US7358181B2 - Method for structuring a semiconductor device - Google Patents
Method for structuring a semiconductor device Download PDFInfo
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- US7358181B2 US7358181B2 US11/074,699 US7469905A US7358181B2 US 7358181 B2 US7358181 B2 US 7358181B2 US 7469905 A US7469905 A US 7469905A US 7358181 B2 US7358181 B2 US 7358181B2
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000006243 chemical reaction Methods 0.000 claims description 38
- 238000005530 etching Methods 0.000 claims description 32
- 239000010936 titanium Substances 0.000 claims description 26
- 229910052719 titanium Inorganic materials 0.000 claims description 25
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 24
- 150000004767 nitrides Chemical class 0.000 claims description 20
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 17
- 229920005591 polysilicon Polymers 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 8
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910021341 titanium silicide Inorganic materials 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims 1
- 239000000047 product Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 12
- 125000006850 spacer group Chemical group 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
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- 229910008479 TiSi2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000002602 lanthanoids Chemical group 0.000 description 2
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- 230000002250 progressing effect Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
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- 229910052747 lanthanoid Inorganic materials 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66606—Lateral single gate silicon transistors with final source and drain contacts formation strictly before final or dummy gate formation, e.g. contact first technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising silicides
Definitions
- the present invention relates to a method for structuring a laterally extending first layer in a semiconductor device with the aid of a reactive second layer, which together with the first layer to be structured forms first reaction products, which are removed by material removal that acts selectively on the first reaction products.
- a semiconductor device is understood to mean a wafer, for example.
- a method is known from U.S. Pat. No. 6,211,044 B1 that is directed to the fabrication of MOS transistors having gate electrodes that are smaller than 0.1 micrometers in width. According to U.S. Pat. No. 6,211,044 B1, such widths cannot be defined reliably even with lithographic methods operating with ultraviolet light. In order to define such widths, first a nitride etch stop layer and then a first metallic reaction layer, and subsequently a layer that is inert relative to the reaction layer, are created on a wafer having a gate layer on a layer series of a dielectric gate layer and a semiconductor substrate.
- a hard mask is formed from the reaction layer and the inert layer by lithographic steps, and this hard mask defines a lithography-dependent first width D 1 in an etching step. After an etching step, corresponding mesa structures with the width D 1 remain on the etch stop layer, which contain material of the first metallic reaction layer. To reduce the structure width, a second reaction layer of polysilicon is deposited, from which reactive spacers on the side walls of the mesa structures are created through an anisotropic etching step.
- the side walls of the mesa structures are silicidized by a laterally progressing reaction of the spacer material with the material of the first reaction layer, wherein a remaining volume of material of the first reaction layer with width D 2 ⁇ D 1 , between the silicidized side walls, is not encompassed by the reaction.
- a structure width D 2 that is reduced in the lateral direction is thus produced by selective etching of the silicide, in which the remaining volume is not removed.
- the remaining volume subsequently serves as a hard mask for structuring the etch stop layer and the gate layer beneath it.
- One example is conductive layers of polysilicon that must be locally removed to a defined depth to permit dielectric insulation from conductive layers to be deposited thereon. For example, when a first conductor of polysilicon is deposited over a nitride block, a three-dimensional conductor structure results that is cut into during planarization.
- This object is attained in a method of the aforementioned type in that the structuring (accomplished through solid reactions between individual layers) takes place in a vertical direction.
- a thickness of the second layer can control an extent of material removal taking place in the vertical direction.
- the quantity of reaction products, and thus the depth to which the first layer to be structured is subsequently removed, is determined by the thickness of the second layer (auxiliary layer, reaction layer). Since the second layer can be deposited with high precision in its layer thickness, there results a corresponding precision with which the first layer can be structured in the vertical direction.
- first layer and the second layer are locally separated from one another by third layer regions, wherein the third layer regions either do not react with the auxiliary layer, or in the event of reactions with the auxiliary layer form second reaction products that are not removed by the material removal that acts selectively on the first reaction products.
- the structuring reaction is suppressed locally, so the structuring of the first layer can be determined by the structure of the third layer.
- the first layer can be electrically conductive.
- buried conductors can be produced that, by additional measures, can be dielectrically insulated vertically from additional vertically offset conductors.
