US7751611B2 - Apparatus for inspecting appearance of inspection piece - Google Patents
Apparatus for inspecting appearance of inspection piece Download PDFInfo
- Publication number
- US7751611B2 US7751611B2 US11/314,094 US31409405A US7751611B2 US 7751611 B2 US7751611 B2 US 7751611B2 US 31409405 A US31409405 A US 31409405A US 7751611 B2 US7751611 B2 US 7751611B2
- Authority
- US
- United States
- Prior art keywords
- board
- imaging
- slave
- inspecting means
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Abstract
Description
- [patent document No. 1]
- JP 2003-115047 A
- [patent document No. 2]
- JP 11-118439
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373741A JP4654022B2 (en) | 2004-12-24 | 2004-12-24 | Substrate visual inspection device |
JP2004-373741 | 2004-12-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060165274A1 US20060165274A1 (en) | 2006-07-27 |
US7751611B2 true US7751611B2 (en) | 2010-07-06 |
Family
ID=36696796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/314,094 Active 2028-07-11 US7751611B2 (en) | 2004-12-24 | 2005-12-22 | Apparatus for inspecting appearance of inspection piece |
Country Status (3)
Country | Link |
---|---|
US (1) | US7751611B2 (en) |
JP (1) | JP4654022B2 (en) |
CN (1) | CN100439862C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090257050A1 (en) * | 2008-04-09 | 2009-10-15 | Orbotech Ltd. | Illumination system for optical inspection |
US20100328435A1 (en) * | 2006-06-21 | 2010-12-30 | Yong Joo Puah | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4977528B2 (en) * | 2007-05-29 | 2012-07-18 | 株式会社サキコーポレーション | Appearance inspection apparatus and system |
JP5989981B2 (en) * | 2011-09-22 | 2016-09-07 | 富士機械製造株式会社 | Production line and board inspection method |
FR3004582B1 (en) * | 2013-04-11 | 2015-04-10 | Vit | SYSTEM AND METHOD FOR OPTICALLY INSPECTING ELECTRONIC CIRCUITS |
JP6338085B2 (en) * | 2014-03-20 | 2018-06-06 | 日本電産リード株式会社 | Flexible substrate inspection device |
JP6665458B2 (en) * | 2015-09-18 | 2020-03-13 | 日本電気株式会社 | Identification device and identification method |
JP6450697B2 (en) * | 2016-03-22 | 2019-01-09 | Ckd株式会社 | Board inspection equipment |
JP6815162B2 (en) | 2016-10-20 | 2021-01-20 | 株式会社日立製作所 | Weld monitoring system and welding monitoring method |
CN106767508A (en) * | 2016-12-24 | 2017-05-31 | 大连日佳电子有限公司 | A kind of detection means of steel mesh perforate accuracy |
CN108535262A (en) * | 2018-03-22 | 2018-09-14 | 深圳市永光神目科技有限公司 | A kind of light-source structure and scolding tin defect detecting system |
JP7280068B2 (en) * | 2019-03-12 | 2023-05-23 | 株式会社Screenホールディングス | Inspection device and inspection method |
Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4538909A (en) * | 1983-05-24 | 1985-09-03 | Automation Engineering, Inc. | Circuit board inspection apparatus and method |
US4759074A (en) * | 1986-10-28 | 1988-07-19 | General Motors Corporation | Method for automatically inspecting parts utilizing machine vision and system utilizing same |
US4884696A (en) * | 1987-03-29 | 1989-12-05 | Kaman Peleg | Method and apparatus for automatically inspecting and classifying different objects |
US5161202A (en) * | 1990-07-18 | 1992-11-03 | Dainippon Screen Mfg. Co. Ltd. | Method of and device for inspecting pattern of printed circuit board |
US5230027A (en) * | 1990-09-05 | 1993-07-20 | Nec Corporation | Image processor and automated optical inspection system using the same |
US5835223A (en) * | 1996-01-05 | 1998-11-10 | Electronic Packaging Services, Ltd. | System for measuring surface flatness using shadow moire technology |
JPH11118439A (en) | 1997-10-13 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Appearance inspection device, appearance inspection system, and appearance inspection for mounted substrate |
JPH11132966A (en) | 1997-10-31 | 1999-05-21 | Mitsubishi Rayon Co Ltd | Meandering following apparatus for flaw inspection apparatus |
