USRE39261E1 - Method and apparatus for an integrated laser beam scanner - Google Patents
Method and apparatus for an integrated laser beam scanner Download PDFInfo
- Publication number
- USRE39261E1 USRE39261E1 US10/014,563 US1456301A USRE39261E US RE39261 E1 USRE39261 E1 US RE39261E1 US 1456301 A US1456301 A US 1456301A US RE39261 E USRE39261 E US RE39261E
- Authority
- US
- United States
- Prior art keywords
- layer
- mirror
- recess
- torsional
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 23
- 229920005591 polysilicon Polymers 0.000 claims description 22
- 239000010409 thin film Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- 230000005291 magnetic effect Effects 0.000 claims description 6
- 230000005294 ferromagnetic effect Effects 0.000 claims description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 230000000717 retained effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 24
- 239000007787 solid Substances 0.000 abstract description 7
- 238000000708 deep reactive-ion etching Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 40
- 238000001020 plasma etching Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 229910004205 SiNX Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000003491 array Methods 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 241000053208 Porcellio laevis Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
Abstract
Description
Claims (32)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/014,563 USRE39261E1 (en) | 1998-12-01 | 2001-12-14 | Method and apparatus for an integrated laser beam scanner |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/201,738 US6002507A (en) | 1998-12-01 | 1998-12-01 | Method and apparatus for an integrated laser beam scanner |
US10/014,563 USRE39261E1 (en) | 1998-12-01 | 2001-12-14 | Method and apparatus for an integrated laser beam scanner |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/201,738 Reissue US6002507A (en) | 1998-12-01 | 1998-12-01 | Method and apparatus for an integrated laser beam scanner |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE39261E1 true USRE39261E1 (en) | 2006-09-05 |
Family
ID=22747073
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/201,738 Ceased US6002507A (en) | 1998-12-01 | 1998-12-01 | Method and apparatus for an integrated laser beam scanner |
US10/014,563 Expired - Lifetime USRE39261E1 (en) | 1998-12-01 | 2001-12-14 | Method and apparatus for an integrated laser beam scanner |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/201,738 Ceased US6002507A (en) | 1998-12-01 | 1998-12-01 | Method and apparatus for an integrated laser beam scanner |
Country Status (1)
Country | Link |
---|---|
US (2) | US6002507A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060261357A1 (en) * | 2005-05-18 | 2006-11-23 | Ching-Fu Tsou | Array-type modularized light-emitting diode structure and a method for packaging the structure |
US20120122256A1 (en) * | 2010-11-11 | 2012-05-17 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing light emitting diode |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6442307B1 (en) * | 2000-11-03 | 2002-08-27 | Lucent Technologies Inc. | Solder-packaged optical MEMs device and method for making the same |
US6479311B1 (en) * | 2000-11-27 | 2002-11-12 | Microscan Systems, Inc. | Process for manufacturing micromechanical and microoptomechanical structures with pre-applied patterning |
US6479315B1 (en) | 2000-11-27 | 2002-11-12 | Microscan Systems, Inc. | Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step |
US6506620B1 (en) | 2000-11-27 | 2003-01-14 | Microscan Systems Incorporated | Process for manufacturing micromechanical and microoptomechanical structures with backside metalization |
US6532093B2 (en) * | 2000-12-06 | 2003-03-11 | Xerox Corporation | Integrated micro-opto-electro-mechanical laser scanner |
CN1287585C (en) * | 2001-08-28 | 2006-11-29 | 西门子公司 | Scanning camera |
EP1461656A2 (en) * | 2001-11-06 | 2004-09-29 | Keyotee | Apparatus for image projection |
US20040240034A1 (en) * | 2001-11-30 | 2004-12-02 | Scharf Bruce R. | Diffraction compensation using a patterned reflector |
US6755982B2 (en) * | 2002-01-07 | 2004-06-29 | Xerox Corporation | Self-aligned micro hinges |
WO2004017371A2 (en) * | 2002-08-15 | 2004-02-26 | The Charles Stark Draper Laboratory, Inc. | Method for microfabricating structures using silicon-on-insulator material |
US6666561B1 (en) | 2002-10-28 | 2003-12-23 | Hewlett-Packard Development Company, L.P. | Continuously variable analog micro-mirror device |
