer
- FIG. 47 illustrates a plan view of the back etch mask
- FIG. 48 illustrates a side plan view, partly in section, of the preferred embodiment with the back etch Layer
- FIG. 49 illustrates a side perspective view of the preferred embodiment with the stripping sacrificial material Layer
- FIG. 50 illustrates a plan view of the stripping sacrificial material mask
- FIG. 51 illustrates a side plan view, partly in section, of the preferred embodiment with the stripping sacrificial material Layer
- FIG. 52 illustrates a side perspective view of the preferred embodiment after the device has been primed with ink.
- FIG. 53 illustrates a plan view of the package, bond, prime and test mask
- FIG. 54 illustrates a side plan view, partly in section, of the preferred embodiment with the package, bond, prime and test;
- FIG. 55 illustrates a side perspective view in section of the preferred embodiment ejecting a drop
- FIG. 56 illustrates a side perspective view of the preferred embodiment when actuating
- FIG. 57 illustrates a side perspective view in section of the preferred embodiment ejecting a drop
- FIG. 58 illustrates a side plan view, partly in section, of the preferred embodiment when returning
- FIG. 59 illustrates a top plan view of the preferred embodiment
- FIG. 60 illustrates an enlarged side perspective view showing the actuator arm and nozzle chamber
- FIG. 61 illustrates an enlarged side perspective view showing the actuator paddle rim and nozzle chamber
- FIG. 62 illustrates an enlarged side perspective view showing the actuator heater element
- FIG. 63 illustrates a top plan view of an array of nozzles formed on a wafer
- FIG. 64 illustrates a side perspective view in section of an array of nozzles formed on a wafer.
- FIG. 65 illustrates an enlarged side perspective view in section of an array of nozzles formed on a wafer.
- a compact form of liquid ejection device which utilizes a thermal bend actuator to eject ink from a nozzle chamber.
- an ink ejection arrangement 1 which comprises a nozzle chamber 2 which is normally filled with ink so as to form a meniscus 3 around an ink ejection nozzle 4 having a raised rim.
- the ink within the nozzle chamber 2 is resupplied by means of ink supply channel 5 .
- the ink is ejected from a nozzle chamber 2 by means of a thermal actuator 7 which is rigidly interconnected to a nozzle paddle 8 .
- the thermal actuator 7 comprises two arms 10 , 11 with the bottom arm 11 being interconnected to a electrical current source so as to provide conductive heating of the bottom arm 11 .
- the bottom arm 11 is heated so as to cause the rapid expansion of this arm 11 relative to the top arm 10 .
- the rapid expansion in turn causes a rapid upward movement of the paddle 8 within the nozzle chamber 2 .
- the initial movement is illustrated in FIG.
- the nozzle chamber comprises a profile edge 15 which, as the paddle 8 moves up, causes a large increase in the channel space 16 as illustrated in FIG. 2 .
- This large channel space 16 allows for substantial amounts of ink to flow rapidly into the nozzle chamber 2 with the ink being drawn through the channel 16 by means of surface tension effects of the ink meniscus 3 .
- the profiling of the nozzle chamber allows for the rapid refill of the nozzle chamber with the arrangement eventually returning to the quiescent position as previously illustrated in FIG. 1 .
- the arrangement 1 also comprises a number of other significant features. These comprise a circular rim 18 , as shown in FIG. 1 which is formed around an external circumference of the paddle 8 and provides for structural support for the paddle 8 whilst substantially maximising the distance between the meniscus 3 , as illustrated in FIG. 3 and the paddle surface 8 . The maximising of this distance reduces the likelihood of meniscus 3 making contact with the paddle surface 8 and thereby affecting the operational characteristic. Further, as part of the manufacturing steps, an ink outflow prevention lip 19 is provided for reducing the possibility of ink wicking along a surface eg. 20 and thereby affecting the operational characteristics of the arrangement 1 .
- FIG. 4 there is shown, a thermal bend actuator attached to a substrate 22 which comprises an actuator arm 23 on both sides of which are activating arms 24 , 25 .
