US7385457B2 - Flexible capacitive coupler assembly and method of manufacture - Google Patents
Flexible capacitive coupler assembly and method of manufacture Download PDFInfo
- Publication number
- US7385457B2 US7385457B2 US11/390,510 US39051006A US7385457B2 US 7385457 B2 US7385457 B2 US 7385457B2 US 39051006 A US39051006 A US 39051006A US 7385457 B2 US7385457 B2 US 7385457B2
- Authority
- US
- United States
- Prior art keywords
- flexible
- package
- dielectric substrate
- coupler
- capacitive coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 238000000034 method Methods 0.000 title description 27
- 238000004519 manufacturing process Methods 0.000 title description 4
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000005476 soldering Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000004891 communication Methods 0.000 description 25
- 230000008901 benefit Effects 0.000 description 16
- 239000004033 plastic Substances 0.000 description 15
- 239000003990 capacitor Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 7
- 239000011449 brick Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 229920001646 UPILEX Polymers 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000001010 compromised effect Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000029305 taxis Effects 0.000 description 1
- 229960005196 titanium dioxide Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/95—Electrical connector adapted to transmit electricity to mating connector without physical contact, e.g. by induction, magnetism, or electrostatic field
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Near-Field Transmission Systems (AREA)
- Combinations Of Printed Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
Claims (19)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/390,510 US7385457B2 (en) | 2002-10-03 | 2006-03-27 | Flexible capacitive coupler assembly and method of manufacture |
US12/134,316 US20080238582A1 (en) | 2002-10-03 | 2008-06-06 | Flexible Capacitive Coupler Assembly And Method Of Manufacture |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/264,893 US7038553B2 (en) | 2002-10-03 | 2002-10-03 | Scalable computer system having surface-mounted capacitive couplers for intercommunication |
US11/390,510 US7385457B2 (en) | 2002-10-03 | 2006-03-27 | Flexible capacitive coupler assembly and method of manufacture |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/264,893 Continuation-In-Part US7038553B2 (en) | 2002-10-03 | 2002-10-03 | Scalable computer system having surface-mounted capacitive couplers for intercommunication |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/134,316 Continuation US20080238582A1 (en) | 2002-10-03 | 2008-06-06 | Flexible Capacitive Coupler Assembly And Method Of Manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070085625A1 US20070085625A1 (en) | 2007-04-19 |
US7385457B2 true US7385457B2 (en) | 2008-06-10 |
Family
ID=32042352
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/264,893 Expired - Fee Related US7038553B2 (en) | 2002-10-03 | 2002-10-03 | Scalable computer system having surface-mounted capacitive couplers for intercommunication |
US11/390,510 Expired - Fee Related US7385457B2 (en) | 2002-10-03 | 2006-03-27 | Flexible capacitive coupler assembly and method of manufacture |
US12/134,316 Abandoned US20080238582A1 (en) | 2002-10-03 | 2008-06-06 | Flexible Capacitive Coupler Assembly And Method Of Manufacture |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/264,893 Expired - Fee Related US7038553B2 (en) | 2002-10-03 | 2002-10-03 | Scalable computer system having surface-mounted capacitive couplers for intercommunication |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/134,316 Abandoned US20080238582A1 (en) | 2002-10-03 | 2008-06-06 | Flexible Capacitive Coupler Assembly And Method Of Manufacture |
