US9123773B1 - T-shaped single diffusion barrier with single mask approach process flow - Google Patents
T-shaped single diffusion barrier with single mask approach process flow Download PDFInfo
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- US9123773B1 US9123773B1 US14/461,015 US201414461015A US9123773B1 US 9123773 B1 US9123773 B1 US 9123773B1 US 201414461015 A US201414461015 A US 201414461015A US 9123773 B1 US9123773 B1 US 9123773B1
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 230000008569 process Effects 0.000 title claims abstract description 11
- 238000009792 diffusion process Methods 0.000 title claims description 3
- 230000004888 barrier function Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 125000006850 spacer group Chemical group 0.000 claims abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 43
- 229910052710 silicon Inorganic materials 0.000 claims description 43
- 239000010703 silicon Substances 0.000 claims description 43
- 238000005530 etching Methods 0.000 claims description 31
- 238000001020 plasma etching Methods 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- -1 silicon cobalt nitride Chemical class 0.000 claims description 3
- 229910003481 amorphous carbon Inorganic materials 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02115—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
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Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/461,015 US9123773B1 (en) | 2014-08-15 | 2014-08-15 | T-shaped single diffusion barrier with single mask approach process flow |
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Application Number | Priority Date | Filing Date | Title |
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US14/461,015 US9123773B1 (en) | 2014-08-15 | 2014-08-15 | T-shaped single diffusion barrier with single mask approach process flow |
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US9123773B1 true US9123773B1 (en) | 2015-09-01 |
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US14/461,015 Active US9123773B1 (en) | 2014-08-15 | 2014-08-15 | T-shaped single diffusion barrier with single mask approach process flow |
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Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9524911B1 (en) | 2015-09-18 | 2016-12-20 | Globalfoundries Inc. | Method for creating self-aligned SDB for minimum gate-junction pitch and epitaxy formation in a fin-type IC device |
US9570442B1 (en) | 2016-04-20 | 2017-02-14 | Qualcomm Incorporated | Applying channel stress to Fin field-effect transistors (FETs) (FinFETs) using a self-aligned single diffusion break (SDB) isolation structure |
US9589845B1 (en) * | 2016-05-23 | 2017-03-07 | International Business Machines Corporation | Fin cut enabling single diffusion breaks |
US9716042B1 (en) | 2015-12-30 | 2017-07-25 | International Business Machines Corporation | Fin field-effect transistor (FinFET) with reduced parasitic capacitance |
US20170278925A1 (en) * | 2016-03-23 | 2017-09-28 | Globalfoundries Inc. | Introducing material with a lower etch rate to form a t-shaped sdb sti structure |
CN107768308A (en) * | 2016-08-23 | 2018-03-06 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
CN107785316A (en) * | 2016-08-29 | 2018-03-09 | 中芯国际集成电路制造(上海)有限公司 | The forming method of semiconductor structure |
CN107978563A (en) * | 2016-10-21 | 2018-05-01 | 中芯国际集成电路制造(上海)有限公司 | A kind of semiconductor devices and preparation method, electronic device |
CN108155148A (en) * | 2016-12-02 | 2018-06-12 | 中芯国际集成电路制造(上海)有限公司 | The forming method of semiconductor structure |
US10014296B1 (en) * | 2017-04-14 | 2018-07-03 | Globalfoundries Inc. | Fin-type field effect transistors with single-diffusion breaks and method |
US10283413B2 (en) | 2016-08-15 | 2019-05-07 | United Microelectronics Corp. | Semiconductor device and manufacturing method thereof |
US20190341449A1 (en) * | 2017-04-19 | 2019-11-07 | Winbond Electronics Corp. | Method of manufacturing memory structure |
US10475693B1 (en) * | 2018-06-07 | 2019-11-12 | Globalfoundries Inc. | Method for forming single diffusion breaks between finFET devices and the resulting devices |
US10985048B2 (en) | 2018-01-17 | 2021-04-20 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11056399B2 (en) * | 2019-04-10 | 2021-07-06 | International Business Machines Corporation | Source and drain EPI protective spacer during single diffusion break formation |
US11062954B2 (en) * | 2018-01-17 | 2021-07-13 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11450659B2 (en) | 2020-03-12 | 2022-09-20 | International Business Machines Corporation | On-chip decoupling capacitor |
US11545574B2 (en) | 2020-08-17 | 2023-01-03 | Globalfoundries U.S. Inc. | Single diffusion breaks including stacked dielectric layers |
US11563106B2 (en) * | 2017-07-28 | 2023-01-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Formation method of isolation feature of semiconductor device structure |
US11948970B2 (en) | 2017-11-30 | 2024-04-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
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---|---|---|---|---|
US6165870A (en) * | 1998-06-30 | 2000-12-26 | Hyundai Electronics Industries Co., Ltd. | Element isolation method for semiconductor devices including etching implanted region under said spacer to form a stepped trench structure |
