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Brevets

  1. Recherche avancée dans les brevets
Numéro de publicationUSD401251 S
Type de publicationOctroi
Numéro de demandeUS 29/082,617
Date de publication17 nov. 1998
Date de dépôt27 janv. 1998
Numéro de publication082617, 29082617, US D401251 S, US D401251S, US-S-D401251, USD401251 S, USD401251S
InventeursAndrew William Tudhope, David Bruce Jordan, Jose Luis Gonzalez
Cessionnaire d'origineSemiconductor Equipment Technology
Exporter la citationBiBTeX, EndNote, RefMan
Liens externes: USPTO, Cession USPTO, Espacenet
Shield and cover for target of sputter coating apparatus
US D401251 S
Images(4)
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Revendications(1)
  1. The ornamental design for a shield and cover for target of sputter coating apparatus, as shown and described.
Description

FIG. 1 is a perspective view of a shield and cover for target of sputter coating apparatus embodying the design of the invention;

FIG. 2 is a top plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;

FIG. 3 is a bottom plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;

FIG. 4 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the bottom of FIG. 2;

FIG. 5 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the top of FIG. 2;

FIG. 6 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the left side of FIG. 2;

FIG. 7 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the right side of FIG. 2;

FIG. 8 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 8--8 of FIG. 2; and,

FIG. 9 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 9--9 of FIG. 2.

Référencé par
Brevet citant Date de dépôt Date de publication Déposant Titre
US7952373 *23 oct. 200631 mai 2011Verigy (Singapore) Pte. Ltd.Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
Classifications
Classification aux États-UnisD15/138