- the two arms 24 , 25 are preferably formed from the same material so as to be in a thermal balance with one another.
- a pressure P is assumed to act on the surface of the actuator arm 23 .
- the bottom arm 25 is heated so as to reduce the tensile stress between the top and bottom arm 24 , 25 . This results in an output resultant force on the actuator arm 23 which results in its general upward movement.
- the portion 26 of the actuator arm 23 between the activating portion 24 , 25 will be in a state of shear stress and, as a result, efficiencies of operation may be lost in this embodiment. Further, the presence of the material 26 can resulted in rapid thermal conductivity from the arm portion 25 to the arm portion 24 .
- the thermal arm 25 must be operated at a temperature which is suitable for operating the arm 23 .
- the operational characteristics are limited by the characteristics, eg. melting point, of the portion 26 .
- FIG. 9 there is illustrated an alternative form of thermal bend actuator which comprises the two arms 24 , 25 and an actuator extension portion in the form of arm 23 and wherein there is provided a space or gap 28 between the arms 24 , 25 .
- the arm 25 bends upwards as before.
- the arrangement of FIG. 10 has the advantage that the operational characteristics eg. temperature, of the arms 24 , 25 may not necessarily be limited by the material utilized in the arm 23 . Further, the arrangement of FIG. 10 does not induce a shear force in the arm 23 and also has a lower probability of delaninating during operation.
- a thermal actuator relies on conductive heating and, the arrangement utilized in the preferred embodiment can be schematically simplified as illustrated in FIG. 11 to a material 30 which is interconnected at a first end 31 to a substrate and at a second end 32 to a load.
- the arm 30 is conductively heated so as to expand and exert a force on the load 32 .
- the temperature profile will be approximately as illustrated in FIG. 12 .
- the two ends 31 , 32 act as “heat sinks” for the conductive thermal heating and so the temperature profile is cooler at each end and hottest in the middle.
- the operational characteristics of the arm 30 will be determined by the melting point 35 in that if the temperature in the middle 36 exceeds the melting point 35 , the arm may fail.
- the graph of FIG. 12 represents a non optimal result in that the arm 30 in FIG. 11 is not heated uniformly along its length.
- FIG. 14 By modifying the arm 30 , as illustrated in FIG. 13, through the inclusion of heat sinks 38 , 39 in a central portion of the arm 30 a more optimal thermal profile, as illustrated in FIG. 14, can be achieved.
- the profile of FIG. 14 has a more uniform heating across the lengths of the arm 30 thereby providing for more efficient overall operation.
- FIG. 15 further efficiencies and reduction in buckling likelihood can be achieved by providing a series of struts to couple the two actuator activation arms 24 , 25 .
- a series of struts eg. 40 , 41 are provided to couple the two arms 24 , 25 so as to prevent buckling thereof.
- FIG. 17 a 1 micron grid, as illustrated in FIG. 17 is utilized as a frame of reference.
- the starting material is assumed to be a CMOS wafer 100 , suitably processed and passivated (using say silicon nitride) as illustrated in FIG. 16 to FIG. 18 .
- 1 micron of spin-on photosensitive polyimide 102 is deposited and exposed using UV light through the Mask 104 of FIG. 20 .
- the polyimide 102 is then developed.
- the polyimide 102 is sacrificial, so there is a wide range of alternative materials which can be used. Photosensitive polyimide simplifies the processing, as it eliminates deposition, etching, and resist stripping steps.
- 0.2 microns of magnetron sputtered titanium nitride 106 is deposited at 300 ⁇ C and etched using the Mask 108 of FIG. 23 . This forms a layer containing the actuator layer 105 and paddle 107 .
- photosensitive polyimide 110 is spun on and exposed using UV light through the Mask 112 of FIG. 26 .
- the polyimide 110 is then developed. The thickness ultimately determines the gap 101 between the actuator and compensator Tin layers, so has an effect on the amount that the actuator bends.
