US7430123B2 - Rack for computer system modules - Google Patents
Rack for computer system modules Download PDFInfo
- Publication number
- US7430123B2 US7430123B2 US11/528,090 US52809006A US7430123B2 US 7430123 B2 US7430123 B2 US 7430123B2 US 52809006 A US52809006 A US 52809006A US 7430123 B2 US7430123 B2 US 7430123B2
- Authority
- US
- United States
- Prior art keywords
- rack
- computer system
- side walls
- module
- top panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1428—Housings for small modular apparatus with terminal block
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1411—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting box-type drawers
Definitions
- the present invention relates to a rack for computer system modules, and particularly to a rack for holding system modules of a desktop computer during testing.
- Mass produced computer system modules such as compact disk-read only memories (CD-ROMs), floppy disk drives (FDDs), hard disk drives (HDDs), optical disk drives (ODDs), motherboards, switching power supplies (SPSs), TV tuner cards, and accelerated graphical port (AGP) cards are often mounted in a desktop computer.
- CD-ROMs compact disk-read only memories
- FDDs floppy disk drives
- HDDs hard disk drives
- ODDs optical disk drives
- motherboards motherboards
- SPSs switching power supplies
- TV tuner cards TV tuner cards
- AGP accelerated graphical port cards
- AGP accelerated graphical port
- What is needed is a rack which conveniently receives modules of a desktop computer to be tested as well as house the requisite components needed to accomplish the testing.
- An exemplary rack for receiving modules of a computer system to be tested includes a chassis including a bracing frame for mounting test components of the computer system, and a top panel attached to the chassis, the top panel includes a braces member, receiving a module for testing, the module is electronically connected to the test components.
- FIG. 1 is an exploded, isometric view of a rack in accordance with a preferred embodiment of the present invention
- FIG. 2 is an assembled view of FIG. 1 ;
- FIG. 3 is a hard disk drive (HDD) in the rack of FIG. 1 .
- HDD hard disk drive
- a mounting apparatus such as a rack in accordance with a preferred embodiment of the present invention includes a top panel 10 and a chassis 100 .
- the chassis 100 is used for mounting test components of the computer system needed to test modules, such as a hard disk drive (HDD), a floppy disk drive (FDD), an optical disk drive (ODD), a switching power supply (SPS), and a motherboard.
- the top panel 10 is used for mounting a module to be tested, such as any one of a motherboard, an HDD, an FDD, and an ODD.
- the top panel 10 includes a plurality of brace members: two supports 11 and 12 each for mounting a data storage device, and a plurality of posts 15 for selectively fastening different kinds of motherboards.
- the chassis 100 includes a plurality of bracing frames: two brackets 70 and 80 each for mounting a data storage device, a plurality of posts 21 for selectively fastening different kinds of motherboards, and a support 22 for mounting a switching power supply (SPS).
- SPS switching power supply
- the supports 11 and 12 are located in the front side of the top panel 10 .
- the support 11 is used for mounting a HDD or a FDD
- the support 12 is used for mounting an ODD.
- the support 11 includes a bottom wall 112 , a side wall 113 fastened to the bottom wall 112 via two screws 114 , and a side wall 115 defining two elliptical shaped locking holes 116 thereof.
- bolts can be inserted into the locking holes 116 so that the side wall 115 is movable to selectively fasten different-sized HDDs or FDDs.
- the structure of the support 12 is the same as the support 11 but of a size to properly accommodate ODDs.
- Two openings 13 and 14 are defined in the top panel 10 corresponding to the supports 11 and 12 .
- the opening 13 is used for extending a data transmission line and a power transmission line of the HDD or FDD being tested, therethrough.
- the opening 14 is used for extending a data transmission line and a power transmission line of the ODD being tested therethrough.
- the posts 15 are mounted on a rear portion of the top panel 10 .
- a power switch 151 is mounted on a left portion of the support 11 , and can be correspondingly connected to an electrical outlet of a motherboard mounted to the posts 15 to be tested.
- Four handles 18 are formed in the four corners of the top panel 10 , for facilitating movement of the top panel 10 by users.
- Three through holes 17 are defined along each of two opposite long edges of the top panel 10 .
- the chassis 100 includes a bottom panel 20 , four panels 30 , 40 , 50 , and 60 .
- Six braces 19 are formed along edges of the bottom panel 20 corresponding to the through holes 17 .
