US8125778B2 - Device for air-cooling electronic apparatus - Google Patents

Device for air-cooling electronic apparatus Download PDF

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Publication number
US8125778B2
US8125778B2 US11/920,694 US92069406A US8125778B2 US 8125778 B2 US8125778 B2 US 8125778B2 US 92069406 A US92069406 A US 92069406A US 8125778 B2 US8125778 B2 US 8125778B2
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air
air introduction
cooling
electronic apparatus
plates
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US20090168346A1 (en
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Toyokazu Miyoshi
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JVCKenwood Corp
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Kenwood KK
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Assigned to KABUSHIKI KAISHA KENWOOD reassignment KABUSHIKI KAISHA KENWOOD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIYOSHI, TOYOKAZU
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components

Definitions

  • the present invention relates to an electronic apparatus, and more particularly to an air-cooling device for the same.
  • FIG. 5 An exemplary conventional device for air-cooling an electronic apparatus will be described with reference to FIG. 5 .
  • An upper housing 1 and a lower housing 2 illustrated in FIG. 5 are coupled to sandwich a chassis 3 and constitutes a housing that contains an electronic apparatus.
  • Suction openings 4 , 4 are provided in each of the upper housing 1 and the lower housing 2 ; and a discharge opening 5 is provided in the chassis 3 , or the upper housing 1 and the lower housing 2 .
  • a fan 6 is secured to the chassis 3 .
  • bosses 3 a , 3 a , . . . and radiation fins 3 b , 3 b , . . . are formed in the chassis 3 ; and printed boards 8 , 8 , . . . are fastened to the bosses 3 a , 3 a , . . . . Heat produced by a maximum-heat-producing part 9 mounted on the printed boards 8 , 8 , . . . is transmitted via the heat transmitting parts to the chassis 3 .
  • This airflow cools down the chassis 3 and heat-producing electronic parts including the maximum-heat-producing part 9 mounted on the printed boards 8 , 8 . . . .
  • a dustproof filter may be installed in the suction openings 4 , 4 of the air-cooling device illustrated in FIG. 5 .
  • such an air-cooling device is not suitable for a model having a large amount of heat production because clogging of the filter reduces air-intake to lower the capacity for cooling.
  • FIG. 6 illustrates an exemplary conventional device for air-cooling an electronic apparatus which allows for dustproof performance.
  • an upper housing 1 and a lower housing 2 are mounted in the upper and lower parts of a chassis 3 , respectively, so that an upper-side space and a lower-side space are formed.
  • Printed boards 8 , 8 arranged in the upper-side sealed space are fastened to bosses 3 a , 3 a , . . . of the chassis 3 .
  • Heat produced by a maximum-heat-producing part 9 mounted on the printed boards 8 , 8 , . . . is transmitted via the heat transmitting parts to the chassis 3 .
  • Suction opening 4 and discharge openings 5 , 5 are arranged in the lower housing 2 .
  • Airflow indicated by the arrow, traveling from the suction openings 4 to the discharge openings 5 , 5 is generated by the fan 6 secured to the upper side of the suction opening 4 .
  • This airflow cools down radiation fins 3 b , 3 b , . . . of the chassis 3 .
  • the air in a space where the printed boards 8 , 8 are contained is cooled via the chassis 3 , and this air cools down electronic parts mounted on the printed boards 8 , 8 .
  • the volume of the chassis 3 acting as a heat radiator and the volume of the sealed space must be increased, thus increasing the size of the electronic apparatus.
  • improvement can be made by increasing the volume of air sent by the fan.
  • the device is disadvantageous in space saving and manufacturing cost.
  • a heat-releasing structure for an apparatus described in paragraphs [0013] to [0027], and illustrated in FIGS. 1 to 9 of Japanese Patent Application Laid-Open No. 2002-353677 satisfies the temperature conditions of a heat-producing body irrespective of whether the structure has a horizontal position or a vertical position, but includes no specific means for raising the dustproof performance and the capacity for cooling.
  • the present invention has been achieved in view of the above problems and has an object to provide a device for air-cooling an electronic apparatus which has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.
  • a device for air-cooling an electronic apparatus in which a suction opening is provided in a housing, a discharge opening is provided in the housing, an airflow passing the inside of the housing is generated by a fan, and heat produced by a heat-producing body is released to the outside of the housing by the airflow, a plurality of air introduction plates inclined to change the direction of the airflow being arranged at the suction opening, a large number of projections being formed on the surfaces of the air introduction plates.
  • the large number of projections has a convex-like shape extending in a direction perpendicular to the airflow.
  • a plurality of air lead-through boards inclined in a direction different from the air introduction plate are arranged at a down stream region of the air introduction plate.
  • a dust removing unit in which the plurality of air introduction plates and the plurality of air lead-through boards are formed in an integrated manner, and which can be easily attached or detached to the housing.
  • FIG. 1 is a cross-sectional view illustrating a device for air-cooling an electronic apparatus according to an embodiment of the present invention
  • FIG. 2 is a side view illustrating a part of the air-cooling device
  • FIG. 3 is a side view illustrating a part of the air-cooling device
  • FIG. 4( a ) is a front view illustrating a dust removing unit used in the air-cooling device
  • FIG. 4( b ) is a back view illustrating the dust removing unit
  • FIG. 4( c ) is a top view illustrating the dust removing unit