- step 3 the use of photosensitive polyimide simplifies the processing, as it eliminates deposition, etching, and resist stripping steps.
- the top layer of TiN 116 is not electrically connected, and is used purely as a mechanical component.
- the portion 301 of the TiN 116 and the portion 302 of the TiN 106 are in the form of arms corresponding in function, for example, with the arms 24 and 25 , respectively, of FIG. 9 .
- the remainder of the TiN 106 and TiN 116 to the right side of the position designated 303 as shown in FIG. 30 constitutes an actuator extension portion corresponding with the actuator extension portion 23 described in relation to FIG. 9 .
- the portions 304 of the arms 302 constitute heat sinks corresponding in function with the heat sinks 38 , 39 of FIG. 13 .
- the heat sinks 304 are integral parts of the arms 302 , thereby constituting tab bodies connected to the remainders of the arms 302 , these remainders thus constituting main bodies 305 of the arms 302 .
- each heat sink 304 has a thinned neck portion 306 where the heat sink is connected to the respective main body 305 .
- the PECVD silicon nitride 122 is etched using the mask 124 of FIG. 38 to a nominal depth of 1 micron. This is a simple timed etch as the etch depth is not critical, and may vary up to ⁇ 50%.
- the etch forms the nozzle rim 126 and actuator port rim 128 . These rims are used to pin the meniscus of the ink to certain locations, and prevent the ink from spreading.
- the PECVD silicon nitride 122 is etched using the mask 130 of FIG. 41 to a nominal depth of 1 micron, stopping on polyimide 118 .
- a 100% over-etch can accommodate variations in the previous two steps, allowing loose manufacturing tolerances.
- the etch forms the roof 132 of the nozzle chamber.
- the wafer 100 is thinned to 300 microns (to reduce back-etch time), and 3 microns of resist (not shown) on the back-side 136 of the wafer 100 is exposed through the mask 138 of FIG. 47 .
- Alignment is to metal portions 103 on the front side of the wafer 100 . This alignment can be achieved using an IR microscope attachment to the wafer aligner.
- the wafer 100 is then etched (from the back-side 136 ) to a depth of 330 microns (allowing 10% over-etch) using the deep silicon etch “Bosch process”. This process is available on plasma etchers from Alcatel, Plasma-therm, and Surface Technology Systems. The chips are also diced by this etch, but the wafer is still held together by 11 microns of the various polyimide layers.
- the wafer 100 is turned over, placed in a tray, and all of the sacrificial polyimide layers 102 , 110 , 118 and 134 are etched in an oxygen plasma using no mask (FIG. 60 ).
- a package is prepared by drilling a 0.5 mm hold in a standard package, and gluing an ink hose (not shown) to the package.
- the ink hose should include a 0.5 micron absolute filter to prevent contamination of the nozzles from the ink 121 .
- FIGS. 55 to 62 illustrate various views of the preferred embodiment, some illustrating the embodiments in operation.
- large arrays 200 of print heads 202 can be simultaneously constructed as illustrated in FIG. 63 to FIG. 56 which illustrate various print head array views.
- the presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers, high speed pagewidth printers, notebook computers with in-built pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic ‘minilabs’, video printers, PhotoCD printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.
- MEMS principles outlined have general applicability in the construction of MEMS devices.