Country Status (10)
Country | Link |
---|---|
US (3) | US7038553B2 (en) |
EP (1) | EP1550023A2 (en) |
JP (1) | JP2006517039A (en) |
KR (1) | KR100754565B1 (en) |
CN (1) | CN1316329C (en) |
AU (1) | AU2003278895A1 (en) |
CA (1) | CA2498133C (en) |
MX (1) | MXPA05003568A (en) |
TW (1) | TWI280496B (en) |
WO (1) | WO2004034240A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8622762B2 (en) | 2010-11-22 | 2014-01-07 | Andrew Llc | Blind mate capacitively coupled connector |
US8622768B2 (en) | 2010-11-22 | 2014-01-07 | Andrew Llc | Connector with capacitively coupled connector interface |
US8894439B2 (en) | 2010-11-22 | 2014-11-25 | Andrew Llc | Capacitivly coupled flat conductor connector |
US9048527B2 (en) | 2012-11-09 | 2015-06-02 | Commscope Technologies Llc | Coaxial connector with capacitively coupled connector interface and method of manufacture |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7242579B2 (en) * | 2004-01-09 | 2007-07-10 | International Business Machines Corporation | System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers |
US7617336B1 (en) | 2005-04-05 | 2009-11-10 | Sprint Communications Company L.P. | Blade computing system |
US8351204B2 (en) * | 2008-01-31 | 2013-01-08 | Hewlett-Packard Development Company, L.P. | Modular data processing components and systems |
ES2370587T3 (en) * | 2009-04-14 | 2011-12-20 | Actaris Sas | WIRELESS BIDIRECTIONAL TRANSMISSION OF SERIAL DATA SIGNS BETWEEN AN ELECTRONIC EQUIPMENT AND AN ENERGY METER. |
US8405229B2 (en) * | 2009-11-30 | 2013-03-26 | Endicott Interconnect Technologies, Inc. | Electronic package including high density interposer and circuitized substrate assembly utilizing same |
US8174826B2 (en) * | 2010-05-27 | 2012-05-08 | International Business Machines Corporation | Liquid cooling system for stackable modules in energy-efficient computing systems |
US8279597B2 (en) | 2010-05-27 | 2012-10-02 | International Business Machines Corporation | Heatsink allowing in-situ maintenance in a stackable module |
US8358503B2 (en) | 2010-05-28 | 2013-01-22 | International Business Machines Corporation | Stackable module for energy-efficient computing systems |
US8179674B2 (en) | 2010-05-28 | 2012-05-15 | International Business Machines Corporation | Scalable space-optimized and energy-efficient computing system |
US8496527B2 (en) * | 2010-06-02 | 2013-07-30 | Sony Computer Entertainment Inc. | Capacitive input for computer program |
CN103959555B (en) | 2011-12-22 | 2017-03-08 | 康普技术有限责任公司 | Capacitive character blindmate module interconnects |
GB2529617B (en) * | 2014-08-05 | 2018-11-28 | Cybula Ltd | Computing devices |
US9924595B2 (en) * | 2014-12-11 | 2018-03-20 | Intel Corporation | Cable for alternative interconnect attachement |
US10816583B2 (en) * | 2018-11-28 | 2020-10-27 | The Boeing Company | Differential capacitive probe for measuring contact resistance |
CN111508901B (en) | 2019-10-01 | 2022-01-25 | 威锋电子股份有限公司 | Integrated circuit chip, packaging substrate and electronic assembly |
TWM599029U (en) * | 2019-10-01 | 2020-07-21 | 威鋒電子股份有限公司 | Integrated circuit chip, package substrate and electronic assembly |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3921167A (en) * | 1974-06-14 | 1975-11-18 | Ibm | Capacitive circuitboard |
US4423465A (en) * | 1981-09-30 | 1983-12-27 | Teng Ching Weng | Combination electronic circuit element with multidirectionally adjustable joints |
US4486739A (en) | 1982-06-30 | 1984-12-04 | International Business Machines Corporation | Byte oriented DC balanced (0,4) 8B/10B partitioned block transmission code |
