Recherche Images Maps Play YouTube Actualités Gmail Drive Plus »
Recherche avancée dans les brevets | Historique Web | Connexion

Brevets

Numéro de publicationUST955008 I4
Type de publicationOctroi
Numéro de demande05/693,385
Date de publication1 févr. 1977
Date de dépôt7 juin 1976
Date de priorité
19 août 1974
Inventeurs
Lawrence V. Gregor
Robert G. Shepheard
Cessionnaire d'origine
International Business Machines Corporation
Classification aux États-Unis
257/778
361/783
361/779
Classification internationale
H01L23/15
H01L21/60
Classification coopérative
H01L2224/81801
H01L2924/14
H01L2924/01005
H01L23/15
H01L24/81
Classification européenne
H01L 24/81
H01L 23/15
Références
Liens externes
USPTO
Cession USPTO
Espacenet
Flip chip structure including a silicon semiconductor element bonded to an Si.sub.3 N.sub.4 base substrate
US T955008 I4
Résumé

A semiconductor device and carrier assembly package having a silicon integrated circuit semiconductor device provided with at least three raised electrical contacts on a first surface, a device support substrate of Si.sub.3 N.sub.4 provided with a conductive metallurgy pattern on at least one surface, the conductive pattern including an electrical contact configuration matching the raised electrical contacts on the device, metallurgical bonds between the raised electrical contacts on the device and the electrical contact pattern on the support substrate, and an electrically conductive means for electrically connecting elements of the conductive metallurgy pattern to coacting elements off the support substrate.

Référencé par
Brevet citant Date de dépôt Date de publication Déposant Titre
US477463030 sept. 198527 sept. 1988Microelectronics Center Of North CarolinaApparatus for mounting a semiconductor chip and making electrical connections thereto
US536821725 août 199329 nov. 1994Microelectronics And Computer Technology CorporationHigh force compression flip chip bonding method and system
US53791919 juin 19943 janv. 1995Microelectronics And Computer Technology CorporationCompact adapter package providing peripheral to area translation for an integrated circuit chip
US546221715 sept. 199431 oct. 1995Microelectronics And Computer Technology CorporationHigh force compression flip chip bonding system
US567997728 avr. 199321 oct. 1997Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US56820615 juin 199528 oct. 1997Tessera, Inc.Component for connecting a semiconductor chip to a substrate
US56858857 oct. 199411 nov. 1997Tessera, Inc.Wafer-scale techniques for fabrication of semiconductor chip assemblies
US584846713 mai 199715 déc. 1998Tessera, Inc.Methods of making semiconductor chip assemblies
US595030421 mai 199714 sept. 1999Tessera, Inc.Methods of making semiconductor chip assemblies
US61336273 déc. 199717 oct. 2000Tessera, Inc.Semiconductor chip package with center contacts
US63725278 sept. 199916 avr. 2002Tessera, Inc.Methods of making semiconductor chip assemblies
US643341920 janv. 200013 août 2002Tessera, Inc.Face-up semiconductor chip assemblies
US646589319 oct. 200015 oct. 2002Tessera, Inc.Stacked chip assembly
US71989697 sept. 20003 avr. 2007Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US72919105 juin 20026 nov. 2007Tessera, Inc.Semiconductor chip assemblies, methods of making same and components for same
US810651627 juil. 201031 janv. 2012Volterra Semiconductor CorporationWafer-level chip scale package
EP0218438A229 sept. 198615 avr. 1987McncApparatus for mounting a semiconductor chip and making electrical connections thereto