USD748591S1 - Keyed spindle - Google Patents

Keyed spindle Download PDF

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Publication number
USD748591S1
USD748591S1 US29/514,586 US201529514586F USD748591S US D748591 S1 USD748591 S1 US D748591S1 US 201529514586 F US201529514586 F US 201529514586F US D748591 S USD748591 S US D748591S
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US
United States
Prior art keywords
keyed spindle
keyed
spindle
view
ornamental design
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Active
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US29/514,586
Inventor
Sandeep Krishnan
Keng Moy
Alexander I. Gurary
Matthew King
Vadim Boguslavskiy
Steven Krommenhoek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
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Veeco Instruments Inc
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Priority to US29/514,586 priority Critical patent/USD748591S1/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GURARY, ALEXANDER I., BOGUSLAVSKIY, VADIM, KING, MATTHEW, KRISHNAN, SANDEEP, KROMMENHOEK, STEVEN, MOY, KENG
Application granted granted Critical
Publication of USD748591S1 publication Critical patent/USD748591S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
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Description

FIG. 1 is a top perspective view of a keyed spindle showing our new design;
FIG. 2 is a right side view thereof, the left side view being a mirror image of the right side view;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.
The broken line in the figure drawings represents unclaimed environment only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a keyed spindle, as shown and described.
US29/514,586 2012-03-20 2015-01-14 Keyed spindle Active USD748591S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/514,586 USD748591S1 (en) 2012-03-20 2015-01-14 Keyed spindle

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/416,216 USD726133S1 (en) 2012-03-20 2012-03-20 Keyed spindle
US29/514,586 USD748591S1 (en) 2012-03-20 2015-01-14 Keyed spindle

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/416,216 Division USD726133S1 (en) 2012-03-20 2012-03-20 Keyed spindle

Publications (1)

Publication Number Publication Date
USD748591S1 true USD748591S1 (en) 2016-02-02

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Family Applications (2)

Application Number Title Priority Date Filing Date
US29/416,216 Active USD726133S1 (en) 2012-03-20 2012-03-20 Keyed spindle
US29/514,586 Active USD748591S1 (en) 2012-03-20 2015-01-14 Keyed spindle

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US29/416,216 Active USD726133S1 (en) 2012-03-20 2012-03-20 Keyed spindle

Country Status (1)

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US (2) USD726133S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD812595S1 (en) * 2015-11-30 2018-03-13 Kmw Inc. Antenna
USD832803S1 (en) * 2016-12-06 2018-11-06 Arris Enterprises Llc Heater assembly for a laser diode
USD1015384S1 (en) * 2020-09-02 2024-02-20 Bpr Engineering Pty Ltd Spindle

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD712852S1 (en) * 2012-03-20 2014-09-09 Veeco Instruments Inc. Spindle key
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD768282S1 (en) * 2015-05-27 2016-10-04 Alva Alta Lda Structural support for solar envelope and solar collector