  • FIG. 4( d ) is a bottom view illustrating the dust removing unit
  • FIG. 4( e ) is a left side view illustrating the dust removing unit
  • FIG. 4( f ) is a right side view illustrating the dust removing unit
  • FIG. 4( g ) is a sectional view along the line A-A of FIG. 4( a );
  • FIG. 4( h ) is a sectional view along the line B-B of FIG. 4( a );
  • FIG. 4( i ) is a sectional view along the line C-C of FIG. 4( a );
  • FIG. 4( j ) is a sectional view along the line D-D of FIG. 4( a );
  • FIG. 4( k ) is a sectional view along the line E-E of FIG. 4( a );
  • FIG. 4( m ) is a sectional view along the line F-F of FIG. 4( a );
  • FIG. 5 is a cross-sectional view illustrating an exemplary conventional device for air-cooling an electronic apparatus.
  • FIG. 6 is a cross-sectional view illustrating another exemplary conventional device for air-cooling an electronic apparatus.
  • FIG. 1 is a cross-sectional view illustrating a device for air-cooling an electronic apparatus according to an embodiment of the present invention.
  • An upper housing 1 and a lower housing 2 illustrated in FIG. 1 are coupled to sandwich a chassis 3 and constitutes a housing that contains an electronic apparatus.
  • Suction openings 4 , 4 , . . . which will be illustrated in detail in FIG. 4 are provided in a dustproof unit 7 attached so as to seal a hole of the lower housing 2 ; and a discharge opening 5 is provided in a chassis 3 , or the upper housing 1 and the lower housing 2 .
  • a fan 6 is secured to the chassis 3 .
  • Bosses 3 a , 3 a , . . . and radiation fin 3 b are formed in the chassis 3 ; and printed boards 8 , 8 are fastened to the bosses 3 a , 3 a , . . . . Heat produced by a maximum-heat-producing part 9 mounted on the printed boards 8 is transmitted via the heat transmitting parts to the chassis 3 .
  • This airflow cools down the chassis 3 and heat-producing electronic parts including the maximum-heat-producing part 9 mounted on the printed boards 8 , 8 .
  • FIG. 4 illustrates the structure of the dustproof unit 7 in detail.
  • the front view illustrated in FIG. 4( a ) is a view of the dustproof unit 7 as seen from below in FIG. 1 . That is, each of the figures of FIG. 4 is drawn with the lower face of the dustproof unit 7 being set as the front.
  • suction openings 4 , 4 , . . . are, as illustrated in FIG. 4( a ), formed in the front lower part of a frame 7 d which constitutes the outer shape of the dustproof unit 7 of resin; and air introduction plates 7 a , 7 a are arranged at the back of the suction openings 4 , 4 , . . . so as to be viewable from the suction openings 4 , 4 . . . .
  • the air introduction plates 7 a , 7 a , . . . are, as illustrated in FIG. 4( g ), inclined relative to the front of the frame 7 d . That is, the air introduction plates 7 a , 7 a , . . . are inclined to change the direction of airflow entering via the suction openings 4 , 4 , . . . .
  • the air introduction plate 7 a is, as illustrated in detail in FIG. 3 , provided with convexes 7 b , 7 b which extend in a direction (direction perpendicular to the paper plane) perpendicular to the airflow indicated by the arrow.
  • the downstream region (the right side part of FIG. 4( m )) of the air introduction plates 7 a , 7 a , . . . is divided into a void part and a part in which the air lead-through boards 7 c , 7 c , . . . are arranged.
  • an airflow passing the air lead-through boards 7 c , 7 c , . . . travels along the lower space of the housing; an airflow bypassing the air lead-through boards 7 c , 7 c , . . . travels along the upper space of the housing; and both of them are discharged via the discharge opening 5 .
  • the frame 7 d of the dustproof unit 7 is, as illustrated in FIGS. 4( a ) and 4 ( b ), provided with three mounting holes 7 e , 7 e , . . . .
  • the dustproof unit 7 is fastened to the chassis 3 with screws (not illustrated) inserted into the mounting holes 7 e , 7 e , . . . .
  • a high-speed airflow entering via the suction opening 4 is, as indicated by the arrow in FIG. 3 , bent to travel along the air introduction plate 7 a .
  • dust contained in the airflow is heavier than air, so the inertia causes the dust to collide with the convex 7 b of the air introduction plate 7 a .
  • the dust is thrown off from the airflow by a turbulent flow of the airflow produced in the vicinity of the convex 7 b.
  • the airflow After passing the air introduction plates 7 a , the airflow passes the air lead-through boards 7 c , 7 c , . . . . In this case, also, the airflow is bent by the air lead-through boards 7 c , 7 c , . . . as illustrated in FIG. 2 , and thus the dust is further thrown off from the airflow.
  • the dustproof unit 7 can be easily detached by taking out the screws, and the dust can be removed by cleaning the dustproof unit 7 , and thus the dust accumulating on the dustproof unit 7 is prevented from entering the airflow again.
  • the flow rate of airflow is not limited by a filter, and thus the flow rate of airflow is large enough to obtain increased capacity for cooling. Further, dust is prevented from entering the housing, so parts in the housing is prevented from being short-circuited.
  • the present embodiment has the above structure, but the present invention is not limited thereto.
  • the effect of the present invention can be achieved even when the air lead-through board 7 c is not provided; and when projections of a concave-like shape are arranged in the air lead-through board 7 c , the effect of the present invention is further increased.
  • a suction opening 4 is provided in a housing 1
  • a discharge opening 5 is provided in housings 1 , 2
  • an airflow passing the inside of the housings is generated by a fan 5
  • heat produced by a heat-producing body 9 is released to the outside of the housings by the airflow.
  • at least one air introduction plate inclined to change the direction of the airflow is arranged at the suction opening 4
  • at least one projection is arranged on the surface of the air introduction plate. Accordingly, increased capacity for cooling a heat-producing part is obtained without increase in the size of the device, and accumulation of dust on the heat-producing part can be prevented.