US4674010A (en) | 1985-01-17 | 1987-06-16 | Shell Oil Company | Capacitive submergible electrical connector apparatus |
US4884982A (en) | 1989-04-03 | 1989-12-05 | Amp Incorporated | Capacitive coupled connector |
US5274336A (en) | 1992-01-14 | 1993-12-28 | Hewlett-Packard Company | Capacitively-coupled test probe |
US5629838A (en) | 1993-06-24 | 1997-05-13 | Polychip, Inc. | Apparatus for non-conductively interconnecting integrated circuits using half capacitors |
US5691885A (en) * | 1992-03-17 | 1997-11-25 | Massachusetts Institute Of Technology | Three-dimensional interconnect having modules with vertical top and bottom connectors |
US5714864A (en) | 1996-01-16 | 1998-02-03 | Electro Dynamics, Inc. | Capacitive charge coupling with dual connector assemblies and charging system |
US5870067A (en) | 1993-12-15 | 1999-02-09 | Bsc Developments Ltd. | Contactless data/power bus |
US5936841A (en) | 1996-01-02 | 1999-08-10 | International Business Machines Corporation | PCMCIA RF connector |
US5977841A (en) | 1996-12-20 | 1999-11-02 | Raytheon Company | Noncontact RF connector |
US6033263A (en) | 1996-10-15 | 2000-03-07 | The Whitaker Corporation | Electrically connector with capacitive coupling |
US6205138B1 (en) | 1998-04-24 | 2001-03-20 | International Business Machines Corporation | Broadband any point to any point switch matrix |
US6299280B1 (en) | 1998-05-18 | 2001-10-09 | Canon Research Centre France S.A. | Method of transmitting information by capacitive connection and a device adapted to implement it, such as a printer |
US6362972B1 (en) | 2000-04-13 | 2002-03-26 | Molex Incorporated | Contactless interconnection system |
US6525620B1 (en) * | 1999-05-21 | 2003-02-25 | Intel Corporation | Capacitive signal coupling device |
US6687128B2 (en) * | 2000-09-21 | 2004-02-03 | Tsunemi Tokuhara | Associative type computers |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5065277A (en) | 1990-07-13 | 1991-11-12 | Sun Microsystems, Inc. | Three dimensional packaging arrangement for computer systems and the like |
US5591885A (en) * | 1994-09-23 | 1997-01-07 | Hoffman-La Roche Inc. | Process for the preparation of halogenated α-aminoketone compounds |
US5552633A (en) * | 1995-06-06 | 1996-09-03 | Martin Marietta Corporation | Three-dimensional multimodule HDI arrays with heat spreading |
US5808529A (en) * | 1996-07-12 | 1998-09-15 | Storage Technology Corporation | Printed circuit board layering configuration for very high bandwidth interconnect |
US6563042B2 (en) * | 1999-05-21 | 2003-05-13 | Intel Corporation | Radiating enclosure |
US6554492B2 (en) * | 2001-06-01 | 2003-04-29 | Stratos Lightwave | Addressable transceiver module |
US6977841B2 (en) * | 2002-11-21 | 2005-12-20 | Micron Technology, Inc. | Preconditioning of defective and redundant columns in a memory device |
-
2002
- 2002-10-03 US US10/264,893 patent/US7038553B2/en not_active Expired - Fee Related
-
2003
- 2003-09-19 CA CA2498133A patent/CA2498133C/en not_active Expired - Fee Related
- 2003-09-19 MX MXPA05003568A patent/MXPA05003568A/en active IP Right Grant
- 2003-09-19 EP EP03770412A patent/EP1550023A2/en not_active Ceased
- 2003-09-19 JP JP2004543011A patent/JP2006517039A/en active Pending
- 2003-09-19 CN CNB038235536A patent/CN1316329C/en not_active Expired - Fee Related
- 2003-09-19 KR KR1020057003617A patent/KR100754565B1/en not_active IP Right Cessation
- 2003-09-19 WO PCT/US2003/030130 patent/WO2004034240A2/en active Application Filing
- 2003-09-19 AU AU2003278895A patent/AU2003278895A1/en not_active Abandoned
- 2003-09-30 TW TW092127006A patent/TWI280496B/en not_active IP Right Cessation
-
2006