US5978521A (en) * | 1997-09-25 | 1999-11-02 | Cognex Corporation | Machine vision methods using feedback to determine calibration locations of multiple cameras that image a common object |
US6061086A (en) * | 1997-09-11 | 2000-05-09 | Canopular East Inc. | Apparatus and method for automated visual inspection of objects |
US6064757A (en) * | 1998-01-16 | 2000-05-16 | Elwin M. Beaty | Process for three dimensional inspection of electronic components |
US6122065A (en) * | 1996-08-12 | 2000-09-19 | Centre De Recherche Industrielle Du Quebec | Apparatus and method for detecting surface defects |
US6173071B1 (en) * | 1997-12-16 | 2001-01-09 | Harold Wasserman | Apparatus and method for processing video data in automatic optical inspection |
US6484066B1 (en) * | 1999-10-29 | 2002-11-19 | Lockheed Martin Corporation | Image life tunnel scanner inspection system using extended depth of field technology |
US6493597B1 (en) * | 1998-01-30 | 2002-12-10 | Inspectron | Print monitoring system and method using slave signal processor/master processor arrangement |
JP2003115047A (en) | 2001-03-23 | 2003-04-18 | Keisoku Giken Co Ltd | Device for generating and displaying highly accurate image |
US6621566B1 (en) * | 2000-10-02 | 2003-09-16 | Teradyne, Inc. | Optical inspection system having integrated component learning |
US6667762B1 (en) * | 1998-05-29 | 2003-12-23 | Robotic Vision Systems, Inc. | Miniature inspection system |
US6753896B2 (en) * | 2001-12-13 | 2004-06-22 | Dainippon Screen Mfg. Co., Ltd. | Laser drawing apparatus and laser drawing method |
US20040212797A1 (en) * | 2003-01-20 | 2004-10-28 | Yoshihiro Akiyama | Appearance inspection apparatus and the method of inspecting the same |
US20040218040A1 (en) * | 2003-01-24 | 2004-11-04 | Yoshihiro Akiyama | Appearance inspection apparatus and method of image capturing using the same |
US6831998B1 (en) * | 2000-06-22 | 2004-12-14 | Hitachi, Ltd. | Inspection system for circuit patterns and a method thereof |
US6914678B1 (en) * | 1999-03-19 | 2005-07-05 | Titech Visionsort As | Inspection of matter |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US20050157841A1 (en) * | 2004-01-15 | 2005-07-21 | Nasreen Chopra | Three-dimensional x-ray imaging system |
US20060165273A1 (en) * | 2004-12-24 | 2006-07-27 | Yoshihiro Akiyama | Appearance inspection apparatus for inspecting inspection piece |
US7215808B2 (en) * | 2004-05-04 | 2007-05-08 | Kla-Tencor Technologies Corporation | High throughout image for processing inspection images |
US20070230819A1 (en) * | 2004-04-27 | 2007-10-04 | Japan Science And Technology Agency | Method and Apparatues for Image Inspection |
US7375360B2 (en) * | 2005-01-10 | 2008-05-20 | Lg Electronics Inc. | Light device of arranging thin film inspection sensor array, and method and apparatus for arranging sensor array using the same |
US20080156207A1 (en) * | 2006-12-28 | 2008-07-03 | Dan Ellenbogen | Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6315380A (en) * | 1986-07-07 | 1988-01-22 | Kyodo Printing Co Ltd | Method and device for inspecting article having repeated pattern |
JP3181435B2 (en) * | 1992-12-01 | 2001-07-03 | 株式会社日立製作所 | Image processing apparatus and image processing method |
JPH11170489A (en) * | 1997-12-08 | 1999-06-29 | Dainippon Printing Co Ltd | Image checking device for printed matter and centralized image checking device for printed matter |
JP2001005166A (en) * | 1999-06-17 | 2001-01-12 | Nec Corp | Pattern inspection method and pattern inspection apparatus |
JP2002100660A (en) * | 2000-07-18 | 2002-04-05 | Hitachi Ltd | Defect detecting method, defect observing method and defect detecting apparatus |
JP2003083718A (en) * | 2001-09-14 | 2003-03-19 | Mitsubishi Electric Engineering Co Ltd | Visual inspection system for high-speed moving body |