- the bracket 70 for mounting the HDD or the FDD, and the bracket 80 for mounting the ODD, are formed at a front portion of the chassis 100 .
- the posts 21 are mounted on a rear portion of the chassis 100 .
- the power switch 151 can be selectively connected to the motherboard.
- the support 22 is also formed at the rear portion of the chassis 100 , and structure of the support 22 is the same as the support 11 .
- the bracket 70 includes two side walls 71 .
- Four support plates 712 are mounted to each side wall 71 via screws.
- the bracket 70 forms four layers for receiving HDDs and FDDs, first and second layers are in an upper place of the bracket 70 , and third and fourth layers are in a lower place of the bracket 70 .
- Four bolts 721 are attached to one of the side walls 71 to abut against a side of the HDDs and the FDDs, the bolts 721 are adjustable so as to fit different-sized HDDs and FDDs.
- the structure of the bracket 80 is much the same as the bracket 70 .
- the bracket 80 includes two side walls 81 , and two baffles 83 .
- Three support plates 812 are mounted to each side wall 81 via screws.
- the support plates 812 form three layers, for receiving the ODDs.
- Each baffles 83 is arranged at an edge of each side wall 81 , for preventing ODDs from sliding out of the bracket 80 .
- Six bolts 811 are mounted to one of the side walls 81 to abut against a side of the ODDs, the bolts 811 are adjustable so as to fit different-sized ODDs. A number of the layers of the brackets 70 and 80 is increased or decreased according to different applications.
- a rectangular opening 31 is defined in the panel 30 corresponding to the third and the fourth layers of the bracket 70 .
- a rectangular opening 32 is defined in the panel 30 corresponding to the bracket 80 .
- An ODD can be placed directly in any one of the layers of the bracket 80 through the rectangular opening 32 .
- An HDD or a FDD can be placed directly in the third or fourth layer through the rectangular opening 31 , or the top panel 10 may be removed and the HDD or the FDD placed in the first or second layers of the bracket 70 .
- a rectangular opening 41 is formed in a rear of the panel 40 corresponding to the posts 21 of the bottom panel 20 .
- a rectangular opening 42 is formed in the panel 40 corresponding to the support 22 .
- a baffle plate 43 is mounted to the panel 40 through two elliptical shaped locking holes 431 , corresponding to an upper area of the rectangular opening 41 .
- a plate 44 is attached to the baffle plate 43 with two bolts, the plate 44 and the baffle plate 43 cooperate to receive TV tuner cards and AGP cards of a motherboard mounted thereon for use as test components. Bolts can be inserted in the locking holes 431 so that the baffle plate 43 is movable to accommodate mounting plates of different size.
- a plurality of holes 51 is defined in the panel 50 for heat dissipation.
- the module to be tested is placed in the top panel 10 , and test components are placed in the chassis 100 .
- a motherboard is placed in the posts 21 of the bottom panel 20 .
- An SPS is placed in the support 22 .
- An FDD is placed in the third layer of the bracket 70 through the rectangular opening 31 .
- An ODD is placed in one layer of the bracket 80 through the rectangular opening 32 .
- An AGP card and a TV tuner card are mounted to the baffle plate 43 and the plate 44 .
- the HDD 90 is placed in the support 11 .
- the data transmission line 92 from the motherboard and the power transmission line 91 from the SPS are respectively connected to the HDD 90 through the opening 13 .
- the power switch 151 is turned on to begin the test. In this way users only need to change the HDD 90 of the support 11 , to test a next one.
- the panels 30 , 40 , 50 , and 60 can be made of acrylic.
- the top panel 10 , the braces 19 , and the bottom panel 20 can be made of Bakelite.
- the Bakelite provides for inhibiting the buildup of static electricity of users, so that safety of the users is ensured.
- the rack accommodates a variety of sizes of various computer system modules, and is convenient to receive the modules to be tested.