TW200419184A (en) * | 2003-03-19 | 2004-10-01 | Delta Electronics Inc | Multiple reflection mirror module |
US6983088B2 (en) * | 2003-08-05 | 2006-01-03 | Xerox Corporation | Thermal actuator and an optical waveguide switch including the same |
US6985650B2 (en) * | 2003-08-05 | 2006-01-10 | Xerox Corporation | Thermal actuator and an optical waveguide switch including the same |
US6985651B2 (en) * | 2003-08-05 | 2006-01-10 | Xerox Corporation | Thermal actuator with offset beam segment neutral axes and an optical waveguide switch including the same |
US7521363B2 (en) * | 2004-08-09 | 2009-04-21 | Analog Devices, Inc. | MEMS device with non-standard profile |
KR100652810B1 (en) * | 2005-12-30 | 2006-12-04 | 삼성전자주식회사 | Mirror package and method of manufacturing the mirror package |
US7834867B2 (en) * | 2006-04-11 | 2010-11-16 | Microvision, Inc. | Integrated photonics module and devices using integrated photonics modules |
US8014682B2 (en) * | 2008-04-18 | 2011-09-06 | Freescale Semiconductor, Inc. | Free-space optical communication system |
US8260151B2 (en) * | 2008-04-18 | 2012-09-04 | Freescale Semiconductor, Inc. | Optical communication integration |
US8630326B2 (en) * | 2009-10-13 | 2014-01-14 | Skorpios Technologies, Inc. | Method and system of heterogeneous substrate bonding for photonic integration |
DE102016213001A1 (en) * | 2016-07-15 | 2018-01-18 | Robert Bosch Gmbh | A light emitting device and method of manufacturing a light emitting device |
US10399179B2 (en) | 2016-12-14 | 2019-09-03 | General Electric Company | Additive manufacturing systems and methods |
JP1625495S (en) * | 2018-05-01 | 2019-03-18 | ||
JP1680388S (en) * | 2018-05-01 | 2021-03-01 | ||
JP1680387S (en) * | 2018-05-01 | 2021-03-01 | ||
JP1680507S (en) | 2018-05-01 | 2021-03-08 | ||
JP1625135S (en) * | 2018-05-01 | 2019-03-18 | ||
USD903614S1 (en) | 2018-05-01 | 2020-12-01 | Hamamatsu Photonics K.K. | Laser beam reflector |
JP1639597S (en) * | 2018-05-01 | 2019-08-19 | ||
USD907085S1 (en) | 2018-05-01 | 2021-01-05 | Hamamatsu Photonics K.K. | Laser beam reflector |
JP1680755S (en) | 2018-05-01 | 2021-03-08 | ||
JP1680386S (en) * | 2018-05-01 | 2021-03-01 | ||
JP1680385S (en) * | 2018-05-01 | 2021-03-01 | ||
FR3105450B1 (en) * | 2019-12-19 | 2023-08-25 | Thales Sa | OPTOELECTRONIC COMPONENT COMPRISING ON A SINGLE SUBSTRATE AN OPTICAL TRANSDUCER MADE OF III-V SEMICONDUCTOR MATERIAL AND AN ELECTROMECHANICAL MICROSYSTEM WITH OPTICAL SCANNING |
JP2022127979A (en) * | 2021-02-22 | 2022-09-01 | スタンレー電気株式会社 | Optical scanning device |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5490034A (en) | 1989-01-13 | 1996-02-06 | Kopin Corporation | SOI actuators and microsensors |
US5493470A (en) | 1989-01-13 | 1996-02-20 | Kopin Corporation | SOI diaphragm sensor |
US5498893A (en) | 1989-10-31 | 1996-03-12 | Fujitsu Limited | Semiconductor device having SOI substrate and fabrication method thereof |
US5612230A (en) | 1991-04-16 | 1997-03-18 | Canon Kabushiki Kaisha | Process for manufacturing a semiconductor device by applying a non-single-crystalline material on a sidewall inside of an opening portion for growing a single-crystalline semiconductor body |
US5625483A (en) * | 1990-05-29 | 1997-04-29 | Symbol Technologies, Inc. | Integrated light source and scanning element implemented on a semiconductor or electro-optical substrate |
US5629790A (en) * | 1993-10-18 | 1997-05-13 | Neukermans; Armand P. | Micromachined torsional scanner |
US5721162A (en) | 1995-11-03 | 1998-02-24 | Delco Electronics Corporation | All-silicon monolithic motion sensor with integrated conditioning circuit |
US5725729A (en) | 1994-09-26 | 1998-03-10 | The Charles Stark Draper Laboratory, Inc. | Process for micromechanical fabrication |
US5742419A (en) * | 1995-11-07 | 1998-04-21 | The Board Of Trustees Of The Leland Stanford Junior Universtiy | Miniature scanning confocal microscope |
US5867297A (en) * | 1997-02-07 | 1999-02-02 | The Regents Of The University Of California | Apparatus and method for optical scanning with an oscillatory microelectromechanical system |
US5882981A (en) | 1996-07-30 | 1999-03-16 | Texas Instruments Incorporated | Mesa isolation Refill Process for Silicon on Insulator Technology Using Flowage Oxides as the Refill Material |
US5903380A (en) * | 1997-05-01 | 1999-05-11 | Rockwell International Corp. | Micro-electromechanical (MEM) optical resonator and method |
US20020067533A1 (en) * | 2000-12-06 | 2002-06-06 | Xerox Corporation | Integrated micro-opto-electro-mechanical laser scanner |
