USD503691S1 - Conductive clip for a semiconductor package - Google Patents

Conductive clip for a semiconductor package Download PDF

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Publication number
USD503691S1
USD503691S1 US29/188,754 US18875403F USD503691S US D503691 S1 USD503691 S1 US D503691S1 US 18875403 F US18875403 F US 18875403F US D503691 S USD503691 S US D503691S
Authority
US
United States
Prior art keywords
conductive clip
semiconductor package
design
conductive
clip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/188,754
Inventor
Martin Standing
Hazel Deborah Schofield
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Priority to US29/188,754 priority Critical patent/USD503691S1/en
Assigned to INTERNATIONAL RECTIFIER CORPORATION reassignment INTERNATIONAL RECTIFIER CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHOFIELD, HAZEL DEBORAH, STANDING, MARTIN
Application granted granted Critical
Publication of USD503691S1 publication Critical patent/USD503691S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/63—Connectors not provided for in any of the groups H01L24/10 - H01L24/50 and subgroups; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Description

FIG. 1 is a perspective view of a conductive clip according to our design;
FIG. 2 is another perspective view of a conductive clip according to our design, the broken lines being included for illustrative purposes and forming no part of the claimed design;
FIG. 3 is a top plan view of a conductive clip according to our design;
FIG. 4 is a bottom plan view of a conductive clip according to our design, the broken lines being included for illustration purposes and forming no part of the claimed design;
FIG. 5 is a side elevational view of a conductive clip according to our design; and,
FIG. 6 is a side elevational view of a conductive clip according to our design.

Claims (1)

  1. The ornamental design for a conductive clip for a semiconductor package, as shown and described.
US29/188,754 2001-03-28 2003-08-22 Conductive clip for a semiconductor package Expired - Lifetime USD503691S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/188,754 USD503691S1 (en) 2001-03-28 2003-08-22 Conductive clip for a semiconductor package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81977401 2001-03-28
US29/188,754 USD503691S1 (en) 2001-03-28 2003-08-22 Conductive clip for a semiconductor package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US09/819,774 Division US6624522B2 (en) 2000-04-04 2001-03-28 Chip scale surface mounted device and process of manufacture

Publications (1)

Publication Number Publication Date
USD503691S1 true USD503691S1 (en) 2005-04-05

Family

ID=34377804

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/188,754 Expired - Lifetime USD503691S1 (en) 2001-03-28 2003-08-22 Conductive clip for a semiconductor package

Country Status (1)

Country Link
US (1) USD503691S1 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090523A1 (en) * 2005-10-20 2007-04-26 Ralf Otremba Semiconductor component and methods to produce a semiconductor component
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US20070259514A1 (en) * 2006-05-04 2007-11-08 Ralf Otremba Interconnection Structure, Electronic Component and Method of Manufacturing the Same
US20070267729A1 (en) * 2006-05-17 2007-11-22 Ralf Otremba Electronic Component Having a Semiconductor Power Device
US7663212B2 (en) 2006-03-21 2010-02-16 Infineon Technologies Ag Electronic component having exposed surfaces
US7757392B2 (en) 2006-05-17 2010-07-20 Infineon Technologies Ag Method of producing an electronic component
US20100308454A1 (en) * 2009-06-08 2010-12-09 Jun Lu Power semiconductor device package and fabrication method
US20110101511A1 (en) * 2009-10-29 2011-05-05 Jun Lu Power semiconductor package
USD642578S1 (en) * 2009-09-30 2011-08-02 Sony Corporation Memory card adapter
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
USD808350S1 (en) * 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD844577S1 (en) * 2014-03-28 2019-04-02 Osram Sylvania Inc. Conductor pad
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
USD971168S1 (en) 2020-11-24 2022-11-29 Bae Systems Information And Electronic Systems Integration Inc. Clip for a semiconductor chip tray

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090523A1 (en) * 2005-10-20 2007-04-26 Ralf Otremba Semiconductor component and methods to produce a semiconductor component
US7786558B2 (en) 2005-10-20 2010-08-31 Infineon Technologies Ag Semiconductor component and methods to produce a semiconductor component
US20070215997A1 (en) * 2006-03-17 2007-09-20 Martin Standing Chip-scale package
US7663212B2 (en) 2006-03-21 2010-02-16 Infineon Technologies Ag Electronic component having exposed surfaces
US20070259514A1 (en) * 2006-05-04 2007-11-08 Ralf Otremba Interconnection Structure, Electronic Component and Method of Manufacturing the Same
US7541681B2 (en) 2006-05-04 2009-06-02 Infineon Technologies Ag Interconnection structure, electronic component and method of manufacturing the same
US20070267729A1 (en) * 2006-05-17 2007-11-22 Ralf Otremba Electronic Component Having a Semiconductor Power Device
US7757392B2 (en) 2006-05-17 2010-07-20 Infineon Technologies Ag Method of producing an electronic component
US7476978B2 (en) 2006-05-17 2009-01-13 Infineon Technologies, Ag Electronic component having a semiconductor power device
US20100308454A1 (en) * 2009-06-08 2010-12-09 Jun Lu Power semiconductor device package and fabrication method
US8563360B2 (en) 2009-06-08 2013-10-22 Alpha And Omega Semiconductor, Inc. Power semiconductor device package and fabrication method
USD658185S1 (en) 2009-09-30 2012-04-24 Sony Corporation Memory card adapter
USD642578S1 (en) * 2009-09-30 2011-08-02 Sony Corporation Memory card adapter
US20110101511A1 (en) * 2009-10-29 2011-05-05 Jun Lu Power semiconductor package
US7939370B1 (en) 2009-10-29 2011-05-10 Alpha And Omega Semiconductor Incorporated Power semiconductor package
USD844577S1 (en) * 2014-03-28 2019-04-02 Osram Sylvania Inc. Conductor pad
USD877103S1 (en) * 2014-03-28 2020-03-03 Osram Sylvania Inc. Conductor pad
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
USD825463S1 (en) * 2016-07-18 2018-08-14 General Electric Company Heat spreader
USD808350S1 (en) * 2017-03-06 2018-01-23 Topline Corporation Fixture for delivering interconnect members onto a substrate
USD874413S1 (en) * 2018-11-02 2020-02-04 Topline Corporation Fixture for delivering 1752 solder columns onto a substrate
USD908648S1 (en) 2019-12-12 2021-01-26 Topline Corporation Adjustable fixture for aligning column grid array substrates
USD971168S1 (en) 2020-11-24 2022-11-29 Bae Systems Information And Electronic Systems Integration Inc. Clip for a semiconductor chip tray

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