US8462823B2 - Small packaged tunable laser with beam splitter - Google Patents
Small packaged tunable laser with beam splitter Download PDFInfo
- Publication number
- US8462823B2 US8462823B2 US13/080,519 US201113080519A US8462823B2 US 8462823 B2 US8462823 B2 US 8462823B2 US 201113080519 A US201113080519 A US 201113080519A US 8462823 B2 US8462823 B2 US 8462823B2
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- laser
- tunable
- optical
- housing
- tunable laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0064—Anti-reflection components, e.g. optical isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
Definitions
- the present application is directed to a tunable laser and, more particularly, to a small, packaged tunable laser.
- Tunable lasers may be packaged as a component of an optical transceiver, or may be used in other applications outside of an optical transceiver. Tunable lasers are generally packaged with other components including an electrical interface and an optical interface.
- the tunable lasers should be sized for use with one of the various form factors.
- the various form factors provide standardized dimensions and electrical input/output interfaces that allow devices from different manufacturers to be used interchangeably. Examples of form factors include but are not limited to XENPAK, SFF (“Small Form Factor”), SFP (“Small Form Factor Pluggable”), and XFP (“10 Gigabit Small Form Factor Pluggable”).
- the present application is directed to tunable lasers configured in a small package.
- the tunable lasers may include a rectangular housing, an electrical input interface, an optical output interface, a tunable semiconductor laser and a focusing lens assembly.
- the rectangular housing has a volume of less than 0.6 cubic centimeters, with six planar exterior walls including a bottom, a top, opposing first and second ends, and opposing sidewalls.
- the exterior walls form a hermetically sealed interior space that includes a major axis that extends through the first and second ends.
- the electrical input interface is positioned at the first end of the housing and aligned with the major axis.
- the electrical interface is configured to receive an information-containing electrical signal.
- the optical output interface is positioned at the second end of the housing and aligned with the major axis.
- the optical interface is configured to transmit a continuous wave optical beam.
- the tunable semiconductor laser is positioned in the interior space and operable to emit a laser beam having a selectable wavelength.
- the focusing lens assembly is positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface.
- FIG. 1 is a top perspective view of a small, packaged tunable laser according to one embodiment.
- FIG. 2 is a side elevational view of the interior components in the tunable laser of FIG. 1 .
- the present application is directed to a small, packaged tunable laser 100 as illustrated in FIG. 1 .
- the tunable laser 100 is packaged in a housing 200 that forms an interior space for housing the laser components 300 .
- the laser 100 is packaged in housing which is particularly small and compact in size which makes it especially suitable for use in pluggable optical transceivers and various other module configurations or applications.
- the housing 200 includes a generally rectangular body 206 with exterior walls that forms a substantially rectangular shape.
- the body 206 includes a bottom 204 , a cover (not illustrated), first and second ends 230 , 231 , and opposing sidewalls 232 , 233 .
- the cover may be substantially planar and positioned on the top surfaces of the first and second ends 230 , 231 and opposing sidewalls 232 , 233 . In one embodiment, the cover is substantially identical to the bottom 204 .
- the housing 200 includes a substantially rectangular shape with a width W formed by the opposing sidewalls 232 , 233 , a length L formed by the first and second ends 230 , 231 , and a height H that extends between the bottom 204 and top of the sidewalls 232 , 233 and ends 230 , 231 .
- the housing 200 may include various sizes. In one specific embodiment, the width W is about 5.4 mm, the length L is about 17.1 mm, and the height H is about 5.9 mm.
- the volume of the interior space formed by the housing 200 may also vary depending upon the application. Exemplary volumes may range from between about 400 mm 3 to about 600 mm 3 . In one specific embodiment, the volume is about 545 mm 3 .
- the housing 200 includes an elongated shape with a major axis X extending along the length L through the first and second ends 230 , 231 , and a minor axis Y perpendicular to the major axis and extending through the opposing sidewalls 232 , 233 .
- the housing 200 may be hermetically sealed to protect the laser components 300 from humidity and other environmental conditions.
- a flexible electrical cable interface 202 extends outward from the first end 230 of the housing 200 .
- the electrical interface 202 is configured to receive power and information-containing electrical signals.
- the electrical interface 202 includes a connector portion 201 that is aligned with the major axis X, and includes various electrical connection pads 203 .
- the electrical interface 202 may also include additional flexible cables that extend outward from the first end 230 , or sidewalls 232 , 233 .
- An optical output interface 800 extends outward from the second end 231 of the housing 200 .
- the optical output interface 800 is an optical fiber ferrule or “pigtail” aligned with the major axis X of the housing 200 .
- the optical output interface 800 is configured to transmit a continuous wave optical beam that is emitted from the laser components 300 over an optical fiber contained within the interface.
- the laser components 300 generally include an external cavity laser and coupling optics 320 .
- the external cavity laser 310 includes a first subassembly including a diode gain chip 311 comprising a Fabry-Perot diode laser with a substantially non-reflective front facet and a highly reflective rear facet.
