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Brevets

  1. Recherche avancée dans les brevets
Numéro de publicationUSD401251 S
Type de publicationOctroi
Numéro de demandeUS 29/082,617
Date de publication17 nov. 1998
Date de dépôt27 janv. 1998
Numéro de publication082617, 29082617, US D401251 S, US D401251S, US-S-D401251, USD401251 S, USD401251S
InventeursAndrew William Tudhope, David Bruce Jordan, Jose Luis Gonzalez
Cessionnaire d'origineSemiconductor Equipment Technology
Exporter la citationBiBTeX, EndNote, RefMan
Liens externes: USPTO, Cession USPTO, Espacenet
Shield and cover for target of sputter coating apparatus
US D401251 S
Résumé  disponible en
Images(4)
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Revendications(1)
  1. The ornamental design for a shield and cover for target of sputter coating apparatus, as shown and described.
Description

FIG. 1 is a perspective view of a shield and cover for target of sputter coating apparatus embodying the design of the invention;

FIG. 2 is a top plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;

FIG. 3 is a bottom plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;

FIG. 4 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the bottom of FIG. 2;

FIG. 5 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the top of FIG. 2;

FIG. 6 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the left side of FIG. 2;

FIG. 7 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the right side of FIG. 2;

FIG. 8 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 8--8 of FIG. 2; and,

FIG. 9 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 9--9 of FIG. 2.

Référencé par
Brevet citant Date de dépôt Date de publication Déposant Titre
US777286017 juil. 200810 août 2010Nanonexus, Inc.Massively parallel interface for electronic circuit
US787248219 sept. 200718 janv. 2011Verigy (Singapore) Pte. LtdHigh density interconnect system having rapid fabrication cycle
US788463415 janv. 20098 févr. 2011Verigy (Singapore) Pte, LtdHigh density interconnect system having rapid fabrication cycle
US7952373 *23 oct. 200631 mai 2011Verigy (Singapore) Pte. Ltd.Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
Classifications
Classification aux États-UnisD15/138