- a lateral structure is defined as a result of the exposure of the first layer through openings in the third layer.
- a reaction partner is provided for the first layer to be structured in the vertical direction.
- the third layer serves as a passivating intermediate layer, which permits reactions between the first and second layers only at the opened locations.
- the first layer can also be produced by depositing semiconductor material over dielectric structures that are arranged on the substrate, and for the local opening of the third layer to be accomplished through a planarization step in which the dielectric structures serve as polish stop.
- step of creating conditions under which parts of the third layer react with parts of the first layer into the first reaction products there can be a step in which the semiconductor device is temporarily subjected to elevated temperatures.
- step of producing such reaction conditions there can be a step in which the semiconductor device is temporarily subjected to a nitrogen atmosphere.
- the nitride formed here under the nitrogen atmosphere with material of the reaction layer can generally be removed together with excess material of the reaction layer with the same etching agent.
- the dielectric structure is made of nitride.
- nitride as a dielectric structure has the special advantage that the nitride can be used as a polish stop in a later planarization step, which opens the passivating third layer. Moreover, the nitride structures can be selectively removed, providing further structuring possibilities in which the nitride structures, in later process steps, are, for example, wholly or partially replaced by spacers.
- the first layer can be made of polysilicon, and the second layer can have at least one metal or a metal alloy, and the third layer can have SiO 2 and/or Si 3 N 4 .
- polysilicon makes it possible to produce buried conductors, for example.
- the aforementioned elements and alloys are suitable for use as reaction partners for polysilicon in order to produce silicides. Together with the aforementioned oxides and nitrides, material pairings result that can be selectively processed and structured.
- the second layer can be made of titanium, so that the first reaction products are titanium silicide.
- any Ti nitride formed in addition to the desired Ti silicide can be removed together with excess titanium, for example, by a wet chemical etching step with a solution of NH 4 OH, H 2 O 2 and H 2 O in a ratio of 1 to 1 to 5.
- Excess titanium can be removed by an etching step that preferentially removes the titanium and the titanium nitride formed under the nitrogen atmosphere.
- an etching agent of H 2 SO 4 and H 2 O 2 in a ratio of 2 to 1 or an etching agent of NH 4 OH, H 2 O 2 and H 2 O in a ratio of 1 to 1 to 5 can be used in the titanium-removing etching step.
- etching agents may be used as alternatives to one another.
- a titanium etching agent of H 2 SO 4 and H 2 O 2 in a ratio of 2 to 1 etches oxide at approximately one tenth the etching rate for titanium.
- it etches polysilicon and silicon nitride at approximately one thousandth the etching rate of titanium, and is thus excellently suited to selective removal of titanium and titanium nitride.
- the titanium silicide can be removed by boiling, concentrated hydrochloric acid, or by NH 3 and H 2 O 2 in a ratio of 1 to 1.
- Hydrochloric acid and NH 3 and H 2 O 2 in a ratio of 1 to 1 have an excellent selective action on oxide, nitride and polysilicon.
- the volumes produced by the removal of the reaction products can be filled by a dielectric and a second conductive layer can be produced thereon.
- FIG. 1 is a cross-section of a wafer in a first manufacturing stage with a first layer and a passivating third layer according to an embodiment of the present invention
- FIG. 2 shows the wafer from FIG. 1 after an opening planarization step
- FIG. 3 shows the wafer from FIG. 2 after production of a second layer
- FIG. 4 shows the wafer from FIG. 3 after a creation of conditions under which parts of the second layer react with parts of the first layer into the first reaction products;
- FIG. 5 shows the wafer from FIG. 4 after a removal of reaction products
- FIG. 6 shows a wafer from FIG. 5 after additional process steps according to a further embodiment of the present invention.
- number 10 designates a wafer having a substrate layer 12 , which may already contain structures 14 .
- the structures 14 may be, for example, dielectric layers that insulate electronic devices, which can be made later, such as transistors or capacitors, from the substrate layer 12 and that have a non-trivial topography.
- the substrate layer 12 can be silicon and can carry nitride blocks 16 .
- a laterally extending first layer 18 is produced over the nitride blocks.
- the first layer is electrically conductive, so that it can later be used as a conductor.