Citations (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1795230A (en) 1927-07-29 1931-03-03 Landis Tool Co Means for holding normally reciprocating spindles from reciprocating
US1844791A (en) 1929-08-13 1932-02-09 Landis Tool Co Spindle reciprocating mechanism
US3101573A (en) 1960-06-17 1963-08-27 Midwest Supply And Mfg Company Reciprocatory buffing spindle structure
US3418758A (en) 1967-01-31 1968-12-31 Mcewan James Oscillating vertical spindle sander
US3731435A (en) 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US3930341A (en) 1974-02-01 1976-01-06 Marcel Neuman Universal vertical grinding machine
US4165584A (en) 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4206572A (en) 1977-07-29 1980-06-10 S.A. Automobiles Citroen Device for controlling expansible grinding tools
JPS59232994A (en) 1983-06-16 1984-12-27 Toshiba Mach Co Ltd Device for vapor phase crystal growth
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4551947A (en) 1982-07-27 1985-11-12 Maschinenfabrik Gehring Gesellschaft Mit Beschrankter Haftung & Co. Kommanditgesellschaft Device for honing workpieces
US4679357A (en) 1984-06-07 1987-07-14 Maschinenfabrik Gehring Gesellschaft mit beschrankter Haftung & Co. Method and apparatus for displacing a honing tool
US4739589A (en) 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US4821457A (en) 1988-03-21 1989-04-18 Ianuzzi Joseph N Vertical oscillating spindle sanders
US4928434A (en) 1987-10-30 1990-05-29 Trimate Lapping internal surfaces
US5191738A (en) 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5335560A (en) 1993-01-22 1994-08-09 Wang Tian Wang Table-top grinder power transmission mechanism
US5361543A (en) 1992-10-01 1994-11-08 Michael Bory Device for ultrasonic erosion of a workpiece
US5371978A (en) 1990-08-04 1994-12-13 Toyo Co., Ltd. Honing tool and super precision finishing method using the same
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5402604A (en) 1993-03-17 1995-04-04 Ryobi Motor Products Oscillating spindle sander
US5422316A (en) 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5482498A (en) 1992-04-02 1996-01-09 Toyo Co., Ltd. Honing tool and super precision finishing method using the same
US5573448A (en) 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5674107A (en) 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
US5683518A (en) 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5788777A (en) 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
US6080042A (en) 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US20020011204A1 (en) 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6375749B1 (en) 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US20020106826A1 (en) 2001-02-07 2002-08-08 Vadim Boguslavskiy Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
US6454635B1 (en) 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6500059B2 (en) 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US6514424B2 (en) 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US20030057089A1 (en) 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
KR20030034309A (en) 2001-10-22 2003-05-09 (주)케이.씨.텍 Apparatus for holding substrate
US6666948B2 (en) 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6709981B2 (en) 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6733367B1 (en) 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US6786807B2 (en) 2002-09-03 2004-09-07 Micromatic Operations, Inc. Universal coupling for machine tool
US6824451B2 (en) 2001-06-29 2004-11-30 Infineon Technologies Ag Process for the abrasive machining of surfaces, in particular of semiconductor wafers
USD503385S1 (en) * 2002-11-28 2005-03-29 Kabushiki Kaisha Toshiba Optoelectronic converting connector plug for optical fibers
US7008308B2 (en) 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US20060090915A1 (en) * 2004-11-03 2006-05-04 Kim Dong-Jin Streamer discharge type lightening rod capable of generating lots of ions
US7125313B2 (en) 2003-02-25 2006-10-24 Novellus Systems, Inc. Apparatus and method for abrading a workpiece
US7169234B2 (en) 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7252737B2 (en) 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
USD574792S1 (en) 2006-08-23 2008-08-12 Tokyo Electron Limited Lower heat insulating cylinder for manufacturing semiconductor wafers
USD579885S1 (en) 2007-02-20 2008-11-04 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
US7520800B2 (en) 2003-04-16 2009-04-21 Duescher Wayne O Raised island abrasive, lapping apparatus and method of use
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
USD601979S1 (en) 2008-03-28 2009-10-13 Tokyo Electron Limited Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers
USD616394S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
WO2011006064A1 (en) 2009-07-10 2011-01-13 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Metal-containing precursors for deposition of metal-containing films
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
KR20110116591A (en) 2010-04-19 2011-10-26 주성엔지니어링(주) Substrate processing apparatus
JP2011216520A (en) 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd Substrate holding rotating device and substrate processing apparatus
US8177993B2 (en) 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
US8182315B2 (en) 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
CN202492576U (en) 2012-02-20 2012-10-17 中微半导体设备(上海)有限公司 Chemical vapor deposition device
US8328600B2 (en) 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD675567S1 (en) * 2011-08-23 2013-02-05 Adamant Kogyo Co., Ltd. Ferrule for optical fiber
US8448289B2 (en) * 2006-03-24 2013-05-28 Robert Bosch Gmbh Windscreen wiper drive arrangement

