US6798625B1 - Spin-valve magnetoresistance sensor and thin-film magnetic head - Google Patents
Spin-valve magnetoresistance sensor and thin-film magnetic head Download PDFInfo
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- US6798625B1 US6798625B1 US09/670,309 US67030900A US6798625B1 US 6798625 B1 US6798625 B1 US 6798625B1 US 67030900 A US67030900 A US 67030900A US 6798625 B1 US6798625 B1 US 6798625B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B2005/3996—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices
Definitions
- This invention concerns a spin-valve type magnetoresistance sensor in which a free ferromagnetic layer and pinned ferromagnetic layer enclosing a nonmagnetic spacer layer on substrate, and in which the magnetization direction of the pinned ferromagnetic layer is pinned by an antiferromagnetic layer, as well as a thin film magnetic head provided with a spin-valve magnetoresistance sensor, for use in magnetic recording devices.
- spin-valve MR films consist of a sandwich structure in which two magnetic layers enclose a nonmagnetic spacer layer on substrate; one of these, the pinned layer (fixed ferromagnetic layer), has its magnetization fixed parallel to the signal magnetic field by the exchange coupling magnetic field with the adjacent antiferromagnetic layer, and the magnetization of the other, free layer (free ferromagnetic layer) has a single magnetic domain induced by a hard-bias method using the magnetic field of a permanent magnet, so that its magnetization rotates freely under the action of an external magnetic field.
- FIG. 5 shows the configuration of the spin-valve films used in these measurements.
- a PtMn (250 ⁇ ) antiferromagnetic layer 4 On top of an underlayer consisting of a Ta (30 ⁇ ) film 2 and NiFeCr (40 ⁇ ) film 3 formed on a substrate 1 are formed a PtMn (250 ⁇ ) antiferromagnetic layer 4 ; a synthetic-structure pinned layer consisting of a CoFe (20 ⁇ ) film 5 , Ru (8.5 ⁇ ) film 6 , and CoFe (26 ⁇ ) film 7 ; a Cu (24 ⁇ ) nonmagnetic spacer layer 8 ; a free layer consisting of a CoFe (10 ⁇ ) film 9 and NiFe (20 ⁇ ) film 10 ; and a Cu nonmagnetic metal layer 11 as a back layer.
- a Ta (30 ⁇ ) protective layer 12 On top of this is formed a Ta (30 ⁇ ) protective layer 12 . After film formation, heat treatment is performed for 10 hours at 270° C. in a 15 kG magnetic field in vacuum, in order to render the PtMn antiferromagnetic layer 4 regular and to induce an exchange coupling with the aforementioned pinned layer.
- FIG. 6 shows changes in H int for this spin-valve film as the thickness t of the Cu nonmagnetic metal layer 11 was varied from 0 to 40 ⁇ .
- H int decreased from 8 Oe to 2 Oe. Because the average amount of change per Angstrom is 0.6 Oe/ ⁇ , even if, for example, the back layer film thickness could be controlled with a precision of ⁇ 1 ⁇ , the amount of change in H int in this error range would be as great as 1.2 Oe, indicating a large dependence on the back layer film thickness.
- H int is an important parameter affecting the nonlinearity (asymmetry) of the sensor output; hence scattering in H int directly causes scattering in the sensor performance, and stability suffers. For this reason, when such a sensor is applied in a read magnetic head, scattering occurs in the magnetic transducing characteristics due to manufacturing conditions, production yields decrease, and reliability is degraded.
- the spin-valve magnetoresistance sensor is characterized by being provided with a free-side ferromagnetic layer deposited on substrate, a pinned-side ferromagnetic layer, a nonmagnetic spacer layer enclosed between both aforementioned ferromagnetic layers, an antiferromagnetic layer adjacent to the aforementioned pinned-side ferromagnetic layer and which pins said fixed-side ferromagnetic layer, and a back layer comprising at least two nonmagnetic metal layers deposited on the side opposite the aforementioned nonmagnetic spacer layer and adjacent to the aforementioned free-side ferromagnetic layer.
- FIG. 1 is a cross-sectional diagram showing one embodiment of a spin-valve film applying this invention.
