USD465207S1 - Leadframe matrix for a surface mount package - Google Patents

Leadframe matrix for a surface mount package Download PDF

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Publication number
USD465207S1
USD465207S1 US29/143,226 US14322601F USD465207S US D465207 S1 USD465207 S1 US D465207S1 US 14322601 F US14322601 F US 14322601F US D465207 S USD465207 S US D465207S
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US
United States
Prior art keywords
surface mount
mount package
leadframe matrix
leadframe
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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US29/143,226
Inventor
Richard K. Williams
James Harnden
Anthony Chia
Chu Weibing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GEM Services Inc USA
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GEM Services Inc USA
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Publication date
Application filed by GEM Services Inc USA filed Critical GEM Services Inc USA
Priority to US29/143,226 priority Critical patent/USD465207S1/en
Assigned to GEM SERVICES, INC. reassignment GEM SERVICES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIA, ANTHONY, WEIBING, CHU, WILLIAMS, RICHARD K., HARNDEN, JAMES
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Publication of USD465207S1 publication Critical patent/USD465207S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;
FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,
FIG. 3 is a perspective view of FIG. 1.
The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.

Claims (1)

  1. The ornamental design for leadframe matrix for a surface mount package, as shown and described.
US29/143,226 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package Expired - Lifetime USD465207S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/143,226 USD465207S1 (en) 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package

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Application Number Priority Date Filing Date Title
US29/143,226 USD465207S1 (en) 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package

Publications (1)

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USD465207S1 true USD465207S1 (en) 2002-11-05

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US29/143,226 Expired - Lifetime USD465207S1 (en) 2001-06-08 2001-06-08 Leadframe matrix for a surface mount package

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US20040124487A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. LED package die having a small footprint
US20050270666A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Composite optical lens with an integrated reflector
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US20070138497A1 (en) * 2003-05-27 2007-06-21 Loh Ban P Power surface mount light emitting die package
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US20040079957A1 (en) * 2002-09-04 2004-04-29 Andrews Peter Scott Power surface mount light emitting die package
US8167463B2 (en) 2002-09-04 2012-05-01 Cree, Inc. Power surface mount light emitting die package
US20040041222A1 (en) * 2002-09-04 2004-03-04 Loh Ban P. Power surface mount light emitting die package
US8530915B2 (en) 2002-09-04 2013-09-10 Cree, Inc. Power surface mount light emitting die package
US8710514B2 (en) 2002-09-04 2014-04-29 Cree, Inc. Power surface mount light emitting die package
US8622582B2 (en) 2002-09-04 2014-01-07 Cree, Inc. Power surface mount light emitting die package
US8608349B2 (en) 2002-09-04 2013-12-17 Cree, Inc. Power surface mount light emitting die package
US7264378B2 (en) 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US6897486B2 (en) 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US20040124487A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. LED package die having a small footprint
US20040126913A1 (en) * 2002-12-06 2004-07-01 Loh Ban P. Composite leadframe LED package and method of making the same
US20070181901A1 (en) * 2003-05-27 2007-08-09 Loh Ban P Power surface mount light emitting die package
US20070138497A1 (en) * 2003-05-27 2007-06-21 Loh Ban P Power surface mount light emitting die package
US7659551B2 (en) 2003-05-27 2010-02-09 Cree, Inc. Power surface mount light emitting die package
US8188488B2 (en) 2003-05-27 2012-05-29 Cree, Inc. Power surface mount light emitting die package
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US20100301372A1 (en) * 2003-05-27 2010-12-02 Cree, Inc. Power surface mount light emitting die package
US7976186B2 (en) 2003-05-27 2011-07-12 Cree, Inc. Power surface mount light emitting die package
US8446004B2 (en) 2004-06-04 2013-05-21 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7280288B2 (en) 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US20050269587A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Power light emitting die package with reflecting lens and the method of making the same
US20050270666A1 (en) * 2004-06-04 2005-12-08 Loh Ban P Composite optical lens with an integrated reflector
US8932886B2 (en) 2004-06-04 2015-01-13 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7777247B2 (en) 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
US8308331B2 (en) 2005-06-14 2012-11-13 Cree, Inc. LED backlighting for displays
USD761216S1 (en) * 2014-12-12 2016-07-12 Jiaxing Super Lighting Electric Appliance Co., Ltd LED leadframe
USD803799S1 (en) * 2015-04-20 2017-11-28 Kabushiki Kaisha Toshiba Lead frame

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