USD701864S1 - UICC apparatus - Google Patents

UICC apparatus Download PDF

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Publication number
USD701864S1
USD701864S1 US29/418,880 US201229418880F USD701864S US D701864 S1 USD701864 S1 US D701864S1 US 201229418880 F US201229418880 F US 201229418880F US D701864 S USD701864 S US D701864S
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United States
Prior art keywords
uicc apparatus
uicc
view
ornamental design
broken lines
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US29/418,880
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James Randolph Winter Lepp
Jean-Philippe Paul Cormier
Sheldon Terry Schwandt
Oleg Los
Petra Braun
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BlackBerry Ltd
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BlackBerry Ltd
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Priority to US29/418,880 priority Critical patent/USD701864S1/en
Priority to US29/419,286 priority patent/USD702241S1/en
Assigned to RESEARCH IN MOTION LIMITED reassignment RESEARCH IN MOTION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SCHWANDT, SHELDON TERRY, CORMIER, JEAN-PHILIPPE PAUL, LEPP, JAMES RANDOLPH WINTER
Assigned to RESEARCH IN MOTION CORPORATION reassignment RESEARCH IN MOTION CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LOS, OLEG
Assigned to RESEARCH IN MOTION DEUTSCHLAND GMBH reassignment RESEARCH IN MOTION DEUTSCHLAND GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BRAUN, PETRA
Assigned to RESEARCH IN MOTION LIMITED reassignment RESEARCH IN MOTION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RESEARCH IN MOTION CORPORATION
Assigned to RESEARCH IN MOTION LIMITED reassignment RESEARCH IN MOTION LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RESEARCH IN MOTION DEUTSCHLAND GMBH
Priority to CA 147628 priority patent/CA147628S/en
Assigned to BLACKBERRY LIMITED reassignment BLACKBERRY LIMITED CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: RESEARCH IN MOTION LIMITED
Publication of USD701864S1 publication Critical patent/USD701864S1/en
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Description

FIG. 1 is a plan view of a UICC apparatus;
FIG. 2 is a front view of the UICC apparatus of FIG. 1;
FIG. 3 is a right side view of the UICC apparatus of FIG. 1;
FIG. 4 is a left side view of the UICC apparatus of FIG. 1; and,
FIG. 5 is a rear view of the UICC apparatus of FIG. 1.
Broken lines and portions contained within broken lines are not claimed.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a UICC apparatus, as shown and described.
US29/418,880 2012-04-23 2012-04-23 UICC apparatus Active USD701864S1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US29/418,880 USD701864S1 (en) 2012-04-23 2012-04-23 UICC apparatus
US29/419,286 USD702241S1 (en) 2012-04-23 2012-04-26 UICC apparatus
CA 147628 CA147628S (en) 2012-04-23 2012-09-28 Device smart card

Applications Claiming Priority (1)

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US29/418,880 USD701864S1 (en) 2012-04-23 2012-04-23 UICC apparatus

Related Child Applications (1)

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US29/419,286 Continuation USD702241S1 (en) 2012-04-23 2012-04-26 UICC apparatus

Publications (1)

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USD701864S1 true USD701864S1 (en) 2014-04-01

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US29/418,880 Active USD701864S1 (en) 2012-04-23 2012-04-23 UICC apparatus
US29/419,286 Active USD702241S1 (en) 2012-04-23 2012-04-26 UICC apparatus

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US29/419,286 Active USD702241S1 (en) 2012-04-23 2012-04-26 UICC apparatus

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CA (1) CA147628S (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD756317S1 (en) * 2014-08-26 2016-05-17 Féinics Amatech Teoranta Layout for contact pads and connection bridges of a transponder chip module
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD776070S1 (en) * 2014-03-18 2017-01-10 Sony Corporation Non-contact type data carrier
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
US9769521B2 (en) 2013-03-13 2017-09-19 Nagrastar, Llc Systems and methods for performing transport I/O
US20170359897A1 (en) * 2016-06-13 2017-12-14 Infineon Technologies Austria Ag Chip card module and method for producing a chip card module
USD816135S1 (en) * 2014-12-19 2018-04-24 Myron Walker Spoked solder pad
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016100984A1 (en) 2014-12-19 2016-06-23 Walker Myron Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
JP1647393S (en) 2018-02-01 2019-12-09
USD930000S1 (en) * 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card
USD942538S1 (en) * 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD943024S1 (en) * 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module

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