- FIG. 2 is a graph showing changes in H int with the thickness of the Cu layer in the back layer in the spin-valve film of FIG. 1 .
- FIG. 3 is a graph showing changes in the MR ratio with the Cu layer thickness in the back layer of the spin-valve films of FIG. 1 and FIG. 5 .
- FIG. 4 is a cross-sectional diagram showing one embodiment of a spin-valve MR sensor of this invention.
- FIG. 5 is a cross-sectional diagram showing a spin filter-structure spin-valve film of the prior art.
- FIG. 6 is a graph showing changes in Hi with the thickness of the Cu layer in the back layer of the spin-valve film of FIG. 5 .
- the present invention was devised in light of the abovementioned problems with the prior art.
- One aspect of the present invention provides a spin-valve magnetoresistance sensor with a so-called spin filter structure which enables still thinner free layer thicknesses so as to enable high read outputs with higher sensor sensitivity, while at the same time suppressing asymmetric scattering in read output and stabilizing sensor magnetic characteristics.
- Another aspect of the present invention provides a thin film magnetic head which, by the provision of this spin-valve magnetoresistance sensor, can stably exhibit enhanced performance compatible with still greater recording capacities and higher recording densities in magnetic recording, yet which can be manufactured with good production yields.
- the interlayer coupling magnetic field (H int ) acting between a free layer and a pinned layer consists of a component which fluctuates with the film thickness of the nonmagnetic spacer layer, and a component arising from irregularities in the interface (IEEE Transactions on Magnetics, Vol. 32, No. 4, p. 3165, 1996).
- the fluctuations arising from the film thickness of the nonmagnetic spacer layer have the same origin as the phenomenon of fluctuation with film thickness of the exchange coupling between magnetic layers in a Co/Cu or other multilayer film, and are thought to arise as a result of quantum interference effects between conduction electron waves (Journal of Magnetism and Magnetic Materials, Vol. 93, p. 85, 1991).
- Fluctuations with the back layer film thickness in the H int in spin-valve MR sensors with the above-described conventional spin filter structure of FIG. 5 are also thought to be similarly induced by quantum interference effects of electron waves. That is, conduction electrons pass from the nonmagnetic spacer layer through the free layer and through the back layer to be reflected at the interface with the Ta protective layer, and interfere with electron waves in the nonmagnetic spacer layer to create standing waves. Hence if the thickness of the back layer is changed, the state of interference with electron waves changes, and so it is expected that the exchange coupling between the free layer and pinned layer via the nonmagnetic spacer layer can be changed.
- Embodiments of the present invention have been devised on the basis of these insights of the inventors of this application, and provide a spin-valve magnetoresistance sensor characterized by comprising a free-side ferromagnetic layer (free layer), fixed-side ferromagnetic layer (pinned layer), nonmagnetic spacer layer enclosed between both aforementioned ferromagnetic layers, antiferromagnetic layer adjacent to the fixed-side ferromagnetic layer for pinning said fixed-side ferromagnetic layer, and back layer consisting of at least two nonmagnetic metal layers, adjacent to the free-side ferromagnetic layer and formed on the side opposite the nonmagnetic spacer layer, all formed on substrate.
- the back layer is a nonmagnetic metal layer which acts to pass conduction electrons, while reflecting electrons at the interface with the layer in contact with its upper surface.
- Cu in particular has a high electrical conductivity, and so is well-suited as the back layer in order to increase the mean free path in the free layer; hence it is desirable that at least one of the nonmagnetic metal layers of the aforementioned back layer be of Cu.
- the aforementioned back layer can be formed from a two-layer structure of Cu and Ru.
- Ru has a lower electrical conductivity than Cu, and so conduction electrons are easily scattered.
- the aforementioned back layer is deposited from the free-layer side in the order Cu/Ru, conduction electrons passing from the free layer through the Cu layer to the Ru layer are easily scattered, and so the probability that they will return to the nonmagnetic spacer layer in the coherent state is low, and the effect of fluctuations in the back layer film thickness on the state of interference of electron waves is small.
- Ru has a relatively high melting point, and so has the feature of acting to suppress interdiffusion at the interfaces in multilayer structures where heat treatment is required, as in spin-valve sensors.
