USD341418S - Supply nozzle for applying liquid resist to a semiconductor wafer - Google Patents

Supply nozzle for applying liquid resist to a semiconductor wafer Download PDF

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Publication number
USD341418S
USD341418S US07/748,061 US74806191F USD341418S US D341418 S USD341418 S US D341418S US 74806191 F US74806191 F US 74806191F US D341418 S USD341418 S US D341418S
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US
United States
Prior art keywords
semiconductor wafer
supply nozzle
applying liquid
liquid resist
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/748,061
Inventor
Masami Akimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Tokyo Electron Kyushu Ltd
Original Assignee
Tokyo Electron Ltd
Tokyo Electron Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron Kyushu Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED, TOKYO ELECTRON KYUSHU LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AKIMOTO, MASAMI
Application granted granted Critical
Publication of USD341418S publication Critical patent/USD341418S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top, front and left side perspective view of supply nozzle for applying liquid resist to a semiconductor wafer showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof, the rear being a mirror image;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a cross-sectional view thereof taken on line 7--7 in FIG. 3; and,
FIG. 8 is a cross-sectional view thereof taken on line 8--8 in FIG. 2.

Claims (1)

  1. The ornamental design for supply nozzle for applying liquid resist to a semiconductor wafer, as shown and described.
US07/748,061 1991-02-22 1991-08-21 Supply nozzle for applying liquid resist to a semiconductor wafer Expired - Lifetime USD341418S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3-4465 1991-02-22
JP446591 1991-02-22

Publications (1)

Publication Number Publication Date
USD341418S true USD341418S (en) 1993-11-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
US07/748,061 Expired - Lifetime USD341418S (en) 1991-02-22 1991-08-21 Supply nozzle for applying liquid resist to a semiconductor wafer

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US (1) USD341418S (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6248171B1 (en) 1998-09-17 2001-06-19 Silicon Valley Group, Inc. Yield and line width performance for liquid polymers and other materials
US6689215B2 (en) 1998-09-17 2004-02-10 Asml Holdings, N.V. Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
US6746826B1 (en) 2000-07-25 2004-06-08 Asml Holding N.V. Method for an improved developing process in wafer photolithography
US7357842B2 (en) 2004-12-22 2008-04-15 Sokudo Co., Ltd. Cluster tool architecture for processing a substrate
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20160198891A1 (en) * 2015-01-09 2016-07-14 Jura Elektroapparate Ag Beverage outlet for a beverage preperation machine
USD762752S1 (en) * 2015-06-01 2016-08-02 E3D-Online Ltd Nozzle
USD929534S1 (en) * 2019-04-25 2021-08-31 Tokyo Electron Limited Liquid discharge nozzle for semiconductor substrate processing apparatus
USD930796S1 (en) * 2020-06-08 2021-09-14 Tokyo Electron Limited Liquid discharge nozzle for semiconductor substrate processing apparatus
USD930789S1 (en) * 2019-12-05 2021-09-14 Scott J. McGehee Spray nozzle
USD1017561S1 (en) * 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7625692B2 (en) 1998-09-17 2009-12-01 Asml Holding N.V. Yield and line width performance for liquid polymers and other materials
US6669779B2 (en) 1998-09-17 2003-12-30 Asml Holding N.V. Yield and line width performance for liquid polymers and other materials
US6689215B2 (en) 1998-09-17 2004-02-10 Asml Holdings, N.V. Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
US7208262B2 (en) 1998-09-17 2007-04-24 Asml Holdings N.V. Yield and line width performance for liquid polymers and other materials
US6248171B1 (en) 1998-09-17 2001-06-19 Silicon Valley Group, Inc. Yield and line width performance for liquid polymers and other materials
US6746826B1 (en) 2000-07-25 2004-06-08 Asml Holding N.V. Method for an improved developing process in wafer photolithography
US7743728B2 (en) 2004-12-22 2010-06-29 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US8550031B2 (en) 2004-12-22 2013-10-08 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US7694647B2 (en) 2004-12-22 2010-04-13 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7357842B2 (en) 2004-12-22 2008-04-15 Sokudo Co., Ltd. Cluster tool architecture for processing a substrate
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7925377B2 (en) 2004-12-22 2011-04-12 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US8911193B2 (en) 2004-12-22 2014-12-16 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US8066466B2 (en) 2005-12-22 2011-11-29 Applied Materials, Inc. Substrate processing sequence in a Cartesian robot cluster tool
US20160198891A1 (en) * 2015-01-09 2016-07-14 Jura Elektroapparate Ag Beverage outlet for a beverage preperation machine
US10143332B2 (en) * 2015-01-09 2018-12-04 Jura Elecktroapparate AG Beverage outlet for a beverage preparation machine
USD762752S1 (en) * 2015-06-01 2016-08-02 E3D-Online Ltd Nozzle
USD929534S1 (en) * 2019-04-25 2021-08-31 Tokyo Electron Limited Liquid discharge nozzle for semiconductor substrate processing apparatus
USD930789S1 (en) * 2019-12-05 2021-09-14 Scott J. McGehee Spray nozzle
USD930796S1 (en) * 2020-06-08 2021-09-14 Tokyo Electron Limited Liquid discharge nozzle for semiconductor substrate processing apparatus
USD1017561S1 (en) * 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

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