Abstract

A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.

Description

TECHNICAL FIELD
The present invention relates to an electronic apparatus, and more particularly to an air-cooling device for the same.
BACKGROUND ART
An exemplary conventional device for air-cooling an electronic apparatus will be described with reference to FIG. 5. An upper housing 1 and a lower housing 2 illustrated in FIG. 5 are coupled to sandwich a chassis 3 and constitutes a housing that contains an electronic apparatus. Suction openings 4, 4 are provided in each of the upper housing 1 and the lower housing 2; and a discharge opening 5 is provided in the chassis 3, or the upper housing 1 and the lower housing 2. A fan 6 is secured to the chassis 3.
Further, bosses 3 a, 3 a, . . . and radiation fins 3 b, 3 b, . . . are formed in the chassis 3; and printed boards 8, 8, . . . are fastened to the bosses 3 a, 3 a, . . . . Heat produced by a maximum-heat-producing part 9 mounted on the printed boards 8, 8, . . . is transmitted via the heat transmitting parts to the chassis 3.
Airflow indicated by the arrow, traveling from the suction openings 4, 4 to the discharge opening 5 is generated by the fan 6. This airflow cools down the chassis 3 and heat-producing electronic parts including the maximum-heat-producing part 9 mounted on the printed boards 8, 8 . . . .
According to the conventional device for air-cooling an electronic apparatus illustrated in FIG. 5, air flows via the suction opening into the inside of the housing and circulates in the inside of the housing. Along with air, dust also enters the inside of the housing, so that dust accumulates in the printed boards 8, 8, . . . and the like. Accordingly, maintenance must be regularly performed to remove the dust. If no maintenance is performed, dust causes the parts in the inside of the housing to be short-circuited, thus causing a failure.
In order to prevent dust from entering the inside of the housing, a dustproof filter may be installed in the suction openings 4, 4 of the air-cooling device illustrated in FIG. 5. However, such an air-cooling device is not suitable for a model having a large amount of heat production because clogging of the filter reduces air-intake to lower the capacity for cooling.
FIG. 6 illustrates an exemplary conventional device for air-cooling an electronic apparatus which allows for dustproof performance. In this example, an upper housing 1 and a lower housing 2 are mounted in the upper and lower parts of a chassis 3, respectively, so that an upper-side space and a lower-side space are formed. Printed boards 8, 8 arranged in the upper-side sealed space are fastened to bosses 3 a, 3 a, . . . of the chassis 3. Heat produced by a maximum-heat-producing part 9 mounted on the printed boards 8, 8, . . . is transmitted via the heat transmitting parts to the chassis 3.
Suction opening 4 and discharge openings 5, 5 are arranged in the lower housing 2. Airflow indicated by the arrow, traveling from the suction openings 4 to the discharge openings 5, 5 is generated by the fan 6 secured to the upper side of the suction opening 4. This airflow cools down radiation fins 3 b, 3 b, . . . of the chassis 3. The air in a space where the printed boards 8, 8 are contained is cooled via the chassis 3, and this air cools down electronic parts mounted on the printed boards 8, 8.
According to the conventional device for air-cooling an electronic apparatus illustrated in FIG. 6, accumulation of dust on the printed boards 8, 8 can be prevented. In this structure, however, stationary air surrounding the printed boards 8, 8 are cooled via the chassis 3, so sufficient capacity for cooling is not obtained; the temperature of air surrounding the printed boards 8, 8 rises to raise the temperature of electronic parts mounted on the printed boards 8, 8 thus shortening the life of the electronic parts.
In order to raise the capacity for cooling of the device for air-cooling an electronic apparatus illustrated in FIG. 6, the volume of the chassis 3 acting as a heat radiator and the volume of the sealed space must be increased, thus increasing the size of the electronic apparatus. In this case, improvement can be made by increasing the volume of air sent by the fan. In either case, however, the device is disadvantageous in space saving and manufacturing cost.
For example, a heat-releasing structure for an apparatus described in paragraphs [0013] to [0027], and illustrated in FIGS. 1 to 9 of Japanese Patent Application Laid-Open No. 2002-353677 satisfies the temperature conditions of a heat-producing body irrespective of whether the structure has a horizontal position or a vertical position, but includes no specific means for raising the dustproof performance and the capacity for cooling.
The present invention has been achieved in view of the above problems and has an object to provide a device for air-cooling an electronic apparatus which has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.
DISCLOSURE OF THE INVENTION
According to the present invention, there is provided a device for air-cooling an electronic apparatus in which a suction opening is provided in a housing, a discharge opening is provided in the housing, an airflow passing the inside of the housing is generated by a fan, and heat produced by a heat-producing body is released to the outside of the housing by the airflow, a plurality of air introduction plates inclined to change the direction of the airflow being arranged at the suction opening, a large number of projections being formed on the surfaces of the air introduction plates.
In the device for air-cooling an electronic apparatus, the large number of projections has a convex-like shape extending in a direction perpendicular to the airflow.
In the device for air-cooling an electronic apparatus, a plurality of air lead-through boards inclined in a direction different from the air introduction plate are arranged at a down stream region of the air introduction plate.
In the device for air-cooling an electronic apparatus, there is used a dust removing unit in which the plurality of air introduction plates and the plurality of air lead-through boards are formed in an integrated manner, and which can be easily attached or detached to the housing.
According to the inventive device for air-cooling an electronic apparatus, increased capacity for cooling a heat-producing part is obtained without increase in the size of the device, and accumulation of dust on the heat-producing part can be prevented.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional view illustrating a device for air-cooling an electronic apparatus according to an embodiment of the present invention;
FIG. 2 is a side view illustrating a part of the air-cooling device;
FIG. 3 is a side view illustrating a part of the air-cooling device;
