USD403334S - Shield and cover for target of sputter coating apparatus - Google Patents

Shield and cover for target of sputter coating apparatus Download PDF

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Publication number
USD403334S
USD403334S US29/082,713 US8271398F USD403334S US D403334 S USD403334 S US D403334S US 8271398 F US8271398 F US 8271398F US D403334 S USD403334 S US D403334S
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US
United States
Prior art keywords
shield
target
cover
coating apparatus
sputter coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/082,713
Inventor
Andrew William Tudhope
David Bruce Jordan
Jose Luis Gonzalez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Equipment Tech Inc
Original Assignee
Semiconductor Equipment Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Equipment Tech Inc filed Critical Semiconductor Equipment Tech Inc
Priority to US29/082,713 priority Critical patent/USD403334S/en
Assigned to SEMICONDUCTOR EQUIPMENT TECHNOLOGY, INC. reassignment SEMICONDUCTOR EQUIPMENT TECHNOLOGY, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JORDAN, DAVID BRUCE, TUDHOPE, ANDREW WILLIAM, GONZALEZ, JOSE LUIS
Application granted granted Critical
Publication of USD403334S publication Critical patent/USD403334S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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FIG. 1 is a perspective view of a shield and cover for target of sputter coating apparatus embodying the design of the invention;
FIG. 2 is a top plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;
FIG. 3 is a bottom plan view of the shield and cover for target of sputter coating apparatus of FIG. 1;
FIG. 4 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the bottom of FIG. 2;
FIG. 5 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the top of FIG. 2;
FIG. 6 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the left side of FIG. 2;
FIG. 7 is a side elevation view of the shield and cover for target of sputter coating apparatus as seen from the right side of FIG. 2;
FIG. 8 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 8--8 of FIG. 2; and,
FIG. 9 is a cross-sectional view of the shield and cover for target of sputter coating apparatus taken along the line 9--9 of FIG. 2.

Claims (1)

  1. The ornamental design for a shield and cover for target of sputter coating apparatus, as shown and described.
US29/082,713 1998-01-27 1998-01-27 Shield and cover for target of sputter coating apparatus Expired - Lifetime USD403334S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/082,713 USD403334S (en) 1998-01-27 1998-01-27 Shield and cover for target of sputter coating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/082,713 USD403334S (en) 1998-01-27 1998-01-27 Shield and cover for target of sputter coating apparatus

Publications (1)

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USD403334S true USD403334S (en) 1998-12-29

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Family Applications (1)

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US29/082,713 Expired - Lifetime USD403334S (en) 1998-01-27 1998-01-27 Shield and cover for target of sputter coating apparatus

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040251130A1 (en) * 2003-06-12 2004-12-16 Applied Materials, Inc. Method and apparatus for controlling darkspace gap in a chamber
US7772860B2 (en) 1999-05-27 2010-08-10 Nanonexus, Inc. Massively parallel interface for electronic circuit
US7872482B2 (en) 2000-05-23 2011-01-18 Verigy (Singapore) Pte. Ltd High density interconnect system having rapid fabrication cycle
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US20160033070A1 (en) * 2014-08-01 2016-02-04 Applied Materials, Inc. Recursive pumping member
USD904066S1 (en) * 2019-09-19 2020-12-08 Georgia-Pacific LLC Core plug
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7772860B2 (en) 1999-05-27 2010-08-10 Nanonexus, Inc. Massively parallel interface for electronic circuit
US7884634B2 (en) 1999-05-27 2011-02-08 Verigy (Singapore) Pte, Ltd High density interconnect system having rapid fabrication cycle
US7872482B2 (en) 2000-05-23 2011-01-18 Verigy (Singapore) Pte. Ltd High density interconnect system having rapid fabrication cycle
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US20040251130A1 (en) * 2003-06-12 2004-12-16 Applied Materials, Inc. Method and apparatus for controlling darkspace gap in a chamber
US7097744B2 (en) 2003-06-12 2006-08-29 Applied Materials, Inc. Method and apparatus for controlling darkspace gap in a chamber
US20160033070A1 (en) * 2014-08-01 2016-02-04 Applied Materials, Inc. Recursive pumping member
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD904066S1 (en) * 2019-09-19 2020-12-08 Georgia-Pacific LLC Core plug
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life

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