JP2004085436A (en) * | 2002-08-28 | 2004-03-18 | Hitachi Giken Co Ltd | Visual inspection support device for industrial product |
JP4188674B2 (en) * | 2002-12-09 | 2008-11-26 | 松下電器産業株式会社 | Inspection data creation method |
JP2006184022A (en) * | 2004-12-24 | 2006-07-13 | Saki Corp:Kk | Visual inspection system |
-
2004
- 2004-12-24 JP JP2004373741A patent/JP4654022B2/en active Active
-
2005
- 2005-12-22 US US11/314,094 patent/US7751611B2/en active Active
- 2005-12-23 CN CNB2005100033839A patent/CN100439862C/en active Active
Patent Citations (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4538909A (en) * | 1983-05-24 | 1985-09-03 | Automation Engineering, Inc. | Circuit board inspection apparatus and method |
US4759074A (en) * | 1986-10-28 | 1988-07-19 | General Motors Corporation | Method for automatically inspecting parts utilizing machine vision and system utilizing same |
US4884696A (en) * | 1987-03-29 | 1989-12-05 | Kaman Peleg | Method and apparatus for automatically inspecting and classifying different objects |
US5161202A (en) * | 1990-07-18 | 1992-11-03 | Dainippon Screen Mfg. Co. Ltd. | Method of and device for inspecting pattern of printed circuit board |
US5230027A (en) * | 1990-09-05 | 1993-07-20 | Nec Corporation | Image processor and automated optical inspection system using the same |
US5835223A (en) * | 1996-01-05 | 1998-11-10 | Electronic Packaging Services, Ltd. | System for measuring surface flatness using shadow moire technology |
US6122065A (en) * | 1996-08-12 | 2000-09-19 | Centre De Recherche Industrielle Du Quebec | Apparatus and method for detecting surface defects |
US6061086A (en) * | 1997-09-11 | 2000-05-09 | Canopular East Inc. | Apparatus and method for automated visual inspection of objects |
US5978521A (en) * | 1997-09-25 | 1999-11-02 | Cognex Corporation | Machine vision methods using feedback to determine calibration locations of multiple cameras that image a common object |
JPH11118439A (en) | 1997-10-13 | 1999-04-30 | Matsushita Electric Ind Co Ltd | Appearance inspection device, appearance inspection system, and appearance inspection for mounted substrate |
JPH11132966A (en) | 1997-10-31 | 1999-05-21 | Mitsubishi Rayon Co Ltd | Meandering following apparatus for flaw inspection apparatus |
US6173071B1 (en) * | 1997-12-16 | 2001-01-09 | Harold Wasserman | Apparatus and method for processing video data in automatic optical inspection |
US6064757A (en) * | 1998-01-16 | 2000-05-16 | Elwin M. Beaty | Process for three dimensional inspection of electronic components |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
US7085411B2 (en) * | 1998-01-16 | 2006-08-01 | Scanner Technologies Corporation | Method of manufacturing electronic components including a method for three dimensional inspection |
US7079678B2 (en) * | 1998-01-16 | 2006-07-18 | Scanner Technologies Corporation | Electronic component products made according to a process that includes a method for three dimensional inspection |
US6915006B2 (en) * | 1998-01-16 | 2005-07-05 | Elwin M. Beaty | Method and apparatus for three dimensional inspection of electronic components |
US6493597B1 (en) * | 1998-01-30 | 2002-12-10 | Inspectron | Print monitoring system and method using slave signal processor/master processor arrangement |
US6667762B1 (en) * | 1998-05-29 | 2003-12-23 | Robotic Vision Systems, Inc. | Miniature inspection system |
US6914678B1 (en) * | 1999-03-19 | 2005-07-05 | Titech Visionsort As | Inspection of matter |
US6484066B1 (en) * | 1999-10-29 | 2002-11-19 | Lockheed Martin Corporation | Image life tunnel scanner inspection system using extended depth of field technology |
US6831998B1 (en) * | 2000-06-22 | 2004-12-14 | Hitachi, Ltd. | Inspection system for circuit patterns and a method thereof |
US6621566B1 (en) * | 2000-10-02 | 2003-09-16 | Teradyne, Inc. | Optical inspection system having integrated component learning |