FIG. 4( a) is a front view illustrating a dust removing unit used in the air-cooling device;
FIG. 4( b) is a back view illustrating the dust removing unit;
FIG. 4( c) is a top view illustrating the dust removing unit;
FIG. 4( d) is a bottom view illustrating the dust removing unit;
FIG. 4( e) is a left side view illustrating the dust removing unit;
FIG. 4( f) is a right side view illustrating the dust removing unit;
FIG. 4( g) is a sectional view along the line A-A of FIG. 4( a);
FIG. 4( h) is a sectional view along the line B-B of FIG. 4( a);
FIG. 4( i) is a sectional view along the line C-C of FIG. 4( a);
FIG. 4( j) is a sectional view along the line D-D of FIG. 4( a);
FIG. 4( k) is a sectional view along the line E-E of FIG. 4( a);
FIG. 4( m) is a sectional view along the line F-F of FIG. 4( a);
FIG. 5 is a cross-sectional view illustrating an exemplary conventional device for air-cooling an electronic apparatus; and
FIG. 6 is a cross-sectional view illustrating another exemplary conventional device for air-cooling an electronic apparatus.
 BEST MODES FOR CARRYING OUT THE INVENTION
A preferred embodiment to implement the present invention will be described below with reference to an embodiment. FIG. 1 is a cross-sectional view illustrating a device for air-cooling an electronic apparatus according to an embodiment of the present invention. An upper housing 1 and a lower housing 2 illustrated in FIG. 1 are coupled to sandwich a chassis 3 and constitutes a housing that contains an electronic apparatus. Suction openings 4, 4, . . . which will be illustrated in detail in FIG. 4 are provided in a dustproof unit 7 attached so as to seal a hole of the lower housing 2; and a discharge opening 5 is provided in a chassis 3, or the upper housing 1 and the lower housing 2. Further, a fan 6 is secured to the chassis 3.
Bosses 3 a, 3 a, . . . and radiation fin 3 b are formed in the chassis 3; and printed boards 8, 8 are fastened to the bosses 3 a, 3 a, . . . . Heat produced by a maximum-heat-producing part 9 mounted on the printed boards 8 is transmitted via the heat transmitting parts to the chassis 3.
Airflow indicated by the arrow, traveling from the suction openings 4, 4, . . . to the discharge opening 5 is generated by the fan 6. This airflow cools down the chassis 3 and heat-producing electronic parts including the maximum-heat-producing part 9 mounted on the printed boards 8, 8.
FIG. 4 illustrates the structure of the dustproof unit 7 in detail. The front view illustrated in FIG. 4( a) is a view of the dustproof unit 7 as seen from below in FIG. 1. That is, each of the figures of FIG. 4 is drawn with the lower face of the dustproof unit 7 being set as the front.
Twelve suction openings 4, 4, . . . are, as illustrated in FIG. 4( a), formed in the front lower part of a frame 7 d which constitutes the outer shape of the dustproof unit 7 of resin; and air introduction plates 7 a, 7 a are arranged at the back of the suction openings 4, 4, . . . so as to be viewable from the suction openings 4, 4 . . . .
The air introduction plates 7 a, 7 a, . . . are, as illustrated in FIG. 4( g), inclined relative to the front of the frame 7 d. That is, the air introduction plates 7 a, 7 a, . . . are inclined to change the direction of airflow entering via the suction openings 4, 4, . . . . The air introduction plate 7 a is, as illustrated in detail in FIG. 3, provided with convexes 7 b, 7 b which extend in a direction (direction perpendicular to the paper plane) perpendicular to the airflow indicated by the arrow.
The downstream region (the right side part of FIG. 4( m)) of the air introduction plates 7 a, 7 a, . . . is divided into a void part and a part in which the air lead-through boards 7 c, 7 c, . . . are arranged. As illustrated in FIG. 1, an airflow passing the air lead-through boards 7 c, 7 c, . . . travels along the lower space of the housing; an airflow bypassing the air lead-through boards 7 c, 7 c, . . . travels along the upper space of the housing; and both of them are discharged via the discharge opening 5.
The frame 7 d of the dustproof unit 7 is, as illustrated in FIGS. 4( a) and 4(b), provided with three mounting holes 7 e, 7 e, . . . . The dustproof unit 7 is fastened to the chassis 3 with screws (not illustrated) inserted into the mounting holes 7 e, 7 e, . . . .
In the above structure, a high-speed airflow entering via the suction opening 4 is, as indicated by the arrow in FIG. 3, bent to travel along the air introduction plate 7 a. In this case, dust contained in the airflow is heavier than air, so the inertia causes the dust to collide with the convex 7 b of the air introduction plate 7 a. Also, the dust is thrown off from the airflow by a turbulent flow of the airflow produced in the vicinity of the convex 7 b.
After passing the air introduction plates 7 a, the airflow passes the air lead-through boards 7 c, 7 c, . . . . In this case, also, the airflow is bent by the air lead-through boards 7 c, 7 c, . . . as illustrated in FIG. 2, and thus the dust is further thrown off from the airflow.
Of the dust thrown off in this way, some go out of the housing, and others accumulate on the dustproof unit 7. The dustproof unit 7 can be easily detached by taking out the screws, and the dust can be removed by cleaning the dustproof unit 7, and thus the dust accumulating on the dustproof unit 7 is prevented from entering the airflow again.
In this way, since the airflow passing the inside of the housing does not pass through any filter, the flow rate of airflow is not limited by a filter, and thus the flow rate of airflow is large enough to obtain increased capacity for cooling. Further, dust is prevented from entering the housing, so parts in the housing is prevented from being short-circuited.
The present embodiment has the above structure, but the present invention is not limited thereto. For example, the effect of the present invention can be achieved even when the air lead-through board 7 c is not provided; and when projections of a concave-like shape are arranged in the air lead-through board 7 c, the effect of the present invention is further increased.
INDUSTRIAL APPLICABILITY
In the inventive air-cooling device for an electronic apparatus, a suction opening 4 is provided in a housing 1, a discharge opening 5 is provided in housings 1, 2, an airflow passing the inside of the housings is generated by a fan 5, and heat produced by a heat-producing body 9 is released to the outside of the housings by the airflow. Further, at least one air introduction plate inclined to change the direction of the airflow is arranged at the suction opening 4, and at least one projection is arranged on the surface of the air introduction plate. Accordingly, increased capacity for cooling a heat-producing part is obtained without increase in the size of the device, and accumulation of dust on the heat-producing part can be prevented.

