US9398389B2 - Apparatus for securing components in an electret condenser microphone (ECM) - Google Patents

Apparatus for securing components in an electret condenser microphone (ECM) Download PDF

Info

Publication number
US9398389B2
US9398389B2 US14/273,041 US201414273041A US9398389B2 US 9398389 B2 US9398389 B2 US 9398389B2 US 201414273041 A US201414273041 A US 201414273041A US 9398389 B2 US9398389 B2 US 9398389B2
Authority
US
United States
Prior art keywords
diaphragm
charge plate
stitch
support structure
ring support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US14/273,041
Other versions
US20140334646A1 (en
Inventor
Felix Matthew Naylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knowles Electronics LLC
Original Assignee
Knowles Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC
Priority to US14/273,041 priority Critical patent/US9398389B2/en
Assigned to KNOWLES ELECTRONICS, LLC reassignment KNOWLES ELECTRONICS, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAYLOR, Felix Matthew
Publication of US20140334646A1 publication Critical patent/US20140334646A1/en
Application granted granted Critical
Publication of US9398389B2 publication Critical patent/US9398389B2/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/01Electrostatic transducers characterised by the use of electrets
    • H04R19/016Electrostatic transducers characterised by the use of electrets for microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • This application relates to acoustic devices and, more specifically, securing the internal components of these devices.
  • acoustic devices Various types exist and one such type of device is a microphone.
  • the Electret Condenser Microphone (ECM) is being used in devices such as cellular phones, video cameras, studio performance microphones, and headphones to mention a few examples.
  • ECM electrostatic discharge memory
  • sound energy enters through a sound port and vibrates a diaphragm and this action creates a corresponding change in electrical potential (voltage) between the diaphragm and a charge plate disposed near the diaphragm.
  • This voltage represents the sound energy that has been received.
  • the voltage is then transmitted to an electric circuit (e.g., an integrated circuit such as an application specific integrated circuit (ASIC)). Further processing of the signal may be performed on the electrical circuit. For instance, amplification or filtering functions may be performed on the voltage signal at the integrated circuit.
  • ASIC application specific integrated circuit
  • the diaphragm and charge plate combination In order for the diaphragm and charge plate combination to function properly, they need to be secured within the microphone. If, for example, the distance separating them changes in an unexpected way (in the absence of the diaphragm moving in response to sound energy), then the microphone will not function properly.
  • the connection between the charge plate and diaphragm provides mechanical support and is sometimes referred to as a “stitch”, due to its shape.
  • the connection between the diaphragm and housing provides mechanical support and an air-tight seal around the perimeter of the diaphragm.
  • Various attempts have been made to provide mechanical support and an air-tight seal, but these attempts have various shortcomings.
  • FIG. 1 comprises a side cutaway view of an ECM showing a stitch according to various embodiments of the present invention
  • FIG. 2 comprises a perspective view of an ECM with a stitch according to various embodiments of the present invention
  • FIG. 3 comprises a top view of an ECM with a stitch according to various embodiments of the present invention.
  • FIG. 4 comprises a flow chart for making an ECM with a stitch according to various embodiments of the present invention.
  • a stitch typically comprised of epoxy, is used to hold a charge plate and a diaphragm and to, in the absence of sound energy, maintain a constant or substantially constant distance between these elements.
  • sealing material typically comprised of epoxy, is applied around the perimeter of a diaphragm to create an air-tight seal around its perimeter.
  • a stitch or other securing device can be made of a smaller size and this allows for smaller microphones and more available back volume; hence, more microphone sensitivity is provided. This is particularly advantageous for situations where the microphone needs to be as small as possible (e.g., in portable electronic devices and hearing aid applications).
  • the present approaches also provide for increased mechanical strength than adhesive only stitches, specifically amongst its motor components. This allows for better mechanical performance when mechanical shocks impact the microphone.
  • the present approaches also provide for reduced vibration sensitivity capability.
