US7737515B2 - Method of assembly using array of programmable magnets - Google Patents
Method of assembly using array of programmable magnets Download PDFInfo
- Publication number
- US7737515B2 US7737515B2 US12/142,897 US14289708A US7737515B2 US 7737515 B2 US7737515 B2 US 7737515B2 US 14289708 A US14289708 A US 14289708A US 7737515 B2 US7737515 B2 US 7737515B2
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/95053—Bonding environment
- H01L2224/95091—Under pressure
- H01L2224/95092—Atmospheric pressure, e.g. dry self-assembly
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95136—Aligning the plurality of semiconductor or solid-state bodies involving guiding structures, e.g. shape matching, spacers or supporting members
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- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
- H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
- H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
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Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/142,897 US7737515B2 (en) | 2007-06-20 | 2008-06-20 | Method of assembly using array of programmable magnets |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93642107P | 2007-06-20 | 2007-06-20 | |
US12/142,897 US7737515B2 (en) | 2007-06-20 | 2008-06-20 | Method of assembly using array of programmable magnets |
Publications (2)
Publication Number | Publication Date |
---|---|
US20080315336A1 US20080315336A1 (en) | 2008-12-25 |
US7737515B2 true US7737515B2 (en) | 2010-06-15 |
Family
ID=40135594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/142,897 Expired - Fee Related US7737515B2 (en) | 2007-06-20 | 2008-06-20 | Method of assembly using array of programmable magnets |
Country Status (1)
Country | Link |
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US (1) | US7737515B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9105517B2 (en) | 2013-09-12 | 2015-08-11 | International Business Machines Corporation | Wafer to wafer alignment by LED/LSD devices |
US20170227617A1 (en) * | 2016-02-09 | 2017-08-10 | Weinberg Medical Physics, Inc. | Method and apparatus for manipulating electropermanent magnets for magnetic resonance imaging and image guided therapy |
US11319090B2 (en) * | 2018-12-20 | 2022-05-03 | Airbus Operations Sas | System and method for determining the separation between two parts using eddy current sensors |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2159304A1 (en) * | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
FR2942911B1 (en) | 2009-03-09 | 2011-05-13 | Soitec Silicon On Insulator | METHOD FOR PRODUCING A HETEROSTRUCTURE WITH LOCAL ADAPTATION OF THERMAL EXPANSION COEFFICIENT |
US20180322993A1 (en) * | 2015-12-21 | 2018-11-08 | Intel Corporation | Magnetic pick and place probe |
TWI605536B (en) * | 2017-04-12 | 2017-11-11 | 財團法人工業技術研究院 | Magnetic transfer module and method for transferring electronic element |
Citations (16)
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US4542397A (en) | 1984-04-12 | 1985-09-17 | Xerox Corporation | Self aligning small scale integrated circuit semiconductor chips to form large area arrays |
US5034802A (en) | 1989-12-11 | 1991-07-23 | Hewlett-Packard Company | Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates |
US5962975A (en) | 1996-12-02 | 1999-10-05 | Lepselter; Martin P. | Flat-panel display having magnetic elements |
US6072251A (en) * | 1997-04-28 | 2000-06-06 | Ultratech Stepper, Inc. | Magnetically positioned X-Y stage having six degrees of freedom |
US20030098965A1 (en) * | 2001-11-29 | 2003-05-29 | Mike Binnard | System and method for supporting a device holder with separate components |
US6650079B2 (en) * | 2001-06-01 | 2003-11-18 | Nikon Corporation | System and method to control planar motors |
US6833277B2 (en) | 2002-01-24 | 2004-12-21 | Massachusetts Institute Of Technology | Method and system for field assisted statistical assembly of wafers |
WO2005089184A2 (en) | 2004-03-12 | 2005-09-29 | New Jersey Institute Of Technology | Method of magnetic field assisted self-assembly |
US20070268475A1 (en) * | 2006-05-16 | 2007-11-22 | Nikon Corporation | System and method for controlling a stage assembly |
US7321159B2 (en) | 2000-09-12 | 2008-01-22 | Alien Technology Corporation | Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs |
US20080067968A1 (en) * | 2006-09-12 | 2008-03-20 | Nikon Corporation | Identifying and compensating force-ripple and side-forces produced by linear actuators |