Patent Citations (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1795230A (en) 1927-07-29 1931-03-03 Landis Tool Co Means for holding normally reciprocating spindles from reciprocating
US1844791A (en) 1929-08-13 1932-02-09 Landis Tool Co Spindle reciprocating mechanism
US3101573A (en) 1960-06-17 1963-08-27 Midwest Supply And Mfg Company Reciprocatory buffing spindle structure
US3418758A (en) 1967-01-31 1968-12-31 Mcewan James Oscillating vertical spindle sander
US3731435A (en) 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
US3845738A (en) 1973-09-12 1974-11-05 Rca Corp Vapor deposition apparatus with pyrolytic graphite heat shield
US3930341A (en) 1974-02-01 1976-01-06 Marcel Neuman Universal vertical grinding machine
US4165584A (en) 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4206572A (en) 1977-07-29 1980-06-10 S.A. Automobiles Citroen Device for controlling expansible grinding tools
US4551947A (en) 1982-07-27 1985-11-12 Maschinenfabrik Gehring Gesellschaft Mit Beschrankter Haftung & Co. Kommanditgesellschaft Device for honing workpieces
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
JPS59232994A (en) 1983-06-16 1984-12-27 Toshiba Mach Co Ltd Device for vapor phase crystal growth
US4679357A (en) 1984-06-07 1987-07-14 Maschinenfabrik Gehring Gesellschaft mit beschrankter Haftung & Co. Method and apparatus for displacing a honing tool
US4739589A (en) 1985-07-12 1988-04-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoff Mbh Process and apparatus for abrasive machining of a wafer-like workpiece
US4928434A (en) 1987-10-30 1990-05-29 Trimate Lapping internal surfaces
US4821457A (en) 1988-03-21 1989-04-18 Ianuzzi Joseph N Vertical oscillating spindle sanders
US5191738A (en) 1989-06-16 1993-03-09 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafer
US5371978A (en) 1990-08-04 1994-12-13 Toyo Co., Ltd. Honing tool and super precision finishing method using the same
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5482498A (en) 1992-04-02 1996-01-09 Toyo Co., Ltd. Honing tool and super precision finishing method using the same
US5361543A (en) 1992-10-01 1994-11-08 Michael Bory Device for ultrasonic erosion of a workpiece
US5683518A (en) 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5335560A (en) 1993-01-22 1994-08-09 Wang Tian Wang Table-top grinder power transmission mechanism
US5377451A (en) 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5624302A (en) 1993-03-17 1997-04-29 Ryobi Motor Products Corp. Oscillating spindle sander
US5402604A (en) 1993-03-17 1995-04-04 Ryobi Motor Products Oscillating spindle sander
US5573448A (en) 1993-08-18 1996-11-12 Shin-Etsu Handotai Co., Ltd. Method of polishing wafers, a backing pad used therein, and method of making the backing pad
US5647789A (en) 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5422316A (en) 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5674107A (en) 1995-04-25 1997-10-07 Lucent Technologies Inc. Diamond polishing method and apparatus employing oxygen-emitting medium
USD405430S (en) * 1997-01-31 1999-02-09 Tokyo Electron Limited Inner tube for use in a semiconductor wafer heat processing apparatus
US5788777A (en) 1997-03-06 1998-08-04 Burk, Jr.; Albert A. Susceptor for an epitaxial growth factor
US5840124A (en) 1997-06-30 1998-11-24 Emcore Corporation Wafer carrier with flexible wafer flat holder
US5865666A (en) 1997-08-20 1999-02-02 Lsi Logic Corporation Apparatus and method for polish removing a precise amount of material from a wafer
US6080042A (en) 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
US6241825B1 (en) 1999-04-16 2001-06-05 Cutek Research Inc. Compliant wafer chuck
US6375749B1 (en) 1999-07-14 2002-04-23 Seh America, Inc. Susceptorless semiconductor wafer support and reactor system for epitaxial layer growth
US20020011204A1 (en) 2000-02-28 2002-01-31 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6514424B2 (en) 2000-05-11 2003-02-04 WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process
US6454635B1 (en) 2000-08-08 2002-09-24 Memc Electronic Materials, Inc. Method and apparatus for a wafer carrier having an insert