  • the thickness of the stitch can be increased more precisely than with epoxy only stitches, which reduces vibration sensitivity.
  • a motor in many of these embodiments, includes a diaphragm and a charge plate.
  • the diaphragm is separated from the charge plate by a constant distance.
  • the separation is secured using a stitch that is constructed from a b-stage epoxy bonded to a polyimide layer, such as Kapton (manufactured by Dupont corporation).
  • the acoustic apparatus is a motor for an ECM.
  • the apparatus 100 includes a charge plate 102 , a diaphragm 104 , a diaphragm ring 106 , and a stitch 108 .
  • these components are together referred to as an ECM motor.
  • the charge plate 102 is a conventional charge plate that is used in ECMs and the diaphragm 104 is a conventional diaphragm (e.g., a film material) used in ECM devices.
  • the ring 106 secures the diaphragm 104 .
  • the charge plate 102 and diaphragm 104 are separated by a distance “d.” In the absence of sound energy, this distance d is maintained to be a constant distance or a nearly constant distance.
  • the stitch 108 is, in one example, constructed of “b-stage” epoxy 107 backed with a polyimide film 109 .
  • the polyimide e.g., Kapton
  • the polyimide gives the b-stage epoxy a more sturdy mechanical structure, which makes for ease of shape designing, cutting, and handling with reduced risk of breakage and shape deformation.
  • the b-stage epoxy bonds to the charge plate and adjacent diaphragm ring 106 to secure the motor.
  • the b-staged epoxy used in the stitch 108 is a semi-solid form of partially cured epoxy. It is used between (e.g., midway between) the liquid state of blended, but partially cured resins, and a final state of a fully formed polymer. “B-stage” epoxy has been heat cured for a short period of time and then cooled (quenched) to prevent complete polymerization of the resin system. As discussed elsewhere herein, this midway solid state can expand manufacturing options. B-stage epoxy can be provided in a number of options such as in rolls or sheets.
  • the epoxy With the epoxy having been partially cured (e.g., less than approximately 10 percent), it is available for bonding parts together (i.e., the charge plate and diaphragm). In other words, the epoxy and its polymerization are “staged” in order to facilitate the overall process. Later, the epoxy is re-heated to reactivate polymerization and complete the curing cycle.
  • the blending/depositing process (blending of resin and hardener, then depositing the liquid on a substrate) is separated from the curing process (after the liquid is deposited, immediately curing the liquid with time or heat) thereby adding flexibility to the manufacturing process.
  • This voltage represents the sound energy that has been received.
  • the voltage is then transmitted to an electric circuit (e.g., an integrated circuit such as an application specific integrated circuit (ASIC)). Further processing of the signal may be performed on the electrical circuit. For instance, amplification or filtering functions may be performed on the voltage signal at the integrated circuit.
  • ASIC application specific integrated circuit
  • FIG. 3 another example of a stitch that is shaped differently from the example of FIGS. 1 and 2 is described.
  • the elements of FIG. 3 are the same as those in FIGS. 1 and 2 so that their descriptions are not repeated here.
  • FIG. 3 illustrates that stitches can take on a number of different shapes and dimensions.
  • FIG. 4 one example of a method for making an ECM microphone with a stitch is described.
  • the b-stage epoxy/polyimide (e.g., Kapton) assembly is removed from frozen storage.
  • the assembly is kept frozen prior to use to prolong its life by decelerating cure and to make it easier to handle, as it is not as tacky in the frozen or chilled state.
  • the shape of the stitch is cut out which can be accomplished using a conventional die stamping process or by using a laser cutting process.
  • the epoxy/polyimide (e.g., Kapton) stitch is put down over the charge plate and diaphragm ring, bridging the gap between them, and tacking their position.
  • the epoxy/polyimide (e.g., Kapton) stitch and its adjacent components (charge plate and diaphragm ring) are put in an oven and heated (e.g., at 90 degrees Celsius) for approximately two hours whereas, the oven process renders the stitch attached to the diaphragm and the charge plate, and they are removed from the oven.
  • the epoxy/polyimide film assembly functions as a mechanical support; however, it will be appreciated that the principles described herein can also be applied to other functions, such as creating an air tight seal around the perimeter of the microphone diaphragm.
  • the device is a microphone; however, it will be appreciated that the principles described herein can also be applied to other types of devices, such as armature balanced receivers.