US6207532B1 (en) * | 1999-09-30 | 2001-03-27 | Taiwan Semiconductor Manufacturing Company | STI process for improving isolation for deep sub-micron application |
US20030030089A1 (en) * | 2001-08-13 | 2003-02-13 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating a semiconductor device with a trench isolation structure and semiconductor device |
US6746936B1 (en) * | 2002-12-09 | 2004-06-08 | Hynix Semiconductor Inc. | Method for forming isolation film for semiconductor devices |
-
2014
- 2014-08-15 US US14/461,015 patent/US9123773B1/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6165870A (en) * | 1998-06-30 | 2000-12-26 | Hyundai Electronics Industries Co., Ltd. | Element isolation method for semiconductor devices including etching implanted region under said spacer to form a stepped trench structure |
US6207532B1 (en) * | 1999-09-30 | 2001-03-27 | Taiwan Semiconductor Manufacturing Company | STI process for improving isolation for deep sub-micron application |
US20030030089A1 (en) * | 2001-08-13 | 2003-02-13 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating a semiconductor device with a trench isolation structure and semiconductor device |
US6746936B1 (en) * | 2002-12-09 | 2004-06-08 | Hynix Semiconductor Inc. | Method for forming isolation film for semiconductor devices |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9524911B1 (en) | 2015-09-18 | 2016-12-20 | Globalfoundries Inc. | Method for creating self-aligned SDB for minimum gate-junction pitch and epitaxy formation in a fin-type IC device |
US10062785B2 (en) | 2015-12-30 | 2018-08-28 | International Business Machines Corporation | Fin field-effect transistor (FinFET) with reduced parasitic capacitance |
US9716042B1 (en) | 2015-12-30 | 2017-07-25 | International Business Machines Corporation | Fin field-effect transistor (FinFET) with reduced parasitic capacitance |
US20170278925A1 (en) * | 2016-03-23 | 2017-09-28 | Globalfoundries Inc. | Introducing material with a lower etch rate to form a t-shaped sdb sti structure |
US9570442B1 (en) | 2016-04-20 | 2017-02-14 | Qualcomm Incorporated | Applying channel stress to Fin field-effect transistors (FETs) (FinFETs) using a self-aligned single diffusion break (SDB) isolation structure |
US9589845B1 (en) * | 2016-05-23 | 2017-03-07 | International Business Machines Corporation | Fin cut enabling single diffusion breaks |
US10522415B1 (en) | 2016-08-15 | 2019-12-31 | United Microelectronics Corp. | Semiconductor device |
US10460997B2 (en) | 2016-08-15 | 2019-10-29 | United Microelectronics Corp. | Manufacturing method of semiconductor device |
US10283413B2 (en) | 2016-08-15 | 2019-05-07 | United Microelectronics Corp. | Semiconductor device and manufacturing method thereof |
CN107768308A (en) * | 2016-08-23 | 2018-03-06 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor structure and forming method thereof |
CN107785316A (en) * | 2016-08-29 | 2018-03-09 | 中芯国际集成电路制造(上海)有限公司 | The forming method of semiconductor structure |
CN107978563A (en) * | 2016-10-21 | 2018-05-01 | 中芯国际集成电路制造(上海)有限公司 | A kind of semiconductor devices and preparation method, electronic device |
CN108155148B (en) * | 2016-12-02 | 2020-05-08 | 中芯国际集成电路制造(上海)有限公司 | Method for forming semiconductor structure |
CN108155148A (en) * | 2016-12-02 | 2018-06-12 | 中芯国际集成电路制造(上海)有限公司 | The forming method of semiconductor structure |
US10014296B1 (en) * | 2017-04-14 | 2018-07-03 | Globalfoundries Inc. | Fin-type field effect transistors with single-diffusion breaks and method |
US10847612B2 (en) * | 2017-04-19 | 2020-11-24 | Winbond Electronics Corp. | Method of manufacturing memory structure |
US20190341449A1 (en) * | 2017-04-19 | 2019-11-07 | Winbond Electronics Corp. | Method of manufacturing memory structure |
US11563106B2 (en) * | 2017-07-28 | 2023-01-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Formation method of isolation feature of semiconductor device structure |
US11948970B2 (en) | 2017-11-30 | 2024-04-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method thereof |
US10985048B2 (en) | 2018-01-17 | 2021-04-20 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11062954B2 (en) * | 2018-01-17 | 2021-07-13 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11901239B2 (en) | 2018-01-17 | 2024-02-13 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11417564B2 (en) | 2018-01-17 | 2022-08-16 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11721591B2 (en) | 2018-01-17 | 2023-08-08 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US11600531B2 (en) | 2018-01-17 | 2023-03-07 | United Microelectronics Corp. | Semiconductor device and method for fabricating the same |
US10475693B1 (en) * | 2018-06-07 | 2019-11-12 | Globalfoundries Inc. | Method for forming single diffusion breaks between finFET devices and the resulting devices |
US11121023B2 (en) | 2018-06-07 | 2021-09-14 | Globalfoundries U.S. Inc. | FinFET device comprising a single diffusion break with an upper surface that is substantially coplanar with an upper surface of a fin |
US11056399B2 (en) * | 2019-04-10 | 2021-07-06 | International Business Machines Corporation | Source and drain EPI protective spacer during single diffusion break formation |
US11450659B2 (en) | 2020-03-12 | 2022-09-20 | International Business Machines Corporation | On-chip decoupling capacitor |
US11545574B2 (en) | 2020-08-17 | 2023-01-03 | Globalfoundries U.S. Inc. | Single diffusion breaks including stacked dielectric layers |
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