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Numéro de publicationUSD447120 S1
Type de publicationOctroi
Numéro de demande29/130,163
Date de publication28 août 2001
Date de dépôt27 sept. 2000
Date de priorité27 sept. 2000
Numéro de publication130163, 29130163, US D447120 S1, US D447120S1, US-S1-D447120, USD447120 S1, USD447120S1
InventeursKendrew Lee
Cessionnaire d'origineMonster Cable Products, Inc.
Liens externes: USPTO, Cession USPTO, Espacenet
Molded cable interconnect
US D447120 S1
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Revendications
  1. The ornamental design for a molded cable interconnect, as shown and described.
Description

A portion of the disclosure of this design patent application document contains material to which a claim for copyright is also made. The copyright owner has no objection to the facsimile reproduction of this design patent application by anyone as it appears in the Patent and Trademark Office patent file or records, but reserves all other copyrights whatsoever.

FIG. 1 is a perspective view of a first embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 2 is a plan view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 3 is an underside view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 4 is a side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 5 is a corresponding side view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1, as depicted in FIG. 1.

FIG. 6 is a rear view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 7 is a frontal view of a first embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 1.

FIG. 8 is a perspective view of a second embodiment of a molded cable interconnect, in accordance with the present invention.

FIG. 9 is a plan view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 10 is an underside view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 11 is a side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 12 is a corresponding side view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

FIG. 13 is a rear view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8; and,

FIG. 14 is a frontal view of a second embodiment of a molded cable interconnect, in accordance with the present invention, as depicted in FIG. 8.

Classifications
Classification aux États-UnisD13/146, D13/153