Claims (16)

The invention claimed is:
1. A device for air-cooling an electronic apparatus, comprising:
a housing provided with a hole for suction air and a discharge opening for discharge air;
a heat-producing body provided in the housing;
a fan for generating an airflow from the hole to the discharge opening, heat produced by the heat-producing body being released to an outside of the housing by the airflow; and
a dustproof unit sealing the hole and including a plurality of air introduction plates, a plurality of projections being formed on surfaces of the air introduction plates,
wherein a suction opening to receive airflow is formed between edges of adjacent air introduction plates,
wherein the air introduction plates are inclined to change a direction of the airflow entering via the suction opening,
wherein the fan is arranged downstream of the airflow relative to the air introduction plates,
wherein the projections formed on the surfaces of the air introduction plates on a side of the suction opening are extended in a direction of the suction opening, and
wherein the projections formed on the surfaces of the air introduction plates on an opposite side of the suction opening are extended in an opposite direction of the suction opening.
2. The device for air-cooling an electronic apparatus according to claim 1, wherein a plurality of air lead-through boards inclined in a direction different from the air introduction plates is arranged at a downstream region of the air introduction plates.
3. The device for air-cooling an electronic apparatus according to claim 1,
wherein at least one portion of the air introduction plates is arranged in a same direction and inclined at a prescribed angle.
4. The device for air-cooling an electronic apparatus according to claim 1,
wherein the air introduction plates are constituted of resin in an integrated manner.
5. The device for air-cooling an electronic apparatus according to claim 1, further comprising a chassis for transmitting the heat produced by the heat-producing body, the chassis being arranged in the housing to divide a space of the housing,
wherein the airflow travels along each of the divided spaces and is discharged via the discharge opening.
6. The device for air-cooling an electronic apparatus according to claim 1, further comprising a first portion of the air introduction plates inclined at a first angle and a second portion of the air introduction plates inclined at a second angle,
wherein the first angle and the second angle have line symmetry with each other centering on a line parallel to a line between an endpoint of a first air introduction plate on the side of the suction opening and an endpoint of a second air introduction plate adjacent to the first air introduction plate on the opposite side of the suction opening.
7. The device for air-cooling an electronic apparatus according to claim 1,
wherein a line between an endpoint of a first air introduction plate on the side of the suction opening and an endpoint of a second air introduction plate adjacent to the first air introduction plate on the opposite side of the suction opening is perpendicular to a line between the endpoint of the first air introduction plate on the side of the suction opening and an endpoint of the second air introduction plate on the side of the suction opening.
8. The device for air-cooling an electronic apparatus according to claim 1,
wherein plural suction openings are aligned in parallel between adjacent air introduction plates.
9. A device for air-cooling an electronic apparatus, comprising:
a housing provided with a hole for suction air and a discharge opening for discharge air;
a heat-producing body provided in the housing;
a fan for generating an airflow from the hole to the discharge opening, heat produced by the heat-producing body being released to an outside of the housing by the airflow, and
a dustproof unit sealing the hole and including a plurality of air introduction plates, a plurality of projections being formed on surfaces of the air introduction plates,
wherein suction openings to receive airflow are formed in parallel between edges of adjacent air introduction plates,
wherein the air introduction plates are inclined to change a direction of the airflow entering via the suction openings, and
wherein the fan is arranged downstream of the airflow relative to the air introduction plates.
10. The device for air-cooling an electronic apparatus according to claim 9, wherein a plurality of air lead-through boards inclined in a direction different from the air introduction plates are arranged at a downstream region of the air introduction plates.
11. The device for air-cooling an electronic apparatus according to claim 9,
wherein at least one portion of the air introduction plates is arranged in a same direction and inclined at a prescribed angle.
12. The device for air-cooling an electronic apparatus according to claim 9,
wherein the air introduction plates are constituted of resin in an integrated manner.
13. The device for air-cooling an electronic apparatus according to claim 9,
wherein the projections formed on the surfaces of the air introduction plates on a side of the suction openings are extended in a direction of the suction openings; and
wherein the projections formed on the surfaces of the air introduction plates on an opposite side of the suction openings are extended in an opposite direction of the suction openings.
14. The device for air-cooling an electronic apparatus according to claim 9, further comprising a chassis for transmitting the heat produced by the heat-producing body, the chassis being arranged in the housing to divide a space of the housing,
wherein the airflow travels along each of the divided spaces and is discharged via the discharge opening.
15. The device for air-cooling an electronic apparatus according to claim 9, further comprising a first portion of the air introduction plates inclined at a first angle and a second portion of the air introduction plates inclined at a second angle,
wherein the first angle and the second angle have line symmetry with each other centering on a line parallel to a line between an endpoint of a first air introduction plate on a side of the suction openings and an endpoint of a second air introduction plate adjacent to the first air introduction plate on an opposite side of the suction openings.
16. The device for air-cooling an electronic apparatus according to claim 9,
wherein a line between an endpoint of a first air introduction plate on a side of the suction openings and an endpoint of a second air introduction plate adjacent to the first air introduction plate on an opposite side of the suction openings is perpendicular to a line between the endpoint of the first air introduction plate on the side of the suction openings and an endpoint of the second air introduction plate on the side of the suction openings.
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JP2005150496A JP4420230B2 (en) 2005-05-24 2005-05-24 Air cooling device for electronic equipment
PCT/JP2006/310601 WO2006126693A1 (en) 2005-05-24 2006-05-22 Device for air-cooling electronic apparatus