Abstract

An Electret Condenser Microphone (ECM) motor apparatus includes a diaphragm ring support structure, a charge plate, and at least one stitch. The diaphragm ring support structure defines an opening there through. The charge plate is disposed within the opening. The at least one stitch is coupled to the diaphragm ring support structure to the charge plate. The diaphragm is disposed adjacent to and in a generally parallel relationship to the charge plate. The stitch is configured to hold the charge plate and the diaphragm ring, and the stitch is configured to maintain a constant or nearly constant distance between the charge plate and the diaphragm in the absence of sound energy.

Description

CROSS REFERENCE TO RELATED APPLICATIONS
This patent claims benefit under 35 U.S.C. §119 (e) to U.S. Provisional Application No. 61/822,590 entitled “Apparatus for Securing Components in an Electret Condenser (ECM)” filed May 13, 2013, the content of which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
This application relates to acoustic devices and, more specifically, securing the internal components of these devices.
BACKGROUND OF THE INVENTION
Various types of acoustic devices exist and one such type of device is a microphone. In one example, the Electret Condenser Microphone (ECM) is being used in devices such as cellular phones, video cameras, studio performance microphones, and headphones to mention a few examples.
In the case of an ECM, sound energy enters through a sound port and vibrates a diaphragm and this action creates a corresponding change in electrical potential (voltage) between the diaphragm and a charge plate disposed near the diaphragm. This voltage represents the sound energy that has been received. Typically, the voltage is then transmitted to an electric circuit (e.g., an integrated circuit such as an application specific integrated circuit (ASIC)). Further processing of the signal may be performed on the electrical circuit. For instance, amplification or filtering functions may be performed on the voltage signal at the integrated circuit.
In order for the diaphragm and charge plate combination to function properly, they need to be secured within the microphone. If, for example, the distance separating them changes in an unexpected way (in the absence of the diaphragm moving in response to sound energy), then the microphone will not function properly. There are various methods to secure the diaphragm to the charge plate and the diaphragm to the housing. The connection between the charge plate and diaphragm provides mechanical support and is sometimes referred to as a “stitch”, due to its shape. The connection between the diaphragm and housing provides mechanical support and an air-tight seal around the perimeter of the diaphragm. Various attempts have been made to provide mechanical support and an air-tight seal, but these attempts have various shortcomings.
BRIEF DESCRIPTION OF THE DRAWINGS
For a more complete understanding of the disclosure, reference should be made to the following detailed description and accompanying drawings wherein:
FIG. 1 comprises a side cutaway view of an ECM showing a stitch according to various embodiments of the present invention;
FIG. 2 comprises a perspective view of an ECM with a stitch according to various embodiments of the present invention;
FIG. 3 comprises a top view of an ECM with a stitch according to various embodiments of the present invention; and
FIG. 4 comprises a flow chart for making an ECM with a stitch according to various embodiments of the present invention.
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity. It will further be appreciated that certain actions and/or steps may be described or depicted in a particular order of occurrence while those skilled in the art will understand that such specificity with respect to sequence is not actually required. It will also be understood that the terms and expressions used herein have the ordinary meaning as is accorded to such terms and expressions with respect to their corresponding respective areas of inquiry and study except where specific meanings have otherwise been set forth herein.
DETAILED DESCRIPTION
Approaches are provided herein that allow elements of an acoustic device to be attached together. In particular, a stitch, typically comprised of epoxy, is used to hold a charge plate and a diaphragm and to, in the absence of sound energy, maintain a constant or substantially constant distance between these elements.
Approaches are provided herein that allow elements of an acoustic device to be acoustically sealed. In particular, sealing material, typically comprised of epoxy, is applied around the perimeter of a diaphragm to create an air-tight seal around its perimeter.
In one advantage of the present approaches, a stitch or other securing device can be made of a smaller size and this allows for smaller microphones and more available back volume; hence, more microphone sensitivity is provided. This is particularly advantageous for situations where the microphone needs to be as small as possible (e.g., in portable electronic devices and hearing aid applications).
In another advantage, consistently sized and shaped stitches are obtained. This allows for less variation in the available back volume of microphones; hence, less sensitivity variation of the microphone.
The present approaches also provide for increased mechanical strength than adhesive only stitches, specifically amongst its motor components. This allows for better mechanical performance when mechanical shocks impact the microphone.
The present approaches also provide for reduced vibration sensitivity capability. In other words, the thickness of the stitch can be increased more precisely than with epoxy only stitches, which reduces vibration sensitivity.