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPP8689 | 1999-02-15 | ||
AUPP8689A AUPP868999A0 (en) | 1999-02-15 | 1999-02-15 | A method and apparatus(IJ46P1D) |
Publications (1)
Publication Number | Publication Date |
---|---|
US6480089B1 true US6480089B1 (en) | 2002-11-12 |
Family
ID=3812890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/505,152 Expired - Fee Related US6480089B1 (en) | 1999-02-15 | 2000-02-15 | Thermal bend actuator |
Country Status (2)
Country | Link |
---|---|
US (1) | US6480089B1 (en) |
AU (1) | AUPP868999A0 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020036555A1 (en) * | 2000-06-20 | 2002-03-28 | Alcatel | Bi-stable microswitch including magnetic latch |
US20080197964A1 (en) * | 2007-02-21 | 2008-08-21 | Simpler Networks Inc. | Mems actuators and switches |
US7545252B1 (en) | 2008-07-24 | 2009-06-09 | International Business Machines Corporation | Phase change MEMS switch |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4423401A (en) * | 1982-07-21 | 1983-12-27 | Tektronix, Inc. | Thin-film electrothermal device |
US4864824A (en) * | 1988-10-31 | 1989-09-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Thin film shape memory alloy and method for producing |
US5061914A (en) * | 1989-06-27 | 1991-10-29 | Tini Alloy Company | Shape-memory alloy micro-actuator |
US5402099A (en) * | 1993-12-14 | 1995-03-28 | Ballard; Edwin C. | High temperature, temperature responsive snap acting control member and electrical switches using such members |
US5619177A (en) * | 1995-01-27 | 1997-04-08 | Mjb Company | Shape memory alloy microactuator having an electrostatic force and heating means |
US5796152A (en) * | 1997-01-24 | 1998-08-18 | Roxburgh Ltd. | Cantilevered microstructure |
US5808539A (en) * | 1996-10-10 | 1998-09-15 | Texas Instruments Incorporated | Temperature responsive snap acting control assembly, device using such assembly and method for making |
US5870007A (en) * | 1997-06-16 | 1999-02-09 | Roxburgh Ltd. | Multi-dimensional physical actuation of microstructures |
US6087638A (en) * | 1997-07-15 | 2000-07-11 | Silverbrook Research Pty Ltd | Corrugated MEMS heater structure |
US6180427B1 (en) * | 1997-07-15 | 2001-01-30 | Silverbrook Research Pty. Ltd. | Method of manufacture of a thermally actuated ink jet including a tapered heater element |
US6217153B1 (en) * | 1997-07-15 | 2001-04-17 | Silverbrook Research Pty Ltd | Single bend actuator cupped paddle ink jet printing mechanism |
US6228668B1 (en) * | 1997-07-15 | 2001-05-08 | Silverbrook Research Pty Ltd | Method of manufacture of a thermally actuated ink jet printer having a series of thermal actuator units |
US6236300B1 (en) * | 1999-03-26 | 2001-05-22 | R. Sjhon Minners | Bistable micro-switch and method of manufacturing the same |
US6239685B1 (en) * | 1999-10-14 | 2001-05-29 | International Business Machines Corporation | Bistable micromechanical switches |
US6243113B1 (en) * | 1998-03-25 | 2001-06-05 | Silverbrook Research Pty Ltd | Thermally actuated ink jet printing mechanism including a tapered heater element |
US6245247B1 (en) * | 1998-06-09 | 2001-06-12 | Silverbrook Research Pty Ltd | Method of manufacture of a surface bend actuator vented ink supply ink jet printer |
-
1999
- 1999-02-15 AU AUPP8689A patent/AUPP868999A0/en not_active Abandoned
-
2000
- 2000-02-15 US US09/505,152 patent/US6480089B1/en not_active Expired - Fee Related
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4423401A (en) * | 1982-07-21 | 1983-12-27 | Tektronix, Inc. | Thin-film electrothermal device |
US4864824A (en) * | 1988-10-31 | 1989-09-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Thin film shape memory alloy and method for producing |
US5061914A (en) * | 1989-06-27 | 1991-10-29 | Tini Alloy Company | Shape-memory alloy micro-actuator |
US5402099A (en) * | 1993-12-14 | 1995-03-28 | Ballard; Edwin C. | High temperature, temperature responsive snap acting control member and electrical switches using such members |