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110072835A1 (en) * 2008-03-12 2011-03-31 NFT Nanofiltertechnik Gesellschaft MIT Beschrankter Hafting Cooling device for electronic components
US20110122581A1 (en) * 2009-11-20 2011-05-26 Lee-Long Chen Heat exchange device and closed-type electronic apparatus using the same
US20130286580A1 (en) * 2012-04-26 2013-10-31 Hong Hai Precision Industry Co., Ltd. Heat dissipation assembly and server using the same
US20140235156A1 (en) * 2013-02-21 2014-08-21 Sunonwealth Electric Machine Industry Co., Ltd. Cooling System for a Hand-Held Electronic Device
US20150355231A1 (en) * 2014-06-06 2015-12-10 Advantest Corporation Universal test cell
US10064311B2 (en) 2014-12-31 2018-08-28 Elbit Systems Ltd. Thermal management of printed circuit board components
EP3609306A3 (en) * 2018-07-19 2020-04-29 ZF Friedrichshafen AG Control apparatus for a vehicle
US11375612B2 (en) * 2019-11-22 2022-06-28 Bio-Rad Laboratories, Inc. Thermal management for thermal cyclers using air tubes

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20085945L (en) 2008-10-08 2010-04-09 Abb Oy Electronic device cooling structure and method
US7969733B1 (en) * 2008-12-17 2011-06-28 Nvidia Corporation Heat transfer system, method, and computer program product for use with multiple circuit board environments
US7898810B2 (en) 2008-12-19 2011-03-01 Raytheon Company Air cooling for a phased array radar
TWI377008B (en) * 2009-04-14 2012-11-11 Compal Electronics Inc Electronic device
US8936072B2 (en) * 2010-06-11 2015-01-20 Hewlett-Packard Development Company, L.P. Thermal distribution systems and methods
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US20120118327A1 (en) * 2010-11-16 2012-05-17 Rouben Mazmanyan Dust Removal System for Electronic Devices
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US9766668B2 (en) * 2015-08-21 2017-09-19 Corsair Memory, Inc. Forced and natural convection liquid cooler for personal computer
JP2017174847A (en) * 2016-03-18 2017-09-28 東芝メモリ株式会社 Semiconductor device
FR3060202B1 (en) 2016-12-12 2019-07-05 Aptiv Technologies Limited DEVICE FOR DISSIPATING HEAT FROM A MULTIMEDIA CONTROL UNIT
JP2018113406A (en) * 2017-01-13 2018-07-19 アルパイン株式会社 Electronic device
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US10390464B1 (en) * 2018-12-03 2019-08-20 Aic Inc. Server heat dissipation channel structure
CN109885129A (en) * 2019-02-28 2019-06-14 上海摩软通讯技术有限公司 A kind of front housing and mobile terminal device applied to mobile terminal device

