USRE36773E - Method for plating using nested plating buses and semiconductor device having the same - Google Patents
Method for plating using nested plating buses and semiconductor device having the same Download PDFInfo
- Publication number
- USRE36773E USRE36773E US08/970,272 US97027297A USRE36773E US RE36773 E USRE36773 E US RE36773E US 97027297 A US97027297 A US 97027297A US RE36773 E USRE36773 E US RE36773E
- Authority
- US
- United States
- Prior art keywords
- substrate
- plating
- receiving area
- die
- nested
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 238000005530 etching Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 4
- 230000007613 environmental effect Effects 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- 238000003801 milling Methods 0.000 abstract description 3
- 239000013589 supplement Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 24
- 230000008901 benefit Effects 0.000 description 11
- 239000002356 single layer Substances 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000011295 pitch Substances 0.000 description 3
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Abstract
Description
Claims (21)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/970,272 USRE36773E (en) | 1993-10-18 | 1997-11-14 | Method for plating using nested plating buses and semiconductor device having the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/136,845 US5467252A (en) | 1993-10-18 | 1993-10-18 | Method for plating using nested plating buses and semiconductor device having the same |
US08/970,272 USRE36773E (en) | 1993-10-18 | 1997-11-14 | Method for plating using nested plating buses and semiconductor device having the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/136,845 Reissue US5467252A (en) | 1993-10-18 | 1993-10-18 | Method for plating using nested plating buses and semiconductor device having the same |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE36773E true USRE36773E (en) | 2000-07-11 |
Family
ID=22474631
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/136,845 Ceased US5467252A (en) | 1993-10-18 | 1993-10-18 | Method for plating using nested plating buses and semiconductor device having the same |
US08/970,272 Expired - Lifetime USRE36773E (en) | 1993-10-18 | 1997-11-14 | Method for plating using nested plating buses and semiconductor device having the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/136,845 Ceased US5467252A (en) | 1993-10-18 | 1993-10-18 | Method for plating using nested plating buses and semiconductor device having the same |
Country Status (3)
Country | Link |
---|---|
US (2) | US5467252A (en) |
KR (1) | KR100232939B1 (en) |
MY (1) | MY111907A (en) |
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Also Published As
Publication number | Publication date |
---|---|
KR100232939B1 (en) | 1999-12-01 |
KR950012640A (en) | 1995-05-16 |
MY111907A (en) | 2001-02-28 |
US5467252A (en) | 1995-11-14 |
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