In still another advantage of the present approaches, manual epoxy stitch “artistry” requirements are eliminated. In other words, operator dependency is alleviated; thus, less variation in the sensitivity of the microphone.
In many of these embodiments, a motor includes a diaphragm and a charge plate. The diaphragm is separated from the charge plate by a constant distance. The separation is secured using a stitch that is constructed from a b-stage epoxy bonded to a polyimide layer, such as Kapton (manufactured by Dupont corporation).
Referring now to FIG. 1 and FIG. 2, and acoustic apparatus 100 is described. In this example, the acoustic apparatus is a motor for an ECM. The apparatus 100 includes a charge plate 102, a diaphragm 104, a diaphragm ring 106, and a stitch 108. In this example, these components are together referred to as an ECM motor.
The charge plate 102 is a conventional charge plate that is used in ECMs and the diaphragm 104 is a conventional diaphragm (e.g., a film material) used in ECM devices. The ring 106 secures the diaphragm 104. The charge plate 102 and diaphragm 104 are separated by a distance “d.” In the absence of sound energy, this distance d is maintained to be a constant distance or a nearly constant distance.
The stitch 108 is, in one example, constructed of “b-stage” epoxy 107 backed with a polyimide film 109. The polyimide (e.g., Kapton) film remains stable in a wide range of temperatures (e.g., from approximately −273 to approximately +400 degrees C.). The polyimide gives the b-stage epoxy a more sturdy mechanical structure, which makes for ease of shape designing, cutting, and handling with reduced risk of breakage and shape deformation. The b-stage epoxy bonds to the charge plate and adjacent diaphragm ring 106 to secure the motor.
The b-staged epoxy used in the stitch 108 is a semi-solid form of partially cured epoxy. It is used between (e.g., midway between) the liquid state of blended, but partially cured resins, and a final state of a fully formed polymer. “B-stage” epoxy has been heat cured for a short period of time and then cooled (quenched) to prevent complete polymerization of the resin system. As discussed elsewhere herein, this midway solid state can expand manufacturing options. B-stage epoxy can be provided in a number of options such as in rolls or sheets.
With the epoxy having been partially cured (e.g., less than approximately 10 percent), it is available for bonding parts together (i.e., the charge plate and diaphragm). In other words, the epoxy and its polymerization are “staged” in order to facilitate the overall process. Later, the epoxy is re-heated to reactivate polymerization and complete the curing cycle.
In this way, and as compared with other approaches, the blending/depositing process (blending of resin and hardener, then depositing the liquid on a substrate) is separated from the curing process (after the liquid is deposited, immediately curing the liquid with time or heat) thereby adding flexibility to the manufacturing process.
In one example of the operation of the system of FIGS. 1 and 2, sound energy enters through a sound port in a microphone assembly (not shown) and vibrates the diaphragm 104 and this action creates a corresponding change in electrical potential (voltage) between the diaphragm 104 and the charge plate 102. In the absence of the sound energy, the diaphragm 104 is separated from the charge plate 102 by the constant or nearly constant distance d. The separation is secured using a stitch 108 to provide mechanical strength and to ensure that the distance is maintained.
This voltage represents the sound energy that has been received. Typically, the voltage is then transmitted to an electric circuit (e.g., an integrated circuit such as an application specific integrated circuit (ASIC)). Further processing of the signal may be performed on the electrical circuit. For instance, amplification or filtering functions may be performed on the voltage signal at the integrated circuit.
Referring now to FIG. 3, another example of a stitch that is shaped differently from the example of FIGS. 1 and 2 is described. The elements of FIG. 3 are the same as those in FIGS. 1 and 2 so that their descriptions are not repeated here. FIG. 3 illustrates that stitches can take on a number of different shapes and dimensions.
Referring now to FIG. 4, one example of a method for making an ECM microphone with a stitch is described.
At step 402, the b-stage epoxy/polyimide (e.g., Kapton) assembly is removed from frozen storage. The assembly is kept frozen prior to use to prolong its life by decelerating cure and to make it easier to handle, as it is not as tacky in the frozen or chilled state. At step 404, the shape of the stitch is cut out which can be accomplished using a conventional die stamping process or by using a laser cutting process.
At step 406, the epoxy/polyimide (e.g., Kapton) stitch is put down over the charge plate and diaphragm ring, bridging the gap between them, and tacking their position. At step 408, the epoxy/polyimide (e.g., Kapton) stitch and its adjacent components (charge plate and diaphragm ring) are put in an oven and heated (e.g., at 90 degrees Celsius) for approximately two hours whereas, the oven process renders the stitch attached to the diaphragm and the charge plate, and they are removed from the oven.
In this example, the epoxy/polyimide film assembly functions as a mechanical support; however, it will be appreciated that the principles described herein can also be applied to other functions, such as creating an air tight seal around the perimeter of the microphone diaphragm.
In this example, the device is a microphone; however, it will be appreciated that the principles described herein can also be applied to other types of devices, such as armature balanced receivers.
Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. It should be understood that the illustrated embodiments are exemplary only, and should not be taken as limiting the scope of the appended claims.

