Recherche Images Maps Play YouTube Actualités Gmail Drive Plus »
Connexion
Les utilisateurs de lecteurs d'écran peuvent cliquer sur ce lien pour activer le mode d'accessibilité. Celui-ci propose les mêmes fonctionnalités principales, mais il est optimisé pour votre lecteur d'écran.

Brevets

  1. Recherche avancée dans les brevets
Numéro de publicationUSD394844 S
Type de publicationOctroi
Numéro de demandeUS 29/070,050
Date de publication2 juin 1998
Date de dépôt25 avr. 1997
Numéro de publication070050, 29070050, US D394844 S, US D394844S, US-S-D394844, USD394844 S, USD394844S
InventeursWarren M. Farnworth, Alan G. Wood, David R. Hembree, Salman Akram
Cessionnaire d'origineMicron Technology, Inc.
Exporter la citationBiBTeX, EndNote, RefMan
Liens externes: USPTO, Cession USPTO, Espacenet
Temporary package for semiconductor dice
US D394844 S
Images(2)
Previous page
Next page
Revendications(1)
  1. The ornamental design for a temporary package for semiconductor dice, as shown and described.
Description

FIG. 1 is an enlarged top perspective view of a temporary package for semiconductor dice showing my new design;

FIG. 2 is a left side elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a front side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear side elevation view thereof.