Abstract
Description
Claims (17)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2005200672683U CN2849809Y (en) | 2005-11-11 | 2005-11-11 | Computer module rack |
CN200520067268.3 | 2005-11-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20070109752A1 US20070109752A1 (en) | 2007-05-17 |
US7430123B2 true US7430123B2 (en) | 2008-09-30 |
Family
ID=37522290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/528,090 Expired - Fee Related US7430123B2 (en) | 2005-11-11 | 2006-09-27 | Rack for computer system modules |
Country Status (2)
Country | Link |
---|---|
US (1) | US7430123B2 (en) |
CN (1) | CN2849809Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110096491A1 (en) * | 2009-10-27 | 2011-04-28 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Hard disk drive tray and computer having the same |
CN102298425A (en) * | 2010-06-25 | 2011-12-28 | 鸿富锦精密工业(深圳)有限公司 | Expansion card assembly |
US20130043896A1 (en) * | 2011-08-18 | 2013-02-21 | Hon Hai Precision Industry Co., Ltd. | Test device for printed circuit board |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009102321A1 (en) * | 2008-02-12 | 2009-08-20 | Hewlett-Packard Development Company, L.P. | Computing devices having fail-safe mechanical shut-off switch |
US8705244B2 (en) * | 2008-12-12 | 2014-04-22 | Nec Display Solutions, Ltd. | Projector and unit for projector |
TWI439221B (en) * | 2009-11-27 | 2014-05-21 | Asustek Comp Inc | Motherboard |
KR102052560B1 (en) * | 2017-08-28 | 2019-12-06 | 주식회사 펜터다임 | Slim Type Computer Body Case |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4536051A (en) * | 1981-10-21 | 1985-08-20 | Marconi Instruments Limited | Electrical interface arrangements |
US5131272A (en) * | 1990-03-15 | 1992-07-21 | Harris Corporation | Portable deployable automatic test system |
US5247249A (en) * | 1992-02-13 | 1993-09-21 | Tti Testron, Inc. | Bi-level test fixture |
US5396186A (en) * | 1993-08-09 | 1995-03-07 | Landers Plastics Inc. | Vacuum actuated multiple level printed circuit board test fixture |
US5682289A (en) | 1991-12-11 | 1997-10-28 | Hewlett-Packard Company | Chassis of a device |
US5894225A (en) * | 1996-10-31 | 1999-04-13 | Coffin; Harry S. | Test fixture |
US6040982A (en) * | 1997-10-16 | 2000-03-21 | Dell Usa, L.P. | Electronic system implementing redundant and nonredundant power supply configurations |
US6054869A (en) * | 1998-03-19 | 2000-04-25 | H+W Test Products, Inc. | Bi-level test fixture for testing printed circuit boards |
US6088224A (en) * | 1997-12-03 | 2000-07-11 | Emc Corporation | Cabinet for storing a plurality of processing unit modules |
US6175498B1 (en) * | 1999-07-13 | 2001-01-16 | Micro Control Company | Burn-in board and heat sink assembly mounting rack |
US6307750B1 (en) * | 1999-11-22 | 2001-10-23 | 3Com Corporation | Interface panel apparatus and method |
US6469530B1 (en) * | 2000-02-15 | 2002-10-22 | Agilent Technologies, Inc. | Method and apparatus for testing of ball grid array circuitry |
US6509754B2 (en) * | 2000-06-29 | 2003-01-21 | Asustek Computer Inc. | CPU adapter for a motherboard test machine |
US20040007379A1 (en) * | 2002-05-29 | 2004-01-15 | Yazaki Corporation | Electrical junction box and method of manufacturing the same |
US6762932B2 (en) * | 2002-09-17 | 2004-07-13 | Dell Products L.P. | Method and system for mounting an information handling system storage device |
US6819099B1 (en) * | 2003-08-06 | 2004-11-16 | Intel Corporation | Programmable carrier plate for automated circuit board tester |
US6900648B2 (en) * | 2003-03-12 | 2005-05-31 | Hon Hai Precision Ind. Co., Ltd. | Tester for printed circuit boards |
US6958908B2 (en) * | 2003-05-30 | 2005-10-25 | Hubbell Incorporated | Compact enclosure for interchangeable SONET multiplexer cards and methods for using same |
US20070096756A1 (en) * | 2005-10-28 | 2007-05-03 | Teradyne, Inc. | Automatic testing equipment instrument card and probe cabling system and apparatus |
US20070152694A1 (en) * | 2005-12-29 | 2007-07-05 | Hon Hai Precision Industry Co., Ltd. | Motherboard test machine |
US7286338B2 (en) * | 2004-04-19 | 2007-10-23 | Sumitomo Wiring Systems, Ltd. | Electrical connection box |
-
2005
- 2005-11-11 CN CNU2005200672683U patent/CN2849809Y/en not_active Expired - Fee Related