US6709981B2 (en) 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6500059B2 (en) 2000-12-01 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus and method for mounting a wafer in a polishing machine
US20030057089A1 (en) 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US20020106826A1 (en) 2001-02-07 2002-08-08 Vadim Boguslavskiy Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition
US6666948B2 (en) 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6733367B1 (en) 2001-04-23 2004-05-11 Phuong Van Nguyen Method and apparatus for polishing silicon wafers
US6824451B2 (en) 2001-06-29 2004-11-30 Infineon Technologies Ag Process for the abrasive machining of surfaces, in particular of semiconductor wafers
US7252737B2 (en) 2001-08-09 2007-08-07 Applied Materials, Inc. Pedestal with integral shield
KR20030034309A (en) 2001-10-22 2003-05-09 (주)케이.씨.텍 Apparatus for holding substrate
US6786807B2 (en) 2002-09-03 2004-09-07 Micromatic Operations, Inc. Universal coupling for machine tool
USD503385S1 (en) * 2002-11-28 2005-03-29 Kabushiki Kaisha Toshiba Optoelectronic converting connector plug for optical fibers
US7125313B2 (en) 2003-02-25 2006-10-24 Novellus Systems, Inc. Apparatus and method for abrading a workpiece
US7520800B2 (en) 2003-04-16 2009-04-21 Duescher Wayne O Raised island abrasive, lapping apparatus and method of use
US7008308B2 (en) 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7235139B2 (en) 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7169234B2 (en) 2004-01-30 2007-01-30 Asm America, Inc. Apparatus and methods for preventing rotational slippage between a vertical shaft and a support structure for a semiconductor wafer holder
US20060090915A1 (en) * 2004-11-03 2006-05-04 Kim Dong-Jin Streamer discharge type lightening rod capable of generating lots of ions
USD564462S1 (en) * 2005-12-27 2008-03-18 Tokyo Electron Limited RF electrode for a process tube of semiconductor manufacturing apparatus
US8448289B2 (en) * 2006-03-24 2013-05-28 Robert Bosch Gmbh Windscreen wiper drive arrangement
USD574792S1 (en) 2006-08-23 2008-08-12 Tokyo Electron Limited Lower heat insulating cylinder for manufacturing semiconductor wafers
US8177993B2 (en) 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD579885S1 (en) 2007-02-20 2008-11-04 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
US20090194026A1 (en) 2008-01-31 2009-08-06 Burrows Brian H Processing system for fabricating compound nitride semiconductor devices
US8182315B2 (en) 2008-03-24 2012-05-22 Phuong Van Nguyen Chemical mechanical polishing pad and dresser
USD601979S1 (en) 2008-03-28 2009-10-13 Tokyo Electron Limited Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers
USD616394S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD616395S1 (en) 2009-03-11 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
WO2011006064A1 (en) 2009-07-10 2011-01-13 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Metal-containing precursors for deposition of metal-containing films
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8328600B2 (en) 2010-03-12 2012-12-11 Duescher Wayne O Workpiece spindles supported floating abrasive platen
JP2011216520A (en) 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd Substrate holding rotating device and substrate processing apparatus
KR20110116591A (en) 2010-04-19 2011-10-26 주성엔지니어링(주) Substrate processing apparatus
USD674759S1 (en) 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD675567S1 (en) * 2011-08-23 2013-02-05 Adamant Kogyo Co., Ltd. Ferrule for optical fiber
CN202492576U (en) 2012-02-20 2012-10-17 中微半导体设备(上海)有限公司 Chemical vapor deposition device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Japanese Office Action for Application No. 2015-501689 dated Feb. 27, 2015.
Korean Office Action for Application No. 10-2014-7027578 dated Dec. 18, 2014.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD812595S1 (en) * 2015-11-30 2018-03-13 Kmw Inc. Antenna
USD832803S1 (en) * 2016-12-06 2018-11-06 Arris Enterprises Llc Heater assembly for a laser diode
USD1015384S1 (en) * 2020-09-02 2024-02-20 Bpr Engineering Pty Ltd Spindle

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