US708052A - Etching designs. - Google Patents

Etching designs. Download PDF

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Publication number
US708052A
US708052A US9325299A US1899093252A US708052A US 708052 A US708052 A US 708052A US 9325299 A US9325299 A US 9325299A US 1899093252 A US1899093252 A US 1899093252A US 708052 A US708052 A US 708052A
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United States
Prior art keywords
etching
plates
etched
steam
receptacle
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Expired - Lifetime
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US9325299A
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Isidor Kitsee
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Individual
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas

Definitions

  • My invention relates to an improvement in the process of etching.
  • the etching of metallic plates is mostly accomplished by the immersion of the plate in a solution containing acid capable of combining with the metal to be etched.
  • a great improvement over this process consists inv spraying the plate to be etched. ⁇ This process is called by its inventor the .blast process. Undoubtedly the cut of the lines is clearer and the whole process requires less acid than had been heretofore the case; butthe necessary apparatus is cumbersome and a great deal of the acid is lost before it is entirely exhausted.
  • A is the cabinet itself; a, its door; B, the gasinlet pipe; C, the steam-inlet pipe.
  • D represents the plates resting on their support d.
  • E is the outlet-pipe for the steam-combined gas.
  • the underlying principle of my invention consists in the application of the agent capable of etching in the form of gas or fume to the plate to be etched; but as the dried gases alone would not be capable of etching the plate in a manner necessary for artistic printing it is advisable toeither apply moisture to the plate, or, as I prefer, to apply at one and the same time moist steam to the metal to be etched.
  • the 'modus operandi' of practicing my invention is as follows:
  • the plates to be etched are assembled in a receptacle and are placed on suitable supports. I have found that the etching is accomplished far better if the plates are placed'face downward, so that the moisture will not accumulate on the surface.
  • the valves of the pipes B and C, leading, respectively, to the' steam generatorandthe generator of the gases, capable of etching when combined with moisture, are opened and the'receptacle lled simultaneously with the gases and steam.
  • the outlet-pipe is provided with a pressurevalve, so that the steam and gas shall exert a certain pressure on the surface of the plates before being able to escape. It is best to have one ofthe sides of the receptacle made of glass, so that the operator can see the progress of the operation.. It is unnecessary to say that all parts of the metallic plate not to be etched have to be carefully waxed or paraflined or provided withany other acid-resistant medium. If at'nearly every section of the shelf on which the plate rests the outer wall of the receptacle is provided with a slit, to be conveniently closed and opened, the plates can each separately at different times be taken out to be examined without opening the receptacle.
  • time of operation will have to vary according to the depth of the lines to be etched, and a shorter or longer time may be required for dierent metals. Repeated trials will soon teach the operator what particular degree of concentration will be required for his work or what length of time is necessary for the operation, and it is in his power through the addition of more or less steam or more or less active gas to secure the desired result.
  • the method of etching which consists in bringing in contact the parts of the plates to be etched, simultaneously with two agents each from a separate source, one agent in a ISIDOR K/ITSEE.

Description

Pat'entd Sept. 2, |902.
I. KITSEE. ETCHING DESIGNS. (Application filed S-apt.` 18, 1899. Renewed Feb. 8, 1902'.)
(No Model.)
I nventor..
Witnesses.
TN: nonms ravens co., Puorcyumo.. msnmn'mn. n. c.
UNITED STATES PATENT OFFICE.
ISIDOR KITSEE, lOF PHILADELPHIA, PENNSYLVANIA.
ETCHING DESIGNS.
SPECIFICATION forming part 0f Letters Patent No. 708,052, dated September 2, 1902.
Application iiledeptember 18, 1899. Renewed February 8,1902. Serial No. 93,252. (No specimens.)
To all whom it may concern.-V
Be it known that I, IsIDoR Krrsnn, of the city and county of Philadelphia,S tate of Pennsylvania, have invented certain new and useful Improvements in the Process of Etching, of which the following is a specification.
My invention relates to an improvement in the process of etching.
The etching of metallic plates is mostly accomplished by the immersion of the plate in a solution containing acid capable of combining with the metal to be etched. A great improvement over this process consists inv spraying the plate to be etched. `This process is called by its inventor the .blast process. Undoubtedly the cut of the lines is clearer and the whole process requires less acid than had been heretofore the case; butthe necessary apparatus is cumbersome and a great deal of the acid is lost before it is entirely exhausted.
It is the object of my invention' to simplify,
the process of etching and to obtain results comparing favorably with hand etching with the aid of unskilled labor.
Referring to the drawing which illustrates in sectional view a receptacle orA cabinet, A is the cabinet itself; a, its door; B, the gasinlet pipe; C, the steam-inlet pipe.
D represents the plates resting on their support d.
E is the outlet-pipe for the steam-combined gas.
The underlying principle of my invention consists in the application of the agent capable of etching in the form of gas or fume to the plate to be etched; but as the dried gases alone would not be capable of etching the plate in a manner necessary for artistic printing it is advisable toeither apply moisture to the plate, or, as I prefer, to apply at one and the same time moist steam to the metal to be etched.
The 'modus operandi' of practicing my invention is as follows: The plates to be etched are assembled in a receptacle and are placed on suitable supports. I have found that the etching is accomplished far better if the plates are placed'face downward, so that the moisture will not accumulate on the surface. After the plates are assembled and the receptacle is closed the valves of the pipes B and C, leading, respectively, to the' steam generatorandthe generator of the gases, capable of etching when combined with moisture, are opened and the'receptacle lled simultaneously with the gases and steam.
-The outlet-pipe is provided with a pressurevalve, so that the steam and gas shall exert a certain pressure on the surface of the plates before being able to escape. It is best to have one ofthe sides of the receptacle made of glass, so that the operator can see the progress of the operation.. It is unnecessary to say that all parts of the metallic plate not to be etched have to be carefully waxed or paraflined or provided withany other acid-resistant medium. If at'nearly every section of the shelf on which the plate rests the outer wall of the receptacle is provided with a slit, to be conveniently closed and opened, the plates can each separately at different times be taken out to be examined without opening the receptacle. It is understood that the time of operation will have to vary according to the depth of the lines to be etched, and a shorter or longer time may be required for dierent metals. Repeated trials will soon teach the operator what particular degree of concentration will be required for his work or what length of time is necessary for the operation, and it is in his power through the addition of more or less steam or more or less active gas to secure the desired result.
Having now described my invention, Wh I claim as new, and desire to secure by Letters Patent, is-
1. The method of etching metallic plates, lwhich consists in subjecting said plates simultaneously to the action `of an active gas or vapor and to the action of steam.
2. The method of etching, which consists in bringing in contact the parts of the plates to be etched, simultaneously with two agents each from a separate source, one agent in a ISIDOR K/ITSEE.
Vitnesses:
E. R. STILLEY, WM L ICO
US9325299A 1899-09-18 1899-09-18 Etching designs. Expired - Lifetime US708052A (en)

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US9325299A US708052A (en) 1899-09-18 1899-09-18 Etching designs.

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429763A (en) * 1964-01-30 1969-02-25 Azoplate Corp Etching grill for one-step etching machines
US5181985A (en) * 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429763A (en) * 1964-01-30 1969-02-25 Azoplate Corp Etching grill for one-step etching machines
US5181985A (en) * 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers

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