- 2006-03-27 US US11/390,510 patent/US7385457B2/en not_active Expired - Fee Related
-
2008
- 2008-06-06 US US12/134,316 patent/US20080238582A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3921167A (en) * | 1974-06-14 | 1975-11-18 | Ibm | Capacitive circuitboard |
US4423465A (en) * | 1981-09-30 | 1983-12-27 | Teng Ching Weng | Combination electronic circuit element with multidirectionally adjustable joints |
US4486739A (en) | 1982-06-30 | 1984-12-04 | International Business Machines Corporation | Byte oriented DC balanced (0,4) 8B/10B partitioned block transmission code |
US4674010A (en) | 1985-01-17 | 1987-06-16 | Shell Oil Company | Capacitive submergible electrical connector apparatus |
US4884982A (en) | 1989-04-03 | 1989-12-05 | Amp Incorporated | Capacitive coupled connector |
US5274336A (en) | 1992-01-14 | 1993-12-28 | Hewlett-Packard Company | Capacitively-coupled test probe |
US5691885A (en) * | 1992-03-17 | 1997-11-25 | Massachusetts Institute Of Technology | Three-dimensional interconnect having modules with vertical top and bottom connectors |
US5629838A (en) | 1993-06-24 | 1997-05-13 | Polychip, Inc. | Apparatus for non-conductively interconnecting integrated circuits using half capacitors |
US5870067A (en) | 1993-12-15 | 1999-02-09 | Bsc Developments Ltd. | Contactless data/power bus |
US5936841A (en) | 1996-01-02 | 1999-08-10 | International Business Machines Corporation | PCMCIA RF connector |
US5714864A (en) | 1996-01-16 | 1998-02-03 | Electro Dynamics, Inc. | Capacitive charge coupling with dual connector assemblies and charging system |
US6033263A (en) | 1996-10-15 | 2000-03-07 | The Whitaker Corporation | Electrically connector with capacitive coupling |
US5977841A (en) | 1996-12-20 | 1999-11-02 | Raytheon Company | Noncontact RF connector |
US6205138B1 (en) | 1998-04-24 | 2001-03-20 | International Business Machines Corporation | Broadband any point to any point switch matrix |
US6299280B1 (en) | 1998-05-18 | 2001-10-09 | Canon Research Centre France S.A. | Method of transmitting information by capacitive connection and a device adapted to implement it, such as a printer |
US6525620B1 (en) * | 1999-05-21 | 2003-02-25 | Intel Corporation | Capacitive signal coupling device |
US6362972B1 (en) | 2000-04-13 | 2002-03-26 | Molex Incorporated | Contactless interconnection system |
US6687128B2 (en) * | 2000-09-21 | 2004-02-03 | Tsunemi Tokuhara | Associative type computers |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8622762B2 (en) | 2010-11-22 | 2014-01-07 | Andrew Llc | Blind mate capacitively coupled connector |
US8622768B2 (en) | 2010-11-22 | 2014-01-07 | Andrew Llc | Connector with capacitively coupled connector interface |
US8894439B2 (en) | 2010-11-22 | 2014-11-25 | Andrew Llc | Capacitivly coupled flat conductor connector |
US9048527B2 (en) | 2012-11-09 | 2015-06-02 | Commscope Technologies Llc | Coaxial connector with capacitively coupled connector interface and method of manufacture |
Also Published As
Publication number | Publication date |
---|---|
JP2006517039A (en) | 2006-07-13 |
AU2003278895A1 (en) | 2004-05-04 |
US20040066249A1 (en) | 2004-04-08 |
KR20060032947A (en) | 2006-04-18 |
MXPA05003568A (en) | 2005-06-03 |
US20080238582A1 (en) | 2008-10-02 |
EP1550023A2 (en) | 2005-07-06 |
WO2004034240A3 (en) | 2004-10-07 |
CA2498133C (en) | 2011-02-22 |
KR100754565B1 (en) | 2007-09-05 |
US20070085625A1 (en) | 2007-04-19 |
TW200414000A (en) | 2004-08-01 |
TWI280496B (en) | 2007-05-01 |
CN1316329C (en) | 2007-05-16 |
US7038553B2 (en) | 2006-05-02 |
CN1688954A (en) | 2005-10-26 |
WO2004034240A2 (en) | 2004-04-22 |
AU2003278895A8 (en) | 2004-05-04 |
CA2498133A1 (en) | 2004-04-22 |
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