- the first layer 18 can be made of polysilicon, for example, and can be produced through chemical vapor deposition (CVD). Instead of polysilicon, it is also generally possible for a silicon layer of a morphology not specified in detail (monocrystalline or amorphous) to be deposited.
- the first layer is covered by a passivating third layer 20 , which can be formed for example of TEOS oxide.
- TEOS stands for tetraethyl orthosilicate. Decomposition of this compound at average temperatures (up to approximately 700° C.) produces silicon dioxide.
- the surface of the first layer 18 can also be thermally oxidized so that a third layer 20 of silicon dioxide grows.
- the reaction-inhibiting, structured third layer 20 can also be made of Si 3 N 4 and possibly also contain nonstoichiometric additions of oxygen (“SiON”).
- FIG. 2 shows the wafer 10 after further process steps.
- the third layer 20 is laterally structured, which is to say opened at individual locations.
- the structuring can be accomplished with the aid of lithographic masks or otherwise defined masks.
- the opening can also be accomplished by a planarization step, in which the structure from FIG. 1 is abraded down to the nitride blocks 16 , with the nitride blocks 16 serving as polish stop.
- FIG. 2 shows the wafer 10 after such a planarization step, in which the first layer 18 is cut into in the opened regions 22 .
- layers located beneath the third layer 20 or parts of the substrate layer 12 can also be acted on or structured through, where this seems useful.
- a reactive, second layer 24 is deposited on the opened structure in another step; under suitable conditions this layer, together with the first layer 18 to be structured, forms first reaction products that are removed by material removal which acts selectively on the first reaction products.
- FIG. 3 shows the wafer 10 after deposition of the second layer 24 .
- the upper, reactive second layer 24 can be, e.g., a transitional metal or a member of the lanthanide group, for example Pt, Ti, Co, Ni, Y or Gd, Dy, Er, Lu, Yb, or of mixtures of such transitional metals and/or lanthanides.
- the second layer 24 can be made of metals or metal alloys.
- titanium is considered an especially suitable material for the second layer 24 .
- the thickness d of the second layer 24 determines the quantity of reactive material that lies over the opened regions 22 . Consequently, the thickness of the layer 24 represents an important parameter for determining the depth of the solid reaction occurring in the vertical direction.
- the first layer 18 and the second layer 24 are locally separated from one another by regions of the third layer 20 .
- the third layer 20 has a passivating, and hence a reaction-inhibiting, effect.
- structuring due to solid reactions between the first layer 18 and the second layer 24 only occurs in the opened regions 22 and largely only in the vertical direction.
- a solid reaction is triggered by setting up suitable reaction conditions. Such conditions obtain for rapid thermal annealing (RTA) in a nitrogen atmosphere at 550° C. to 680° C.
- RTA rapid thermal annealing
- TiN is formed in orthorhombic face-centered modification of the surface of the titanium layer. The temperature is limited at the lower end by the reaction rate of titanium with silicon, and at the upper end by the undesirable reaction of titanium with SiO 2 to form substoichiometric rutile (crystal of titanium and oxygen with fewer than two oxygen atoms per titanium atom).
- the SiO 2 stems from the reaction-inhibiting third layer 20 , for example.
- FIG. 4 shows the wafer after the conclusion of such a solid reaction, in which parts of the first layer 18 and of the second layer 24 have been converted into selectively soluble first reaction products 28 to a defined depth 26 in the first layer 18 .
- the first reaction products 28 is titanium silicide.
- This etching step can be accomplished, for example, through the use of an etching agent of H 2 SO 4 and H 2 O 2 in a ratio of 2 to 1 or an etching agent of NH 4 OH, H 2 O 2 and H 2 O in a ratio of 1 to 1 to 5.
- reaction products 28 composed for example of titanium silicide
- reaction products 28 are removed.
- a titanium etching agent of NH 3 : H 2 O 2 can be used.
- Hydrochloric acid is excellently selective to oxide, nitride and polysilicon, while the cited titanium etching agent etches oxide at approximately one tenth the etching rate for titanium, and polysilicon and silicon nitride at approximately one thousandth.