JP2003115047A (en) | 2001-03-23 | 2003-04-18 | Keisoku Giken Co Ltd | Device for generating and displaying highly accurate image |
US6753896B2 (en) * | 2001-12-13 | 2004-06-22 | Dainippon Screen Mfg. Co., Ltd. | Laser drawing apparatus and laser drawing method |
US20040212797A1 (en) * | 2003-01-20 | 2004-10-28 | Yoshihiro Akiyama | Appearance inspection apparatus and the method of inspecting the same |
US7002676B2 (en) * | 2003-01-20 | 2006-02-21 | Saki Corporation | Appearance inspection apparatus and the method of inspecting the same |
US20040218040A1 (en) * | 2003-01-24 | 2004-11-04 | Yoshihiro Akiyama | Appearance inspection apparatus and method of image capturing using the same |
US7221443B2 (en) * | 2003-01-24 | 2007-05-22 | Saki Corporation | Appearance inspection apparatus and method of image capturing using the same |
US7010086B2 (en) * | 2004-01-15 | 2006-03-07 | Agilent Technologies, Inc. | Three-dimensional x-ray imaging system |
US20050157841A1 (en) * | 2004-01-15 | 2005-07-21 | Nasreen Chopra | Three-dimensional x-ray imaging system |
US20070230819A1 (en) * | 2004-04-27 | 2007-10-04 | Japan Science And Technology Agency | Method and Apparatues for Image Inspection |
US7215808B2 (en) * | 2004-05-04 | 2007-05-08 | Kla-Tencor Technologies Corporation | High throughout image for processing inspection images |
US20060165273A1 (en) * | 2004-12-24 | 2006-07-27 | Yoshihiro Akiyama | Appearance inspection apparatus for inspecting inspection piece |
US7375360B2 (en) * | 2005-01-10 | 2008-05-20 | Lg Electronics Inc. | Light device of arranging thin film inspection sensor array, and method and apparatus for arranging sensor array using the same |
US20080156207A1 (en) * | 2006-12-28 | 2008-07-03 | Dan Ellenbogen | Stencil printers and the like, optical systems therefor, and methods of printing and inspection |
Non-Patent Citations (5)
Title |
---|
English Abstract of JP Application 09-278382, Publication No. 11-118439, Apr. 30, 1999, Patent Abstracts of Japan, Japanese Patent Office Website. |
English Abstract of JP Application 09-300978, Publication No. 11-123966, May 21, 2005, Patent Abstracts of Japan, Japanese Patent Office Website. |
English Abstract of JP Application 2001-084244, Publication No. 2003-115047, Apr. 18, 2003, Patent Abstracts of Japan, Japanese Patent Office Website. |
Japanese Patent Office, Patent Application No. 2004-373741, Notification of Reason(s) for Refusal, Apr. 20, 2010. |
State Intellectual Property Office of People's Republic of China, The First Office Action, Feb. 1, 2008, Application No. 200510003383.9. |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100328435A1 (en) * | 2006-06-21 | 2010-12-30 | Yong Joo Puah | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
US8885040B2 (en) * | 2006-06-21 | 2014-11-11 | Generic Power Pte Ltd. | Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components |
US20090257050A1 (en) * | 2008-04-09 | 2009-10-15 | Orbotech Ltd. | Illumination system for optical inspection |
US8077307B2 (en) * | 2008-04-09 | 2011-12-13 | Orbotech Ltd. | Illumination system for optical inspection |
Also Published As
Publication number | Publication date |
---|---|
JP2006177887A (en) | 2006-07-06 |
JP4654022B2 (en) | 2011-03-16 |
CN100439862C (en) | 2008-12-03 |
US20060165274A1 (en) | 2006-07-27 |
CN1987347A (en) | 2007-06-27 |
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Owner name: SAKI CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AKIYAMA, YOSHIHIRO;YANG, YONG;AKIYAMA, SAKIE;SIGNING DATES FROM 20060123 TO 20060208;REEL/FRAME:017742/0391 Owner name: SAKI CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AKIYAMA, YOSHIHIRO;YANG, YONG;AKIYAMA, SAKIE;REEL/FRAME:017742/0391;SIGNING DATES FROM 20060123 TO 20060208 |
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