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2824939A (en) * 1955-03-17 1958-02-25 Westinghouse Electric Corp Cooling means for metal-clad switchgear
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly
US4479198A (en) * 1983-02-23 1984-10-23 Honeywell Information Systems Inc. Modular computer system
JPS6033744A (en) 1983-08-04 1985-02-21 Yaesu Musen Co Ltd Cooling system of radio communication equipment
US4502100A (en) * 1982-11-24 1985-02-26 International Business Machines Corporation Cooling system with counter flow of coolant
JPS60156808A (en) 1984-01-25 1985-08-17 三菱重工業株式会社 Emergency elevator apparatus of high road
US4699208A (en) * 1985-05-11 1987-10-13 Zinser Textilmaschinen Gmbh Cooling apparatus for an electrical cabinet of a textile machine
US4894749A (en) * 1987-08-31 1990-01-16 AT&T Information Systems Inc American Telephone and Telegraph Company Option slot filler board
US5103374A (en) * 1990-05-23 1992-04-07 At&T Bell Laboratories Circuit pack cooling using turbulators
JPH06152170A (en) 1992-04-03 1994-05-31 Nec Corp Dust-removing apparatus from air
JPH0755312A (en) 1993-08-18 1995-03-03 Canon Inc Cooling device of heat source built-in vessel
JPH0871347A (en) 1994-09-09 1996-03-19 Fuji Electric Co Ltd Foreign matter removing apparatus
US5563768A (en) * 1995-08-31 1996-10-08 At&T Global Information Solutions Company Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid
US5597035A (en) * 1995-08-18 1997-01-28 Dell Usa, L.P. For use with a heatsink a shroud having a varying cross-sectional area
US5689403A (en) 1994-12-27 1997-11-18 Motorola, Inc. Intercooled electronic device
US5704212A (en) * 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices
US5940266A (en) * 1997-10-14 1999-08-17 International Business Machines Corporation Bi-directional cooling arrangement for use with an electronic component enclosure
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
US5983890A (en) * 1998-01-09 1999-11-16 Canadian Gas Research Institute Fireplace having multi-zone heating control
JP2000105524A (en) 1998-09-30 2000-04-11 Minolta Co Ltd Deduster for ventilation airflow in device
US20020054479A1 (en) * 2000-11-06 2002-05-09 Jeff Wu Server having an air flow guide device
US20020159232A1 (en) * 2001-04-30 2002-10-31 Beitelmal Abdlmonem H. Air jet cooling arrangement for electronic systems
JP2003017882A (en) 2001-07-03 2003-01-17 Nec Corp Structure of preventing salt damage of mounting card
US20030168208A1 (en) * 2002-03-11 2003-09-11 Kaoru Sato Electronic component cooling apparatus
US6643130B1 (en) 2002-07-08 2003-11-04 Demarchis John A. Wash down filtered fan apparatus
US20040100773A1 (en) * 2002-11-21 2004-05-27 Hoffman Mark S. Circuit board cover with exhaust apertures for cooling electronic components
US20040196631A1 (en) * 2002-12-18 2004-10-07 Satoshi Ueda Communication device, cooling fan unit, and operation control method for the cooling fan unit
US20040200608A1 (en) * 2003-04-11 2004-10-14 Baldassarre Gregg J. Plate fins with vanes for redirecting airflow
US7038911B2 (en) * 2004-06-30 2006-05-02 International Business Machines Corporation Push-pull dual fan fansink
US20060120043A1 (en) * 2004-12-07 2006-06-08 International Business Machines Corp. Cooling apparatus for vertically stacked printed circuit boards
US20060172685A1 (en) * 2004-08-26 2006-08-03 O'brien Paul Internal environmental control system and uses thereof
US7180740B2 (en) * 2004-09-30 2007-02-20 Datech Technology Co., Ltd. Method and apparatus for side-type heat dissipation
US20070097604A1 (en) * 2005-10-28 2007-05-03 Bruski Gary P Arc resistant baffle for reducing arc-flash energy in an electrical enclosure
US7355856B2 (en) * 2004-09-01 2008-04-08 Lumination Llc Method and apparatus for increasing natural convection efficiency in long heat sinks
US7447021B2 (en) * 2005-06-04 2008-11-04 Hon Hai Precision Industry Co., Ltd. Air guiding cover

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60156808U (en) * 1984-03-29 1985-10-18 株式会社東芝 Salt damage prevention fence for electrical equipment
JP2002353677A (en) 2001-05-24 2002-12-06 Kenwood Corp Heat dissipating structure of apparatus equipped with heating element