- FIG. 5 shows the wafer 10 after the process steps of producing the first layer 18 on a substrate 12 , producing the third layer 20 on the first layer 18 , local opening of the third layer 20 such that the first layer 18 is exposed at the opened locations ( 22 in FIGS. 2 and 3 ), production of the second layer 24 on the third layer 20 , creation of conditions under which parts of the second layer 24 react with parts of the first layer 18 into the first reaction products 28 , and removal of the first reaction products 28 . Material-free volumes 31 are created as a result of the removal of the reaction products 28 .
- the volumes 31 that result from removal of the reaction products 28 can be filled with a dielectric.
- another dielectric is first applied, and planarized by CMP while using the nitride block 16 as polish stop. Then the nitride block 16 and parts of the structures 14 are removed. Inside spacers 34 are placed in the resultant opening.
- FIG. 6 shows the structure produced after application of another electrically conductive layer 35 , in which electrically conductive structures 32 , 35 that are self-aligned with one another but electrically insulated from one another, have been produced through the use of solid reactions progressing in the vertical direction.
- an auxiliary layer 24 is deposited that is reactive with the first layer 18 at a subsequent high temperature step, but not with the dielectric 20 employed, and is caused to react with the first layer 18 .
- the feed materials are chosen such that both the layer 24 and its reaction products 28 with the first layer 18 can be selectively removed.
- the thickness of the layer 24 precisely controlled during the deposition, determines the depth of the solid reaction so no etch stop layer is necessary. In the ideal case, the part of the layer 24 that is not converted by the solid reaction, which is to say the part above the dielectric 20 , can also be removed selectively with respect to the other layers.
Abstract
Description
-
- production of the first layer on a substrate;
- production of the third layer on the first layer;
- local opening of the third layer such that the first layer is exposed at the opened locations;
- production of the second layer on the third layer and on the opened locations where the first layer is exposed;
- creation of conditions under which parts of the second layer react with parts of the first layer into the first reaction products; and
- removal of the first reaction products.
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102004013047A DE102004013047B4 (en) | 2004-03-10 | 2004-03-10 | Method for structuring a conductive layer of a semiconductor device |
DE102004013047.7 | 2004-03-10 |
Publications (2)
Publication Number | Publication Date |
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US20050202669A1 US20050202669A1 (en) | 2005-09-15 |
US7358181B2 true US7358181B2 (en) | 2008-04-15 |
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US11/074,699 Active 2026-06-14 US7358181B2 (en) | 2004-03-10 | 2005-03-09 | Method for structuring a semiconductor device |
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DE (1) | DE102004013047B4 (en) |
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DE102004017166B4 (en) * | 2004-04-01 | 2007-10-11 | Atmel Germany Gmbh | Process for the production of bipolar transistors |
CN101984405A (en) * | 2010-10-11 | 2011-03-09 | 中兴通讯股份有限公司 | Method of software version upgrade and terminal and system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US4818723A (en) * | 1985-11-27 | 1989-04-04 | Advanced Micro Devices, Inc. | Silicide contact plug formation technique |
US5587338A (en) * | 1995-04-27 | 1996-12-24 | Vanguard International Semiconductor Corporation | Polysilicon contact stud process |
US6211044B1 (en) | 1999-04-12 | 2001-04-03 | Advanced Micro Devices | Process for fabricating a semiconductor device component using a selective silicidation reaction |
US20020187606A1 (en) | 2000-06-16 | 2002-12-12 | Drynan John M. | Interconnect line selectively isolated from an underlying contact plug |
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2004
- 2004-03-10 DE DE102004013047A patent/DE102004013047B4/en not_active Expired - Fee Related
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2005
- 2005-03-09 US US11/074,699 patent/US7358181B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5587338A (en) * | 1995-04-27 | 1996-12-24 | Vanguard International Semiconductor Corporation | Polysilicon contact stud process |
US6211044B1 (en) | 1999-04-12 | 2001-04-03 | Advanced Micro Devices | Process for fabricating a semiconductor device component using a selective silicidation reaction |
US20020187606A1 (en) | 2000-06-16 | 2002-12-12 | Drynan John M. | Interconnect line selectively isolated from an underlying contact plug |
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US20050202669A1 (en) | 2005-09-15 |
DE102004013047A1 (en) | 2005-10-06 |
DE102004013047B4 (en) | 2009-01-02 |
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