Claims (17)

What is claimed is:
1. A Electret Condenser Microphone (ECM) motor apparatus comprising:
a diaphragm ring support structure, the diaphragm ring support structure defining an opening therethrough;
a charge plate disposed within the opening;
at least one stitch coupling the diaphragm ring support structure to the charge plate;
a diaphragm disposed adjacent to and in a generally parallel relationship to the charge plate;
at least one spacer separating the charge plate and the diaphragm, the at least one spacer being spaced from the diaphragm ring support structure and disposed between the charge plate and the diaphragm;
wherein the at least one stitch fastens the charge plate to the diaphragm ring support structure, and
wherein the charge plate and the diaphragm have a constant or nearly constant distance between the charge plate and the diaphragm in the absence of sound energy.
2. The ECM motor apparatus of claim 1 wherein the at least one stitch has a first layer and a second layer.
3. The ECM motor apparatus of claim 2 wherein the first layer comprises a polyimide, and the second layer comprises a B-staged epoxy.
4. The ECM motor apparatus of claim 1 wherein the at least one stitch is four stitches.
5. The ECM motor apparatus of claim 4 wherein the four stitches are configured in the same shape.
6. A method of manufacturing an Electret Condenser Microphone (ECM) motor apparatus including a charge plate, a diaphragm, and a diaphragm ring support structure, the method comprising:
positioning the charge plate within the diaphragm ring support structure wherein there is a gap between the charge plate and the diaphragm ring support structure;
applying a stitch to the charge plate and to the diaphragm ring support structure wherein the stitch bridges the gap; and
curing the stitch by applying heat to the stitch.
7. The method of claim 6 wherein applying the stitch includes positioning a multi-layer stitch material on a portion of the diaphragm ring support structure and on a portion of the charge plate wherein the multi-layer stitch material bridges the gap.
8. The method of claim 6 wherein applying the stitch includes applying a multi-layer stitch material, the multi-layer stitch material comprising a polyimide and a B-staged epoxy.
9. The method of claim 6 wherein applying the stitch includes applying four stitches.
10. The method of claim 9 wherein the applying four stitches includes applying four stitches configured in the same shape.
11. The method of claim 6 further comprising:
providing a fixed space between the charge plate and the diaphragm in the absence of an acoustic input signal.
12. The method of claim 11 wherein providing the fixed space includes separating the charge plate and the diaphragm with a spacer spaced apart from the diaphragm ring support structure.
13. A Electret Condenser Microphone (ECM) motor apparatus comprising:
a diaphragm ring support structure, the diaphragm ring support structure defining an opening therethrough;
a charge plate disposed within the opening;
a stitch coupling the diaphragm ring support structure to the charge plate at four connection regions, the stitch being generally u-shaped in configuration;
a diaphragm disposed adjacent to and in a generally parallel relationship to the charge plate;
wherein the charge plate and the diaphragm have a constant or nearly constant distance between the charge plate and the diaphragm in the absence of sound energy.
14. The ECM motor apparatus of claim 13 wherein the stitch has a first layer and a second layer.
15. The ECM motor apparatus of claim 14 wherein the first layer comprises a polyimide, and the second layer comprises a B-staged epoxy.
16. The ECM motor apparatus of claim 13, wherein in the presence of sound energy, the diaphragm vibrates and an electrical potential between the diaphragm and the charge plate is changed.
17. The ECM motor apparatus of claim 1, wherein in the presence of sound energy, the diaphragm vibrates and an electrical potential between the diaphragm and the charge plate is changed.
US14/273,041 2013-05-13 2014-05-08 Apparatus for securing components in an electret condenser microphone (ECM) Active 2034-05-15 US9398389B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/273,041 US9398389B2 (en) 2013-05-13 2014-05-08 Apparatus for securing components in an electret condenser microphone (ECM)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361822590P 2013-05-13 2013-05-13
US14/273,041 US9398389B2 (en) 2013-05-13 2014-05-08 Apparatus for securing components in an electret condenser microphone (ECM)