- the aforementioned back layer is formed from a three-layer Ru/Cu/Ru layer structure, both the action of suppressing fluctuations in H int described above, and the action of preventing degradation of performance by heat treatment are obtained simultaneously, for greater expedience.
- the film thickness of the nonmagnetic metal layer consisting of Cu is in the range 5 to 20 ⁇ , the mean free path of conduction electrons is increased and the MR ratio can be improved, as described below, and moreover the influence of the shunt effect acting to reduce the MR ratio is small, for greater expedience.
- the aforementioned back layer comprises two or more layers, combining a nonmagnetic metal layer consisting of one, or of two or more, elements selected from the group Cu, Ag, Au with relatively high electrical conductivity, and a nonmagnetic metal layer consisting of one, or of two or more, elements selected from the group Ru, Re, Os, Ir, Rh, W, Nb, Mo, Cr, V, Pd, Pt with lower electrical conductivity.
- a thin film magnetic head equipped with the above-described spin-valve magnetoresistance sensor is provided. Because fluctuations in H int are small, there is little asymmetry in the reproduction output, and at the same time high reproduction output is obtained.
- FIG. 1 shows a cross-sectional view of the configuration of a spin-valve MR sensor to which the so-called spin filter structure of this invention is applied.
- this spin-valve MR sensor on a substrate 1 of glass, silicon, Al 2 O 3 —TiC or other ceramic material, or similar, an underlayer is formed with a two-layer structure consisting of a first underlayer film of Ta 2 and a second underlayer film of NiFeCr 3 , in order to improve the overall crystal orientation of films formed on top of these; on these is formed the spin-valve MR film.
- This MR film is what is called a synthetic spin-valve film, with a three-layer structure pinned layer formed in layers on top of an antiferromagnetic layer 4 .
- the three-layer structure consists of a CoFe ferromagnetic film 5 , a Ru nonmagnetic film 6 , and a CoFe ferromagnetic film 7 .
- the antiferromagnetic layer 4 consists of a PtMn film formed on the aforementioned underlayer.
- the two aforementioned ferromagnetic films enclose the nonmagnetic film, integrated by a strong antiparallel magnetic coupling, as a result of which the exchange coupling with the antiferromagnetic layer 4 is strengthened and the sensor operation is stabilized, and moreover the static magnetic field from the pinned layer to the free layer is diminished, so that the asymmetry of the read output is alleviated.
- a nonmagnetic spacer layer 8 of Cu is formed, and on top of this is formed a free layer with a two-layer structure consisting of a CoFe layer 9 and an NiFe layer 10 .
- the aforementioned free layer is formed to a smaller thickness than in conventional spin-valve films.
- a back layer 15 with a two-layer structure consisting of a nonmagnetic metal layer 13 of Cu and a nonmagnetic metal layer 14 of Ru, in order to increase the mean free path of conduction electrons.
- a protective layer 12 of, for example, Ta is formed on the very top, in order to prevent the oxidation which is known to occur in subsequent manufacturing processes and during use.
- the antiferromagnetic layer 4 is made regular, and the exchange coupling imparts a uniaxial anisotropy to the aforementioned pinned layer and fixes the direction of its magnetization.
- the Cu of the nonmagnetic metal layer 13 may diffuse into the thin free layer of NiFe 10 , possibly degrading sensor characteristics.
- the aforementioned back layer is formed with a Ru/Cu/Ru three-layer structure. The Ru film in contact with the NiFe film 10 functions as a Cu diffusion barrier layer during the above heat treatment after film deposition, so that degradation of sensor characteristics is prevented.
- nonmagnetic metal materials can be used in the back layer 15 .
- the aforementioned back layer can be formed, and as a result effects can be obtained similar to those described above in connection with FIG. 1 .
- DC magnetron sputtering was used to actually form the spin-valve MR film of FIG. 1, with composition Ta (30 ⁇ )/NiFeCr (40 ⁇ )/PtMn (250 ⁇ )/CoFe (20 ⁇ )/Ru (8.5 ⁇ )/CoFe (26 ⁇ )/Cu (24 ⁇ )/CoFe (10 ⁇ )/NiFe (20 ⁇ )/Cu/Ru (5 ⁇ )/Ta (30 ⁇ ) on substrate, and changes in H int with the film thickness t of the Cu layer of the back layer 15 were measured.
