USD465207S1 - Leadframe matrix for a surface mount package - Google Patents
Leadframe matrix for a surface mount package Download PDFInfo
- Publication number
- USD465207S1 USD465207S1 US29/143,226 US14322601F USD465207S US D465207 S1 USD465207 S1 US D465207S1 US 14322601 F US14322601 F US 14322601F US D465207 S USD465207 S US D465207S
- Authority
- US
- United States
- Prior art keywords
- surface mount
- mount package
- leadframe matrix
- leadframe
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;
FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,
FIG. 3 is a perspective view of FIG. 1.
The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.
Claims (1)
- The ornamental design for leadframe matrix for a surface mount package, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/143,226 USD465207S1 (en) | 2001-06-08 | 2001-06-08 | Leadframe matrix for a surface mount package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/143,226 USD465207S1 (en) | 2001-06-08 | 2001-06-08 | Leadframe matrix for a surface mount package |
Publications (1)
Publication Number | Publication Date |
---|---|
USD465207S1 true USD465207S1 (en) | 2002-11-05 |
Family
ID=27660938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/143,226 Expired - Lifetime USD465207S1 (en) | 2001-06-08 | 2001-06-08 | Leadframe matrix for a surface mount package |
Country Status (1)
Country | Link |
---|---|
US (1) | USD465207S1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040041222A1 (en) * | 2002-09-04 | 2004-03-04 | Loh Ban P. | Power surface mount light emitting die package |
US20040079957A1 (en) * | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US20040126913A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
US20040124487A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | LED package die having a small footprint |
US20050270666A1 (en) * | 2004-06-04 | 2005-12-08 | Loh Ban P | Composite optical lens with an integrated reflector |
US20050269587A1 (en) * | 2004-06-04 | 2005-12-08 | Loh Ban P | Power light emitting die package with reflecting lens and the method of making the same |
US20060157726A1 (en) * | 2005-01-14 | 2006-07-20 | Loh Ban P | Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same |
US20070138497A1 (en) * | 2003-05-27 | 2007-06-21 | Loh Ban P | Power surface mount light emitting die package |
US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
USD761216S1 (en) * | 2014-12-12 | 2016-07-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED leadframe |
USD803799S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
-
2001
- 2001-06-08 US US29/143,226 patent/USD465207S1/en not_active Expired - Lifetime
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US20040079957A1 (en) * | 2002-09-04 | 2004-04-29 | Andrews Peter Scott | Power surface mount light emitting die package |
US8167463B2 (en) | 2002-09-04 | 2012-05-01 | Cree, Inc. | Power surface mount light emitting die package |
US20040041222A1 (en) * | 2002-09-04 | 2004-03-04 | Loh Ban P. | Power surface mount light emitting die package |
US8530915B2 (en) | 2002-09-04 | 2013-09-10 | Cree, Inc. | Power surface mount light emitting die package |
US8710514B2 (en) | 2002-09-04 | 2014-04-29 | Cree, Inc. | Power surface mount light emitting die package |
US8622582B2 (en) | 2002-09-04 | 2014-01-07 | Cree, Inc. | Power surface mount light emitting die package |
US8608349B2 (en) | 2002-09-04 | 2013-12-17 | Cree, Inc. | Power surface mount light emitting die package |
US7264378B2 (en) | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
US7692206B2 (en) | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
US6897486B2 (en) | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
US20040124487A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | LED package die having a small footprint |
US20040126913A1 (en) * | 2002-12-06 | 2004-07-01 | Loh Ban P. | Composite leadframe LED package and method of making the same |
US20070181901A1 (en) * | 2003-05-27 | 2007-08-09 | Loh Ban P | Power surface mount light emitting die package |
US20070138497A1 (en) * | 2003-05-27 | 2007-06-21 | Loh Ban P | Power surface mount light emitting die package |
US7659551B2 (en) | 2003-05-27 | 2010-02-09 | Cree, Inc. | Power surface mount light emitting die package |
US8188488B2 (en) | 2003-05-27 | 2012-05-29 | Cree, Inc. | Power surface mount light emitting die package |
US7775685B2 (en) | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
US20100301372A1 (en) * | 2003-05-27 | 2010-12-02 | Cree, Inc. | Power surface mount light emitting die package |
US7976186B2 (en) | 2003-05-27 | 2011-07-12 | Cree, Inc. | Power surface mount light emitting die package |
US8446004B2 (en) | 2004-06-04 | 2013-05-21 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7280288B2 (en) | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
US20050269587A1 (en) * | 2004-06-04 | 2005-12-08 | Loh Ban P | Power light emitting die package with reflecting lens and the method of making the same |
US20050270666A1 (en) * | 2004-06-04 | 2005-12-08 | Loh Ban P | Composite optical lens with an integrated reflector |
US8932886B2 (en) | 2004-06-04 | 2015-01-13 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7777247B2 (en) | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
US20060157726A1 (en) * | 2005-01-14 | 2006-07-20 | Loh Ban P | Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same |
US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
US8308331B2 (en) | 2005-06-14 | 2012-11-13 | Cree, Inc. | LED backlighting for displays |
USD761216S1 (en) * | 2014-12-12 | 2016-07-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED leadframe |
USD803799S1 (en) * | 2015-04-20 | 2017-11-28 | Kabushiki Kaisha Toshiba | Lead frame |
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