Publications (2)

Publication Number Publication Date
US20140334646A1 US20140334646A1 (en) 2014-11-13
US9398389B2 true US9398389B2 (en) 2016-07-19

Family

ID=51864805

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/273,041 Active 2034-05-15 US9398389B2 (en) 2013-05-13 2014-05-08 Apparatus for securing components in an electret condenser microphone (ECM)

Country Status (5)

Country Link
US (1) US9398389B2 (en)
CN (1) CN105284130B (en)
DE (1) DE112014002383T5 (en)
DK (1) DK201570810A1 (en)
WO (1) WO2014186224A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9398389B2 (en) 2013-05-13 2016-07-19 Knowles Electronics, Llc Apparatus for securing components in an electret condenser microphone (ECM)
US11081285B2 (en) 2019-05-08 2021-08-03 Deborah Duen Ling Chung Electrically conductive electret and associated electret-based power source and self-powered structure

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063050A (en) 1976-12-30 1977-12-13 Industrial Research Products, Inc. Acoustic transducer with improved electret assembly
US4316062A (en) 1979-12-28 1982-02-16 Beveridge Harold N Electrostatic electroacoustic transducer
US4701640A (en) 1985-03-11 1987-10-20 Telex Communications, Inc. Electret transducer and method of fabrication
US4730283A (en) 1986-09-15 1988-03-08 Industrial Research Products, Inc. Acoustic transducer with improved electrode spacing
US4764690A (en) 1986-06-18 1988-08-16 Lectret S.A. Electret transducing
US4815560A (en) 1987-12-04 1989-03-28 Industrial Research Products, Inc. Microphone with frequency pre-emphasis
EP0533284A1 (en) 1991-09-17 1993-03-24 Microtronic Nederland B.V. Electroacoustic transducer of the electret type
WO1993018627A1 (en) 1992-03-05 1993-09-16 Knowles Electronics, Inc. Electret microphone assembly, and method of manufacture
US5335286A (en) 1992-02-18 1994-08-02 Knowles Electronics, Inc. Electret assembly
US5548658A (en) 1994-06-06 1996-08-20 Knowles Electronics, Inc. Acoustic Transducer
US20030034536A1 (en) 2000-12-22 2003-02-20 Bruel & Kjaer Sound & Vibration Measurement A/S Micromachined capacitive electrical component
US6532293B1 (en) 2000-02-08 2003-03-11 Knowles Electronics Llc Acoustical transducer with reduced parasitic capacitance
JP2003209899A (en) 2002-01-11 2003-07-25 Audio Technica Corp Condenser microphone
US6654473B2 (en) 2001-05-09 2003-11-25 Knowles Electronics, Llc Condenser microphone
US6704427B2 (en) 2000-02-24 2004-03-09 Knowles Electronics, Llc Acoustic transducer with improved acoustic damper
US20060140423A1 (en) * 2004-12-15 2006-06-29 Citizen Electronics Co., Ltd. Condenser microphone and method for manufacturing the same
US20060205244A1 (en) * 2004-04-27 2006-09-14 Yasuhiro Shigeno Electret capacitor microphone
US20060245606A1 (en) 2005-04-27 2006-11-02 Knowles Electronics, Llc Electret condenser microphone and manufacturing method thereof
US7136500B2 (en) 2003-08-05 2006-11-14 Knowles Electronics, Llc. Electret condenser microphone
US7184563B2 (en) 2003-03-04 2007-02-27 Knowles Electronics Llc. Electret condenser microphone
US7260230B2 (en) 2003-10-24 2007-08-21 Knowles Electronics, Llc. High performance microphone and manufacturing method thereof
JP2007295308A (en) 2006-04-25 2007-11-08 Citizen Electronics Co Ltd Method of manufacturing electret capaciter microphone
US20080232631A1 (en) 2007-03-20 2008-09-25 Knowles Electronics, Llc Microphone and manufacturing method thereof
US20090097687A1 (en) 2007-10-16 2009-04-16 Knowles Electronics, Llc Diaphragm for a Condenser Microphone
US20090226012A1 (en) 2006-04-19 2009-09-10 Hosiden Corporation Electret Condenser Microphone
US20110233692A1 (en) 2008-12-12 2011-09-29 Takeshi Inoda Microphone unit and voice input device using same
US8085956B2 (en) 2007-12-14 2011-12-27 Knowles Electronics, Llc Filter circuit for an electret microphone
US8144898B2 (en) 2003-10-24 2012-03-27 Knowles Electronics, Llc High performance microphone and manufacturing method thereof
CN102582073A (en) 2010-09-08 2012-07-18 美商楼氏电子有限公司 Method for forming blunt terminal on pipe
US8401209B2 (en) 2009-04-23 2013-03-19 Knowles Electronics, Llc Microphone having diaphragm ring with increased stability
US20130094676A1 (en) * 2011-10-18 2013-04-18 Hosiden Corporation Electret Condenser Microphone
US8542852B2 (en) * 2008-04-07 2013-09-24 National University Corporation Saitama University Electro-mechanical transducer, an electro-mechanical converter, and manufacturing methods of the same
US20140334646A1 (en) 2013-05-13 2014-11-13 Knowles Electronics, Llc Apparatus For Securing Components In An Electret Condenser Microphone (ECM)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5028291B2 (en) * 2008-01-31 2012-09-19 三洋電機株式会社 Device mounting substrate, device mounting substrate manufacturing method, semiconductor module, and semiconductor module manufacturing method