- the gain chip 311 may also include a bent-waveguide structure.
- the first subassembly also includes a collimating lens 314 and a steering lens 315 in the path of the beam emitted from the gain chip 311 .
- the collimating lens 314 and the steering lens 315 are both mounted on the same base as the gain chip 311 .
- the external cavity laser 310 further includes a second subassembly including a tunable filter 316 (including tunable filter elements 316 a and 316 b ), a cavity length actuator 317 disposed between the tunable filter elements 316 a and 316 b , and a reflective element 319 .
- the tunable filter 316 includes a pair of spaced apart tunable elements or etalons 316 a , 316 b .
- the etalons 316 a , 316 b are Fabry-Perot spaced etalons that are positioned in a parallel configuration.
- the first etalon 316 a includes a thickness measured between opposing faces and a refractive index according to the material from which it is constructed.
- the second etalon 316 b includes a thickness measured between its opposing faces and a refractive index according to the material from which it is constructed.
- the etalons 316 a , 316 b may be constructed from the same or different materials, and may include the same or different thicknesses.
- Etalons 316 a , 316 b may be constructed from various materials, such as but not limited to silicon and gallium arsenide.
- One or both etalons 316 a , 316 b are tunable by a temperature-induced change in their refractive indexes and/or a temperature-induced change in their thickness.
- the etalons 316 a , 316 b are tunable by simultaneous control of both the refractive index and the physical thickness.
- the tunable filter 316 utilizes a Vernier tuning mechanism including respective first and second optical filters 316 a , 316 b having respective sets of transmission peaks having slightly different free spectral ranges and similar finesses. Tuning is performed by shifting the set of transmission peaks of the second optical filter 316 b relative to the set of transmission peaks of first optical filter 316 a to align a single transmission peak of each of the first and second sets of transmission peaks.
- the actuator 317 may be a block of silicon which is polished and anti-reflection coated, and is disposed between etalons 316 a and 316 b .
- the actuator 317 may use thermal, mechanical, or electro-optical mechanisms to adjust the optical pathlength of the laser cavity.
- the actuator 317 is oriented in the cavity with a seven degree tilt with respect to the optical axis of the beam directed to it from etalon 316 a , so that the light circulating in the optical cavity does not reflect back into the cavity regardless of the efficacy of the anti-reflection coating.
- the actuator 317 may also lock the optical path length.
- the external cavity tunable laser 310 may be configured with the tunable filter 316 a / 316 b being decoupled from the gain chip 311 . This configuration results in the tunable filter 316 a / 316 b being very stable and therefore does not require an external wavelength locker as required in Distributed Feedback (DFB) lasers and Distributed Bragg Reflector (DBR) lasers.
- DFB Distributed Feedback
- DBR Distributed Bragg Reflector
- Other advantages of the external cavity tunable laser 310 over these other lasers are the extremely narrow linewidth and very high side mode suppression ratio.
- the coupling optics 320 provide isolation and coupling to the optical output interface 801 .
- the coupling optics 320 efficiently couple light from the gain chip 311 to the optical output interface 801 .
- a total optical magnification of the coupling optics 320 (including . . . ) and the external cavity lenses 314 , 315 is chosen to correct for the difference between mode field diameters of the gain chip 311 and the optical fiber 802 .
- the coupling optics 320 includes an optical isolator 324 .
- the optical isolator 324 may include a two-stage isolator that prevents light reflected from coupling optics 320 from getting back into the external cavity tunable laser 310 .
- the isolator 324 may also rotate a light polarization by 90 degrees to improve transmission.
- the optical path is aligned substantially along the major axis X of the housing 200 .
- the lens assembly is disposed between the optical isolator 324 of the coupling optics 320 and the optical output interface 800 and includes a wedge shaped support 400 which supports a planar beam splitter 401 .
- the beam splitter 401 is arranged on the support 400 so that its plane is at a 45 degree angle with respect to the incoming beam.
- a photodiode 402 is mounted on the surface of the base below the beam splitter 401 .
- the beam splitter 401 directs a small portion (e.g. 5%) of the isolator output beam to the photodiode 402 , which functions to sense the intensity level of the tunable laser output, so that the user may appropriately control the current to the laser to achieve the desired optical output level or intensity.
- the remainder of the isolator output beam is directed by a beam splitter to the collimating lens 501 .
- a window 600 Downstream from the collimating lens 501 is a window 600 which is attached to the housing 200 and permits the collimated beam to exit the housing 200 .
- the optical output interface which includes a fiber focus alignment lens 700 and the optical fiber ferrule 800 .
- the cladded optical fiber 802 is a “pig-tail” that extends for a relatively short distance to allow coupling to other subassemblies.
- the window 600 or the alignment lens 700 may be the final downstream components associated with the housing 200 , to allow the user to couple an optical fiber directly to the outside of the housing 200 through a pluggable connector or other optical interface.
- thermoelectric cooler includes first and second plates 702 and 704 , respectively, separated by intermediate members 703 a , 703 b , 703 c , etc., that provides a base for supporting the various elements of the tunable laser 100 .
