US9679838B2 - Stub minimization for assemblies without wirebonds to package substrate - Google Patents
Stub minimization for assemblies without wirebonds to package substrate Download PDFInfo
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- US9679838B2 US9679838B2 US15/165,323 US201615165323A US9679838B2 US 9679838 B2 US9679838 B2 US 9679838B2 US 201615165323 A US201615165323 A US 201615165323A US 9679838 B2 US9679838 B2 US 9679838B2
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
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Abstract
Description
Claims (20)
Priority Applications (1)
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US15/165,323 US9679838B2 (en) | 2011-10-03 | 2016-05-26 | Stub minimization for assemblies without wirebonds to package substrate |
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US201161542495P | 2011-10-03 | 2011-10-03 | |
US201161542488P | 2011-10-03 | 2011-10-03 | |
US201161542553P | 2011-10-03 | 2011-10-03 | |
US201261600361P | 2012-02-17 | 2012-02-17 | |
US13/439,299 US8610260B2 (en) | 2011-10-03 | 2012-04-04 | Stub minimization for assemblies without wirebonds to package substrate |
US14/107,564 US9373565B2 (en) | 2011-10-03 | 2013-12-16 | Stub minimization for assemblies without wirebonds to package substrate |
US15/165,323 US9679838B2 (en) | 2011-10-03 | 2016-05-26 | Stub minimization for assemblies without wirebonds to package substrate |
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US14/107,564 Continuation US9373565B2 (en) | 2011-10-03 | 2013-12-16 | Stub minimization for assemblies without wirebonds to package substrate |
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US9679838B2 true US9679838B2 (en) | 2017-06-13 |
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US13/439,354 Active US8629545B2 (en) | 2011-10-03 | 2012-04-04 | Stub minimization for assemblies without wirebonds to package substrate |
US13/439,299 Active US8610260B2 (en) | 2011-10-03 | 2012-04-04 | Stub minimization for assemblies without wirebonds to package substrate |
US14/107,564 Active US9373565B2 (en) | 2011-10-03 | 2013-12-16 | Stub minimization for assemblies without wirebonds to package substrate |
US15/165,323 Active US9679838B2 (en) | 2011-10-03 | 2016-05-26 | Stub minimization for assemblies without wirebonds to package substrate |
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US13/439,354 Active US8629545B2 (en) | 2011-10-03 | 2012-04-04 | Stub minimization for assemblies without wirebonds to package substrate |
US13/439,299 Active US8610260B2 (en) | 2011-10-03 | 2012-04-04 | Stub minimization for assemblies without wirebonds to package substrate |
US14/107,564 Active US9373565B2 (en) | 2011-10-03 | 2013-12-16 | Stub minimization for assemblies without wirebonds to package substrate |
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US10068866B2 (en) * | 2016-09-29 | 2018-09-04 | Intel Corporation | Integrated circuit package having rectangular aspect ratio |
US11257793B2 (en) | 2019-06-25 | 2022-02-22 | Samsung Electronics Co., Ltd. | Semiconductor devices and methods for manufacturing the same |
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US8823165B2 (en) | 2011-07-12 | 2014-09-02 | Invensas Corporation | Memory module in a package |
EP2766928A1 (en) | 2011-10-03 | 2014-08-20 | Invensas Corporation | Stub minimization with terminal grids offset from center of package |
EP2769409A1 (en) | 2011-10-03 | 2014-08-27 | Invensas Corporation | Stub minimization for multi-die wirebond assemblies with orthogonal windows |
US8659140B2 (en) | 2011-10-03 | 2014-02-25 | Invensas Corporation | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate |
US8525327B2 (en) | 2011-10-03 | 2013-09-03 | Invensas Corporation | Stub minimization for assemblies without wirebonds to package substrate |
US8653646B2 (en) | 2011-10-03 | 2014-02-18 | Invensas Corporation | Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