US5619177A (en) * | 1995-01-27 | 1997-04-08 | Mjb Company | Shape memory alloy microactuator having an electrostatic force and heating means |
US5808539A (en) * | 1996-10-10 | 1998-09-15 | Texas Instruments Incorporated | Temperature responsive snap acting control assembly, device using such assembly and method for making |
US5796152A (en) * | 1997-01-24 | 1998-08-18 | Roxburgh Ltd. | Cantilevered microstructure |
US5870007A (en) * | 1997-06-16 | 1999-02-09 | Roxburgh Ltd. | Multi-dimensional physical actuation of microstructures |
US6087638A (en) * | 1997-07-15 | 2000-07-11 | Silverbrook Research Pty Ltd | Corrugated MEMS heater structure |
US6180427B1 (en) * | 1997-07-15 | 2001-01-30 | Silverbrook Research Pty. Ltd. | Method of manufacture of a thermally actuated ink jet including a tapered heater element |
US6217153B1 (en) * | 1997-07-15 | 2001-04-17 | Silverbrook Research Pty Ltd | Single bend actuator cupped paddle ink jet printing mechanism |
US6228668B1 (en) * | 1997-07-15 | 2001-05-08 | Silverbrook Research Pty Ltd | Method of manufacture of a thermally actuated ink jet printer having a series of thermal actuator units |
US6243113B1 (en) * | 1998-03-25 | 2001-06-05 | Silverbrook Research Pty Ltd | Thermally actuated ink jet printing mechanism including a tapered heater element |
US6245247B1 (en) * | 1998-06-09 | 2001-06-12 | Silverbrook Research Pty Ltd | Method of manufacture of a surface bend actuator vented ink supply ink jet printer |
US6236300B1 (en) * | 1999-03-26 | 2001-05-22 | R. Sjhon Minners | Bistable micro-switch and method of manufacturing the same |
US6239685B1 (en) * | 1999-10-14 | 2001-05-29 | International Business Machines Corporation | Bistable micromechanical switches |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020036555A1 (en) * | 2000-06-20 | 2002-03-28 | Alcatel | Bi-stable microswitch including magnetic latch |
US6794964B2 (en) * | 2000-06-20 | 2004-09-21 | Alcatel | Bi-stable microswitch including magnetic latch |
US20080197964A1 (en) * | 2007-02-21 | 2008-08-21 | Simpler Networks Inc. | Mems actuators and switches |
US20110012703A1 (en) * | 2007-02-21 | 2011-01-20 | Reseaux Mems, Societe En Commandite | Mems actuators and switches |
US7545252B1 (en) | 2008-07-24 | 2009-06-09 | International Business Machines Corporation | Phase change MEMS switch |
Also Published As
Publication number | Publication date |
---|---|
AUPP868999A0 (en) | 1999-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6426014B1 (en) | Method of manufacturing a thermal bend actuator | |
US6612110B1 (en) | Mechanical bend actuator | |
US6322195B1 (en) | Nozzle chamber paddle | |
US7708382B2 (en) | Inkjet nozzle arrangement incorporating thermal differential actuation | |
US7052113B2 (en) | Inkjet printhead comprising printhead integrated circuits | |
EP1165432B1 (en) | Thermal bend actuator and paddle structure for ink jet nozzle | |
US6460778B1 (en) | Liquid ejection device | |
US20110285791A1 (en) | Inkjet nozzle arrangement with displaceable partial chamber wall | |
US7207658B2 (en) | Printhead integrated circuit with electromechanical actuators incorporating heatsinks | |
US6305788B1 (en) | Liquid ejection device | |
US6480089B1 (en) | Thermal bend actuator | |
AU775594B2 (en) | A method of manufacturing a thermal bend actuator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SILVERBROOK RESEARCH PTY. LTD., AUSTRALIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SILVERBROOK, KIA;REEL/FRAME:010573/0981 Effective date: 20000214 |
|
FEPP | Fee payment procedure |
Free format text: PAT HOLDER NO LONGER CLAIMS SMALL ENTITY STATUS, ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: STOL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
AS | Assignment |
Owner name: ZAMTEC LIMITED, IRELAND Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED;REEL/FRAME:028537/0738 Effective date: 20120503 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20141112 |