Patent Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2824939A (en) * 1955-03-17 1958-02-25 Westinghouse Electric Corp Cooling means for metal-clad switchgear
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly
US4502100A (en) * 1982-11-24 1985-02-26 International Business Machines Corporation Cooling system with counter flow of coolant
US4479198A (en) * 1983-02-23 1984-10-23 Honeywell Information Systems Inc. Modular computer system
JPS6033744A (en) 1983-08-04 1985-02-21 Yaesu Musen Co Ltd Cooling system of radio communication equipment
JPS60156808A (en) 1984-01-25 1985-08-17 三菱重工業株式会社 Emergency elevator apparatus of high road
US4699208A (en) * 1985-05-11 1987-10-13 Zinser Textilmaschinen Gmbh Cooling apparatus for an electrical cabinet of a textile machine
US4894749A (en) * 1987-08-31 1990-01-16 AT&T Information Systems Inc American Telephone and Telegraph Company Option slot filler board
US5103374A (en) * 1990-05-23 1992-04-07 At&T Bell Laboratories Circuit pack cooling using turbulators
JPH06152170A (en) 1992-04-03 1994-05-31 Nec Corp Dust-removing apparatus from air
JPH0755312A (en) 1993-08-18 1995-03-03 Canon Inc Cooling device of heat source built-in vessel
JPH0871347A (en) 1994-09-09 1996-03-19 Fuji Electric Co Ltd Foreign matter removing apparatus
US5689403A (en) 1994-12-27 1997-11-18 Motorola, Inc. Intercooled electronic device
US5597035A (en) * 1995-08-18 1997-01-28 Dell Usa, L.P. For use with a heatsink a shroud having a varying cross-sectional area
US5563768A (en) * 1995-08-31 1996-10-08 At&T Global Information Solutions Company Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
US5704212A (en) * 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices
US5940266A (en) * 1997-10-14 1999-08-17 International Business Machines Corporation Bi-directional cooling arrangement for use with an electronic component enclosure
US5983890A (en) * 1998-01-09 1999-11-16 Canadian Gas Research Institute Fireplace having multi-zone heating control
JP2000105524A (en) 1998-09-30 2000-04-11 Minolta Co Ltd Deduster for ventilation airflow in device
US20020054479A1 (en) * 2000-11-06 2002-05-09 Jeff Wu Server having an air flow guide device
US20020159232A1 (en) * 2001-04-30 2002-10-31 Beitelmal Abdlmonem H. Air jet cooling arrangement for electronic systems
JP2003017882A (en) 2001-07-03 2003-01-17 Nec Corp Structure of preventing salt damage of mounting card
US20030168208A1 (en) * 2002-03-11 2003-09-11 Kaoru Sato Electronic component cooling apparatus
US6643130B1 (en) 2002-07-08 2003-11-04 Demarchis John A. Wash down filtered fan apparatus
US20040100773A1 (en) * 2002-11-21 2004-05-27 Hoffman Mark S. Circuit board cover with exhaust apertures for cooling electronic components
US20040196631A1 (en) * 2002-12-18 2004-10-07 Satoshi Ueda Communication device, cooling fan unit, and operation control method for the cooling fan unit
US20040200608A1 (en) * 2003-04-11 2004-10-14 Baldassarre Gregg J. Plate fins with vanes for redirecting airflow
US7038911B2 (en) * 2004-06-30 2006-05-02 International Business Machines Corporation Push-pull dual fan fansink
US20060172685A1 (en) * 2004-08-26 2006-08-03 O'brien Paul Internal environmental control system and uses thereof
US7355856B2 (en) * 2004-09-01 2008-04-08 Lumination Llc Method and apparatus for increasing natural convection efficiency in long heat sinks
US7180740B2 (en) * 2004-09-30 2007-02-20 Datech Technology Co., Ltd. Method and apparatus for side-type heat dissipation
US20060120043A1 (en) * 2004-12-07 2006-06-08 International Business Machines Corp. Cooling apparatus for vertically stacked printed circuit boards
US7447021B2 (en) * 2005-06-04 2008-11-04 Hon Hai Precision Industry Co., Ltd. Air guiding cover
US20070097604A1 (en) * 2005-10-28 2007-05-03 Bruski Gary P Arc resistant baffle for reducing arc-flash energy in an electrical enclosure

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
European Search Report (Application No. 06766408.6) dated Oct. 1, 2010.
International Preliminary Examination Report (Application No. PCT/JP2006/310601) dated Mar. 27, 2008.
International Search Report (Application No. PCT/JP2006/310601).

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110072835A1 (en) * 2008-03-12 2011-03-31 NFT Nanofiltertechnik Gesellschaft MIT Beschrankter Hafting Cooling device for electronic components
US20110122581A1 (en) * 2009-11-20 2011-05-26 Lee-Long Chen Heat exchange device and closed-type electronic apparatus using the same
US8503178B2 (en) * 2009-11-20 2013-08-06 Delta Electronics, Inc. Heat exchange device and closed-type electronic apparatus using the same
US20130286580A1 (en) * 2012-04-26 2013-10-31 Hong Hai Precision Industry Co., Ltd. Heat dissipation assembly and server using the same
US20140235156A1 (en) * 2013-02-21 2014-08-21 Sunonwealth Electric Machine Industry Co., Ltd. Cooling System for a Hand-Held Electronic Device
US9861005B2 (en) * 2013-02-21 2018-01-02 Sunonwealth Electric Machine Industry Co., Ltd. Cooling system for a hand-held electronic device
US20150355231A1 (en) * 2014-06-06 2015-12-10 Advantest Corporation Universal test cell
US10161962B2 (en) * 2014-06-06 2018-12-25 Advantest Corporation Universal test cell
US10064311B2 (en) 2014-12-31 2018-08-28 Elbit Systems Ltd. Thermal management of printed circuit board components
EP3609306A3 (en) * 2018-07-19 2020-04-29 ZF Friedrichshafen AG Control apparatus for a vehicle
US11375612B2 (en) * 2019-11-22 2022-06-28 Bio-Rad Laboratories, Inc. Thermal management for thermal cyclers using air tubes
US11690169B2 (en) 2019-11-22 2023-06-27 Bio-Rad Laboratories, Inc. Thermal management for thermal cyclers using air tubes

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EP1885169B1 (en) 2012-06-13
EP1885169A1 (en) 2008-02-06
US20090168346A1 (en) 2009-07-02
DE06766408T1 (en) 2008-06-05
JP2006332154A (en) 2006-12-07
CN101185382A (en) 2008-05-21
EP2480060A1 (en) 2012-07-25
CN101185382B (en) 2010-09-08
EP1885169A4 (en) 2010-11-03
WO2006126693A1 (en) 2006-11-30

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