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063050A (en) 1976-12-30 1977-12-13 Industrial Research Products, Inc. Acoustic transducer with improved electret assembly
US4316062A (en) 1979-12-28 1982-02-16 Beveridge Harold N Electrostatic electroacoustic transducer
US4701640A (en) 1985-03-11 1987-10-20 Telex Communications, Inc. Electret transducer and method of fabrication
US4764690A (en) 1986-06-18 1988-08-16 Lectret S.A. Electret transducing
US4730283A (en) 1986-09-15 1988-03-08 Industrial Research Products, Inc. Acoustic transducer with improved electrode spacing
US4815560A (en) 1987-12-04 1989-03-28 Industrial Research Products, Inc. Microphone with frequency pre-emphasis
EP0533284A1 (en) 1991-09-17 1993-03-24 Microtronic Nederland B.V. Electroacoustic transducer of the electret type
US5335286A (en) 1992-02-18 1994-08-02 Knowles Electronics, Inc. Electret assembly
WO1993018627A1 (en) 1992-03-05 1993-09-16 Knowles Electronics, Inc. Electret microphone assembly, and method of manufacture
US5408534A (en) 1992-03-05 1995-04-18 Knowles Electronics, Inc. Electret microphone assembly, and method of manufacturer
US5548658A (en) 1994-06-06 1996-08-20 Knowles Electronics, Inc. Acoustic Transducer
US6532293B1 (en) 2000-02-08 2003-03-11 Knowles Electronics Llc Acoustical transducer with reduced parasitic capacitance
US6684484B2 (en) 2000-02-08 2004-02-03 Knowles Electronics, Llc Method for manufacturing acoustical transducer with reduced parasitic capacitance
US6704427B2 (en) 2000-02-24 2004-03-09 Knowles Electronics, Llc Acoustic transducer with improved acoustic damper
US20030034536A1 (en) 2000-12-22 2003-02-20 Bruel & Kjaer Sound & Vibration Measurement A/S Micromachined capacitive electrical component
US6654473B2 (en) 2001-05-09 2003-11-25 Knowles Electronics, Llc Condenser microphone
JP2003209899A (en) 2002-01-11 2003-07-25 Audio Technica Corp Condenser microphone
US7184563B2 (en) 2003-03-04 2007-02-27 Knowles Electronics Llc. Electret condenser microphone
US7136500B2 (en) 2003-08-05 2006-11-14 Knowles Electronics, Llc. Electret condenser microphone
US8144898B2 (en) 2003-10-24 2012-03-27 Knowles Electronics, Llc High performance microphone and manufacturing method thereof
US7260230B2 (en) 2003-10-24 2007-08-21 Knowles Electronics, Llc. High performance microphone and manufacturing method thereof
US20060205244A1 (en) * 2004-04-27 2006-09-14 Yasuhiro Shigeno Electret capacitor microphone
US20060140423A1 (en) * 2004-12-15 2006-06-29 Citizen Electronics Co., Ltd. Condenser microphone and method for manufacturing the same
US20060245606A1 (en) 2005-04-27 2006-11-02 Knowles Electronics, Llc Electret condenser microphone and manufacturing method thereof
US20090226012A1 (en) 2006-04-19 2009-09-10 Hosiden Corporation Electret Condenser Microphone
US8150078B2 (en) * 2006-04-19 2012-04-03 Hosiden Corporation Electret condenser microphone
JP2007295308A (en) 2006-04-25 2007-11-08 Citizen Electronics Co Ltd Method of manufacturing electret capaciter microphone
US20070258605A1 (en) * 2006-04-25 2007-11-08 Citizen Electronics Co., Ltd. Electret condenser microphone and method of producing the same
US20080232631A1 (en) 2007-03-20 2008-09-25 Knowles Electronics, Llc Microphone and manufacturing method thereof
US20090097687A1 (en) 2007-10-16 2009-04-16 Knowles Electronics, Llc Diaphragm for a Condenser Microphone
US8085956B2 (en) 2007-12-14 2011-12-27 Knowles Electronics, Llc Filter circuit for an electret microphone
US8229140B2 (en) 2007-12-14 2012-07-24 Knowles Electronics, Llc Filter circuit for an electret microphone
US8542852B2 (en) * 2008-04-07 2013-09-24 National University Corporation Saitama University Electro-mechanical transducer, an electro-mechanical converter, and manufacturing methods of the same
US20110233692A1 (en) 2008-12-12 2011-09-29 Takeshi Inoda Microphone unit and voice input device using same
US8401209B2 (en) 2009-04-23 2013-03-19 Knowles Electronics, Llc Microphone having diaphragm ring with increased stability
CN102582073A (en) 2010-09-08 2012-07-18 美商楼氏电子有限公司 Method for forming blunt terminal on pipe
US20130094676A1 (en) * 2011-10-18 2013-04-18 Hosiden Corporation Electret Condenser Microphone
US20140334646A1 (en) 2013-05-13 2014-11-13 Knowles Electronics, Llc Apparatus For Securing Components In An Electret Condenser Microphone (ECM)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion for PCT/US2014/037481, dated Sep. 12, 2014, 10 pages.