-
1998
- 1998-12-01 US US09/201,738 patent/US6002507A/en not_active Ceased
-
2001
- 2001-12-14 US US10/014,563 patent/USRE39261E1/en not_active Expired - Lifetime
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5493470A (en) | 1989-01-13 | 1996-02-20 | Kopin Corporation | SOI diaphragm sensor |
US5490034A (en) | 1989-01-13 | 1996-02-06 | Kopin Corporation | SOI actuators and microsensors |
US5498893A (en) | 1989-10-31 | 1996-03-12 | Fujitsu Limited | Semiconductor device having SOI substrate and fabrication method thereof |
US5625483A (en) * | 1990-05-29 | 1997-04-29 | Symbol Technologies, Inc. | Integrated light source and scanning element implemented on a semiconductor or electro-optical substrate |
US5612230A (en) | 1991-04-16 | 1997-03-18 | Canon Kabushiki Kaisha | Process for manufacturing a semiconductor device by applying a non-single-crystalline material on a sidewall inside of an opening portion for growing a single-crystalline semiconductor body |
US5629790A (en) * | 1993-10-18 | 1997-05-13 | Neukermans; Armand P. | Micromachined torsional scanner |
US5725729A (en) | 1994-09-26 | 1998-03-10 | The Charles Stark Draper Laboratory, Inc. | Process for micromechanical fabrication |
US5721162A (en) | 1995-11-03 | 1998-02-24 | Delco Electronics Corporation | All-silicon monolithic motion sensor with integrated conditioning circuit |
US5742419A (en) * | 1995-11-07 | 1998-04-21 | The Board Of Trustees Of The Leland Stanford Junior Universtiy | Miniature scanning confocal microscope |
US5882981A (en) | 1996-07-30 | 1999-03-16 | Texas Instruments Incorporated | Mesa isolation Refill Process for Silicon on Insulator Technology Using Flowage Oxides as the Refill Material |
US5867297A (en) * | 1997-02-07 | 1999-02-02 | The Regents Of The University Of California | Apparatus and method for optical scanning with an oscillatory microelectromechanical system |
US5903380A (en) * | 1997-05-01 | 1999-05-11 | Rockwell International Corp. | Micro-electromechanical (MEM) optical resonator and method |
US20020067533A1 (en) * | 2000-12-06 | 2002-06-06 | Xerox Corporation | Integrated micro-opto-electro-mechanical laser scanner |
Non-Patent Citations (3)
Title |
---|
Daneman. M.J.; Solgaard, O; Tien, N.C.; Lau, K.Y.; Muller, R.S., "Laser-to-fiber coupling module using a macromachined alignment mirror", IEEE Photonics Technology Letters, vol. 8, No. 3, Mar. 1996, pp. 396-398. * |
Judy, J.W.; Muller, R.S., "Batch-fabricated, addressable, magnetically actuated microstructures." , Solid State Sensor and Actuator Workshop, Hilton Head, South Carolina, Jun. 2-6, 1996, pp. 187-190. * |
Lin, L.Y; Les S.S; Pister, K.S.J.; Wu, M.C., "Self-aligned hybrid integration of semiconductor lasers with micromachined micro-optics for optoelectronic packaging" , Appl. Phys. Lett. 66 (22), May 29, 1995, pp. 2946-2948. * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060261357A1 (en) * | 2005-05-18 | 2006-11-23 | Ching-Fu Tsou | Array-type modularized light-emitting diode structure and a method for packaging the structure |
US7329942B2 (en) * | 2005-05-18 | 2008-02-12 | Ching-Fu Tsou | Array-type modularized light-emitting diode structure and a method for packaging the structure |
US20120122256A1 (en) * | 2010-11-11 | 2012-05-17 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing light emitting diode |
US8530252B2 (en) * | 2010-11-11 | 2013-09-10 | Advanced Optoelectronic Technology, Inc. | Method for manufacturing light emitting diode |
Also Published As
Publication number | Publication date |
---|---|
US6002507A (en) | 1999-12-14 |
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Owner name: BANK ONE, NA, AS ADMINISTRATIVE AGENT,ILLINOIS Free format text: SECURITY AGREEMENT;ASSIGNOR:XEROX CORPORATION;REEL/FRAME:013111/0001 Effective date: 20020621 Owner name: BANK ONE, NA, AS ADMINISTRATIVE AGENT, ILLINOIS Free format text: SECURITY AGREEMENT;ASSIGNOR:XEROX CORPORATION;REEL/FRAME:013111/0001 Effective date: 20020621 |
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Owner name: XEROX CORPORATION, CONNECTICUT Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A. AS SUCCESSOR-IN-INTEREST ADMINISTRATIVE AGENT AND COLLATERAL AGENT TO BANK ONE, N.A.;REEL/FRAME:061388/0388 Effective date: 20220822 Owner name: XEROX CORPORATION, CONNECTICUT Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A. AS SUCCESSOR-IN-INTEREST ADMINISTRATIVE AGENT AND COLLATERAL AGENT TO JPMORGAN CHASE BANK;REEL/FRAME:066728/0193 Effective date: 20220822 |