USD584249S1 - Grooves formed around a semiconductor device on a circuit board - Google Patents

Grooves formed around a semiconductor device on a circuit board Download PDF

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Publication number
USD584249S1
USD584249S1 US29/303,706 US30370608F USD584249S US D584249 S1 USD584249 S1 US D584249S1 US 30370608 F US30370608 F US 30370608F US D584249 S USD584249 S US D584249S
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US
United States
Prior art keywords
circuit board
semiconductor device
formed around
grooves formed
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/303,706
Inventor
Emiko TANI
Tetsuya Ohsawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US29/303,706 priority Critical patent/USD584249S1/en
Application granted granted Critical
Publication of USD584249S1 publication Critical patent/USD584249S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 shows a plan view of the grooves formed around a semiconductor device on a circuit board showing the design according to the invention.
FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.
FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2; and,
FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 2.
The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.

Claims (1)

  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
US29/303,706 2006-05-01 2008-02-15 Grooves formed around a semiconductor device on a circuit board Expired - Lifetime USD584249S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/303,706 USD584249S1 (en) 2006-05-01 2008-02-15 Grooves formed around a semiconductor device on a circuit board

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006011446 2006-05-01
JP2006011443 2006-05-01
JP2006011445 2006-05-01
US29/268,261 USD567774S1 (en) 2006-05-01 2006-11-01 Groove formed around a semiconductor device on a circuit board
US29/303,706 USD584249S1 (en) 2006-05-01 2008-02-15 Grooves formed around a semiconductor device on a circuit board

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/268,261 Division USD567774S1 (en) 2006-05-01 2006-11-01 Groove formed around a semiconductor device on a circuit board

Publications (1)

Publication Number Publication Date
USD584249S1 true USD584249S1 (en) 2009-01-06

Family

ID=39322098

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/268,261 Expired - Lifetime USD567774S1 (en) 2006-05-01 2006-11-01 Groove formed around a semiconductor device on a circuit board
US29/303,707 Expired - Lifetime USD584250S1 (en) 2006-05-01 2008-02-15 Grooves formed around a semiconductor device on a circuit board
US29/303,706 Expired - Lifetime USD584249S1 (en) 2006-05-01 2008-02-15 Grooves formed around a semiconductor device on a circuit board

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US29/268,261 Expired - Lifetime USD567774S1 (en) 2006-05-01 2006-11-01 Groove formed around a semiconductor device on a circuit board
US29/303,707 Expired - Lifetime USD584250S1 (en) 2006-05-01 2008-02-15 Grooves formed around a semiconductor device on a circuit board

Country Status (1)

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US (3) USD567774S1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
USD692005S1 (en) * 2011-11-07 2013-10-22 Blackberry Limited Device smart card
USD702694S1 (en) 2011-11-07 2014-04-15 Blackberry Limited Device smart card
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods

Also Published As

Publication number Publication date
USD567774S1 (en) 2008-04-29
USD584250S1 (en) 2009-01-06

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