US8659142B2 (en) | 2011-10-03 | 2014-02-25 | Invensas Corporation | Stub minimization for wirebond assemblies without windows |
WO2013052373A1 (en) | 2011-10-03 | 2013-04-11 | Invensas Corporation | Stub minimization for multi-die wirebond assemblies with parallel windows |
US9368477B2 (en) | 2012-08-27 | 2016-06-14 | Invensas Corporation | Co-support circuit panel and microelectronic packages |
US8848392B2 (en) | 2012-08-27 | 2014-09-30 | Invensas Corporation | Co-support module and microelectronic assembly |
US8848391B2 (en) | 2012-08-27 | 2014-09-30 | Invensas Corporation | Co-support component and microelectronic assembly |
US9070423B2 (en) | 2013-06-11 | 2015-06-30 | Invensas Corporation | Single package dual channel memory with co-support |
US8883563B1 (en) | 2013-07-15 | 2014-11-11 | Invensas Corporation | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation |
US9023691B2 (en) | 2013-07-15 | 2015-05-05 | Invensas Corporation | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation |
US9034696B2 (en) | 2013-07-15 | 2015-05-19 | Invensas Corporation | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation |
US9559040B2 (en) * | 2013-12-30 | 2017-01-31 | International Business Machines Corporation | Double-sided segmented line architecture in 3D integration |
US9214454B2 (en) | 2014-03-31 | 2015-12-15 | Invensas Corporation | Batch process fabrication of package-on-package microelectronic assemblies |
US10642087B2 (en) | 2014-05-23 | 2020-05-05 | Eyesafe, Llc | Light emission reducing compounds for electronic devices |
US9281296B2 (en) | 2014-07-31 | 2016-03-08 | Invensas Corporation | Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design |
US9691437B2 (en) | 2014-09-25 | 2017-06-27 | Invensas Corporation | Compact microelectronic assembly having reduced spacing between controller and memory packages |
US10276468B2 (en) * | 2015-03-27 | 2019-04-30 | Hewlett-Packard Development Company, L.P. | Circuit package |
WO2017034515A1 (en) * | 2015-08-21 | 2017-03-02 | Hewlett-Packard Development Company, L.P. | Circuit package |
US9484080B1 (en) | 2015-11-09 | 2016-11-01 | Invensas Corporation | High-bandwidth memory application with controlled impedance loading |
US10037946B2 (en) | 2016-02-05 | 2018-07-31 | Dyi-chung Hu | Package structure having embedded bonding film and manufacturing method thereof |
US9806044B2 (en) * | 2016-02-05 | 2017-10-31 | Dyi-chung Hu | Bonding film for signal communication between central chip and peripheral chips and fabricating method thereof |
US9955605B2 (en) * | 2016-03-30 | 2018-04-24 | Intel Corporation | Hardware interface with space-efficient cell pattern |
US9679613B1 (en) | 2016-05-06 | 2017-06-13 | Invensas Corporation | TFD I/O partition for high-speed, high-density applications |
CN113488505B (en) * | 2019-04-30 | 2022-09-30 | 长江存储科技有限责任公司 | Three-dimensional memory device with three-dimensional phase change memory |
US11309246B2 (en) * | 2020-02-05 | 2022-04-19 | Apple Inc. | High density 3D interconnect configuration |
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US10068866B2 (en) * | 2016-09-29 | 2018-09-04 | Intel Corporation | Integrated circuit package having rectangular aspect ratio |
US11257793B2 (en) | 2019-06-25 | 2022-02-22 | Samsung Electronics Co., Ltd. | Semiconductor devices and methods for manufacturing the same |
US11830853B2 (en) | 2019-06-25 | 2023-11-28 | Samsung Electronics Co., Ltd. | Semiconductor devices and methods for manufacturing the same |
Also Published As
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US8610260B2 (en) | 2013-12-17 |
US20130082389A1 (en) | 2013-04-04 |
US9373565B2 (en) | 2016-06-21 |
US20130082375A1 (en) | 2013-04-04 |
US20160268187A1 (en) | 2016-09-15 |
US8525327B2 (en) | 2013-09-03 |
US20130083582A1 (en) | 2013-04-04 |
US8629545B2 (en) | 2014-01-14 |
US20140103535A1 (en) | 2014-04-17 |
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