Also Published As

Publication number Publication date
CN105284130A (en) 2016-01-27
US20140334646A1 (en) 2014-11-13
DK201570810A1 (en) 2015-12-21
WO2014186224A1 (en) 2014-11-20
DE112014002383T5 (en) 2016-01-21
CN105284130B (en) 2019-04-05

Similar Documents

Publication Publication Date Title
US20150078611A1 (en) Joint speaker surround and gasket, and methods of manufacture thereof
CN102959988B (en) Sound generator
KR101814951B1 (en) Speaker and earphone
WO2010029699A1 (en) Magnetorestrictive actuator and speaker and device using said magnetorestrictive actuator
US9883289B2 (en) Acoustic generator, acoustic generation device, and electronic device
US20030113546A1 (en) Multi-layer electret having ultra-high charge stability and method of manufacturing thereof
US20140056468A1 (en) Magnetic circuit for loudspeaker and loudspeaker using the same
KR101927961B1 (en) Speaker and speaker manufacturing method
US7610670B2 (en) Method for manufacturing a diaphragm assembly
JP2008028593A (en) Piezoelectric electroacoustic transducer
US9398389B2 (en) Apparatus for securing components in an electret condenser microphone (ECM)
US10028060B2 (en) Temperature stable membrane plate structure for a loudspeaker
JP2007295308A (en) Method of manufacturing electret capaciter microphone
US20140087148A1 (en) Compound membrane and acoustic device using same
US20140087132A1 (en) Compound membrane and acoustic device using same
US8925675B2 (en) Compound membrane and acoustic device using same
KR101765419B1 (en) Piezoelectric Speaker and Method of Manufacturing the Same
JP4740059B2 (en) Microphone housing and condenser microphone
US8769803B2 (en) Speaker manufacturing method
US20140083797A1 (en) Compound membrane and acoustic device using same
US20150003643A1 (en) Acoustic generator, acoustic generating device, and electronic device
US9392374B2 (en) Acoustic generator, acoustic generation device, and electronic device
JP5534938B2 (en) Piezoelectric speaker
US9398378B2 (en) Acoustic generator, acoustic generating apparatus, and electronic apparatus
KR101673296B1 (en) Pattern diaphram and method of making the same

Legal Events

Date Code Title Description
AS Assignment

Owner name: KNOWLES ELECTRONICS, LLC, ILLINOIS

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:NAYLOR, FELIX MATTHEW;REEL/FRAME:033760/0203

Effective date: 20140917

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8