Citations hors brevets
Référence
11994 Dram Data Book, Micron Semiconductor, Inc., pp. 7-7-7-13, Apr., 1994.
Référencé par
Brevet citant Date de dépôt Date de publication Déposant Titre
US62223798 juin 199824 avr. 2001Micron Technology, Inc.Conventionally sized temporary package for testing semiconductor dice
US635332628 août 19985 mars 2002Micron Technology, Inc.Test carrier with molded interconnect for testing semiconductor components
US65444612 oct. 20008 avr. 2003Micron Technology, Inc.Test carrier with molded interconnect for testing semiconductor components
US65586004 mai 20006 mai 2003Micron Technology, Inc.Method for packaging microelectronic substrates
US657649428 juin 200010 juin 2003Micron Technology, Inc.Recessed encapsulated microelectronic devices and methods for formation
US663859511 juil. 200128 oct. 2003Micron Technology, Inc.Method and apparatus for reduced flash encapsulation of microelectronic devices
US664273027 janv. 20034 nov. 2003Micron Technology, Inc.Test carrier with molded interconnect for testing semiconductor components
US664494911 juil. 200111 nov. 2003Micron Technology, Inc.Apparatus for reduced flash encapsulation of microelectronic devices
US665317319 sept. 200125 nov. 2003Micron Technology, Inc.Method and apparatus for packaging a microelectronic die
US66567698 mai 20012 déc. 2003Micron Technology, Inc.Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
US666413919 sept. 200116 déc. 2003Micron Technology, Inc.Method and apparatus for packaging a microelectronic die
US667767519 sept. 200113 janv. 2004Micron Technology, Inc.Microelectronic devices and microelectronic die packages
US668338819 sept. 200127 janv. 2004Micron Technology, Inc.Method and apparatus for packaging a microelectronic die
US674054621 août 200225 mai 2004Micron Technology, Inc.Packaged microelectronic devices and methods for assembling microelectronic devices
US678106629 août 200224 août 2004Micron Technology, Inc.Packaged microelectronic component assemblies
US67960287 oct. 200228 sept. 2004Micron Technology, Inc.Method of Interconnecting substrates for electrical coupling of microelectronic components
US681900316 déc. 200216 nov. 2004Micron Technology Inc.Recessed encapsulated microelectronic devices and methods for formation
US683600928 août 200228 déc. 2004Micron Technology, Inc.Packaged microelectronic components
US683876028 août 20004 janv. 2005Micron Technology, Inc.Packaged microelectronic devices with interconnecting units
US684142316 déc. 200211 janv. 2005Micron Technology, Inc.Methods for formation of recessed encapsulated microelectronic devices
US687606630 août 20015 avr. 2005Micron Technology, Inc.Packaged microelectronic devices and methods of forming same
US687905011 févr. 200312 avr. 2005Micron Technology, Inc.Packaged microelectronic devices and methods for packaging microelectronic devices
US692186018 mars 200326 juil. 2005Micron Technology, Inc.Packages for electrical and electronic apparatus such as flip chips comprising a layout of spaced dams associated with and enclosing terminals, and dielectric coverings; miniaturization
US69245505 avr. 20042 août 2005Micron Technology, Inc.comprises die and an interposer substrate which includes depositing solder ball onto a ball-pad on the interposer substrate and molding to form casing; integrated circuits
US69331705 avr. 200423 août 2005Micron Technology, Inc.Packaged microelectronic component assemblies
US694345030 août 200413 sept. 2005Micron Technology, Inc.Packaged microelectronic devices and methods of forming same
US695198218 déc. 20024 oct. 2005Micron Technology, Inc.Packaged microelectronic component assemblies
US697959524 août 200027 déc. 2005Micron Technology, Inc.Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
US69823867 oct. 20023 janv. 2006Micron Technology, Inc.Interconnecting substrates for electrical coupling of microelectronic components
US69835517 oct. 200210 janv. 2006Micron Technology, Inc.Interconnecting substrates for electrical coupling of microelectronic components
US705728128 avr. 20036 juin 2006Micron Technology Inc.Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US70679058 août 200227 juin 2006Micron Technology, Inc.Packaged microelectronic devices including first and second casings
US709106424 août 200415 août 2006Micron Technology, Inc.Method and apparatus for attaching microelectronic substrates and support members
US710173720 oct. 20045 sept. 2006Micron Technology, Inc.Method of encapsulating interconnecting units in packaged microelectronic devices
US71095884 avr. 200219 sept. 2006Micron Technology, Inc.Method and apparatus for attaching microelectronic substrates and support members
US71573101 sept. 20042 janv. 2007Micron Technology, Inc.Methods for packaging microfeature devices and microfeature devices formed by such methods
US719595719 août 200427 mars 2007Micron Technology, Inc.Packaged microelectronic components
US72180015 avr. 200415 mai 2007Micron Technology, Inc.Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US725032830 août 200431 juil. 2007Micron Technology, Inc.Microelectronic component assemblies with recessed wire bonds and methods of making same
US725945115 août 200521 août 2007Micron Technology, Inc.Invertible microfeature device packages
US727376916 août 200025 sept. 2007Micron Technology, Inc.Method and apparatus for removing encapsulating material from a packaged microelectronic device
US730697416 août 200511 déc. 2007Micron Technology, Inc.Microelectronic devices and methods for manufacturing and operating packaged microelectronic device assemblies
US73323765 sept. 200619 févr. 2008Micron Technology, Inc.Method of encapsulating packaged microelectronic devices with a barrier
US736542418 mai 200629 avr. 2008Micron Technology, Inc.Microelectronic component assemblies with recessed wire bonds and methods of making same
US736881029 août 20036 mai 2008Micron Technology, Inc.Invertible microfeature device packages
US740548712 août 200229 juil. 2008Micron Technology, Inc.Method and apparatus for removing encapsulating material from a packaged microelectronic device
US742547017 août 200416 sept. 2008Micron Technology, Inc.Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US75796849 mai 200625 août 2009Micron Technology, Inc.Methods for packing microfeature devices and microfeature devices formed by such methods
US761587130 juin 200610 nov. 2009Micron Technology, Inc.Method and apparatus for attaching microelectronic substrates and support members
US76714591 mai 20062 mars 2010Micron Technologies, Inc.Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US769168023 avr. 20086 avr. 2010Micron Technologies, Inc.Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths
US769172615 mai 20076 avr. 2010Micron Technology, Inc.Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
US769600312 mars 200813 avr. 2010Micron Technology, Inc.Microelectronic component assemblies with recessed wire bonds and methods of making same
US774594431 août 200529 juin 2010Micron Technology, Inc.Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US780750530 août 20055 oct. 2010Micron Technology, Inc.Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
US783345623 févr. 200716 nov. 2010Micron Technology, Inc.Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
US791038512 mai 200622 mars 2011Micron Technology, Inc.Method of fabricating microelectronic devices
US795589813 mars 20077 juin 2011Micron Technology, Inc.Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
US813861321 mars 201120 mars 2012Micron Technology, Inc.Microelectronic devices
US820275413 juin 200619 juin 2012Micron Technology, Inc.Packaged microelectronic devices recessed in support member cavities, and associated methods
US820321329 juin 201019 juin 2012Micron Technology, Inc.Methods for packaging microelectronic devices and microelectronic devices formed using such methods
US831933218 mai 201027 nov. 2012Micron Technology, Inc.Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US844113217 févr. 201214 mai 2013Micron Technology, Inc.Packaged microelectronic devices recessed in support member cavities, and associated methods
US845083919 janv. 201028 mai 2013Micron Technology, Inc.Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US863797327 mars 200728 janv. 2014Micron Technology, Inc.Packaged microelectronic components with terminals exposed through encapsulant
US870359927 nov. 201222 avr. 2014Micron Technology, Inc.Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
US87043802 sept. 201022 avr. 2014Micron Technology, Inc.Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
Classifications
Classification aux États-UnisD13/182