-
2006
- 2006-09-27 US US11/528,090 patent/US7430123B2/en not_active Expired - Fee Related
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4536051A (en) * | 1981-10-21 | 1985-08-20 | Marconi Instruments Limited | Electrical interface arrangements |
US5131272A (en) * | 1990-03-15 | 1992-07-21 | Harris Corporation | Portable deployable automatic test system |
US5682289A (en) | 1991-12-11 | 1997-10-28 | Hewlett-Packard Company | Chassis of a device |
US5247249A (en) * | 1992-02-13 | 1993-09-21 | Tti Testron, Inc. | Bi-level test fixture |
US5396186A (en) * | 1993-08-09 | 1995-03-07 | Landers Plastics Inc. | Vacuum actuated multiple level printed circuit board test fixture |
US5894225A (en) * | 1996-10-31 | 1999-04-13 | Coffin; Harry S. | Test fixture |
US6040982A (en) * | 1997-10-16 | 2000-03-21 | Dell Usa, L.P. | Electronic system implementing redundant and nonredundant power supply configurations |
US6088224A (en) * | 1997-12-03 | 2000-07-11 | Emc Corporation | Cabinet for storing a plurality of processing unit modules |
US6054869A (en) * | 1998-03-19 | 2000-04-25 | H+W Test Products, Inc. | Bi-level test fixture for testing printed circuit boards |
US6175498B1 (en) * | 1999-07-13 | 2001-01-16 | Micro Control Company | Burn-in board and heat sink assembly mounting rack |
US6307750B1 (en) * | 1999-11-22 | 2001-10-23 | 3Com Corporation | Interface panel apparatus and method |
US6469530B1 (en) * | 2000-02-15 | 2002-10-22 | Agilent Technologies, Inc. | Method and apparatus for testing of ball grid array circuitry |
US6509754B2 (en) * | 2000-06-29 | 2003-01-21 | Asustek Computer Inc. | CPU adapter for a motherboard test machine |
US20040007379A1 (en) * | 2002-05-29 | 2004-01-15 | Yazaki Corporation | Electrical junction box and method of manufacturing the same |
US6762932B2 (en) * | 2002-09-17 | 2004-07-13 | Dell Products L.P. | Method and system for mounting an information handling system storage device |
US6900648B2 (en) * | 2003-03-12 | 2005-05-31 | Hon Hai Precision Ind. Co., Ltd. | Tester for printed circuit boards |
US6958908B2 (en) * | 2003-05-30 | 2005-10-25 | Hubbell Incorporated | Compact enclosure for interchangeable SONET multiplexer cards and methods for using same |
US6819099B1 (en) * | 2003-08-06 | 2004-11-16 | Intel Corporation | Programmable carrier plate for automated circuit board tester |
US7286338B2 (en) * | 2004-04-19 | 2007-10-23 | Sumitomo Wiring Systems, Ltd. | Electrical connection box |
US20070096756A1 (en) * | 2005-10-28 | 2007-05-03 | Teradyne, Inc. | Automatic testing equipment instrument card and probe cabling system and apparatus |
US20070152694A1 (en) * | 2005-12-29 | 2007-07-05 | Hon Hai Precision Industry Co., Ltd. | Motherboard test machine |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110096491A1 (en) * | 2009-10-27 | 2011-04-28 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Hard disk drive tray and computer having the same |
US8164893B2 (en) * | 2009-10-27 | 2012-04-24 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Hard disk drive tray and computer having the same |
CN102298425A (en) * | 2010-06-25 | 2011-12-28 | 鸿富锦精密工业(深圳)有限公司 | Expansion card assembly |
US20130043896A1 (en) * | 2011-08-18 | 2013-02-21 | Hon Hai Precision Industry Co., Ltd. | Test device for printed circuit board |
US8736293B2 (en) * | 2011-08-18 | 2014-05-27 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Test device for printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
US20070109752A1 (en) | 2007-05-17 |
CN2849809Y (en) | 2006-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XIAO, REN-JUN;GAN, XIAO-LIN;REEL/FRAME:018356/0720 Effective date: 20060405 Owner name: HON HAI PRECISION INDUSTRY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:XIAO, REN-JUN;GAN, XIAO-LIN;REEL/FRAME:018356/0720 Effective date: 20060405 |
|
AS | Assignment |
Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:021292/0027 Effective date: 20080623 Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:021292/0027 Effective date: 20080623 Owner name: HON HAI PRECISION INDUSTRY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:021292/0027 Effective date: 20080623 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20120930 |