- This MR film was heat-treated for 10 hours at 270° C. in vacuum in a 15 kG magnetic field after deposition.
- the magnetoresistance effect (MR effect) for thickness t of the Cu layer of the back layer was measured, as the change in dR/R value, for a spin-valve MR film of this embodiment and for an example of a spin-valve MR film of the prior art in relation to FIG. 5, both using the four-probe method after heat treatment.
- the measurement results appear in FIG. 3 .
- the Cu layer thickness t in order to extend the mean free path and improve the MR ratio, the Cu layer thickness t must be at least 5 ⁇ , and that if the film thickness t is 20 ⁇ or greater, the shunt effect of the sense current will cause the MR ratio to be decreased more than necessary.
- the thickness t of the Cu layer comprising the back layer in order to obtain the magnetoresistance effect desired for a spin-valve MR sensor—that is, in order to obtain a high read output—it is desirable that the thickness t of the Cu layer comprising the back layer be 5 ⁇ or greater, and 20 ⁇ or less.
- Both sides of the spin-valve MR film of FIG. 1 are removed by etching so that the aforementioned free layer has the desired track width, and on both sides, a hard bias underlayer 16 and hard bias film 17 are formed so as to induce a single domain in the free layer, as shown in FIG. 4 .
- a hard bias underlayer 16 and hard bias film 17 are formed so as to induce a single domain in the free layer, as shown in FIG. 4 .
- On the hard bias film 17 is formed a pair of electrode films 18 to pass a sense current; this entire layered structure is covered with an alumina gap film 19 , to complete the spin-valve MR sensor of this invention.
- This spin-valve MR sensor is created on top of a lower magnetic shield layer and alumina insulating layer 20 formed on the substrate in FIG. 4; on top of it are formed an upper shield layer, a write head, read and write signal terminals and other components, all of which is covered by an alumina protective layer. This is followed by machining into a slider from the wafer, and addition of a suspension and leader line and assembly, to complete the compound thin film magnetic head of this invention.
- a thin film magnetic head was assembled using a spin-valve MR sensor comprising the layers Ta (30 ⁇ )/NiFeCr (40 ⁇ )/PtMn (250 ⁇ )/CoFe (20 ⁇ )/Ru (8.5 ⁇ )/CoFe (26 ⁇ )/Cu (24 ⁇ )/CoFe (10A)/NiFe (20 ⁇ )/Cu (10A)/Ru (5 ⁇ )/Ta (30 ⁇ ), fabricated by a method similar to that of the embodiment described above, and heat-treated at 270° C. for 10 hours in vacuum in a 15 kG magnetic field, and the read/write characteristics of the head were measured using a read-write tester.
- a thin film magnetic head was also fabricated with exactly the same composition, except for the fact that the back layer consisted only of a Cu layer, and read/write characteristics were similarly measured. The measurement results appear in Table 1 below.
- the spin-valve magnetoresistance sensor of this invention has a thinner free layer and higher magnetic sensitivity, and not only can a higher read output be obtained, but by forming a back layer from two or more nonmagnetic metal layers, fluctuations in H int due to fluctuations in the film thickness can be effectively suppressed. Consequently scattering in the asymmetry of the read output can be suppressed, the magnetic characteristics of the sensor can be stabilized, and high recording densities in magnetic recording can be realized. Further, a thin film magnetic head providing high performance and stability, and enabling larger-capacity, higher-density magnetic recording, can be manufactured with good production yields.
Abstract
Description
TABLE 1 | |||||
Read output | Standard | ||||
Back layer | per unit | Output | deviation of | ||
structure | track width | asymmetry | asymmetry | ||
This invention | Cu(10Å)/ | 3.05 mV/μm | 2.40% | 7.29% |
Ru(5Å) | ||||
Example for | Cu(10Å) | 2.97 mV/μm | 4.45% | 10.81% |
comparison | ||||
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JP30755499A JP2001126219A (en) | 1999-10-28 | 1999-10-28 | Spin valve magneto-resistive sensor and thin film magnetic head |
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