US20080275661A1 (en) * | 2007-04-18 | 2008-11-06 | Nikon Corporation | On-machine methods for identifying and compensating force-ripple and side-forces produced by actuators on a multiple-axis stage |
US20080285004A1 (en) * | 2007-05-18 | 2008-11-20 | Nikon Corporation | Monolithic, Non-Contact Six Degree-of-Freedom Stage Apparatus |
US20080285005A1 (en) * | 2007-05-15 | 2008-11-20 | Jean-Marc Gery | System and method for measuring and mapping a sideforce for a mover |
US20090001907A1 (en) * | 2007-06-27 | 2009-01-01 | Brooks Automation, Inc. | Commutation of an electromagnetic propulsion and guidance system |
US20090296069A1 (en) * | 2004-02-02 | 2009-12-03 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
-
2008
- 2008-06-20 US US12/142,897 patent/US7737515B2/en not_active Expired - Fee Related
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4542397A (en) | 1984-04-12 | 1985-09-17 | Xerox Corporation | Self aligning small scale integrated circuit semiconductor chips to form large area arrays |
US5034802A (en) | 1989-12-11 | 1991-07-23 | Hewlett-Packard Company | Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates |
US5962975A (en) | 1996-12-02 | 1999-10-05 | Lepselter; Martin P. | Flat-panel display having magnetic elements |
US6072251A (en) * | 1997-04-28 | 2000-06-06 | Ultratech Stepper, Inc. | Magnetically positioned X-Y stage having six degrees of freedom |
US7321159B2 (en) | 2000-09-12 | 2008-01-22 | Alien Technology Corporation | Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs |
US6650079B2 (en) * | 2001-06-01 | 2003-11-18 | Nikon Corporation | System and method to control planar motors |
US20030098965A1 (en) * | 2001-11-29 | 2003-05-29 | Mike Binnard | System and method for supporting a device holder with separate components |
US6833277B2 (en) | 2002-01-24 | 2004-12-21 | Massachusetts Institute Of Technology | Method and system for field assisted statistical assembly of wafers |
US6888178B2 (en) | 2002-01-24 | 2005-05-03 | Massachusetts Institute Of Technology | Method and system for magnetically assisted statistical assembly of wafers |
US20090296069A1 (en) * | 2004-02-02 | 2009-12-03 | Nikon Corporation | Stage drive method and stage unit, exposure apparatus, and device manufacturing method |
WO2005089184A2 (en) | 2004-03-12 | 2005-09-29 | New Jersey Institute Of Technology | Method of magnetic field assisted self-assembly |
US7217592B2 (en) | 2004-03-12 | 2007-05-15 | New Jersey Institute Of Technology | Method of magnetic field assisted self-assembly |
US20070268475A1 (en) * | 2006-05-16 | 2007-11-22 | Nikon Corporation | System and method for controlling a stage assembly |
US20080067968A1 (en) * | 2006-09-12 | 2008-03-20 | Nikon Corporation | Identifying and compensating force-ripple and side-forces produced by linear actuators |
US20080275661A1 (en) * | 2007-04-18 | 2008-11-06 | Nikon Corporation | On-machine methods for identifying and compensating force-ripple and side-forces produced by actuators on a multiple-axis stage |
US20080285005A1 (en) * | 2007-05-15 | 2008-11-20 | Jean-Marc Gery | System and method for measuring and mapping a sideforce for a mover |
US20080285004A1 (en) * | 2007-05-18 | 2008-11-20 | Nikon Corporation | Monolithic, Non-Contact Six Degree-of-Freedom Stage Apparatus |
US20090001907A1 (en) * | 2007-06-27 | 2009-01-01 | Brooks Automation, Inc. | Commutation of an electromagnetic propulsion and guidance system |
Non-Patent Citations (1)
Title |
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Sudhakar,et al., The Magnetic Field-Assisted Assembly of Nanoscale Semiconductor Devices: A New Technique, JOM, Oct. 2004, pp. 32-34. |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9105517B2 (en) | 2013-09-12 | 2015-08-11 | International Business Machines Corporation | Wafer to wafer alignment by LED/LSD devices |
US20170227617A1 (en) * | 2016-02-09 | 2017-08-10 | Weinberg Medical Physics, Inc. | Method and apparatus for manipulating electropermanent magnets for magnetic resonance imaging and image guided therapy |
US11319090B2 (en) * | 2018-12-20 | 2022-05-03 | Airbus Operations Sas | System and method for determining the separation between two parts using eddy current sensors |
Also Published As
Publication number | Publication date |
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US20080315336A1 (en) | 2008-12-25 |
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