- the thermoelectric cooler (comprised of elements 702 , 703 , 704 ) is positioned between the bottom 204 of the housing 200 and one or more of the laser components 300 .
- the plates 702 , 704 may be constructed from a variety of materials, including ceramics.
- the intermediate members 703 a , 703 b , etc., each include a first end operatively connected to the first plate 702 and a second end operatively connected to the second plate 704 .
- the intermediate members 703 a , 703 b , etc. are electrically connected in series by connectors.
- the intermediate members 703 a , 703 b , etc. are constructed from semiconductor material that allows for electron flow through the member 703 a , 703 b , etc. when connected to a DC power source.
- the DC power source is activated and a current passes through the series of intermediate members 703 a , 703 b , etc.
- the current causes a decrease in temperature at the first plate 702 that absorbs heat from the laser components 300 .
- the heat is transferred through the plate 702 and intermediate members 703 a , 703 b , etc., into the second plate 704 . This heat may then be transferred from the second plate 704 , such as to a heat sink.
- the temperature of the tunable filter 316 and cavity length actuator 317 may be separately controlled from the other laser components 300 .
- a bench 318 which may be composed of a glass, may provide thermal isolation from the thermoelectric cooler 400 .
Abstract
Description
Claims (22)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/080,519 US8462823B2 (en) | 2009-08-06 | 2011-04-05 | Small packaged tunable laser with beam splitter |
US13/774,309 US8923348B2 (en) | 2009-08-06 | 2013-02-22 | Small packaged tunable laser assembly |
US13/899,467 US9337611B2 (en) | 2009-08-06 | 2013-05-21 | Small packaged tunable laser transmitter |
US14/518,943 US9054480B2 (en) | 2009-08-06 | 2014-10-20 | Small packaged tunable traveling wave laser assembly |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/537,026 US20110033192A1 (en) | 2009-08-06 | 2009-08-06 | Small Packaged Tunable Optical Transmitter |
US12/722,825 US20110032955A1 (en) | 2009-08-06 | 2010-03-12 | Small Packaged Tunable Laser |
US201161444362P | 2011-02-18 | 2011-02-18 | |
US13/080,519 US8462823B2 (en) | 2009-08-06 | 2011-04-05 | Small packaged tunable laser with beam splitter |
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US12/722,825 Continuation-In-Part US20110032955A1 (en) | 2009-08-06 | 2010-03-12 | Small Packaged Tunable Laser |
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US13/774,309 Continuation-In-Part US8923348B2 (en) | 2009-08-06 | 2013-02-22 | Small packaged tunable laser assembly |
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US20110182305A1 US20110182305A1 (en) | 2011-07-28 |
US8462823B2 true US8462823B2 (en) | 2013-06-11 |
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US13/080,519 Active 2029-09-15 US8462823B2 (en) | 2009-08-06 | 2011-04-05 | Small packaged tunable laser with beam splitter |
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Cited By (5)
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US9054480B2 (en) | 2009-08-06 | 2015-06-09 | Neophotonics Corporation | Small packaged tunable traveling wave laser assembly |
US20150162990A1 (en) * | 2013-12-09 | 2015-06-11 | Emcore Corporation | Small packaged tunable laser transmitter |
US9337611B2 (en) | 2009-08-06 | 2016-05-10 | Neophotonics Corporation | Small packaged tunable laser transmitter |
US10340660B2 (en) | 2013-12-09 | 2019-07-02 | Neophotonics Corporation | Semiconductor tunable laser package with tunable optical filters subassembly |
US11811195B2 (en) | 2019-03-01 | 2023-11-07 | Neophotonics Corporation | Method for wavelength control of silicon photonic external cavity tunable laser |
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US8923348B2 (en) | 2009-08-06 | 2014-12-30 | Emcore Corporation | Small packaged tunable laser assembly |
USD745208S1 (en) * | 2013-02-12 | 2015-12-08 | Neophotonics Corporation | Support for a beam splitter |
US9512985B2 (en) | 2013-02-22 | 2016-12-06 | Kla-Tencor Corporation | Systems for providing illumination in optical metrology |
EP2770590A1 (en) * | 2013-02-22 | 2014-08-27 | EMCORE Corporation | Small packaged tunable laser assembly |
CN103557937A (en) * | 2013-10-31 | 2014-02-05 | 中国科学院半导体研究所 | Laser power monitoring assembly, laser emission module with laser power monitoring assembly used and optical amplifier with laser power monitoring assembly used |
CN111987586A (en) * | 2019-05-24 | 2020-11-24 | 苏州旭创科技有限公司 | Tunable laser and optical module |
CN112332214A (en) * | 2019-08-02 | 2021-02-05 | 苏州旭创科技有限公司 | Tunable laser and optical module |
US20210036489A1 (en) * | 2019-08-02 | 2021-02-04 | Innolight Technology (Suzhou) Ltd. | Narrow linewidth external cavity laser and optical module |
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